Grounding Construction Or Detail Patents (Class 361/799)
  • Patent number: 11930609
    Abstract: The present disclosure relates to a rear housing of a display device comprising a first portion corresponding to a first region of a backboard of the display device and a second portion corresponding to a second region of the backboard of the display device; the first portion comprises a top wall which circumferentially surrounds an annular side wall having a notch, and the side wall is provided with a terminal hole corresponding to a connection terminal on a mainboard of the display device; the second portion is provided on a notch side of the first portion, and the second portion comprises a central portion corresponding to the notch of the first portion, and side portions on opposite sides of the central portion, the central portion is provided with a connection wall covering the notch, and the connection wall is provided with a terminal hole corresponding to a connection terminal on the mainboard of the display device. The present disclosure also relates to a display device.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: March 12, 2024
    Assignees: Hefei BOE Vision-Electronic Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventor: Zuoyan Xi
  • Patent number: 11764459
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: September 19, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Juneseok Lee, Junsig Kum, Kwanghyun Baek, Dohyuk Ha, Jinsu Heo, Youngju Lee, Jungyub Lee
  • Patent number: 11744056
    Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee-Won Kang, Nam-Su Kim, In-Hyuk Ko, Eun-Ji Moon
  • Patent number: 11687129
    Abstract: In some embodiments an apparatus includes a housing that defines an interior. The apparatus includes a first circuit board that has multiple integrated circuits (ICs). The first circuit board is disposed within the interior of the housing. The apparatus includes a second circuit board that has multiple ICs. The second circuit board is also disposed within the interior of the housing. The apparatus further includes a first electromagnetic interference (EMI) shield disposed about an IC from the multiple ICs of the first circuit board and not disposed about remaining ICs from the multiple ICs of the first circuit board. The apparatus further includes a second EMI shield disposed about the first circuit board and not the second circuit board. The apparatus further includes a third EMI shield disposed about the first circuit board and the second circuit board.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: June 27, 2023
    Assignee: Management Services Group, Inc.
    Inventors: Thomas Scott Morgan, Brian Lee Yonker
  • Patent number: 11602088
    Abstract: A shield assembly includes a closing structure configured to be disposed over an opening of an enclosure. The closing structure includes an inner surface configured to face an inside of the enclosure when the closing structure is closed and a finger bracket structure mounted on the inner surface, the finger bracket structure having a bracket and one or more finger gaskets coupled to the bracket. An electromagnetic interference (EMI) shielded gasket disposed along a portion of the opening of the enclosure shields an edge of the opening of the enclosure or a radio frequency (RF) fence bracket coupled to a frame disposed around the opening of the enclosure creates a narrow path between the frame and the closing structure, the narrow path attenuating RF signals passing through the narrow path and shielding an edge of the opening of the enclosure.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: March 7, 2023
    Assignee: CAREFUSION 303, INC.
    Inventors: Michael Rahilly, Edward Stephen Ferner, Jr., Brendan John Burgess, Scott Riley, Michael Dugan Joyce, Noe Arroyo, Chris Pedersen
  • Patent number: 11036024
    Abstract: A method for manufacturing an intermittent bonding type optical fiber ribbon which is capable of forming non-connection portions and intermittent connection portions between adjacent coated optical fibers formed into an optical fiber ribbon by performing a laser processing for the ribbon through irradiation with a pulse laser light, thereby making it possible to rapidly form the intermittent connection portions and the non-connection portions while maintaining high linear velocity of the coated optical fiber. The non-connection portions and the intermittent connection portions are formed in the obtained intermittent bonding type optical fiber ribbon through the irradiation with the pulse laser light, so the intermittent bonding type optical fiber ribbon becomes the intermittent bonding type optical fiber ribbon, which is capable of securing operability during collective connection and surely being subjected to an intermediate branching without damaging cable characteristics during high density mounting.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: June 15, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiroki Tanaka, Kenji Yokomizo, Tomohiro Ishimura, Yutaka Hoshino, Masaki Iwama, Eisuke Otani, Shunichi Matsushita, Yoshihiro Arashitani, Takeshi Yagi
  • Patent number: 10910925
    Abstract: A circuit board for a motor unit equipped with a motor includes a substrate having a main surface being one of a pair of surfaces opposed to each other, and a back surface being another of the pair of surfaces, a magnetic detection element disposed in a predetermined region on an outer periphery side of the substrate on the main surface, and configured to output a detection signal in accordance with a position of a rotor of the motor, and a metal member formed between the outer periphery of the substrate and the magnetic detection element in the predetermined region on the main surface, and configured to receive a supplied ground voltage.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: February 2, 2021
    Assignee: MINEBEA MITSUMI INC.
    Inventors: Toshiaki Seima, Takeshi Ohara, Koichi Tamai, Haruomi Morohashi
  • Patent number: 10797388
    Abstract: A vehicle-mounted antenna device includes an antenna, an electronic component, a coaxial cable and a shielding member. The electronic component is electrically isolated from the antenna. The electronic component has a coaxial connector including an inner terminal and an outer terminal. The coaxial cable has one end connected to the coaxial connector. The shielding member is grounded to a vehicle body being ground. The shielding member is configured to block at least part of noise generated from the electronic component from reaching the antenna. The coaxial cable includes an inner conductor connected to the inner terminal and an outer conductor connected to the outer terminal. The electronic component is electrically connected to the shielding member via only the outer terminal.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: October 6, 2020
    Assignee: HARADA INDUSTRY CO., LTD.
    Inventor: Hajime Kiyokawa
  • Patent number: 10749300
    Abstract: Systems and methods are disclosed for a soft power start solution based on a two pin connector for a device such as a mobile terminal. When a charging pad of the device is first docked to a charging cradle, the charging pad of the device is connected to a plunger in a ground pin, but power is not applied at that moment. In a separate step, the plunger is shorted to a spring flat that allows power to be applied to the charging pad. Similar steps occur during de-docketing. With this method, contact interface burn caused by electrical arcing when docking or de-docking a mobile terminal from a charging cradle may be minimized.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: August 18, 2020
    Assignee: HAND HELD PRODUCTS, INC.
    Inventors: Wei Shi, ZhiQiang Liu, Kop Liu, Zhihua Dai
  • Patent number: 10622313
    Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 14, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Thomas A Kim, Chang Moo Jung, Kyung In Kang
  • Patent number: 10560136
    Abstract: An arrangement for determining a connected state of an antenna component with another component, such as a base unit of remote access unit in a wireless distribution system. The arrangement can include a filter block integrated into an antenna base unit that incorporates all or a part of a circuit configured to determine the connected state. The filter block can be a cavity filter block that provides a DC current path across the block.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: February 11, 2020
    Assignee: Corning Optical Communications LLC
    Inventor: Ronen Schwartzman
  • Patent number: 10379306
    Abstract: A rollable optical fiber ribbon includes a plurality of optical transmission elements, wherein each optical transmission element includes an optical core surrounded by a cladding of a different refractive index than the optical core, the cladding surrounded by a fiber coating layer, the fiber coating layer having an inner surface contacting the cladding and an outer surface defining an exterior surface of the optical transmission elements; and a coupling element coupled to and supporting the plurality of optical transmission elements in an array. The coupling element forms a chevron pattern and is formed from a flexible polymeric material such that the plurality of optical transmission elements are reversibly movable from an unrolled position in which the plurality of optical transmission elements are substantially aligned with each other to a rolled position.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: August 13, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Anne Germaine Bringuier, David Wesley Chiasson, Barada Kanta Nayak
  • Patent number: 10342167
    Abstract: A rearview assembly having a circuit board. A grounded heat sink is proximate the circuit board. A thermal pad is disposed between and in abutting contact with the circuit board and the grounded heat sink. An electromagnetic shield includes a plurality of spring tabs disposed about a periphery of the electromagnetic shield.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: July 2, 2019
    Assignee: GENTEX CORPORATION
    Inventor: David J. Bouwkamp
  • Patent number: 10185110
    Abstract: To improve identifiability of optical fiber ribbons, an exemplary optical fiber ribbon of the invention includes: at least three optical fibers arranged side by side; and a plurality of connection parts that each connect two adjacent ones of the optical fibers, the connection parts being provided intermittently in a length direction of the optical fibers and in a width direction of the optical fibers. A marking for identifying the optical fiber ribbon is provided to each optical fiber. The position, in the circumferential direction, of the marking provided to at least one of the optical fibers is different from the position, in the circumferential direction, of the marking provided to another optical fiber.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: January 22, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Soichiro Kaneko, Mizuki Isaji, Ken Osato
  • Patent number: 9844153
    Abstract: A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the main board and the inverter board. The bracket includes a shielding part to block electromagnetic waves, an inverter board holding part to allow the inverter board to be easily seated on the bracket, and a support and fixing part to support and fix the bracket. Further, a front cover and a back cover are connected in a snap-fit manner, and a bottom chassis includes a cable receipt groove to organize the internal wiring of the display device.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: December 12, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwang Sung Hwang, Hyung Suk Park
  • Patent number: 9559469
    Abstract: Provided is a connector whose miniaturization is easier than before. A connector includes a signal terminal as at least one first terminal having conductivity, a housing having insulating property and holding the signal terminal, a shell having conductivity and covering the housing, and an upper ground terminal as a second terminal having conductivity and a lower ground terminal as a third terminal having conductivity which are held by the housing so as to face each other via the signal terminal with a space left therebetween. Further, the upper ground terminal has a contact portion being in contact with a contact inner surface of the shell.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: January 31, 2017
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Hiroto Nishimori, Minoru Shinmyo
  • Patent number: 9323006
    Abstract: A protector is fixed to a housing in a state where a ferrule on which the protector is mounted is accommodated in a ferrule accommodation space of the housing, and thus a release of a locking state by a locking window and a fixing hook is regulated.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: April 26, 2016
    Assignee: YAZAKI CORPORATION
    Inventors: Kenichi Ikeya, Tomohiro Hikosaka, Keigo Tsubo
  • Patent number: 9258921
    Abstract: This disclosure relates to systems and methods for securing a port component of a user that receives a connection component to a remote device. The port component may be secured by a docking component that may include compressible features that apply a force to the port component to insure proper alignment or orientation to receive the connection component.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: February 9, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Brandon Michael Potens, Joshua Paul Davies, Andrew McIntyre, Angel Wilfredo Martinez
  • Patent number: 9128325
    Abstract: A display device has light sources located in a receptacle, where a lower interior walls part of the receptacle is formed of an electrically insulating material. The device includes a vertically extending grounding electrode extending to and physically affixed at one end to the interior walls part of the receptacle. This allows the light sources to be easily grounded by means of the grounding electrode.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: September 8, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Su-Young Yun, Young-Ho Lee, Jae-Hwan Chun, Young-Nam Kim
  • Patent number: 9066440
    Abstract: A side bracket for holding a housing in a rack is provided that includes a profile section with a vertical mounting plate that can be used to attach the profile section in a rack. The profile section includes a horizontal slide plate attached to the mounting plate, upon which slide plate a housing may be placed and moved in a sliding manner, and includes at least one retaining element with which a force acting in the horizontal direction from the profile section can be exerted on a side wall of the housing.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: June 23, 2015
    Assignee: dSPACE digital signal processing and control engineering GmbH
    Inventor: Robert Breicher
  • Patent number: 9007776
    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 14, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Chih-Hung Li, Cheng-Te Chen
  • Patent number: 8988894
    Abstract: An electronic device is provided. The electronic device includes a metal housing, a first opening, a first metal line, a first grounding point and a first current zero point. The first opening passes through the metal housing. The first metal line is disposed inside the first opening, wherein a first end of the first metal line is electrically connected to a side of the first opening, and a second end of the first metal line has a first feeding point. The first grounding point and the first current zero point are located on the side of the first opening. The metal housing forms a first loop antenna to transmit or receive a first radio frequency signal by a first excitation path from the first feeding point to the first grounding point.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: March 24, 2015
    Assignee: Acer Incorporated
    Inventor: Ching-Chi Lin
  • Patent number: 8952253
    Abstract: An enclosure includes a sidewall defining an opening through which a connector is to extend and a through hole, a resilient piece, and a sliding member slidably received in the through hole. The resilient piece includes a connecting piece slantingly extending from the sidewall between the opening and the through hole and a contacting piece connected to a distal end of the connecting piece. When the connector extends through the opening, The sliding member is slid toward the resilient piece to force the contacting piece to contact the connector.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: February 10, 2015
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei Huang, Lei Li
  • Patent number: 8933340
    Abstract: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: January 13, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboro Kato, Jun Sasaki
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Patent number: 8908376
    Abstract: Disclosed is an image display device which is provided with an image display panel (1), and a housing (2) which houses the image display panel (1). On the rear wall (22) of the housing (2), a socket (6), wherein the plug (71) of a power supply code (7) for supplying the image display panel (1) with power is to be fitted, is provided. On the rear wall (22) of the housing (2), a housing section (3) for housing the socket (6) is provided, and the housing section (3) is configured by bonding together a recessed section (4) provided in the rear wall (22) of the housing (2), and a cover body (5) that covers the opening (40) of the recessed section (4).
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: December 9, 2014
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Masayoshi Mukaide
  • Patent number: 8897032
    Abstract: A method and system for connecting a vertical printed circuit board with a horizontal printed circuit board where a contact device is biased in a first position when not contacting a vertical printed circuit board and is biased in a second position when the vertical printed circuit is coupled to the horizontal printed circuit board.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 25, 2014
    Assignee: Xirrus, Inc.
    Inventor: Abraham Hartenstein
  • Patent number: 8897019
    Abstract: There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: November 25, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Eiji Mugiya, Tetsuo Saji, Atsushi Tsunoda, Hiroshi Nakamura
  • Patent number: 8897028
    Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: November 25, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tadaji Takemura
  • Patent number: 8854832
    Abstract: Provided is a grounding structure of a high voltage secondary battery for a vehicle capable of securing stable ground potential of various electric devices included in the vehicle and reducing a risk factor that may be generated due to a potential difference by connecting a battery pack including a secondary battery and an inverter for the vehicle provided in the next generation vehicle such as a hybrid electric vehicle (HEV), an electric vehicle (EV), a plug-in hybrid electric vehicle (PHEV) to each other by a ground wire formed of an electric wire in order to allow a vehicle body and a battery pack to have equipotential.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: October 7, 2014
    Assignee: SK Innovation Co., Ltd.
    Inventor: Jongguk Yoon
  • Patent number: 8837169
    Abstract: An electromagnetic interference (EMI) shielding device includes first and second housing portions assembled along an assembly direction, at least two spaced-apart female fasteners fixed to one of the first and second housing portions, a plurality of male fasteners corresponding in number to the female fasteners and spacedly fixed to the other one of the first and second housing portions, and at least one grip member connected to one of the first and second housing portions. The grip member is applied with a force along the assembly direction or along a direction opposite to the assembly direction to engage or disengage the male and female fasteners.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 16, 2014
    Assignee: Wistron Corporation
    Inventors: Fu-Lung Lu, Yi-He Huang
  • Patent number: 8837117
    Abstract: The electrical card has power modules constituted by power components and by control components that are carried by strips fastened on a support plate comprising an electrical ground plate. The power components are connected firstly to control buses, and secondly to power buses carried by the support plate and extending in a layer adjacent to the electrical ground plate.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: September 16, 2014
    Assignee: Sagem Defense Securite
    Inventors: Etienne Merlet, Marie-Noëlle Besold-Etchechoury
  • Patent number: 8822843
    Abstract: A printed wiring board including a conductive layer, the conductive layer including a network of nanotubes with respective longitudinal axes, the nanotubes arranged such that their longitudinal axes are aligned substantially parallel to one another in a configuration such that electrical current passing through the conductive layer along a first axis substantially parallel to the longitudinal axes of the nanotubes experiences one degree of dissipation, and electrical current passing through the conductive layer along a second axis experiences a higher degree of dissipation.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: September 2, 2014
    Assignee: Nokia Corporation
    Inventors: Vladimir Ermolov, Markku Anttoni Oksanen, Martti Voutilainen
  • Patent number: 8797761
    Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: August 5, 2014
    Inventor: John Mruz
  • Patent number: 8797763
    Abstract: A shield structure for an electronic element, includes a ground pattern provided in a board; and a first member having electrical conductivity, covering the electronic element, and connected with the ground pattern.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: August 5, 2014
    Assignee: Fujitsu Limited
    Inventors: Naomi Fukunaga, Hisashi Yoshinaga, Junichi Ogou, Naofumi Kosugi
  • Patent number: 8792246
    Abstract: A device for protecting a circuit board from electromagnetic interference, and which includes shield to be attached to the circuit board. The device includes a metal plate and a plurality of tangs. The metal plate has a perimeter portion. The plurality of tangs are spaced about and extend transversely away from at least a portion of the perimeter portion of the metal plate. Each tang includes a bridge portion and a finger portion. The bridge portion has a first end attached to the perimeter portion and a second end spaced away from the perimeter portion and attached to the finger portion. The finger portion extends away from the second end of the bridge potion and is disposed at an obtuse angle relative to the bridge portion such that the plurality of tangs, in combination, are adapted to receive the circuit board.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: July 29, 2014
    Assignee: Fisher Controls International LLC
    Inventors: Scott R. Kratzer, Davin S. Nicholas, Barry L. Gaarder
  • Patent number: 8787031
    Abstract: The invention relates to a case 1 intended to be fixed in an electrical cabinet, said case comprising a frontal opening which can be closed by a means of closing 3, and further comprising means of fastening 5 making it possible to fix said case 1 in said electrical cabinet, in particular on a metal rail, and said case 1 further comprising (a) at least one anti-magnetic and/or anti-static protective means 4, (b) a re-writeable medium 2, 21 for storing computer data, which is protected by said anti-magnetic and/or anti-static protective means 4.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: July 22, 2014
    Assignee: Keter Technologies Europe
    Inventor: Binhas R. Hania
  • Patent number: 8780581
    Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: July 15, 2014
    Assignee: Apple Inc.
    Inventors: Nicholas G. L. Merz, Daniel W. Jarvis, Sawyer I. Cohen
  • Patent number: 8773867
    Abstract: A camera module is disclosed. The camera module in accordance with the present invention includes: a printed circuit board having a grounding pad formed on one surface thereof; a housing mounted on an upper side of the printed circuit board and including a lens inside thereof; a shield covering the housing in order to shield electromagnetic waves from an outside and having an opening cavity formed therein in correspondence with a location of the grounding pad; and a solder formed in the opening cavity and connecting the shield with the grounding pad.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: July 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Yong-Gu Kim
  • Patent number: 8767410
    Abstract: According to one embodiment, an electronic device is provided with: an electronic substrate on which electronic components are provided; a screw including a screw head portion and a threaded portion, and configured to be engaged to the electronic substrate; a conducting member provided between the screw head portion and the electronic substrate and configured to electrically connect the screw head portion and the electronic substrate; and an electrical wiring line provided between the screw head portion and the electronic substrate and configured so as not to be electrically connected to the screw head portion.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: July 1, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Nobuhiro Yamamoto, Tsuyoshi Kozai
  • Patent number: 8760885
    Abstract: An electronic device including a conductive element, a conductive layer, and a case is provided. The case has a surface, a first supporting member, and a second supporting member. The first supporting member and the second supporting member are disposed on the surface, and the first supporting member has a suspending arm. The case, the first supporting member and the second supporting member are integrally formed, and the conductive layer exists on the surface of the case, the first supporting member, and the second supporting member. The conductive element presses the first suspending arm to contact the second supporting member, such that a ground circuit is formed with the conductive element, the first suspending arm, the second supporting member, and the surface.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: June 24, 2014
    Assignee: Pegatron Corporation
    Inventors: Chien-Yi Lee, Ching-Jen Wang, Yu-Ti Kuo, Chun-Liang Chen
  • Patent number: 8760884
    Abstract: The present disclosure provides a portable information apparatus, including, an apparatus main body, an incidental article mounted on the apparatus main body when the portable information apparatus is used, a solid-state magnetic memory provided at a portion of the apparatus main body at which the incidental article is mounted and adapted to retain information in accordance with a magnetization state of a magnetic material, and a magnetic shield provided on the incidental article including a portion opposed to the solid-state magnetic memory when the incidental article is mounted on the apparatus main body.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: June 24, 2014
    Assignee: Sony Corporation
    Inventors: Hiroyuki Ohmori, Masanori Hosomi, Kazuhiro Bessho, Yutaka Higo, Kazutaka Yamane, Hiroyuki Uchida
  • Patent number: 8760876
    Abstract: A USB memory stick includes a metal shell structure defining opposing top opening and bottom opening and a locating hole, a PC board formed of a USB interface circuit and a memory chip package, and a tray, which includes a support panel supporting the PC board, a clip extended from one side of the support panel and clamped on the memory chip package of the PC board, a spring plate extended from the clip and pressed on the PC board against the support panel, and an oblique retaining leaf obliquely extended from the spring plate and engaged into the locating hole of the metal shell structure.
    Type: Grant
    Filed: February 25, 2012
    Date of Patent: June 24, 2014
    Assignee: Ho E Screw & Hardware Co., Ltd.
    Inventor: Joseph Huang
  • Patent number: 8755195
    Abstract: In described embodiments, a printed circuit board assembly capable of discharging electro-static discharge (ESD) surges includes an isolation trench track provided in the printed circuit board in close proximity to the peripheral edges between the peripheral edges and the mounting area, and a discharge path formed of conductive material to ground provided between the isolation trench track and the peripheral edges. The discharge path includes the board mounting screws and connects to a power connector ground of the printed circuit board.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: June 17, 2014
    Assignee: LSI Corporation
    Inventors: David Alan Savory, Joshua A. Johnson
  • Patent number: 8749991
    Abstract: An audio amplifier assembly connected to an automotive vehicle media system by a wiring harness is provided. The audio amplifier assembly includes an amplifier having a chassis, an electronic module attached to the chassis, and a cover attached to the chassis to cover the electronic module. A bracket having a base portion composed of a non-conductive material and a grounding portion composed of a conductive material. The base portion being attached to the amplifier at a first end and attached to the automotive vehicle at a second end to mount the amplifier to the automotive vehicle. The grounding portion extends between the first end and the second end to provide an electrically conductive grounding path between the amplifier and the automotive vehicle.
    Type: Grant
    Filed: May 10, 2010
    Date of Patent: June 10, 2014
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Eric John Zielinski, Erik Benavides
  • Patent number: 8739606
    Abstract: A gas tightness testing member disposed in an electronic device includes a first end, a second end, and a fluid channel penetrating from the first end to the second end. The second end of the gas tightness testing member is combined with the electronic device, and the first end is connected to a gas tightness testing device for performing a gas tightness test.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: June 3, 2014
    Assignee: Getac Technology Corporation
    Inventor: Kuang-Cheng Tai
  • Patent number: 8723047
    Abstract: A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or few wirings and interconnecting the outer surface layers by way of through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. The printed circuit board includes outer surface layers and two inner layers therebetween. The inner layers adjacent to the outer surface layers are used for arranging signal lines on an area basis; and the outer surface layers are arranged with no wiring or few wirings and are interconnected as a primary ground through vias. The invention also discloses a mainboard of a terminal product using the printed circuit board.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: May 13, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xiaolan Shen, Qingsong Ye, Konggang Wei
  • Patent number: 8711574
    Abstract: According to one embodiment, an electronic device includes a printed circuit board includes a plurality of circuit parts, a conductive shield case provided on the printed circuit board, a tuner provided on the printed circuit board and inside the shield case, a first ground portion provided on the printed circuit board and outside the shield case and a second ground portion provided on the printed circuit board and inside the shield case. The first ground portion is electrically connected to the second ground portion via the shield case.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: April 29, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masahiro Kobayashi, Noriaki Sakamoto
  • Patent number: 8693204
    Abstract: Multi-purpose cowling structures are provided to minimize spacing impact within an electronic device, while maximizing functional utility. In one embodiment, an electromagnetic interference shield may provide one or more anchors for enabling a logic board cowling to apply sufficient downward force to one or more board connectors to prevent inadvertent disconnects. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board. A compass mounted on a flexible printed circuit board is also provided. Mounting the compass on a flexible printed circuit board enables the compass to be mounted remote from ferrous object that may affect the compass's performance.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: April 8, 2014
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Jared Kole, Nikko Lubinski
  • Patent number: 8654541
    Abstract: Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: February 18, 2014
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Brian Joseph Robert, Ercan Mehmet Dede, Serdar Hakki Yonak