Abstract: A socket for mounting a processor and/or a board has a substrate with a built in socket. The socket has conductive, elastically deformable terminals. The socket may be mounted to a processor and a board without using conventional surface mount technology, instead providing a mechanical contact mechanism between the socket and the board or processor. An adhesive layer may also be used to connect the socket to a processor and/or a board.

Abstract: An apparatus for protecting an electronic card is described. The apparatus has a protective contact. The protective contact has a contact face that, when the apparatus is in a locked protruding state, makes contact with a first incorrect card slot backplane feature. In the locked protruding state, the contact face extends outward a first distance from a feature of the card that can receive resultant damage if the card is fully inserted into the incorrect card slot. The first distance is greater than a second distance between a second incorrect card slot backplane feature that can cause the resultant damage and the first incorrect card slot backplane feature. The apparatus includes a guide along which the protective contact slides in order to transition between the locked protruding state and a collapsed state. The protective contact extends less outward from the card in the collapsed state as compared to the locked protruding state so as to allow the card to be fully inserted into a correct card slot.

Abstract: A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board.

Abstract: An apparatus is described that is capable of receiving a number of different types of flash memory cards using a single slot. The apparatus includes a housing that defines a slot to receive different types of removable memory cards. The slot includes a central region of a first height and outer regions of a second height. A plurality of electrically conductive contact areas are disposed within the slot. The apparatus may receive, for example, any one of a Smart Media flash memory card, a Memory Stick flash memory card, a Secure Digital flash memory card, and MultiMedia flash memory card.

Abstract: A resilient contact element includes a unitary conductive contact strip that has a strip axis and that is configured with a mounting section, a curved section, a resilient section and a contact section. The mounting section is to be disposed on a mounting plane, and has opposite front and rear end portions along the strip axis. The curved section includes a first curved segment that curves rearwardly from the rear end portion away from the mounting plane, and a second curved segment that curves rearwardly from the first curved segment toward the mounting plane. The resilient section curves forwardly from the second curved segment away from the mounting plane, and has a first end connected to the second curved segment, and an opposite second end. The contact section extends forwardly from the second end of the resilient section, and is generally parallel to the mounting section.

Abstract: A chip interface assembly and method of assembling a chip interface provide enhanced performance. The chip interface assembly includes a semiconductor package and a socket. The semiconductor package has a female contact architecture, where the female contact architecture is mated with a male contact architecture of the socket. By reversing the traditional male/female arrangement of conventional interconnection interfaces, difficulties associated with signaling throughput, clearance, hardware complexity and electrical losses can be obviated.

Abstract: An integrated shield wrap suitable for use in an electronic device including electronic circuitry. The integrated shield wrap includes an insulator section composed of an electrically insulative material, as well as a shield section joined to the insulator section and composed of an electrically conductive material. The integrated shield wrap can be configured as necessary to suit a particular application and, in general, serves to electrically insulate the electronic circuitry from other circuitry and components within the electronic device while simultaneously implementing a shielding functionality that permits management of electromagnetic emissions from some or all of the electronic circuitry.

Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.

Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.

Abstract: A portable relay base is composed of an upper cover and a lower cover being oppositely joined to each other. The portable relay base at a lateral side thereof at least provides an outlet unit composed of two contact poles and/or one ground pole and at a proper position thereof provides an opening. The portable relay further comprises a power line carrier, a power line, and a circuit board. The power line carrier has a shape of disk and fits with the lower cover axially. An automatic positioning/wire collecting apparatus is provided in the power line carrier and a central hollow reel is provided at a top thereof with at least two concentric spacing rings in accordance with the number of poles of the power. The power line is a lead wire coiling around the reel as a bundle with an end thereof extending an electricity taking plug outside the opening and another end thereof having at least two conductive pieces. Both of the ends are fixedly attached to the spacing rings.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract: An integrated circuit device module comprises a printed circuit board having opposed sides, the printed circuit board comprising a portion carrying an area contact array on one of the sides of the printed circuit board. The module comprises an integrated circuit device having opposed, top and bottom surfaces, the bottom surface of the integrated circuit device comprising an area contact array for electrical communication with the area contact array on the printed circuit board.

Abstract: A method and apparatus for mounting a lidless semiconductor device. A lidless semiconductor device, such as a land grid array device comprising a substrate having a semiconductor die mounted thereon is disposed in a socket. The socket includes a plurality of resilient conductive members arranged in a predetermined contact array pattern for conductively coupling conductive contacts on a printed circuit board with corresponding contacts on the underside of the lidless semiconductor device. A first set of springs applies a predetermined force to the substrate to conductively couple the contacts on the substrate to the contacts on the printed circuit board via the conductive members of the socket. Another set of springs urges the bottom surface of a heat sink into thermally conductive abutting relation with the top surface of the semiconductor die. The pressure on the die is less than the pressure applied by the substrate so as to avoid damage to the semiconductor die.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: The present invention relates to a breaker apparatus and breaker unit. The breaker apparatus comprises a breaker unit including a power supply/cut-off breaker part, a power connecting part, a first unit connecting part, a ground connecting part and a second unit connecting part and further comprises a breaker unit mounting board including a mating power connecting part, a mating ground connecting part, a first connection mediating part and a second connection mediating part. This breaker apparatus is capable of constituting a power distributing apparatus with a necessary but minimized construction, and of extending the breaker unit in a minimum unit according to necessity. In addition, with this breaker apparatus, parts can be used in common irrespective of a change of a ground system, and further, can be replaced in the hot-line condition without cutting off the power supply to a system.

Abstract: A contact system is disclosed that includes a metal contact clip capable of being surface-mounted to a printed circuit board that facilitates the electrical coupling of the opposing conductive covers in a circuit card assembly having conductive enclosures with a reference potential, such as ground, on the printed circuit card which provide protection against electrostatic discharge (ESD) on the printed circuit card. The clip spans a cut-out region on the printed circuit card and includes opposing tabs the extend from the spanning portion for electrically contacting the conductive covers. The clip further includes geometries such as springs for exerting forces upon the conductive covers thereby providing a reliable contact interface with the conductive covers.

Abstract: A PC board support is disclosed to include a hollow support shell adapted to support a PC board above a frame, a spring mounted inside the support shell, the support shell having a top opening, a top neck, and a retainer head at the top of the top neck, and a slide supported on the spring inside the support shell and moved along a vertical sliding groove at the retainer head and top neck of the support shell in and out of the top opening to unlock/lock the PC board.

Abstract: The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In a preferred embodiment, a terminal is provided on the semiconductor device such that the capacitor can be electrically connected directly to the terminals, as by soldering or with conductive epoxy. Connecting the capacitor between terminals of a power loop provides superior noise and transient suppression. The very short path between the capacitor and the active circuit provides for extremely low inductance, allowing for the use of relatively small capacitors. The semiconductor device then is connected to an electronic device such as a PC board for further connection to other circuitry.

Abstract: A microelectronic component of sandwich construction, that includes a first substrate with a first conductor track plane and a second substrate with a second conductor track plane, between which many semiconductor chips are disposed. The contacting of the second conductor track plane to the adjacent surface of the semiconductor chips is effected by fixed contacting means, in particular with the soldered connections, an electrically conductive adhesive, or electrically conductive balls. The microelectronic components of the invention are suitable in particular as power components and can be used for instance in inverters. The invention also relates to a method for producing the microelectronic component.

Abstract: A power semiconductor module in which at least one semiconductor chip with which contact is made by pressure is electrically connected via a contact element to a main connection. The contact element has two planar contact surfaces, between which a spring element is located. Irrespective of the individual position and height of a chip, the respective spring element ensures a standard contact force. Overloading of the semiconductor chips when the module is being clamped in is prevented by ceramic supporting elements.

Abstract: A spring acts as a central conductor of a fifty ohm RF coax connector, while an aluminum backing of a microstrip module has a hole coaxially surrounding the spring. The resulting annular hole in the aluminum backing represents the outer coax conductor and the initial portion of a stripline circuit board. The machining of the aluminum backing creates a continuous ground path through the transition, thereby reducing the effects of radiation loss, and the need is fulfilled for a low loss, broadband RF solderless interconnect for solid-state systems requiring the quick removal and replacement of microstrip or stripline circuits.

Abstract: A card retention apparatus has an enclosure including an attachable cover. A connector having a card seated in the connector is mounted in the enclosure. A card retaining member is connected to extend from the enclosure into contact with the card. The card retaining member urges the card into seated engagement with the connector. A resilient member is mounted between the card retaining member and the cover for providing a retention force. The card retaining member is engaged with the card and moved into a biased position when the cover is mounted onto the enclosure, the movement to the biased position acting on the spring to establish a retention force that is applied on the card.

Abstract: In an electroconductive contact unit, a base end of a compression coil spring which may be either a contact member itself or a spring member for urging a needle-shaped contact member is received in a support recess formed in a base board. An end of the internal conductor of the base board is exposed on the bottom end of the support recess, and is electrically connected to the base end of the compression coil spring. There is no need for any electric connector, and the electric resistance between the internal conductor of the base board and the contact member can be minimized. To ensure a favorable electric connection, a base end of the compression coil spring may be soldered to the exposed end of the internal conductor which may be either flat or recessed.

Abstract: A computer has an internal chassis with four wall-like frame members located at its rectangular perimeter. A variety of electronic components are mounted to the chassis within the rectangular perimeter. A bezel is mounted to an outer portion of one of the frame members and forms an exterior rear panel of the computer. The chassis is sidably mounted within an integral, five-sided enclosure having a rectangular opening at its rearward end. The enclosure closely receives the chassis to eliminate relative movement therebetween. The bezel has an integral handle with a pair of tabs which engage recesses in the enclosure when the chassis is in the enclosure. The chassis is removed from the enclosure by lifting the handle on the bezel such that the tabs disengage the recesses in the enclosure to allow the chassis to slide out of the enclosure.

Abstract: A plunger stand-off assembly for securing a circuit board to a computer chassis without the need for tools. The plunger stand-off assembly includes an inner component, an outer component, and a spring for causing relative movement between the inner and outer components. The relative movement between the inner and outer components securely fastens the circuit board to the computer chassis.

Abstract: A shutter mechanism for an electrode pad attached card and a contact comprises a slider which can reciprocally move forwardly and backwardly in accordance with insertion and withdrawal of an electrode pad attached card. A contact guide groove is formed in the slider in such a manner as to extend in a direction of the reciprocal movement of the slider and adapted to guide a contacting projection of a contact. A release groove is formed in a bottom surface of the contact guide groove, the release groove having a smaller width than that of the guide groove and extending in the direction of the reciprocal movement of the slider. The release groove is in opposing relation with the contacting projection, a slip portion formed at an area in the vicinity of the contacting projection, the slip portion being resiliently contacted with a stepped portion formed along an opening edge of the release groove.

Abstract: An addressing apparatus and a corresponding method are described, such that addressing of network components, which are connected via a bus and which each have an address including a permanent base address and an offset address linked thereto, is accomplished with a device for transmitting the address via the bus. A coding device, insertable between the bus and a relevant network component, for defining the corresponding offset address using one or more predetermined coding signals generated thereby, is additionally provided. It is possible thereby to achieve a simple manner of addressing components (which preferably have identical functions and identical base addresses) that requires no manual action by the user on the components.

Abstract: An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to conductors of a second substrate. These conductors are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. These conductors are in contact with the dielectric member at only three locations before the dielectric is connected to the electronic package assembly and the conducting member. Ready separability of various parts of the assembly is thus assured.

Abstract: An electronic device has an opening for up to two data carrier devices or, respectively, chip cards with row-type contact surfaces positioned alongside one another. The devices or, cards are stackable over one another in offset fashion. In a region of the terminal side lying opposite the plug opening it comprises two rows of contact springs lying next to one another, said rows being spatially offset upwards by the height of a card, and also offset in the insertion direction in a manner corresponding to the card offset. The resilient ends at the plug side of these contact springs respectively contact the contact surfaces of inserted data carriers from above.

Abstract: An electrical arrangement including a circuitized substrate, the circuitized substrate having (i) a first substrate surface including a set of substrate contacts disposed thereon, and (ii) a second substrate surface including a set of input/output contacts disposed thereon. The electrical arrangement also includes a first die having (i) a first die surface including a set of first die contacts disposed thereon which is coupled to a first portion of the set of substrate contacts, and (ii) a second die surface configured to receive a second die. In the electrical arrangement, the set of substrate contacts includes a second portion of substrate contacts configured to be coupled to a set of second die contacts disposed on the second die and the circuitized substrate electrically interconnects the first portion and second portion of the set of substrate contacts and the set of input/output contacts to form a predetermined circuit.

Abstract: A ground path for microwave circuits positioned on carriers is provided. A ground path is provided between a first and second carrier coupled to respective microwave circuit substrates. The first and second carriers are coupled to a base, forming an opening between the first and second carriers. A conductive element is coupled to a first microstrip transmission line on the first substrate and a second microstrip transmission line on the second substrate. A conductive spring is then positioned in the opening in order to create a ground path. The microstrip transmission line may consist of alumina or a high-frequency plastic, such as Teflon or Duroid.RTM.. The conductive spring may consist of beryllium copper. A conductive rubber material may also be positioned in the opening, contacting the conductive spring and the base.

Abstract: A pressure-mountable, electro-mechanical assembly includes a housing which holds an integrated circuit chip in an open cavity; and, the housing has conductors that connect the chip to a pattern of metal pads on an exterior surface of the housing. A lid lies on the exterior surface of the housing, covers the cavity, and has terminal holes that match and expose the pattern of metal pads. Respective conductive springs are held in the terminal holes, contact the metal pads, and project from the lid. This lid operates as both a protective cover for the chip and a carrier for the springs.

Abstract: A spring button assembly is integrally formed with a casing for an electronic device. The spring button assembly includes a press button disposed facing an exterior of the casing, the PCB contact extension disposed facing an interior of the casing, and a resilient connector connecting the press button and the PCB contact extension to the casing. The casing can be molded with many different configurations of the spring button assembly, enabling the button to be placed far from its corresponding PCB contact including around complex geometry. The PCB contact extension may be configured to actuate a contact switch on the PCB or may be provided with a conductive surface to connect conductive traces on the PCB. In one arrangement, the PCB contact extension includes a cam surface adapted to engage a contact block for activating the PCB contact. In yet another arrangement, the button assembly includes components to be an LED indicator.

Abstract: A conductive strap configured to attach to a circuit board containing a component sensitive to electronmagnetic interference (EMI) and to slidably contact an enclosure having a conductive internal surface can reduce or eliminate EMI in an electronic device. The strap is positioned on the circuit board to shield the sensitive component from EMI. Slidable contact between the shielding strap and the enclosure internal surface renders the strap suitable for almost any enclosure configuration without any design modification.

Abstract: A case for microcircuit card reader, including a case body (1), an electronic circuit incorporated into the case body, a device for guiding the card and holding it in place, and a connector provided with elastic contact segments ensuring an electrical connection between the conductor elements of the card and the electronic circuit. It includes at least one elastic element (13, 55) for supporting the card by means of an elastic force.

Abstract: There is provided a display panel assembly structure capable of achieving a highly reliable connection even when fine-pitch electrode terminals are employed. A second electrode terminal is embedded in a flexible printed circuit board, and protrudes slightly from the flexible printed circuit board within a range of 0 to 2.times.10.sup.-3 mm. By embedding the second electrode terminal in the flexible printed circuit board, an apparent thickness of the second electrode terminal is reduced while keeping the rigidity of the second electrode terminal to thereby improve etching accuracy of a top surface thereof. With the reduction of the protrusion amount of the second electrode terminal, a ratio of a thickness of an anisotropic conductive film to a diameter of a conductive particle can be made to be approximately "1".

Abstract: The ball grid array package (10) uses a flexible base (30) having a substantially flat center plate (34) disposed at a first level coupled to a substantially flat base plate (32) disposed at a second level. The center plate (34) is coupled to the base plate (32) by a plurality of flexible narrow straps (36-38) arranged substantially surrounding the center plate (34). The flexible base (30) accommodates the thermal expansion in the pedestal (18) caused by the powered up integrated circuit (16) so that the rest of the package does not expand and induce stress in the solder joint between the ball grid array (12) and the printed circuit board (14).

Abstract: A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

Abstract: An electret microphone assembly, such as for a hearing aid comprises an electret microphone having a diaphragm and a charged plate, a substrate spaced from the charged plate, and a wire loop having first and second ends and a mid-portion. The first and second ends are secured to the substrate and the mid-portion is pressed against the charged plate. An amplifier is disposed on the substrate and has an input terminal coupled to the wire loop. Alternatively, an impedance matching circuit can be disposed on the substrate and coupled to the wire loop. A conductive bond containing silver particles further secures the wire loop mid-portion and the charged plate. In an alternative configuration the loop is dimensioned such that its mid-portion passes close to the charged plate without touching it. The conductive bond serves not only to form a rigid structure, but also serves as an electrical bridge to complete the circuit between the two elements.

Abstract: A circuit board (12) and electrical connector (10) mounted to an edge (18) thereof is disclosed. The circuit board (12) includes an edge (18) and two major surfaces (14, 16) extending therefrom having circuitry (20). Plated through holes (24) are arranged adjacent the edge and are interconnected to circuitry on the circuit board. Each plated through hole (24) is associated with an opening such as a slot (26) or partial slot (27) that is formed in the edge (18) of the board so that it intersects the hole. The posts (32) of the connector (10) extend into the openings (26, 27) preferably in interference fit therewith whereafter soldering completes the electrical connections of the posts to the through holes.

Abstract: An electric part holding device for holding an electric part or part carrier has a base having a polygonal electric part or carrier accommodation portion for receiving an electric part or carrier therein, and a plurality of semi-elliptic springs, one mounted on the base at each opposing corner portion of the accommodation portion or along opposite sides thereof, each spring being resiliently movable between an outwardly convexly curved shape and an inwardly convexly curved shape, each spring in the outwardly convexly curved shape lying across an upper surface of the base for leaving the accommodation portion open for insertion and removal of an electric part or carrier, and in the inwardly convexly curved shape extending across the accommodation portion for being engaged with a corner of an electric part or carrier positioned in the accommodation portion.