Abstract: An electrode structure combined with an antenna according to an embodiment of the present disclosure includes a substrate layer, sensing electrodes, a bridge electrode and an antenna unit. The sensing electrodes are arranged on the substrate layer, and include first sensing electrodes arranged along a first direction parallel to a top surface of the substrate layer, and second sensing electrodes arranged along a second direction parallel to the top surface of the substrate layer and intersecting the first direction. The bridge electrode connects the first sensing electrodes neighboring in the first direction. The antenna unit is disposed at the same layer as that of the bridge electrode, and includes a radiator overlapping the sensing electrodes in a planar view.

Abstract: To provide an on-vehicle brushless motor device capable of being downsized with respect to an axial direction of a rotor and a method of manufacturing the same. The on-vehicle brushless motor device 1 includes a brushless motor 10 and an electronic substrate 30. The brushless motor 10 includes a rotor 12 and a stator 16 including a plurality of coils 18 arranged around the rotor 12. The electronic substrate 30 includes a through hole 34 penetrating in the axial direction X of the rotor 12 and includes a substrate body 32 arranged along a plane P intersecting the axial direction X on the side opposite to the output shaft of the brushless motor 10, and a terminal 40 fixed on the surface of the substrate body 32 on the side opposite to the rotor 12. A coil wire 20 of the coil 18 is inserted into the through hole 34 and is welded to the terminal 40 on the opposite side of the rotor 12 with respect to the substrate body 32.

Abstract: Various embodiments of the present disclosure relate to an electronic device which may include: a circuit board; at least one electronic component mounted on the upper surface of the circuit board; at least one connector mounted on the upper surface of the circuit board and electrically connected to the circuit board or the at least one electronic component; and a conductive frame which includes a side wall surrounding a space, in which the at least one electronic component and the at least one connector are disposed, and an extension part extending from one end of the side wall into the space.

Abstract: An information handling system includes first and second printed circuit boards (PCBs), and first and second connectors. The first PCB includes a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces. The first connector is embedded within the first PCB, and extends from the first bottom surface toward the first top surface. A first height of the first connector is substantially equal to a first thickness of the first PCB. The second PCB includes a second top surface, a second bottom, and a second plurality of side surfaces extending between the second top and second bottom surfaces. The second connector is embedded within the second PCB, and extends from the second bottom surface toward the second top surface. A second height of the second connector is greater than a second thickness of the second printed circuit board.

Abstract: A fixing device for fixing a display card on a circuit board, includes a backplane and a support bracket. The backplane includes a substrate plate, and a first engaging part. The substrate plate is fixed on the display card. The first engaging part is disposed on the substrate plate. The support bracket includes at least one support leg and a second engaging part. The support leg includes a first end and a second end. The first end is connected with the circuit board. The second engaging part is connected with the second end and engaged with the first engaging part.

Abstract: A semiconductor package structure includes a substrate. The substrate includes a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. The first tooth has a first lateral side. The first lateral side of the first tooth is inclined relative to the side of the body in a top view of the first ground layer.

Abstract: Provided is a semiconductor device having excellent heat radiation performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening hole 21; a conductive cooling member 40 located above the conductive shield can 20; a heat conductive sheet 10 formed between the semiconductor element 30 and the conductive cooling member 40 at least through the opening hole 21; and a conductive member 11 electrically connecting the conductive shield can 20 and the conductive cooling member 40.

Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.

Abstract: In some embodiments an apparatus includes a housing that defines an interior. The apparatus includes a first circuit board that has multiple integrated circuits (ICs). The first circuit board is disposed within the interior of the housing. The apparatus includes a second circuit board that has multiple ICs. The second circuit board is also disposed within the interior of the housing. The apparatus further includes a first electromagnetic interference (EMI) shield disposed about an IC from the multiple ICs of the first circuit board and not disposed about remaining ICs from the multiple ICs of the first circuit board. The apparatus further includes a second EMI shield disposed about the first circuit board and not the second circuit board. The apparatus further includes a third EMI shield disposed about the first circuit board and the second circuit board.

Abstract: A printing apparatus includes a power-supply unit, a printing unit, a circuit board (main wired board), and a cooling unit. The main-wired-board cooling unit includes: an inflow portion including an inlet from which air outside of a housing flows in, the inflow portion being disposed on a rear surface of the housing; a first flow path in which the air flowing in flows to a front surface side of the housing; a turn-around flow path causing the air flowing in the first flow path to be turned around to a rear surface side of the housing; a second flow path in which the air turned around flows to the rear surface side; a flow-out portion including an outlet from which the air flowing through the second flow path flows out to an outside of the housing, the out portion being disposed at the rear surface; and a fan (main fan) causing the air to flow in from the inlet and also causing the air passing through each of the flow paths to flow out from the outlet.

Abstract: A card edge connector includes an insulative housing extending along a lengthwise direction, two rows of (contact) passageways formed in two opposite side walls with a central slot therebetween. Two rows of contacts are disposed within the corresponding passageways, respectively. The contacts include signal contacts and grounding contacts. Each side wall further forms an elongated channel by two sides of central wall under the central slot. A covering block is upwardly assembled into the corresponding channel after the corresponding contacts have been assembled into the corresponding passageways. Each block includes a deflectable latch engaged with the central wall. The covering block occupies at least one half of each passageway in the transverse direction perpendicular to the lengthwise direction. The covering block is optimally made of conductive plastic and forms a plurality of abutment ribs to respectively abut against the corresponding grounding contacts, respectively.

Abstract: The embodied invention is a bendable portable hard drive holder with four foldable arms, an adhering central element, a surface adhering element for attachment to a surface, and bendable metal in the 4 foldable arms. The invention is suited for portable use with a hard drive as the two adhering elements are separable, such as by use of a magnet or hook and loop attachment. The holder remains on the hard drive for improved convenience.

Abstract: Provided is a tuner module including: a casing body adapted to house a tuner module board on which a tuner function unit is formed; and at least one antenna connector fixed to the casing body and having a terminal portion of a center electrode connected to the tuner module board, in which the casing body includes a plate-like portion formed with a hole portion into which a screw member is inserted, and a plurality of protrusions is provided apart from each other at a peripheral portion of the hole portion.

Abstract: An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.

Abstract: A touch screen panel and display device having the same are disclosed. In one aspect, the touch screen panel includes a base layer, a noise shielding layer formed over a base layer, and a plurality of first touch sensors formed over the base layer. The touch screen panel further includes a plurality of second touch sensors formed over the base layer and electrically insulated from the first touch sensors. The second touch sensors cross the first touch sensors. The touch screen panel also includes a first pad part electrically insulated from and overlapping the noise shielding layer, wherein the first pad part comprises a plurality of signal pads. The touch screen panel further includes a plurality of touch signal lines respectively electrically connecting the signal pads to the first and second touch sensors.

Abstract: Examples described include composite nanofibers sheets that have been “infiltrated” with a polymer (i.e., the polymer has flowed past a surface of the nanofiber sheet and into at least some of spaces within the sheet defined by the nanofibers). An adhesive nanofiber tape is formed when the infiltrating polymer is an adhesive and the adhesive infiltrates the nanofiber sheet from a one major surface of the nanofiber sheet. In other described examples, some portions of nanofibers in the sheet have been conformally coated with at least one metal layer.

Abstract: A cassette for insertion and removal of an edge-connected printed circuit card connectable to a server chassis is disclosed. The cassette includes a housing comprising a bottom wall having at least one elongated slot and a catch formed thereon. The cassette further includes a connector sub-assembly overlying the bottom wall having an edge connector socket formed thereon and configured to receive the edge-connected printed circuit card. The cassette further includes a guide sub-assembly underlying the bottom wall having a spring latch formed thereon. The spring latch is operable in a first state to engage the catch to prevent movement of the connector sub-assembly and the guide sub-assembly relative to the housing. The spring latch is operable in a second state to clear the catch to permit the connector sub-assembly and the guide sub-assembly to slide in unison in the at least one elongated slot.

Abstract: Provided is an electronic apparatus including a printed board having on a front surface thereof a first region and a second region in each of which a circuit element is disposed, and a shield member formed by a single metal sheet and disposed such as to face the front surface of the printed board. The shield member has a first section that faces the first region and a second section that faces the second region, and at least a boundary section of the first section and the second section is electrically connected to a ground pattern of the printed board, the ground pattern being formed between the first region and the second region.

Abstract: This relates to correcting the actual absolute capacitance values of electrodes of non-optimized geometric shapes that are connected to electronic circuits. To correct the actual absolute capacitance values, a prediction model can first be determined by carrying out nonlinear regression on the basis of actual values of absolute capacitance values from the electrodes and from a probability density image from idealized electrodes for a plurality of object positions. The prediction model can then be applied to the actual absolute capacitance values to obtain a probabilities densities image for the actual absolute capacitance values, considered to be corrected absolute capacitance values used for the detection of the object.

Abstract: Provided herein are a heat sink module of an inverter module to power an electric vehicle. The heats sink module can include a heat sink body having a plurality of mounting holes, a fluid inlet and a fluid outlet. The heats sink module can include a cooling channel that can be fluidly coupled with the fluid inlet and the fluid outlet. The heats sink module can include an insulator plate having a first surface and a second surface. The second surface of the insulator plate can couple with a joining surface of the heat sink body to seal the cooling channel. The heats sink module can include a heat sink lid disposed over the insulator plate. The heat sink lid can have a plurality of mounting feet to couple with the mounting holes of the heat sink body to secure the heat sink lid to the heat sink body.

Abstract: A two-piece bumperband and clamshell assembly for protecting a smartphone subhousing. The bumperband comprise an impact resistant band of material that encircles peripheral edges of the subhousing. The bumperband includes an inwardly facing groove or channel structure that enables the bumperband to clamp against either or both a display screen bezel of the subhousing and the stepped ridge on the edges of the subhousing. The bumperband may also include a raised screen bumper protruding above and to protect the surface of the display screen. A downwardly protruding perimeter flange of the bumper band forms a perimeter gap to frictionally receive an upwardly protruding lip extending around the perimeter a clamshell backing when press-fitted with the subhousing and bumperband.

Abstract: A television enclosure system includes a housing including a rear bezel and a front bezel coupled to the rear bezel, a gasket on the front wall of the front bezel, a panel held within the front bezel with the gasket between a front wall of the front bezel and the panel, at least one retaining bracket connected to a side wall of the front bezel, and at least one bezel clip coupled to the at least one retaining bracket and configured to engage the panel to compress the gasket.

Abstract: The invention, which relates to an arrangement (1) for the active suppression of interference signals, addresses the problem of specifying an arrangement (1) for the active suppression of interference signals, with which the reliable and secure compensation of the EMC interferences is achieved, which has a lower installation space requirement, generates less interference emission and is cost-effective of production. This problem is resolved thereby that beneath the main circuit board (12) disposed on the surface of the housing (10) a recess (14) is disposed and that in this recess (14) a circuit board (15) for the active EMC filter (4) is emplaced.

Abstract: An electronic device housing of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate, and metal side plates folded and integrally connected to the bottom plate, in which, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member, and the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M).

Abstract: A system includes a shield for a low noise amplifier. The shield includes a top and one or more walls extending from the top defining a cavity. The shield further comprises at least one conducting member extending outwardly from the top and within the cavity. The shield may enclose an amplifier circuit and improve its signal-to-noise ratio.

Abstract: Devices and methods related to packaging of radio-frequency (RF) devices on ceramic substrates. In some embodiments, a packaged electronic device can include a ceramic substrate configured to receive one or more components. The ceramic substrate can include a conductive layer in electrical contact with a ground plane. The packaged electronic device can further include a die having an integrated circuit and mounted on a surface of the ceramic substrate. The packaged electronic device can further include a conformal conductive coating implemented over the die to provide shielding functionality. The packaged electronic device can further include an electrical connection between the conformal conductive coating and the conductive layer.

Abstract: A cover assembly for on-board electric equipment includes a cover body and a connector including a terminal and a connector housing. The cover body includes a ferrous base metal body, and a Zn-based plating layer formed on a surface of the base metal body. The cover body has a through hole formed through the base metal body and the plating layer. The terminal is passed through the through hole and electrically connected to an electric circuit. The connector housing is formed on the cover body so as to surround the terminal. A laser mark is formed on the cover body. The laser mark has a circular shape about the through hole and penetrates the plating layer to the base metal body. The connector housing extends to the base metal body through the plating layer within the laser mark.

Abstract: A touch screen panel and display device having the same are disclosed. In one aspect, the touch screen panel includes a base layer, a noise shielding layer formed over a base layer, and a plurality of first touch sensors formed over the base layer. The touch screen panel further includes a plurality of second touch sensors formed over the base layer and electrically insulated from the first touch sensors. The second touch sensors cross the first touch sensors. The touch screen panel also includes a first pad part electrically insulated from and overlapping the noise shielding layer, wherein the first pad part comprises a plurality of signal pads. The touch screen panel further includes a plurality of touch signal lines respectively electrically connecting the signal pads to the first and second touch sensors.

Abstract: A power converter for converting an input voltage into a predetermined voltage. The power converter includes a housing including a conductive portion. At least two capacitors are electrically connected to the conductive portion. A transformer, which is configured to serve as a choke coil, includes a winding and a core surrounding the winding with a portion of the winding being exposed from the core. The winding includes a lead that is led out from the exposed portion of the winding to the exterior of the transformer. The at least two capacitors, the lead, and the conductive portion of the housing form a loop circuit together. At least part of the exposed portion of the winding overlaps an internal region of the loop circuit, in a front view of the transformer as seen from a direction in which the lead is led out from the exposed portion of the winding.

Abstract: According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.

Abstract: Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.

Abstract: A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.

Abstract: A transceiver module having a partitioned housing, e.g., a bifurcated or multi-segment housing, is disclosed that allows coupling and alignment of a TOSA arrangement and ROSA arrangement in separate respective portions in order to minimize or otherwise reduce component damage and rework iterations during manufacturing and repair. Technicians may thus perform at least partial assembly and testing of each optical subassembly arrangement in parallel and in relative isolation without necessarily interrupting and/or waiting on completion of the other. In a general sense, each separate portion of the partitioned housing provides a dedicated workspace of about equal dimension for coupling of subassembly components. Each separate portion may lie flat on a tabletop, for instance, which may further simplify manufacturing processes and provide a wide-range of acceptance angles for performing soldering, welding, insertion and coupling of components, visual inspection, fiber routing, and so on.

Abstract: An accessory device used with an electronic device is disclosed. The accessory device may provide a protective cover for the electronic device. The accessory device may include a first part and a second part. The accessory device may also include one or more detection mechanisms, some of which may be used to determine whether the first part and the second part are properly aligned with respect to each other. Further, the detection mechanisms may generate an indication whether the first and second parts are properly aligned. The detection mechanism may be in communication with the electronic device such that the electronic device can receive the indication. In this manner, the indication may cause the electronic device to generate and present a message on a display of the electronic device. The message may provide a statement whether the parts are properly aligned.

Abstract: Electronic devices and associated methods are shown including a connector mounted to a printed circuit board (PCB). Examples shown include a number of ground vias passing through the PCB to a second side of the PCB, wherein the number of ground vias is smaller than a number of ground sites. Selected examples include an optoelectronic connector mounted using surface mount technology.

Abstract: A case for an electronic device includes a front member having an aperture for interacting with a touchscreen of the electronic device and a back member that includes a rechargeable power cell, a switched electrical interface, an electromechanical switch, and current monitoring circuitry. The switched electrical interface has an enabled mode in which electrical current is permitted to flow from the rechargeable power cell of the case to the installed electronic device and a disabled mode in which the electrical current is not permitted to flow to the installed electronic device. The electromechanical switch transitions the switched electrical interface from the disabled mode to the enabled mode. The current monitoring circuitry automatically toggles the switched electrical interface from the enabled mode to the disabled mode when the magnitude of the electrical current flowing from the case to the electronic device decreases to a predetermined value.

Abstract: A printer management system includes one or more printing devices having a printing area for printing according to a digital file, an access area through which a user may access the printing area, and a locking mechanism configured to lock the access area preventing access to the printing area. A management server is communicatively coupled to the one or more printing devices over a communication network and is configured to receive a print request from one or more user devices or one of the one or more printing devices to print the digital file, transmit the digital file to one of the one or more printing devices, and transmit commands to lock and unlock the locking mechanism of the one or more printing devices. In one embodiment the management system is configured to update a printing status of each of the one or more printing devices.

Abstract: An electronic device includes a circuit board, a heat sink and thermal gel. The circuit board has an electronic component, which is mounted to a first principal surface of the circuit board. The heat sink has an opposing surface, which is opposed to the first principal surface of the circuit board. The thermal gel is filled between the circuit board and the heat sink to cover the electronic component. The circuit board has through-holes. At least a portion of each through-hole is formed in a bonding range, to which the thermal gel is bonded. The through-holes enable visual recognition of the thermal gel through the through-holes.

Abstract: Methods and apparatus for a dual polarized thumbtack radiator having enhanced dissipation. In embodiments, a power divider resistor for a balun is coupled directly to ground plane blocks that provide a RF shield. An attachment mechanism, such as a screw secures the thumbtack assembly to an aperture plate and provides thermal and electrical connection.

Abstract: Novel assemblies for use in conjunction with RF shielded enclosures and the like include one or more RF power and signal filters connectibly inserted, attached to, or otherwise made a part of optimized cavities or receptacles formed within an optimized frame of the assembly. The use of optimized cavities or receptacles greatly reduces the number of exterior fasteners needed to connect filters to the assembly or the assembly to an enclosure which, in turn, reduces leakage. The optimized cavities or receptacles may be arranged in a compact manner in order to make optimum use of the available space on an optimized frame of the assembly.

Abstract: A cover plate used for an electronic device is provided. The cover plate includes a plate and a conductive layer. The plate has two surfaces opposite to each other and a lateral surface connected between the two surfaces. The lateral surface of the plate is framed by the conductive layer which is electrically connected to a ground end of the electronic device. The disclosure further provides an electronic device including the cover plate and a main body. The main body is disposed within the electronic device and electrically connected to the conductive layer.

Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

Abstract: An RF interference suppressor for satellite receivers and more specifically those that employ the MOCA standard is provided. The RF interference suppressor shields the connection point of the center conductor of the F-connector to the PC board from spurious signals emanating from the high speed digital portions of the receiver. In addition, the RF interference suppressor shield includes a tab portion that encompasses the threaded portion of the F-connector and operates to shield the path for RF interference resulting from the gap between the F-connector body and the inner shield wall of the receiver.

Abstract: A camera module according to an exemplary embodiment of the present invention includes a PCB (Printed Circuit Board) mounted with an image sensor, a housing mounted therein with camera parts and configured to protect the image sensor, and one or more sheets of lenses mounted at the housing, wherein the a window of the one or more sheets of lenses is formed with an IR (infrared) filter.

Abstract: An electronic device including a metal casing and a covering structure is provided. The metal casing has a first opening. The covering structure includes a cover and a conductive component. The cover is assembled to the metal casing and covers the first opening, wherein the cover has at least one hole. The conductive component is fixed to the cover and has at least one contacting portion, wherein the contacting portion passes through the hole and contacts the metal casing, and an electromagnetic wave is adapted to pass through the conductive component to be transmitted to the metal casing.

Abstract: A connection assembly is described. The connection assembly has a substrate having at least two electrically conductive structures, a housing, which is connected to the substrate on the bottom by an adhesive fastening, the housing has a plug receptacle having at least two plug contacts, the plug contacts are connected to at least two contact pads via electrical conductors, and the contact pads connected in an electrically conducting fashion to the electrically conductive structures, the angle between the plug-in direction into the plug receptacle and the bottom of the housing lying between 15° to 90°.

Abstract: An electrostatic discharge (ESD) blocking component is set forth for a computing device. The computing device can include a housing formed of non-conducting material and an overlaying display assembly supported by the housing. The display assembly can further include a plurality of display elements such as thin film transistors (TFTs) interconnected by corresponding metallic traces. The ESD block is used to block static charges associated with an ESD event so that essentially no ESD event related static charge is accumulated on the metallic traces thereby preventing ESD related damage to the plurality of TFTs.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: A shielding device and an electronic device having the same are disclosed. The shielding device is disposed on a circuit board for covering an electronic component. The shielding device comprises a first case and a second case. The first case comprises a first limiting structure and a second limiting structure. The second case is mounted on the circuit board and includes a frame and a first slot. The frame forms an opening. When the first case is connected with the second case, the second limiting structure can move along a first direction to a bottom of the frame and is prevented from moving along a second direction. The first slot corresponds to the first limiting structure to allow the first limiting structure to be inserted into the first slot along the first direction and the first limiting structure is prevented from moving along the second direction.

Abstract: A casing for containing electronic equipment includes a casing member of the metal plate having an opening; a closing member for closing the opening; a first inclined plate portion provided at an edge of the opening, the first inclined plate portion being inclined relative to a plate portion of the casing member and being provided by bending the casing member; a second inclined plate portion provided at a edge of the closing member, the second inclined plate portion being provided by bending the closing member, and the second inclined plate portion being opposed to the first inclined plate portion when the closing member is mounted to close the opening; and an elastic member having an electroconductivity and provided compressed between the first inclined plate portion and the second inclined plate portion.