Abstract: A memory device uses a global input/output line or a pair of complementary global input/output lines to couple write data signals and read data signals to and from a memory array. The same input/output line or pairs of complementary global input/output lines may be used for coupling both write data signals and read data signals.

Abstract: The present disclosure relates to a semiconductor memory device and a method of operation the semiconductor memory device, which sets an encoding value by sequentially defining ranges used for recognizing distribution of memory cells based on a middle range and then performing a read operation in an order from the middle ranges to an outermost range, thereby capable of using infinite ranges for recognizing the distribution of the memory cells without addition of a circuit to an inside of the semiconductor memory device.

Abstract: Methods and systems are disclosed for making temperature-based adjustments to bias conditions for non-volatile memory (NVM) cells to improve performance and product lifetime of NVM systems. System embodiments include integrated NVM systems having an NVM controller, a bias voltage generator, and an NVM cell array. Further, the NVM systems can store temperature-based bias condition information in storage circuitry. The disclosed embodiments select and apply bias conditions for the NVM cells based upon temperature measurements.

Abstract: A data write circuit of a semiconductor apparatus includes a plurality of latches configured to latch a plurality of data in response to activation of a plurality of control signals and output the latched data to data lines; and a control unit configured to generate the plurality of control signals to be activated at different timings, such that partial data input at relatively earlier timing among the plurality of data is latched at earlier timing than the other data by a portion of the plurality of latches.

Abstract: A memory device is provided which includes a memory circuit that allows a circuit which carries out a refresh operation to suitably carry out an original operation of the circuit even if an off-leakage current occurs in a transfer element used in a transfer section. A memory cell includes a switching circuit, a first retaining section, a transfer section, a second retaining section, a first control section, and a voltage supply, and the first control section is controlled to be in (i) a state in which the first control section carries out a first operation in which the first control section is in an active state or a non-active state and (ii) a state in which the first control section carries out a second operation.

Abstract: A semiconductor memory device includes memory cells arranged at regions where word lines and bit lines cross each other; a randomizing and de-randomizing circuit configured to perform a first randomizing operation on data to be programmed to the memory cells, based on a seed value, so as to generate first randomized data; a data reading/writing circuit configured to perform a second randomizing operation on the first randomized data using a data inverting operation so as to generate second randomized data and program the second randomized data to the memory cells; and a control logic configured to control the randomizing and de-randomizing circuit and the data reading/writing circuit.

Abstract: A method and a system are provided for performing write assist. Write assist circuitry is initialized and voltage collapse is initiated to reduce a column supply voltage provided to a storage cell. A bitline of the storage cell is boosted to a boosted voltage level that is below a low supply voltage provided to the storage cell and data encoded by the bitline is written to the storage cell.

Abstract: A semiconductor device may include an internal circuit configured to perform write operations in response to each of a plurality of write commands, wherein the plurality of write commands are sequentially input to the internal circuit, a first pulse generation unit configured to generate a first pulse activated during a first delay amount in response to a write command, a second pulse generation unit configured to generate a second pulse activated during the first delay amount in response to a delayed write command out of the plurality of write commands after a second delay amount from the activation time of the first pulse, and a transfer control unit configured to prevent commands other than the plurality of write commands from being transferred to the internal circuit during a sum of the activation period of the first pulse and the activation period of the second pulse.

Abstract: A method and apparatus for controlling writing of data to a graphic memory is provided. In the method and apparatus, a plurality of consecutively input data pieces are controlled to be not consecutively written to the same memory area in terms of time or space.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes a circuit with first and second inputs and an output. The circuit is configured to combine (add or subtract) input signals. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the circuit, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the circuit.

Abstract: A self-timed memory includes a plurality of write timer cells. A reference write driver circuit writes a logic low value to a true side of the write timer cells. Each write timer cell includes a pullup transistor whose gate is coupled to an internal true node. Self-timing is effectuated by detecting a completion of the logic value write at a complement side of the write timer cells and signaling a reset of the self-timer memory in response to detected completion. To better align detected completion of the write in write timer cells to actual completion of a write in the memory, a gate to source voltage of the write timer cell pullup transistor is lowered by increasing a lower logic level voltage at the internal true node in connection with driver circuit operation to write a low logic state into the true side of the write timer cell.

Abstract: A system and method for reducing write amplification while maintaining a desired level of sequential read and write performance is disclosed. A controller in a multi-bank flash storage device may receive host data for writing to the plurality of flash memory banks. The controller may organize the received data in multi-page logical groups greater than a physical page and less than a physical block and interleave writes of the host data to the memory banks with that striping factor. A buffer RAM is associated with each bank of the multi-bank memory where the buffer RAM is sized as equal to or greater than the size of the multi-page logical group.

Abstract: A magnetic random access memory is configured as a read/write memory and at least a first section of the magnetic random access memory is configured to be converted to a read only memory.

Abstract: A variable resistance nonvolatile memory device includes a memory cell array, a memory cell selection circuit, a write circuit, and a read circuit. The read circuit determines that a selected memory cell has a short-circuit fault when a current higher than or equal to a predetermined current passes through the selected memory cell. The write circuit sets another memory cell different from the faulty memory cell and located on at least a bit or word line including the faulty memory cell to a second high resistance state where a resistance value is higher than a resistance value in the first high resistance state, by applying a second high-resistance write pulse to the other memory cell.

Abstract: A semiconductor device which is capable of high-speed writing with less power consumption and suitable for multi-leveled memory, and verifying operation. A memory cell included in the semiconductor device included a transistor formed using an oxide semiconductor and a transistor formed using a material other than an oxide semiconductor. A variation in threshold value of the memory cells is derived before data of a data buffer is written by using a writing circuit. Data in which the variation in threshold value is compensated with respect to the data of the data buffer is written to the memory cell.

Abstract: An integrated driver system is disclosed. The driver system includes decoding logic and a driver portion. The decoding logic is configured to receive select signals and data signals. The driver portion is configured to generate driver signals according to the decoded signals.

Abstract: A semiconductor device includes at least one memory cell die. The at least one memory cell die includes a data storage unit. The at least one memory cell die includes at least one read assist enabling unit electrically connected to the data storage unit. The at least one read assist enabling unit configured to lower a voltage of a word line. The memory cell die also includes at least one write assist enabling unit electrically connected to the data storage unit. The at least one write assist enabling unit configured to supply a negative voltage to at least one of a bit line or a bit line bar.

Abstract: A fuse circuit includes a program unit and a sensing unit. The program unit is programmed in response to a program signal and outputs a program output signal in response to a sensing enable signal. The sensing unit outputs a sensing output signal based on the program output signal and the sensing output signal indicates whether the program unit is programmed or not. The program unit includes an anti-fuse cell, a selection transistor, a program transistor and a sensing transistor. The anti-fuse cell includes at least two anti-fuse elements which are connected in parallel and are respectively broken down at different levels of a program voltage.

Abstract: A pulsed dynamic LCV circuit for improving write operations for SRAM. The pulsed dynamic LCV circuit includes voltage adjustment circuitry having a plurality of selectable reduced supply voltages and timing adjustment circuitry having a plurality of selectable logical state transition timings for adjustably controlling the voltage and timing of a transition from a selected reduced supply voltage back to a nominal supply voltage. The voltage adjustment circuitry has a plurality of selectable transistors that when individually selected have a cumulative effect to pull the reduced supply voltage down further. The timing adjustment circuitry has a plurality of selectable multiplexers that when individually selected for a delayed voltage transition have a cumulative effect to delay return of voltage supplied to SRAM from a reduced supply voltage to a nominal supply voltage.

Abstract: An integrated driver system is disclosed. The driver system includes decoding logic and a driver portion. The decoding logic is configured to receive select signals and data signals. The driver portion is configured to generate driver signals according to the decoded signals.

Abstract: A program pulse generation circuit includes: a set pulse generator configured to apply a set pulse to an output node in response to a driving signal, a set pulse control signal, and a first switching signal, and a current controller configured to control step reductions forming the set pulse in response to the driving signal and a second switching signal.

Abstract: A semiconductor memory storage device comprises an array of storage devices including a plurality of rows of the storage devices and a plurality of columns of the storage devices, a first plurality of write ports, a write select signal coupled to the write ports, a plurality of write port address lines coupled as input to each of the write ports, and a first plurality of word line select circuits coupled to receive an address signal and the write select signal for each of the write ports and to provide a single selected write word line signal to a respective one of the rows of the storage devices for one of the first plurality of write ports activated by the write select signal.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes: a memory cell array in which a plurality of NAND cell units are arranged, the NAND cell units including a plurality of memory cells, and select gate transistors, the memory cell including a semiconductor layer, a gate insulating film, a charge accumulation layer, and a control gate; and a control circuit. The control circuit adjusts a write condition of each of the memory cells in accordance with write data to each of the memory cells and memory cells adjacent to the memory cells within the data to be written.

Abstract: An object is to provide a semiconductor device with a novel structure, which can hold stored data even when power is not supplied and which has an unlimited number of write cycles. The semiconductor device is formed using a memory cell including a wide band gap semiconductor such as an oxide semiconductor. The semiconductor device includes a potential change circuit having a function of outputting a potential lower than a reference potential for reading data from the memory cell. When the wide band gap semiconductor which allows a sufficient reduction in off-state current of a transistor included in the memory cell is used, a semiconductor device which can hold data for a long period can be provided.

Abstract: Various aspects of a fast, energy efficient write driver capable of efficient operation in a dual-voltage domain memory architecture are provided herein. Specifically, various aspects of the write driver described herein combine a high speed driver with voltage level shifting capabilities that may be implemented efficiently in reducing use of silicon area while using lower power. The write driver circuit shifts or adjusts voltage levels between a first voltage domain to a second voltage domain. In one example, the write driver circuit is coupled to a global write bitline and a local write bitline that is coupled to one or more bitcells (of SRAM memory). The write driver circuit converts a first voltage level at the global write bitline to a second voltage level at the local write bitline during a write operation.

Abstract: A semiconductor memory includes a word line driver and a negative voltage generator. The word line driver includes a first inverter configured to drive a word line at one of a first voltage supplied by a first voltage source and a second voltage supplied by a second voltage source. The negative voltage generator is configured to provide a negative voltage with respect to the second voltage to an input of the first inverter in response to a control signal for performing at least one of a read or a write operation of a memory bit cell coupled to the word line.

Abstract: A memory device includes a memory array comprising a including of memory cells, and control circuitry coupled to the memory array. The control circuitry includes write signal generation circuitry configured to provide a write clock signal for controlling writing of data to portions of the memory array, with timing of the write clock signal being determined at least in part utilizing a parallel combination of two or more additional memory cells external to the memory array. The parallel combination of additional memory cells may comprise a mini-array that includes centrally-located active memory cells surrounded by dummy memory cells. In an arrangement in which the write signal generation circuitry includes a clock latch, the parallel combination of additional memory cells may be coupled between a clock output of the clock latch and a reset input of the clock latch.

Abstract: An operating method for a memory device and a memory array and an operating method for the same are provided. The operating method for the memory device comprises following steps. A memory device is made being in a set state. A method for making the memory device being in the set state comprises applying a first bias voltage to the memory device. The memory device in the set state is read. A method for reading the memory device in the set state comprises applying a second bias voltage to the memory device. A recovering bias voltage is applied to the memory device. The step for applying the recovering bias voltage is performed after the step for applying the first bias voltage or the step for applying the second bias voltage.

Abstract: A desired current through a carbon nano tube (CNT) element of a CNT memory device can be controlled by a wordline voltage, and a voltage on the CNT common node can be held constant.

Abstract: A control method for at least one memory cell is disclosed. The memory cell includes a transistor and a resistor. The resistor is connected to the transistor in series between a first node and a second node. In a programming mode, the memory cell is programmed. When it is determined that the memory cell has been successfully programmed, impedance of the memory cell is in a first state. When it is determined that the memory cell has not been successfully programmed, a specific action is executed to reset the memory cell. The impedance of the memory cell is in a second state after the step resetting the memory cell. The impedance of the memory cell in the second state is higher than that of the memory cell in the first state.

Abstract: A method comprises writing data to one or more static random access memory (SRAM) cells. Writing data to the one or more SRAM cells comprises applying a first data signal to at least one bit line electrically connected to the one or more SRAM memory cells, electrically disconnecting at least one of a first power supply terminal and a second power supply terminal of each of the one or more SRAM cells from a power supply and applying a word line signal to a word line electrically connected to the one or more SRAM cells. Thereafter, the at least one of the first power supply terminal and the second power supply terminal of each of the one or more SRAM cells is electrically connected to the power source.

Abstract: A semiconductor memory device includes an internal signal generation unit configured to output a column select signal and a write enable signal in response to an external address, a write circuit unit configured to output internal data corresponding to external data in response to the write enable signal, a core unit configured to store the internal data in response to the column select signal, and an output timing control unit configured to control output timings of the internal signal generation unit and the write circuit unit in response to an external command, an internal synchronization signal, and preamble related information.

Abstract: A semiconductor memory device includes: a data transfer line coupled with a plurality of memory cell arrays corresponding to an address; an enable signal delayer configured to generate an enable signal by reflecting a delay amount corresponding to the address into an internal command signal corresponding to a column command; and a data exchange block configured to exchange data with the data transfer line in response to the enable signal.

Abstract: A semiconductor memory device comprises a memory cell array comprising a plurality of memory cells, and a filling command determiner that receives a command signal and an address signal and determines whether the command signal corresponds to a filling command. Upon determining that the command signal corresponds to a filling command, the filling command determiner connects a first source voltage to a bitline and connects a second source voltage to a complementary bitline corresponding to the bitline. The bitline is connected to a selected memory cell corresponding to the address signal.

Abstract: A write assist circuit includes a first switch, a second switch and a bias voltage circuit. The first switch connects a cell supply voltage node of a memory cell to a power supply voltage node in response to a write control signal having a first state, and disconnects the cell supply voltage node from the power supply voltage node in response to the write control signal having a second state. The bias voltage circuit generates, at an output thereof, an adjustable bias voltage lower than the power supply voltage. The second switch connects the cell supply voltage node to the output of the bias voltage circuit in response to the write control signal having the second state, and disconnects the cell supply voltage node from the output of the bias voltage circuit in response to the write control signal having the first state.

Abstract: According to various embodiments, a write control circuit configured to control writing to a memory cell by applying a writing current to the memory cell may be provided. The write control circuit may include: a current application circuit configured to apply the writing current to the memory cell; a determination circuit configured to determine whether writing to the memory cell is finished; and a stop writing circuit configured to cut off the writing current from the memory cell if it is determined that writing to the memory cell is finished.

Abstract: A write-tracking circuit for a writable memory array has one or more dummy memory cells and is configured to write different values to the one or more dummy memory cells. Durations of pulses applied to word lines of the memory array during write operations are controlled based on durations of writing the different values to the one or more dummy memory cells. In at least some embodiments, the write-tracking circuit is configured to write the different values to the one or more dummy memory cells during a single write operation. In at least some embodiments, the write-tracking circuit is configured to write the different values to at least one of the one or more dummy memory cells during different write operations.

Abstract: An output driver circuit includes an on/off-timing control circuit that outputs first and second driving signals based on an input data signal, such that the transition of the second driving signal is faster than the transition of the first driving signal when the input data signal transitions from high level to low level, and the transition of the second driving signal is slower than the transition of the first driving signal when the input data signal transitions from low level to high level. The output driver circuit is further provided with pull-down and pull-up pre-drivers that output pull-down and pull-up signals, respectively, in accordance with the first and second driving signals. The output driver circuit is further provided with pull-down and pull-up main drivers that pull down and pull up the voltage of an output terminal, respectively, in accordance with the pull-down signal and the pull-up signal.

Abstract: A semiconductor device includes: a memory cell array comprising a plurality of blocks each comprising a memory cell arranged at an intersection between a word line and a bit line; and a block state information storing unit configured to store state information of the respective blocks. The block state information storing unit stores lock state information to partially limit access to each of the blocks in response to a power-up signal.

Abstract: For selecting anti-fuses in a semiconductor memory device, a decoder block may be enabled to receive selection information for selecting the anti-fuses. The selection information is decoded in the decoder block to select at least one of the anti-fuses. Target operation is performed on the selected anti-fuses. The decoder block is disabled.

Abstract: A pulse-based memory read-out device, including: a pulse generator at a first end of a bit line and a detector at a second end of the bit line. The pulse generator is configured to send an electrical pulse along the bit line from the first end of the bit line. The detector is configured to: detect the electrical pulse at the second end; and output a digital signal representing a current state of a selected memory cell in the bit line, wherein the digital signal is based on an amplitude of the electrical pulse at the second end.

Abstract: Embodiments of a memory are disclosed that may allow for a negative boost of data lines during a write. The memory device may include a data input circuit, an address decode circuit and a plurality of sub-arrays. Each of the sub-arrays may include a plurality of columns, a write selection circuit, a first write driver circuit, a second write driver circuit, and a boost circuit. Each of the columns may include a plurality of data storage cells. The write selection circuit may select a column of the plurality of columns. Each of the write driver circuits may configured to discharge a data line of a selected column into a common node. The boost circuit may be configured to initialize the common node to the first voltage level and couple the common node to a second voltage level, where the second voltage level is lower than the first voltage level.

Abstract: A write assist driver circuit is provided that assists a memory cell (e.g., volatile memory bit cell) in write operations to keep the voltage at the memory core sufficiently high for correct write operations, even when the supply voltage is lowered. The write assist driver circuit may be configured to provide a memory supply voltage VddM to a bit cell core during a standby mode of operation. In a write mode of operation, the write assist driver circuit may provide a lowered memory supply voltage VddMlower to the bit cell core as well as to at least one of the local write bitline (lwbl) and local write bitline bar (lwblb). Additionally, the write assist driver circuit may also provide a periphery supply voltage VddP to a local write wordline (lwwl), where VddP?VddM>VddMlower.

Abstract: A method of operating a semiconductor memory device is disclosed. The method may include receiving an access command, applying a first voltage to a selected word line of the semiconductor memory device for a period of time in response to receiving the access command, applying a second voltage to word lines adjacent to the selected word line before and after the period of time, and applying a third voltage to the word lines adjacent to the selected word line for the period of time, a voltage level of the third voltage greater than the second voltage. The applying the third voltage may occur when the semiconductor memory device is operated at a temperature below the predetermined temperature.

Abstract: A system on chip (SoC) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data. There are m bit lines each coupled to a corresponding one of the m columns of bit cells. There are m write drivers each coupled to a corresponding one of the m bit lines, wherein the m drivers each comprise a write one circuit and a write zero circuit. The m drivers are operable to write all ones into a row of bit cells in response to a first control signal coupled to the write one circuits and to write all zeros into a row of bit cells in response to a second control signal coupled to the write zero circuits.

Abstract: A nonvolatile semiconductor memory quickly and precisely accumulates a desired amount of charges corresponding to data-to-be-written in a charge accumulating part of a memory cell. When charges are injected into the charge accumulating part of the memory cell by applying a writing voltage corresponding to the data-to-be-written to the drain or source region of the memory cell, the writing voltage is reduced on the basis of an increase in the amount of charges accumulated in the charge accumulating part.

Abstract: A method for rewriting a memory array with a number of memory elements includes performing a rewrite process to change the memory array from an initial state to a target state in a manner that avoids violating a set of weight constraints at any time during the rewrite process. A memory system includes a memory array and a memory controller configured to perform a rewrite process to change the memory array from an initial state to a target state in a manner that avoids violating a set of weight constraints at any time during the rewrite process.

Abstract: A system on chip (SoC) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data. There are m bit lines each coupled to a corresponding one of the m columns of bit cells. There are m write drivers each coupled to a corresponding one of the m bit lines, wherein the m drivers each comprise a write one circuit and a write zero circuit. The m drivers are operable to write all ones into a row of bit cells in response to a first control signal coupled to the write one circuits and to write all zeros into a row of bit cells in response to a second control signal coupled to the write zero circuits.

Abstract: Embodiments disclosed herein may relate to programming a memory cell with a programming pulse that includes a quenching period. The quenching period includes an initial portion and a subsequent portion, with the subsequent portion different than the initial portion. During the initial portion, the amplitude of the programming pulse may be reduced to a first target amplitude level, and during the subsequent portion, the amplitude of the programming pulse may be further reduced to a second target amplitude level.

Abstract: Apparatuses, sense circuits, and methods for controlling a clock signal to a clock tree is described. An example apparatus includes a consecutive write command detection circuit configured to detect whether a next write command is received within a consecutive write command period of a current write command responsive to the current write command provided at an output of the write command register. The example apparatus further includes a clock signal control circuit coupled to the consecutive write command detection circuit and configured to control a clock signal to an input/output (I/O) latch based on whether the consecutive write command detection circuit detects that the next write command is within the consecutive write command period.