Abstract: A DC mode word-line coupling noise restriction circuit for multiple-port Random Access Memory cells. This circuit may comprise a Static Random Access Memory array. The SRAM array contains a plurality of columns and a plurality of rows with an SRAM cell formed at a cross-point of the columns and rows. Each SRAM cell has a first word-line conductor and a second word-line conductor. The first word-line conductor is connected to a first coupling noise restriction circuit. The first coupling noise restriction circuit comprises an inverter and a NMOSFET. The inverter has another NMOSFET and a PMOSFET.

Abstract: A semiconductor memory device having a reduced noise interference is presented. The semiconductor memory device includes a first switch and a second switch. The first switch is disposed in a sub hole region or an edge region and is configured to be turned on in response to a first pre-control signal, which is enabled before a time point at which a sense amplifier array begins to operate, and to apply an external voltage to a first voltage line through which a bias voltage is supplied to the sense amplifier array. The second switch is configured to be turned on in response to a first control signal, which is enabled in a sense amplifier overdriving period, and to apply the external voltage to the first voltage line.

Abstract: A memory architecture is provided with an array of non-volatile memory cells arranged in rows and columns, and a sense amplifier coupled to at least one column within the array for sensing a data bit stored within one of the non-volatile memory cells. In order to provide accurate sensing, a reference current generator is provided and coupled to the sense amplifier. The reference current generator provides a first reference current having adjustable magnitude and adjustable slope, and a second reference current having adjustable magnitude, but constant slope. The first reference current is supplied to the sense amplifier for sensing the data bit. The second reference current is supplied to a control block for generating clock signals used to control sense amplifier timing.

Abstract: Standard memory circuits are used for executing a sum-of-products function between data stored in the memory and data introduced into the memory. The sum-of-products function is executed in a manner substantially similar to a standard memory read operation. The memory circuits are standard or slightly modified SRAM and DRAM cells, or computing memory arrays (CAMs).

Abstract: Methods and apparatus are disclosed, such as those involving a solid state memory device. One such method includes selecting a plurality of memory cells in a memory array. States of a plurality of data bits stored in the selected plurality of memory cells are determined. In determining the states of the plurality of data bits, a portion of the plurality of data bits are sensed faster than others. The plurality of data bits are sequentially provided as an output. In one embodiment, the portion of the plurality of data bits includes the first bit of the sequential output of the memory device.

Abstract: Data is read from a memory matrix (10) with a plurality of bit lines (12). A differential sense amplifier (14) receives a signal derived from a first one of the bit lines (12) on a first input. The differential sense amplifier (14) receives a reference signal from a reference output of a reference circuit (15) to a second input. A second one of the bit lines (12), which is adjacent to the first one of the bit lines (12), is coupled to the reference circuit (15), so that a bit line signal value on the second one of the bit lines (12) affects a reference signal value on the reference output, at least partly reproducing an effect of crosstalk of the bit line signal value (12) on the second one of the bit lines (12) on a bit line signal value on the first one of the bit lines (12).

Abstract: A system for providing on-die termination (ODT) of a control signal bus. The system includes a memory device that includes a plurality of data bus connectors, one or both of a load signal connector and a reset signal connector, a control bus connector, an ODT, and a mechanism. The ODT is in communication with the control bus connector, and the ODT provides a level of termination resistance to a control bus connected to the control bus connector. The mechanism latches data received via the data bus connectors in response to a signal received via one or both of the load signal connector and the reset signal connector. The data is utilized to set the level of termination resistance provided by the ODT.

Abstract: Provided is a semiconductor memory device. The semiconductor memory device includes: a first memory block including a first memory cell; a second memory block including a second memory cell; and a column decoder circuit accessing the first memory cell of the first memory block through a first conductor line and accessing the second memory cell of the second memory block through a second conductor line, wherein the column decoder circuit activates the first and second conductor lines in response to one of an address for reading the first memory cell and an address for reading the second memory cell.

Abstract: A semiconductor memory apparatus includes non-inversion repeaters that non-invert data and output the inverted data; and inversion repeaters that invert data and output the inverted data. The non-inversion repeaters or the inversion repeaters are arranged on a first data line and a second data line at a predetermined distance, respectively, which are parallel with each other and the most adjacent to each other and the non-inversion repeater or the inversion repeater is arranged at first positions corresponding to the first data line and the second data line, respectively. The non-inversion repeaters are arranged on one of the first data line and the second data line while the inversion repeaters are arranged on the other first data line and the second data line, at second positions except for the first arrangement positions of positions corresponding to the first data line and the second data line, respectively.

Abstract: A semiconductor memory device comprises a plurality of memory cells each including a holding circuit for holding memory data, and a read-only output circuit for outputting a signal corresponding to the data held by the holding circuit. The read-only output circuit has a read drive transistor controlled in accordance with a signal held by the holding circuit. A gate length of the read drive transistor is longer than a gate length of a transistor included in the holding circuit. Alternatively, the read-only output circuit has a read access transistor controlled in accordance with a read word select signal, and a gate length of the read access transistor is longer than a gate length of a transistor included in the holding circuit.

Abstract: A ROM includes a ROM array, an address decoder, a control circuit, a precharge tracker, a precharge circuit, a reference word line, a reference bit line and a reference sense generator. The control circuit generates control signals for reading the ROM. The address decoder enables a bit line and a word line. The precharge tracker generates a programmable precharge signal, which is provided to the precharge circuit for precharging the enabled bit line. A reference word line is enabled based on the programmable precharge signal and the control signals for tracking the enabled word line. A reference bit line is enabled based on the reference word line for tracking the enabled bit line. The reference sense generator generates a programmable sense signal based on the reference bit line, the programmable precharge signal and the control signals for reading a bit cell corresponding to the enabled bit line and word line.

Abstract: Embodiments of the present invention provide channel estimation for multi-level memories using pilot signals. A memory apparatus includes a memory block comprising a plurality of memory cells and adapted to operate with at least two levels of signals for writing data into and reading data from the memory cells. At least two memory cells are employed as reference cells to output a plurality of pilot signals. The memory apparatus also includes a channel block operatively coupled to the memory block, and adapted to facilitate the writing and reading of data into and from the memory cells. The channel block is also adapted to receive the pilot signals and determine one or more disturbance parameters based at least in part on the pilot signals and to compensate the read back signals based at least in part on the determined one or more disturbance parameters during said reading of data from the memory cells. Other embodiments may be described and claimed.

Abstract: A semiconductor device includes: a first level detecting circuit for detecting a voltage level at a control terminal after a prescribed time period from when a power supply voltage is supplied to a power supply terminal, a control unit for selecting in which operation mode among a plurality of operation modes the semiconductor device operates, based on a result of detection by the first level detecting circuit; and a regulator for generating an internal power supply voltage based on the power supply voltage supplied to the power supply terminal. The first level detecting circuit and the control unit receive the internal power supply voltage as an operating power supply voltage. In an operation mode, among the plurality of operation modes, where a power supply voltage having a level different from that of a power supply voltage in other operation modes is supplied to the power supply terminal, the control unit performs data processing by using the power supply voltage supplied to the power supply terminal.

Abstract: There is provided a semiconductor memory device including: a source strobe signal generating unit configured to generate a source strobe signal having a first or a second activation width corresponding to a normal mode and a bank grouping mode; a final strobe signal generating unit configured to, in the normal mode, expand the first activation width and generate a final strobe signal having the expanded first activation width, and in the bank grouping mode, maintain the second activation width and generate the final strobe signal having the second activation width; and a sense amplifying unit configured to sense, amplify and output data applied through a data line in response to the final strobe signal.

Abstract: A method of programming a non-volatile memory device with memory cells formed of variable resistance elements and disposed between word lines and bit lines, includes: previously charging a selected word line and a selected bit line together with a non-selected word line and a non-selected bit line up to a certain voltage; and further charging the selected word line and the non-selected bit line up to a program voltage higher than the certain voltage and a program-block voltage, respectively, and simultaneously discharging the selected bit line.

Abstract: A method of preventing an unintentional state change in a data storage node of a latch is disclosed. The method comprises receiving a reference input signal; generating a delayed input signal based upon the reference clock signal; maintaining a state of a first data storage node of a plurality of data storage nodes by latching data at the first node using the reference input signal; and maintaining a state of a second data storage node of the plurality of data storage nodes by latching data at the second data storage node using the delayed input signal. A circuit for preventing an unintentional state change in a data storage node of a latch is also disclosed.

Abstract: A page buffer circuit comprises a sense unit, a latch unit, and a bit line voltage control unit. The sense unit is configured to couple a bit line and a sense node in response to a sense control signal in response to the sense control signal. The latch unit includes a plurality of latch circuits configured to latch data programmed or to be programmed. The bit line voltage control unit is configured to classify program states of memory cells, coupled to the selected bit line, into first to nth groups by performing first to nth verification operations after a first program operation of a program operation and is configured to control a voltage level of the sense control signal in order to transfer a bit line voltage to the selected bit line.

Abstract: A sense amplifier includes a first sensing element and a second sensing element redundant to the first sensing element. The sense amplifier further comprises a switch circuit configured to switch between the first and second sensing elements when an offset of the sense amplifier is greater than a prescribed amount.

Abstract: Memory devices and methods are provided for reducing simultaneous switching output noise and power supply noise during burst data write and refresh operations. An embodiment of a memory device according to the present invention includes a first power domain coupled to some of the components of the memory device and a second power domain coupled to different components of the memory device. One or more distributed power domain coupling circuits may be coupled to the first and second power domains. The power domain coupling circuit includes a controller configured to generate an enable signal responsive to control signals, data signals, or any combination thereof. The power domain coupling circuit also includes coupling circuitry coupled to the first and second power domains and coupled to the controller. The coupling circuitry is configured to couple the first and second power domains together responsive to the enable signal.

Abstract: A semiconductor memory device of the present invention determines a logic level of a signal based on a predetermined reference voltage. And the memory device has an input terminal to which a reference signal having the reference voltage is input, a low-pass filter connected to the input terminal for passing a component of the reference voltage of the reference signal and eliminating undesired high frequency components, and one or more input first-stage circuits to each of which an output of the low-pass filter and a signal having the logic level to be determined are connected. In the memory device, the low-pass filter has predetermined attenuation at least at a frequency of an operating clock.

Abstract: A low voltage sensing scheme reduces active power down standby leakage current in a memory device. During memory's active power down state, the leak current may increase because of the use of P and Nsense amplifiers having low threshold voltages (Vth) for low Vcc sensing of data signals. A clamping device or diode is used between a Psense amplifier control line (e.g. ACT) and Vcc and/or between an Nsense amplifier control line (e.g. RNL*) and Vss (ground potential). The clamping diode is not enabled during normal memory operations, but is turned on during active power down mode to reduce leakage current through ACT and/or RNL* nodes. The clamping device connected to the ACT node may reduce the voltage on the ACT line during power down mode, whereas the clamping device connected to the RNL* node may increase the voltage on the RNL* line during power down mode to reduce sense amplifier leakage current through these nodes.

Abstract: An excess region on a chip plane is eliminated to reduce a chip size. A plurality of data pads, which input/output data, are arranged near one side of an outer periphery of a substrate in parallel with the aforementioned one side, and a plurality of data pads, which input/output data, are arranged on an inner side of the plurality of data pads in parallel with the plurality of data pads. NMOSs, which output data, are arranged between the data pads, and PMOSs, which output data, are arranged at positions where they face the NMOSs near the data pads.

Abstract: An apparatus for removing crosstalk in a semiconductor memory device includes pads for receiving externally provided signals, transmission lines for delivering the signals received by each of the pads to corresponding elements in the apparatus, and capacitors, coupled between adjacent ones of the lines, for adjusting the transmission delay of the signals depending on a signal transmission mode between the adjacent lines.

Abstract: A cell array has a plurality of memory cells arranged in a matrix. Each one terminal of a plurality of switching circuits is connected to a bit line. A leakage current compensating circuit has an output node connected in common to the other terminal of the switching circuit. The leakage current compensating circuit comprises a plurality of MOSFETs. Each MOSFET has the same conduction type as a MOSFET whose output node is directly connected to the bit line in the memory cell. Each MOSFET of the leakage current compensating circuit has a gate electrode connected to a first voltage node and a source electrode connected to a second voltage node, and thereby, being biased so that the MOSFET turns off.

Abstract: A memory chip with a plurality of FB DRAM cells, having a word line coupled to a first FB DRAM cell and a second FB DRAM cell is disclosed. The memory chip further has a first bit line coupled to the first FB DRAM cell, and a first state memory circuit coupled to the first bit line. The memory chip further includes a second bit line coupled to the second FB DRAM cell, and a second state memory circuit coupled to the second bit line. The memory chip further includes a sense amplifier, which can be coupled to the first FB DRAM cell, the second FB DRAM cell, the first state memory circuit or the second state memory circuit.

Abstract: A memory array includes a sensing circuit for sensing bit line current while keeping the voltage of the selected bit line substantially unchanged. The word lines and bit lines are biased so that essentially no bias voltage is impressed across half-selected memory cells, which substantially eliminates leakage current through half-selected memory cells. The bit line current which is sensed arises largely from only the current through the selected memory cell. A noise detection line in the memory array reduces the effect of coupling from unselected word lines to the selected bit line. In a preferred embodiment, a three-dimensional memory array having a plurality of rail-stacks forming bit lines on more than one layer, includes at least one noise detection line associated with each layer of bit lines. A sensing circuit is connected to a selected bit line and to its associated noise detection line.

Abstract: A multi-level dynamic memory device includes a bit line pair that is divided into a main bit line pair and a sub-bit line pair, first and second sense amplifiers that are connected between the main bit line pair and between the sub-bit line pair, first and second coupling capacitors that are cross-coupled between the main bit pair and the sub-bit pair, respectively; and first and second correction capacitors that are connected in parallel to the first and second coupling capacitors, respectively, and whose capacitance is adjusted by a control voltage signal.

Abstract: Circuits and methods for improving noise tolerance in memories are disclosed such as those that include biasing a data line above a normal threshold voltage, either by providing a higher data line charge voltage with a voltage source, or by providing a higher data line charge voltage with a current source.

Abstract: A voltage compensated sense amplifier includes a pair of digit line nodes respectively coupled to a pair of transistors. A first pair of switches are adapted to cross-couple the gates of the transistors to the respective digit line node and a second pair of switches are adapted to couple the gates of the transistors to a voltage supply. The first and second pair of switches are coupled to respective gates of the transistors independent of the pair of transistors being respectively coupled to the digit line nodes.

Abstract: Time-switch carrying removable storage includes a memory cell array, a bit line decoder connected with bit lines of the memory cell array, a word line decoder connected with word lines of the memory cell array, a bit line system amplifier connected with the bit line decoder, a word line system amplifier connected with the word line decoder, a semiconductor time switch clamped or bridged between the bit line system amplifier and the bit line decoder, and performing time management of access of the bit line amplifier and the bit line decoder to/from each other without a power supply, a time switch initializer which sets an operation period of the semiconductor time switch, and a controller connected with the bit line system amplifier and the word line system amplifier to control the amplifiers, and having an I/O terminal which transmits/receives an input/output signal.

Abstract: One embodiment of the invention includes a memory system. The system comprises a memory cell coupled to a bit-line node. The memory cell can be configured to generate a bit-line current on the bit-line node in response to a bias voltage during a read operation. The system further comprises a sense amplifier configured to maintain a substantially constant voltage magnitude of the bit-line node during a pre-charge phase and a sense phase of the read operation based on regulating current flow to and from the bit-line node, and to determine a memory value of the flash memory transistor during the read operation based on a magnitude of the bit-line current on the bit-line node.

Abstract: The present invention provides a sense circuit for DRAM memory cell to cover the events that a sense time becomes remarkably longer when a power source voltage is lowered, a sense time under the low voltage condition becomes shorter when temperature rises and a sense time changes to a large extent for fluctuation of processes. The present invention provides the following typical effects. A switch means is provided between the bit line BL and local bit line LBL connected to the memory cells for isolation and coupling of these bit lines. The bit line BL is precharged to the voltage of VDL/2, while the local bit line LBL is precharged to the voltage of VDL. The VDL is the maximum amplitude voltage of the bit line BL. A sense amplifier SA comprises a first circuit including a differential MOS pair having the gate connected to the bit line BL and a second circuit connected to the local bit line LBL for full amplitude amplification and for holding the data.

Abstract: An integrated circuit includes a storage component, a voltage stabilizer circuit with an input configured to receive an input voltage and an output configured to provide an output voltage, and a load. The load is coupled to the output of the voltage stabilizer circuit. The integrated circuit is operable in a first and second operating state. In the first operating state, the storage component receives an input voltage and in the second operating state the input voltage is provided to the input of the voltage stabilizer circuit.

Abstract: A semiconductor device includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells provided at the intersections of the plurality of word lines and the plurality of bit lines and each of that includes a MIS transistor and a memory element, a decoder circuit for selecting a plurality of word lines, and a sense-amplifier circuit for determining information that is read from any of the plurality of memory cells to any of the plurality of bit lines, wherein a twist connector for switching the wiring order of the plurality of word lines is provided and level-stabilizing circuits, for supplying the potential level of a non-selected state to the plurality of word lines in the non-selected state are arranged in the area below the twist connector.

Abstract: This disclosure concerns a memory including: word lines extending to a first direction; bit lines extending to a second direction crossing the first direction; a memory cell array including cell blocks each including memory cells respectively provided corresponding to intersection points of the word lines and the bit lines; and sense amplifiers provided corresponding to the bit lines, wherein the sense amplifiers copies existing data stored in a first cell block within the memory cell array to a plurality of memory cells, the memory cells being included in second and third cell blocks different from the first cell block, and alternately arranged in an extension direction of the word lines and also alternately arranged in an extension direction of the bit lines, and the sense amplifiers reads data from the second cell block or the third cell block, at a time of outputting data to outside of the sense amplifiers.

Abstract: A sense amplifier scheme for SRAM is disclosed. In accordance with one of the embodiments of the present application, a sense amplifier circuit includes a bit line, a sense amplifier output, a power supply node having a power supply voltage, a keeper circuit including an NMOS transistor, and a noise threshold control circuit. The keeper circuit is sized to supply sufficient current to compensate a leakage current of the bit line and maintains a voltage level of the bit line and the noise threshold control circuit lowers a trip point of the sense amplifier output.

Abstract: A method and apparatus is provided to enhance the power-up sequence for integrated circuits (ICs) that contain memory cells having single-ended data inputs with no local reset function. During a power-up sequence, the logic levels that are applied to the data, address, and power inputs of the memory cell are restricted to particular magnitudes by a power-on reset (POR) state machine. First, the data input of the memory cell is held to a logic low value while an address signal of the memory cell is allowed to be asserted to a logic high value in conjunction with activating a power supply that provides operational power to the IC. Next, the address input to the memory cell ramps up to full logic high value, while the regulated power supply to the memory cell array is held low. The regulated power supply then ramps up to an operational level to bias the memory cell into a known logic state.

Abstract: A signal transmission circuit comprising: first and second transmission lines connected to each other; a first impedance storage circuit storing an impedance of the first transmission line; and a control circuit that outputs match information between an impedance of the second transmission line and the impedance stored in the first impedance storage circuit.

Abstract: A semiconductor device can include a first ferroelectric random access memory to which a first voltage is applied and a second ferroelectric random access memory to which a second voltage is applied, where the second voltage is lower than the first voltage. A data protection circuit can determine whether test data is normally read from the second ferroelectric random access memory or whether a write-back operation is normally performed on the second ferroelectric random access memory on the basis of the second voltage. The data protection circuit can also generate a read prevention control signal to control whether a read operation is to be performed on the first ferroelectric random access memory based on the determined result.

Abstract: A memory array includes a sensing circuit for sensing bit line current while keeping the voltage of the selected bit line substantially unchanged. The word lines and bit lines are biased so that essentially no bias voltage is impressed across half-selected memory cells, which substantially eliminates leakage current through half-selected memory cells. The bit line current which is sensed arises largely from only the current through the selected memory cell. A noise detection line in the memory array reduces the effect of coupling from unselected word lines to the selected bit line. In a preferred embodiment, a three-dimensional memory array having a plurality of rail-stacks forming bit lines on more than one layer, includes at least one noise detection line associated with each layer of bit lines. A sensing circuit is connected to a selected bit line and to its associated noise detection line.

Abstract: A complementary field-effect (CMOS) circuit is provided which includes a current-limiting device arranged along a power-supply bus or a ground bus of the circuit. The current-limiting device is configured to prevent latch up of the CMOS circuit. More specifically, the current-limiting device is configured to maintain a junction of the parasitic pnpn diode structure as reverse-biased. A method is also provided which includes creating a current-voltage plot of a pnpn diode arranged within a first CMOS circuit which is absent of a current-limiting device arranged along a power bus of the circuit. In addition, the method includes determining a holding current level from the current-voltage plot and sizing a current-limiting device to place along a power bus of a second CMOS circuit comprising similar design specifications as the first CMOS circuit such that the current through the second CMOS circuit does not exceed the holding current level.

Abstract: A circuit, method, and computer readable medium for on-chip measuring of noise margins in a memory device memory device are disclosed. The on-chip method includes electrically coupling at least a first circuit to a memory cell. A voltage divider is electrically coupled to at least a first voltage and a second voltage. A multiplexer circuit is electrically coupled to the voltage divider. The multiplexer selects one of the first voltage and second voltage for producing a test voltage. A selecting line is electrically coupled to a force\measure network. A comparator is coupled to the force\measure network. The force-measure network supplies the test voltage to the comparator and a measured voltage to the comparator for determining when the measured voltage exceeds the test voltage.

Abstract: This disclosure concerns a memory including memory cell arrays including word lines extending in a first direction, bit lines extending in a second direction crossing the first direction, and memory cells provided to respectively correspond to cross-points in form of a lattice constituted by the word lines and the bit lines; sense amplifiers provided to respectively correspond to the bit lines and reading data stored in the memory cells; and bit line drivers provided to the bit lines and operating the bit lines when data is written to the memory cells, wherein the bit line drivers access the memory cells adjacent to a first memory cell diagonally with respect to the form of the lattice for writing the data to the adjacent memory cells during a data write operation without changing data stored in the memory cells adjacent to the first memory cell in the first and the second directions.

Abstract: A semiconductor storage device according to one aspect of the present invention includes a reference voltage source connected to a capacitor of a cell included in a memory, a buffer circuit holding data to be written in the cell, and a counter noise generator outputting a counter noise current canceling a noise current generated by rewriting the data in the cell to the reference voltage source according to the data held in the buffer circuit.

Abstract: Over-erasure induced noise on a data line in a nonvolatile memory that couples into an adjacent data line is mitigated by using twisted data lines and differential sensing amplifiers. Noise coupled into data lines is compensated by similar noise coupled into reference data lines and cancelled in the differential sensing amplifiers.

Abstract: A system for low power, high yield memory is described. The system includes a memory cell configured to receive a memory supply voltage. The system further includes a memory supply voltage control circuit configured to modify the memory supply voltage from a first memory supply voltage level to a second memory supply voltage level for a write to the memory cell.

Abstract: A programmable precharge circuit includes a plurality of transistors. Each transistor has a different threshold voltage from other transistors of the plurality of transistors. Each transistor is configured to connect a supply voltage to a node, and the node is selectively coupled to bitlines in accordance with a memory operation. Control logic is configured to enable at least one of the plurality of transistors to provide a programmable precharge voltage to the node in accordance with a respective threshold voltage drop from the supply voltage of one of the plurality of transistors.

Abstract: A data strobe signal noise prevention apparatus and semiconductor integrated circuit includes a transition protection unit configured to protect a transition of a data strobe signal in response to a control signal and a controller configured to determine when a burst operation completes and to generate the control signal.

Abstract: Embodiments of the invention are generally related to systems comprising devices connected by a bus. A device in the system may include termination control logic capable of detecting changes in the system clock frequency. Upon detecting a clock frequency, the termination control logic may determine whether the clock frequency is greater than a threshold frequency. If so, the termination control logic may enable bus termination. However, if the new clock frequency is lower than the threshold frequency, bus termination may be disabled, thereby conserving power.

Abstract: A device and a method for a sense circuit have been disclosed. In an implementation, the sense circuit includes a sense amplifier and at least one decoupling device. The decoupling device is coupled to the sense amplifier through at least one reference line. The sense amplifier reads a data value and the decoupling device decouples the sense amplifier from a power supply during a read operation.