Abstract: An electronic device includes a substrate and a layer of superconducting material disposed over the substrate. The layer of superconducting material includes a first wire and a loop that is (1) distinct and separate from the first wire and (ii) capacitively coupled to the first wire while the loop and the first wire are in a superconducting state.

Abstract: An electronic device includes a substrate and a layer of superconducting material disposed over the substrate. The layer of superconducting material includes a first wire and a loop that is (i) distinct and separate from the first wire and (ii) capacitively coupled to the first wire while the loop and the first wire are in a superconducting state.

Abstract: A semiconductor memory includes a first plane that includes a first memory cell array, a second plane that includes a second memory cell array, and a control circuit that includes a first circuit configured to store a first priority for a first operation performed on the first plane and a second circuit configured to store a second priority for a second operation performed on the second plane, and is configured to control the first and second operations based on the first priority and the second priority. When a value of the second priority is higher than a value of the first priority, the control circuit controls the first operation such that a timing of a process executed in the first operation does not overlap with a timing of a process executed in the second operation.

Abstract: An electronic device (e.g., a superconducting memory cell) includes a substrate and a layer of superconducting material disposed over the substrate. The layer of superconducting material is patterned to form a plurality of distinct instances of the layer of superconducting material including: a first wire; and a loop that is (i) distinct and separate from the first wire and (ii) capacitively coupled to the first wire while the loop and the first wire are in a superconducting state. The loop is configured to form a persistent current via the capacitive coupling in response to a write current applied to the first wire while the loop and the first wire are in the superconducting state. The persistent current represents a logic state of the electronic device.

Abstract: A memory array includes a plurality of twin cells, each of the twin cells composed of a first storage element and a second storage element configured to hold binary data according to a difference in threshold voltage between them, the first storage element and the second storage element each being electrically rewritable. Upon receiving a request to read the twin cell, when the threshold voltage of the first storage element forming the twin cell is lower than an erasure determination level and the threshold voltage of the second storage element forming the twin cell is lower than the erasure determination level, an output circuit masks the data stored in the twin cell and outputs the masked data.

Abstract: According to one embodiment, a nonvolatile memory device includes a first electrode, a second electrode, a variable resistance layer. The variable resistance layer is provided between the first electrode and the second electrode. The variable resistance layer contains impurity of a nonmetallic element. The impurity is at least one selected from the group consisting of S, Se, Te, F, Cl, Br, and I.

Abstract: Some embodiments include a memory cell that has an electrode, a switching material over the electrode, a buffer region over the switching material, and an ion reservoir material over the buffer region. The buffer region includes one or more elements from Group 14 of the periodic table in combination with one or more chalcogen elements. Some embodiments include methods of forming memory cells.

Abstract: Methods for reducing location-based variations in the switching characteristics of memory cells within a memory array are described. In some cases, the resistance of an embedded resistor within each memory cell may be set to reduce the overall variation in series resistances for the memory cells within a memory array. For example, embedded resistors associated with far-far bits may be set to a lower resistance than embedded resistors associated with near-near bits. An embedded resistor may comprise a layer of polysilicon within a memory cell. Selective ion implantation may be used to reduce the embedded resistor resistance for memory cells within a particular region of the memory array and to form two or more different sets of embedded resistors within the memory array.

Abstract: A resistance change memory has a resistance change device and a control circuit for controlling application of voltage to the resistance change device. The resistance change device has a first electrode, a second electrode, and a resistance change layer interposed between the first electrode and the second electrode. A material for the second electrode includes one of members selected from the group consisting of W, Ti, Ta, and nitrides thereof. During forming of the resistance change device, the control circuit performs a second forming treatment succeeding to a first forming treatment. The first forming treatment includes application of voltage such that the potential of the first electrode is higher than the potential of the second electrode. The second forming treatment includes application of voltage such that the potential of the second electrode is higher than the potential of the first electrode.

Abstract: A vertically oriented thin film transistor (TFT) having a tunnel barrier is disclosed. The tunnel barrier may be formed from a dielectric such as silicon oxide or hafnium oxide. The vertically oriented TFT selection device with tunnel barrier may serve as a selection device in a 3D memory array. The vertically oriented TFT may be used to connect/disconnect a global bit line to/from a vertical bit line in a 3D memory array. The vertically oriented TFT may be used to connect/disconnect a source line to/from a channel of a vertical NAND string in a 3D memory array. A vertical TFT with tunnel barrier has a high breakdown voltage, low leakage current, and high on current. The tunnel barrier can be at the top junction or bottom junction of the TFT.

Abstract: Some embodiments include a memory cell that has an electrode, a switching material over the electrode, a buffer region over the switching material, and an ion reservoir material over the buffer region. The buffer region includes one or more elements from Group 14 of the periodic table in combination with one or more chalcogen elements. Some embodiments include methods of forming memory cells.

Abstract: Systems and methods are disclosed to control interactivity with a video gaming system. The system includes a game console and a controller that is configured to be held in a plurality of handhold orientations. The controller further includes a handle that extends between a first end and a second end along a length axis and an input feature disposed at the first end. The input feature includes sensors to detect manipulations that cause a relative movement between the input feature and the handle. The manipulations that are detected include torque applied to the input feature about the length axis. Where the detected manipulation are relayed to the game console where the game console correlates the detected manipulation into control of the video game. The gaming system can be primarily executed through a local game console, or the game console (or computing device), can communicate to remote servers, over the internet, to processes primary execution.

Abstract: A resistance change element including a first electrode; a second electrode; and an oxide film, including an oxide of the first electrode, formed at sides of the first electrode and sandwiched between the first electrode and the second electrode in a plurality of regions, wherein at least one of the regions includes a resistance part whose resistance value changes in accordance with a voltage applied to the first and second electrodes.

Abstract: A phase change memory device includes a memory cell array, a register unit and a control unit. The memory cell array includes a plurality of phase change memory cells. The register unit includes a circular queue. The control unit receives a write address and a write data in a write mode, programs the write data in a phase change memory cell corresponding to the write address among the plurality of phase change memory cells, provides the write address and the write data to the register unit, and outputs a write complete signal before a phase of the phase change memory cell is stabilized or after the phase of the phase change memory cell is stabilized based on a logic level of a first result signal received from the register unit. The phase change memory device increases a programming speed.

Abstract: A memory device comprising: a plurality of magnetoresistive random access memory (MRAM) cells arranged in rows and columns, each MRAM cell comprising a magnetic tunnel junction and a select transistor, one end of the magnetic tunnel junction being electrically coupled to the source of the select transistor; a plurality of word lines, each word line connecting MRAM cells along a row via the gate of their select transistor; a plurality of bit lines, each bit line connecting MRAM cells along a column, each bit line connecting the MRAM cells via the drain of their select transistor; wherein the memory device further comprises a plurality of source lines, each source line connecting MRAM cells along a row; and wherein each source line connecting the MRAM cells via the other end of the magnetic tunnel junction.

Abstract: A nonvolatile semiconductor memory device (100) comprises a substrate (102) provided with a transistor (101); a first interlayer insulating layer (103) formed over the substrate to cover the transistor; a first contact plug (104) formed in the first interlayer insulating layer and electrically connected to either of a drain electrode (101a) or a source electrode (101b) of the transistor, and a second contact plug (105) formed in the first interlayer insulating layer and electrically connected to the other of the drain electrode or the source electrode of the transistor; a resistance variable layer (106) formed to cover a portion of the first contact plug; a first wire (107) formed on the resistance variable layer; and a second wire (108) formed to cover a portion of the second contact plug; an end surface of the resistance variable layer being coplanar with an end surface of the first wire.

Abstract: The junction comprising a stack of at least two magnetic layers, a first layer, for example a soft magnetic layer with controllable magnetization, and a second layer, for example a hard magnetic layer with fixed magnetization, the magnetization of the soft layer being described by a uniform magnetic moment, the dynamic behavior of the junction being modeled by an equivalent electrical circuit comprising at least two coupled parts: a first part representing the stack of the layers, through which a current flows corresponding to the polarized current flowing through said layers whose resistance across its terminals depends on three voltages representing the three dimensions of the magnetic moment along three axes, modeling the tunnel effect; a second part representing the behavior of the magnetic moment, comprising three circuits each representing a dimension of the magnetic moment by the three voltages, each of the three voltages depending on the voltages in the other dimensions and on the voltage across the t

Abstract: The present invention uses a ferromagnetic thin wire having a domain wall inside, with the magnetic moment at the center thereof being perpendicular to the longitudinal axis of the thin wire. With the domain wall being fixed by a domain wall fixation device (e.g. antiferromagnetic thin wires) so that the domain wall is prevented from moving in the ferromagnetic thin wire, when a direct current is supplied, the magnetic moment rotates in the immobilized domain wall. This rotation of the moment can be detected by a TMR element or the like. This configuration of the ferromagnetic thin wire element can be directly used to create a microwave oscillator or magnetic memory.

Abstract: A resistive memory device includes a resistive memory cell array, an output circuit and an input circuit. The resistive memory cell array includes a plurality of memory cells that are coupled to bitlines. The output circuit generates a sensing output signal during a write operation by sensing a bitline voltage, and generates output data during a read operation by sensing the bitline voltage. The input circuit controls the bitline voltage based on input data for the write operation, and limits the bitline voltage in response to the sensing output signal during the write operation. The memory cells are protected by effectually limiting bitline voltage.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a substrate, a stacked body, a semiconductor pillar, a charge storage film, and a drive circuit. The stacked body is provided on the substrate. The stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films. A through-hole is made in the stacked body to align in a stacking direction. The semiconductor pillar is buried in an interior of the through-hole. The charge storage film is provided between the electrode film and the semiconductor pillar. The drive circuit supplies a potential to the electrode film. The diameter of the through-hole differs by a position in the stacking direction. The drive circuit supplies a potential to reduce a potential difference with the semiconductor pillar as a diameter of the through-hole piercing the electrode film decreases.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array includes a stacked body, a through-hole, a semiconductor pillar, and a charge storage film. The stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films. The through-hole is made in the stacked body to align in a stacking direction. The semiconductor pillar is buried in the through-hole. The charge storage film is provided between the electrode films and the semiconductor pillar. Memory cells are formed at each intersection between the electrode films and the semiconductor pillar.

Abstract: A method and apparatus for repairing a stuck-at defect condition in a non-volatile memory cell, such as a spin-torque transfer random access memory (STRAM). In some embodiments, a resistive sense element has a magnetic tunneling junction (MTJ) and a repair plane located adjacent to the resistive sense element. The repair plane injects a magnetic field in the MTJ to repair a stuck-at defect condition.

Abstract: A magnetic memory device includes a magnetic tunnel junction having a free magnetic layer having a magnetization orientation that is switchable between a high resistance state magnetization orientation and a low resistance state magnetization orientation and a memristor solid state element electrically coupled to the magnetic tunnel junction. The memristor has a device response that is an integrated voltage versus an integrated current.

Abstract: In one embodiment of the invention, a fuse element for a one time programmable memory may include carbon nanotubes coupled to a first transistor node and to a second transistor node. The carbon nanotubes may have a first resistance which may be changed upon programming the memory cell with low current levels.

Abstract: Systems, circuits and methods for determining read and write voltages for a given word line transistor in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. A first voltage can be supplied to the write operations so that the write operations occur in the saturation region of the word line transistor. A second voltage, which is less than the first voltage, can be supplied for read operations so that the read operations occur in the linear region of the word line transistor.

Abstract: A memory cell includes a plug-type first electrode in a substrate, a magneto-resistive memory element disposed on the first electrode, and a second electrode disposed on the magneto-resistive memory element opposite the first electrode. The second electrode has an area of overlap with the magneto-resistive memory element that is greater than an area of overlap of the first electrode and the magneto-resistive memory element. The first surface may, for example, be substantially circular and have a diameter less than a minimum planar dimension (e.g., width) of the second surface. The magneto-resistive memory element may include a colossal magneto-resistive material, such as an insulating material with a perovskite phase and/or a transition metal oxide.

Abstract: After a digit line is charged to a power supply voltage by turn-on of a first switching element, the first switching element is turned off and a second switching element is turned on, whereby the digit line is connected to a ground voltage. Similarly, in order to feed data write current, a bit line is charged to a data voltage in accordance with write data through a third switching element. Then, the bit line is connected to a voltage different from the data voltage by a fourth switching element while the third switching element is turned off. Therefore, a load current from a power supply to an MRAM device is supplied during charging of a digit line capacitance and a bit line capacitance, without being consumed when the data write current flows. Consequently, a peak of the load current supplied from the power supply is suppressed.

Abstract: An superconductive article and method of forming such an article is disclosed, the article including a substrate and a layer of a rare earth barium cuprate film upon the substrate, the rare earth barium cuprate film including two or more rare earth metals capable of yielding a superconductive composition where ion size variance between the two or more rare earth metals is characterized as greater than zero and less than about 10×10?4, and the rare earth barium cuprate film including two or more rare earth metals is further characterized as having an enhanced critical current density in comparison to a standard YBa2Cu3Oy composition under identical testing conditions.

Abstract: A PCRAM cell has a high resistivity bottom electrode cap to provide partial heating near the interface between the cell and the bottom electrode, preventing separation of the amorphous GST region from the bottom electrode, and reducing the programming current requirements.

Abstract: After a digit line is charged to a power supply voltage by turn-on of a first switching element, the first switching element is turned off and a second switching element is turned on, whereby the digit line is connected to a ground voltage. Similarly, in order to feed data write current, a bit line is charged to a data voltage in accordance with write data through a third switching element. Then, the bit line is connected to a voltage different from the data voltage by a fourth switching element while the third switching element is turned off. Therefore, a load current from a power supply to an MRAM device is supplied during charging of a digit line capacitance and a bit line capacitance, without being consumed when the data write current flows. Consequently, a peak of the load current supplied from the power supply is suppressed.

Abstract: An SRAM cell with gate tunneling load devices. The SRAM cell uses PFET wordline transistors and NFET cross-coupled transistors. The PFET wordline transistors are fully conductive during read operations, thus a full voltage level is passed through the PFET to the high node of the cell from the bitline. Tunnel current load devices maintain the high node of the cell at full voltage level during standby state.

Abstract: A peripheral circuitry is provided adjacent to a memory array and conducts read and write operations from and to the memory array. A power supply voltage line and a ground line for supplying an operating voltage to the peripheral circuitry supply a power supply voltage and a ground voltage, respectively. The power supply voltage line and the ground line are arranged so that a magnetic field generated by a current flowing through the power supply voltage line and a magnetic field generated by a current flowing through the ground line cancel each other in the memory array.

Abstract: When a potential of a power supply line varies according to a flowing current, the gate-source voltage Vgs of a transistor also varies, leading to variations in the constant current between each source follower. In order to solve this problem, a potential Vb of the gate terminal of a transistor as a constant current source is changed in the same manner as a power supply line Vss which is connected to the source terminal of the transistor. Therefore, variations in the constant current are suppressed and variations in the output of the source followers are thus suppressed. In addition, by connecting the circuit having source followers to the output side of a signal line driver circuit, it can be prevented that luminance unevenness of a striped pattern is recognized in a display portion of a semiconductor device.

Abstract: A clock-generating circuit for forming internal clock signals by comparing a signal obtained by delaying, through a variable delay circuit, an input clock signal input through an external terminal with the input clock signal through a phase comparator circuit, and so controlling the delay time of the variable delay circuit that they are brought into agreement with each other, wherein the clock-generating circuit and an internal circuit to be operated by the clock signals formed thereby are formed on a common semiconductor substrate, and an element-forming region in which the clock-generating circuit is formed is electrically isolated from an element-forming region in which the digital circuit is constituted on the semiconductor substrate relying upon the element-isolation technology. The power-source passages, too, are formed independently of other digital circuits.

Abstract: A method and magnetic device for improving the desirable properties of a magnetic device, e.g., magnetization uniformity and reproducibility. Moreover the invention provides magnetic cells that are more magnetically homogeneous, with smaller amount of end domain magnetization canting from the average cell magnetization direction. The invention may provide a magnetic memory cell with less variation in switching fields, more spatially coherent dynamical magnetic properties for high speed and processional or coherent magnetic switching, and higher signal due to the increased uniformity. It may provide a magnetic sensor with more spatially coherent magnetic properties for high speed and processional or coherent magnetic switching, and increased signal. It may provide a read head element with more spatially coherent magnetic properties for high speed and processional or coherent magnetic sensing, and increased signal.

Abstract: A program unit includes two program cells having an electric resistance varying according to a magnetization direction thereof. These program cells are magnetized in the same direction in initial state, that is, non-program state. In program state, the magnetization direction of one of the program cells selected according to program data is changed from the initial state. One-bit program data and information of whether the program unit stores program data or not can be read based on two program signals generated according to the electric resistances of the two program cells.

Abstract: A memory cell with at least two detectable states among which is an unprogrammed state, comprising, in series between two terminals of application of a read voltage, at least one first branch comprising: a pre-read stage comprising, in parallel, two switchable resistors having different values with a first predetermined difference; and a programming stage formed of a polysilicon programming resistor, a terminal of the programming resistor being accessible by a programming circuit capable of causing an irreversible decrease in its value.

Abstract: A magnetoresistive random access memory (MRAM) is embedded with another circuit type. Logic, such as a processing unit, is particularly well-suited circuit type for embedding with MRAM. The embedding is made more efficient by using a metal layer that is used as part of the interconnect for the other circuit also as part of the MRAM cell. The MRAM cells are all written by program lines, which are the two lines that cross to define a cell to be written. Thus, the design is simplified because there is commonality of usage of the metal line that is used for one of the program lines for the MRAM and for one of the interconnect lines for the logic.

Abstract: A method and structure for a memory cell comprising a phase change material; a heating element in thermal contact with the phase change material, wherein the heating element is adapted to induce a phase change in the phase change material; and electrical lines configured to pass current through the heating element, wherein the phase change material and the heating element are arranged in a configuration other than being electrically connected in series. The memory cell further comprises a sensing element in thermal contact with the phase change material, wherein the sensing element is adapted to detect a change in at least one physical property of the phase change material, wherein the sensing element is adapted to detect a change in a thermal conductivity of the phase change material.

Abstract: A program unit includes two program cells having an electric resistance varying according to a magnetization direction thereof. These program cells are magnetized in the same direction in initial state, that is, non-program state. In program state, the magnetization direction of one of the program cells selected according to program data is changed from the initial state. One-bit program data and information of whether the program unit stores program data or not can be read based on two program signals generated according to the electric resistances of the two program cells.

Abstract: A peripheral circuitry is provided adjacent to a memory array and conducts read and write operations from and to the memory array. A power supply voltage line and a ground line for supplying an operating voltage to the peripheral circuitry supply a power supply voltage and a ground voltage, respectively. The power supply voltage line and the ground line are arranged so that a magnetic field generated by a current flowing through the power supply voltage line and a magnetic field generated by a current flowing through the ground line cancel each other in the memory array.

Abstract: This invention relates to an MRAM array architecture which incorporates certain advantages from both cross-point and 1T-1MTJ architectures during reading operations. The fast read-time and higher signal to noise ratio of the 1T-1MTJ architecture and the higher packing density of the cross-point architecture are both exploited by using a single access transistor to control the reading of multiple stacked columns of MRAM cells each column being provided in a respective stacked memory layer.

Abstract: A memory array is provided with first MTJ memory cells arranged in alternate rows and second MTJ memory cells arranged in other alternate rows and each having a layout inverted in a Y direction with respect to the first MTJ memory cell. In each memory cell column, first and second transistor gate interconnections are arranged in the Y direction. In the first MTJ memory cell, a gate of a transistor provided as an access element is connected to the first transistor gate interconnection. In the second MTJ memory cell, a gate of a transistor provided as an access element is connected to the second transistor gate interconnection.

Abstract: A magnetic memory configuration stores data and avoids ageing effects. The memory configuration contains a cell array containing magnetic memory cells disposed along a first direction and a second direction crossing the former, a multiplicity of electrical lines along the first direction, and a multiplicity of electrical lines along the second direction. The magnetic memory cells in each case are disposed at crossover points of the electrical lines. A first current supply device supplies respectively selected electrical lines along the first direction with current. A second current supply device supplies respectively selected electrical lines along the second direction with current. The second current supply device is configured for setting the direction of the current in accordance with an information item to be written. The first current supply device is suitable for changing over the direction of the current as desired.

Abstract: A peripheral circuitry is provided adjacent to a memory array and conducts read and write operations from and to the memory array. A power supply voltage line and a ground line for supplying an operating voltage to the peripheral circuitry supply a power supply voltage and a ground voltage, respectively. The power supply voltage line and the ground line are arranged so that a magnetic field generated by a current flowing through the power supply voltage line and a magnetic field generated by a current flowing through the ground line cancel each other in the memory array.

Abstract: A tunneling magneto-resistance element forming an MTJ memory cell is connected between a bit line and a strap. In each memory cell column, the strap is shared by the plurality of tunneling magneto-resistance elements in the same row block. The access transistor is connected between strap and ground voltage, and is turned on/off in response to a corresponding word line. Storage data is read from the selected memory cell based on a comparison between results of data reading effected on a memory cell group coupled to the same strap before and after application of a predetermined magnetic field to the selected memory cell.

Abstract: A nonvolatile semiconductor memory device includes a silicon substrate, bit lines, word lines, and memory cells. The bit line is positioned above the main surface of the silicon substrate and the word line is provided to intersect the bit line. The memory cell is positioned at a region where the bit line and the word line intersect and has one end electrically connected to the bit line and the other end electrically connected to the word line. The memory cell includes a TMR element and an access diode electrically connected in series. The access diode includes an n-type silicon layer and a p-type silicon layer recrystallized by melting-recrystallization and has a pn junction at the interface between the n-type silicon layer and the p-type silicon layer. As a result, a nonvolatile semiconductor memory device reduced in size and having high performance can be manufactured inexpensively.

Abstract: A program unit includes two program cells having an electric resistance varying according to a magnetization direction thereof. These program cells are magnetized in the same direction in initial state, that is, non-program state. In program state, the magnetization direction of one of the program cells selected according to program data is changed from the initial state. One-bit program data and information of whether the program unit stores program data or not can be read based on two program signals generated according to the electric resistances of the two program cells.

Abstract: A synchronized mirror delay circuit is used to generate an internal clock signal from an external clock signal applied to the synchronized mirror delay. The internal clock signal is then coupled through a clock tree, and a feedback signal is generated that is indicative of the propagation delay of the internal clock signal through the clock tree. The feedback signal is applied to the synchronized mirror delay to allow the synchronized mirror delay to delay the internal clock signal by a delay interval that compensates for the propagation delay in the clock tree. A lock detector may be used to initially generate the internal clock signal directly from the external clock signal. A fine delay circuit that delays the internal clock signal in relatively fine increments may be used to couple the internal clock signal to the clock tree.

Abstract: A single electron device. Fabricated from nanoparticle derivatives, particularly from Au and fullerene nanoparticle derivatives, the device reduces thermal fluctuation in the nanoparticle array and has 15 nm of spacing between two electrodes.