Abstract: An electrical assembly 100 is provided which includes a land grid array integrated circuit package 103, a socket 104, a printed circuit board 106 and a clamping lid 101. Socket 104 and clamping lid 101 have major surface dimensions no greater than the major surface dimensions of the LGA integrated circuit package 103 in order to limit board space requirements to the minimum required by the circuit package 103. Alignment means associated with integrated circuit package 103, socket 104 and printed circuit board 106 are provided to maintain alignment between contact pads 120 on circuit package 103 and first ends of compressible conductors 111 on socket 104 and between contact pads 122 on circuit board 106 and second ends of compressible conductors 111. In the completed assembly, clamping lid 101 applies pressure to an adjacent surface of integrated circuit package 103 thereby compressing compressible conductors 111 against contact pads 120 and contact pads 122.

Abstract: This invention is directed to a chip carrier system for mounting to a first planar electronic device, such as a motherboard or test fixture, where first planar electronic device is provided with a planar, electrical interconnection interface mounted thereto. The chip carrier system includes a frame comprising a peripheral body portion defined by upper and lower planar surfaces, a recess in the lower planar surface to receive the planar, electrical interconnection interface, a central recess terminating in a floor to receive a second planar electronic device, such as an integrated circuit chip, having leads extending therefrom, converging side walls extending from the upper planar surface down to the floor, and plural through slots for receiving the leads. Cooperating therewith is a force applying member adapted to provide a normal force to the second planar electronic device and be mechanically secured to the frame.

Abstract: A coupling connector relies on inductive and capacitive coupling over a length L.sub.c to "connect" signals from a first circuit card to a second circuit card. The coupling connector includes a flex circuit which in a connected state is compressed to provide a coupling length L.sub.c between the first and second circuit cards. A typical application is for coupling cards to a backplane having a plurality of parallel, signal carrying tracks. The near end of each coupling track is input to a receiver having an input impedance equal to the characteristic impedance of the coupling track. The far end of the coupling track is terminated by a resistor whose value equals the characteristic impedance of the coupling track.

Abstract: Electronic apparatus comprises a main circuit board, a transition board, and a first connector composed of a first part attached to the main circuit board at one edge thereof and a second part attached to the transition board at a first main face thereof, whereby when the first and second parts are engaged the transition board is substantially perpendicular to the main circuit board. The transition board is attached to a connector board so that the second main face of the transition board is in spaced substantially parallel confronting relationship with a first main face of the connect or board. A second connector is composed of a first part attached to the connector board at its first main face and a second part attached to the transition board at its second main face.

Abstract: A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication.

Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication.

Abstract: The invention is to a three dimensional circuit module constructed around a heat sink 10. A large integrated circuit component 21 such as a Micro Processing Unit for a computer is mounted over contact pads 27 on a printed wiring board 20. Also mounted to contact pads 27 on the printed wiring board are submodules 11, 12, 24, 25 that have wiring patterns interconnected to other circuit components 13-17, such as high power memory devices. The printed circuit submodules are mounted on the sides of the heat sink.

Abstract: A unitary heat sink and connector housing (10, 10', 10", 10"') is disposed between a pair of electrical members, such as printed circuit boards (11, 12, 31) and/or flexible etched circuits (32) in an overall assembly used in a variety of high-performance miniaturized electronic products. One or more flexible electrical connectors (21, 25, 26, 29, 30) are mounted within the unitary heat sink and connector housing (10, 10', 10", 10"') and provide a circuit interface between respective circuit elements or pads (13, 14) on the printed circuit boards (11, 12, 31) and/or flexible etched circuits (32), respectively. The unitary heat sink and connector housing (10, 10', 10", 10"'), which preferably has heat-radiating fins (20), is made from a material which is thermally conductive but electrically non-conductive. Examples of such a material are anodized aluminum, silicon dioxide and beryllium oxide. Any suitable ceramic material could be used.

Abstract: Disclosed is a means for connecting CPU boards to a radial-and-parallel system bus structure which is consisted of a stack of bus-printed disks whose centers are arranged on a common center axis. Each bus-printed disk comprises a disk of dielectric material bearing a printed radial pattern including a plurality of printed signal conductors radially extending from the center of the disk, and means to connect the end of each radial signal conductor to a selected lead in a selected one of said CPU boards standing upright around said stack of bus-printed disks. A connecting means according to the present invention comprises a plurality of receptacles fixed to the circumference of each disk. Each receptacle is connected at its rear end to the end of each radial signal conductor, and is adapted to detachably accept at its front a selected lead pin of each of said CPU boards. This arrangement facilitates the assembling and disassembling of a stack of disks.

Abstract: A flexible grounding element comprises a rectangular base portion, and a pair of side portions extending obliquely and upward from the edges of the base portion. Each of the side portions includes a pair of slots at the intermediate portion of its edges. One of the side portions bends toward the other one of the side portions at the location adjacent to the slot to form a bend portion. The front end of the bend portion bends upward to form an end portion which contactably touches the inner side of the other side portion. As the side portions are being pressed, a portion of each side portion will pass through the hole of a mother board, and as the side portions are released, the slots thereof will urge against the inner rim of the hole to effect positioning. Furthermore, each corner of the base portion has a flexible plate which includes a protrusion at the bottom thereof.