Abstract: A memory device with configurable delay tracking is described. The memory device includes M normal word line drivers, a dummy word line driver a memory array, N sense amplifiers, and a timing control circuit. The memory array includes M rows and N columns of memory cells and a column of dummy cells. The word line drivers drive word lines for the rows of memory cells. The dummy word line driver drives a dummy word line for at least one dummy cell in the column of dummy cells. The timing control circuit generates enable signals having configurable delay, which may be obtained with an acceleration circuit that provides variable drive for a dummy bit line coupled to the column of memory cells. The sense amplifiers detect bit lines for the columns of memory cells based on the enable signals.

Abstract: A random access memory data resetting method is provided. The method includes following steps. First, a state machine resetting signal is provided to a RAM. Next, the state machine resetting signal is extended for a predetermined time period. Afterwards, a data resetting operation is executed in the RAM within the predetermined time period.

Abstract: A read-out circuit for or in a ROM memory, comprises an input, a comparator circuit, a threshold setting, and a control signal generator for driving the threshold setting generator. A read signal can be coupled into the input. The read signal, depending on the information contained in the read signal, comprises a high signal level relative to a reference potential or a low signal level relative to a reference potential. The comparator circuit compares the read signal with a settable threshold, the threshold setting circuit is designed for setting the threshold of the comparator circuit relative to the high and low signal levels, and the control signal generator generates a control signal similar to the read signal.

Abstract: A method of operating a memory includes performing a write operation and a read operation on a memory cell. The write operation includes starting a first global bit line (GBL) pre-charge on a GBL; and after the first GBL pre-charge is started, enabling a word line to write into the memory cell, wherein the steps of starting the first GBL pre-charge and enabling the word line have a first time interval. The read operation includes starting a second GBL pre-charge on the GBL; and after the second GBL pre-charge is started, enabling the word line to read from the memory cell, wherein the steps of starting the second GBL pre-charge and enabling the word line have a second time interval. The first time interval is greater than the second time interval.

Abstract: A semiconductor device includes a plurality of bonding pads as bonding option, and a test circuit for performing an operation test using particular bonding pads and testing interconnects connecting internal circuits to the remaining bonding pads which are not used in the operation test.

Abstract: To fully evaluate a real signal line and a real memory cell adjacent to a dummy signal line and utilize dummy signal line as real signal line, a semiconductor memory includes at least one real signal line connected to real memory cells driven by a real driver and at least one dummy signal line outside the real signal line connected to dummy memory cells, driven by a dummy driver. Real driver and dummy driver drive the real signal line and the dummy signal line synchronous with a common timing signal generated by an operation control circuit. Consequently, a stress evaluation is also performable, e.g., on a real signal line outside of a memory cell array under the same condition of a real signal line on the inner side. Dummy signal line is driven using common timing signal and evaluated, thus being usable as a redundancy signal line to relieve failure.

Abstract: A method and system are provided for maintaining a virtual ground node of an SRAM memory array at a minimum level sufficient for maintaining data retention. A circuit can maintain the virtual ground node at a virtual ground reference voltage of Vdd?(1.5*Vth), or maintain 1.5*Vth across the memory cells, where Vth is a threshold voltage of an SRAM memory cell transistor and VDD is a positive supply voltage. By tracking the Vth of the memory cell transistors in the SRAM array, the circuit reduces leakage current while maintaining data integrity. A threshold voltage reference circuit can include one or more memory cell transistors (in parallel), or a specially wired memory cell to track the memory cell transistor threshold voltage. The value of the virtual ground reference voltage can be based on a ratio of feedback chain elements in a multiplier circuit.

Abstract: A first plane of memory cells is formed on mesas of the array. A second plane of memory cells is formed in valleys adjacent to the mesas. The second plurality of memory cells is coupled to the first plurality of memory cells through a series connection of their source/drain regions. Wordlines couple rows of memory cells of the array. Metal shields are formed between adjacent wordlines and substantially parallel to the wordlines to shield the floating gates of adjacent cells.

Abstract: Systems, methods, and/or devices that facilitate accessing data from memory are presented. An adaptive detection component can be employed to reduce or minimize detection error and distinguish information stored in memory cells during read operations. A decoder component can include the adaptive detection component, which can employ an adaptive Linde-Buzo-Gray (LBG) algorithm. The decoder component can receive information associated with a current level from a memory location during a read operation, and can analyze and process such information. The adaptive detection component can receive the processed information and, along with other information, can process such information using the iterative LBG algorithm until reconstruction levels and corresponding threshold levels are determined. Such reconstruction levels and/or threshold levels can be compared to the value associated with the information read from the memory location to determine the data value of the data in the memory location.

Abstract: Methods and circuit arrangements are provided for improving equalization of sense nodes of a sense amplifier in a semiconductor memory device. When a memory array segment on a side a sense amplifier has a bitline leakage anomaly for which the sense amplifier is to be isolated when that memory is in an unselected state, isolation of the sense amplifier from the memory array segment is delayed when transitioning from a selected state of the memory array segment to an unselected state of the memory array segment. The duration of the delay is sufficient to allow time for equalization of the sense nodes of the sense amplifier before isolating the sense amplifier from the memory array segment.

Abstract: An integrated circuit having a resistance-based or resistively switching memory cell, and a method for operating a resistively switching memory cell is disclosed. One embodiment is adapted to be put in a low-resistance state by applying a first threshold voltage and in a high-resistance state by applying a second threshold voltage, wherein reading out of the data content from the memory cell is performed by applying a voltage to the memory cell in the range of the first or second threshold voltage or a higher voltage.

Abstract: A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.

Abstract: A memory wherein any “disturb effect” can be suppressed in which data in unselected memory cells are lost. This memory has a memory cell array (1) including bit lines, word lines, which are disposed to intersect the bit lines, and memory cells (12) each connected between bit and word lines. In this memory, an access operation, which includes at least one of read, rewrite and write operations, is made to a selected memory cell (12). During this access operation, it is performed to apply to the memory cell (12) a first voltage pulse, which provides an electrical field in a first direction so as to invert a stored data, and a second voltage pulse, which provides as electrical field in the opposite direction to the first one so as not to invert the stored data. In addition, a recovery operation for recovering a residual polarization amount is made to the memory cell (12).

Abstract: A method for programming a plurality of multi-level memory cells described herein includes iteratively changing a bias voltage applied to a first memory cell to program the first memory cell to a first threshold state and detecting when the first cell reaches a predetermined threshold voltage. The bias voltage applied to the first memory cell upon reaching the predetermined threshold voltage is recorded. A second memory cell is programmed to a second threshold state by applying an initial bias voltage to the second memory cell which is function of the recorded bias voltage.

Abstract: A semiconductor memory apparatus includes a write driver that receives a reset signal, a write enable signal, and a data signal, and transmits data, which is input from the data signal, to an input/output (IO) line when the write enable signal is applied, and an overdrive unit that is connected to the IO line of the write driver and outputs a voltage larger than a driving voltage of the write driver when the write driver outputs a high level.

Abstract: A semiconductor memory apparatus includes a sense amplifier that receives a driving voltage through a sense amplifier power supply input terminal and detects and amplifies a difference between signals that are supplied to two input lines, a sense amplifier voltage supply unit that supplies a driving voltage and an overdriving voltage higher than the driving voltage to the sense amplifier through the sense amplifier power supply input terminal using a power supply voltage, and a driving voltage control unit that maintains a driving voltage level of the sense amplifier power supply input terminal in response to the level of the power supply voltage, after a voltage of the sense amplifier power supply input terminal is elevated to a power supply level responding to the overdriving voltage in order to perform the overdriving operation.

Abstract: During a stand-by state in which power supply is cut off, a high-voltage power supply control circuit isolates a global negative voltage line transmitting a negative voltage and a local negative voltage line provided corresponding to each respective sub array block from each other and isolates a global ground line and a local ground line transmitting a ground voltage from each other. These local ground line and local negative voltage line are charged to a high voltage level through a high voltage line before cut-off from the corresponding power supply. A leakage current path from a word line to the negative voltage line or the ground line is cut off, so that the word line in a non-selected state can reliably be maintained at a non-selection voltage. Thus, in a low power consumption stand-by mode, data stored in a memory cell can be held in a stable manner.

Abstract: An embodiment of the invention relate to a memory device including a memory plane composed of memory cells located at the intersection of lines and columns, and a dummy path designed to output a signal to activate read amplifiers arranged at the bottom of the columns in the memory plane, said dummy path including dummy memory cells connected between two dummy bit lines means of selecting at least one dummy cell designed to discharge at least one of the dummy bit lines, and control means connected to the two dummy bit lines to generate said activation signal, characterized in that said device includes means of programming the number of selected cells to discharge at least said dummy bit line, to adjust the time at which said activation signal is output.

Abstract: A data sensing method for sensing data stored in first and second memory cells includes the steps of: setting a first voltage according to a bit-line voltage corresponding to the first memory cell in response to an enabled level of a first clock signal; providing the first voltage as a sensing voltage in response to a disabled level of the first clock signal; comparing the sensing voltage with a reference voltage to generate a first output voltage; setting a second voltage according to a bit-line voltage corresponding to the second memory cell in response to an enabled level of a second clock signal, a phase difference between the first and second clock signals being 180 degrees; providing the second voltage as the sensing voltage in response to a disabled level of the second clock signal; and comparing the sensing voltage with the reference voltage to generate a second output voltage.

Abstract: A dual-port static random access memory (SRAM) includes a multitude of programmable delay elements disposed along the paths of a number signals used to carry out read, write or read-then-write operations. At least one of the programmable delay elements controls the timing margin between a pair of clock signals that trigger a read/write enable signal. A second programmable delay element coarsely adjusts the delay of a first signal associated with a dummy bitline. A third programmable delay element finely adjusts the delay of a second signal associated with the dummy bitline. A fourth programmable delay element controls the delay of a signal used to reset the read/write enable signal. During a read operation, the voltage level of the second signal is used as an indicator to activate the sense amplifiers. During a write operation, the voltage level of the second signal is used to control the write cycle.

Abstract: A semiconductor memory device controlling an output voltage level of a high voltage generator in response to a variation of temperature has a high voltage generator that provides a high voltage higher than a power source voltage through an output terminal, generates a temperature detection signal obtained by sensing a variation of a diode current based on a temperature variation, and adjusts a voltage level of the output terminal in response to the temperature detection signal. The device is able to automatically control an output voltage or current of the high voltage generator.

Abstract: A semiconductor memory apparatus includes: a cell region having a plurality of unit cells each of which has a switching MOS transistor for transferring data. A peripheral circuit unit accesses data stored in the unit cell. A threshold voltage control unit controls the threshold voltage of the switching MOS transistor.

Abstract: An accessing method for a charge trapping memory including memory cells and tracking cells for storing expected data. The method includes the following steps. In a specific time first, the expected data is written into the tracking cells and the memory cells are not being programmed, read or erased. Next, the data stored in the tracking cells is sensed as read data according to a present reference current. Then, the present reference current is adjusted to an adjusted reference current according to a difference between the read data and the expected data so that the data stored in tracking cells is sensed as corresponding with the expected data according to the adjusted reference current. Thereafter, the memory cells are read according to the adjusted reference current.

Abstract: A circuit and method for a sense amplifier for sensing the charge stored by a memory cell is disclosed. The memory cell is coupled to a bit line, a complementary bit line and a differential sense amplifier is coupled to the bit line and the complementary bit line. A control signal couples a reference voltage to the complementary bit line. A positive precharge voltage is applied to the bit line and complementary bit line prior to the sense amplifier being enabled. The memory cell outputs a voltage to the bit line responsive to a word line, and the sense amplifier senses the differential voltage between the bit line and the complementary bit line responsive to a sense enable signal. A voltage regulator for generating the reference voltage, preferably about 80% of a positive supply voltage, is disclosed. A method of sensing data stored by a memory cell is disclosed.

Abstract: A charge-sharing circuit includes a first input bus pair, a second input bus pair, and an output bus pair. A capacitor is coupled between a first internal node and a second internal node. A first circuit selectively couples the first internal node to the first input bus pair, the second input bus pair and the output bus pair. A second circuit selectively couples the second internal node to the first input bus pair, the second input bus pair and the output bus pair. A third circuit selectively couples the first input bus pair to a reference voltage. A fourth circuit selectively couples the second input bus pair to the reference voltage. The third circuit is activated when the first input bus pair is inactive and charge is shared between the second bus pair and the output bus pair. The fourth circuit is activated when the second input bus pair is inactive and charge is shared between first bus pair and the output bus pair.

Abstract: A semiconductor memory apparatus includes a sense amplifier that receives a driving voltage through a sense amplifier power supply input terminal and detects and amplifies a difference between signals that are supplied to two input lines, a sense amplifier voltage supply unit that supplies a driving voltage and an overdriving voltage higher than the driving voltage to the sense amplifier through the sense amplifier power supply input terminal using a power supply voltage, and a driving voltage control unit that maintains a driving voltage level of the sense amplifier power supply input terminal in response to the level of the power supply voltage, after a voltage of the sense amplifier power supply input terminal is elevated to a power supply level responding to the overdriving voltage in order to perform the overdriving operation.

Abstract: Systems and methods for reducing instability and writability problems arising from relative variations between voltages at which memory cells and logic components that access the memory cells operate by inhibiting memory accesses when the voltages are not within an acceptable operating range. One embodiment comprises a pipelined processor having logic components which receive power at a first voltage and a set of SRAM cells which receive power at a second voltage. A critical condition detector is configured to monitor the first and second voltages and to determine whether the ratio of these voltages is within an acceptable range. When the voltages are not within the acceptable range, an exception is generated, and an exception handler stalls the processor pipeline to inhibit accesses to the SRAM cells. When the voltages return to the acceptable range, the exception handler resumes the pipeline and completes handling of the exception.

Abstract: A multi-chip semiconductor memory device includes of a plurality of memory chips sharing a predetermined chip enable signal. Each of the plurality of memory chips includes an active internal power supply generation circuit configured to convert an external power supply voltage into an internal power supply voltage and to be disabled in response to deactivation of a predetermined drive control signal. Each of the plurality of memory chips also includes a conversion control circuit for generating the drive control signal, wherein the drive control signal is deactivated in an interval in which any of the plurality of memory chips is in an active interval.

Abstract: In a semiconductor memory device, in addition to a sense amplifier connected to bit lines of a memory cell array having a plurality of memory cells in a disconnectable manner, the sense amplifier performing confinement operation to disconnect the bit lines of the memory cell array and amplify a data signal during data sense operation from the memory cells, there is provided a timing adjustment circuit adjusting timing related to confinement operation in the sense amplifier, so as to allow adjusting of timing of the confinement operation and setting of timing of the confinement operation.

Abstract: A memory device includes memory cells that are overwritten in response to receipt of a clear request signal and an overwrite value. The clear request signal enables all word lines of the memory device to be overwritten. The clear request signal in combination with the overwrite value cause the overwrite value to be written to a first column of memory cells. At least two delay elements transfer the overwrite value to another column of memory cells after a delay. By use of at least two delay elements to delay and transfer the overwrite value to be written to another column of memory cells, a relatively low magnitude of current can be used to cause memory cells to be overwritten. In addition, the value and sequence of values that overwrite memory cells can be controlled.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A low power ROM includes a plurality of ROM core groups coupled between a plurality of word lines and bit lines, a word line decoder for selecting a desired word line of the plurality of word lines, a column decoder for selecting a desired bit line of the plurality of bit lines, a common reference voltage generator for generating a common reference voltage, and a plurality of sense amplifiers having the same number as the number of ROM core groups, for comparing an output of the common reference voltage generator and data of a bit line of each ROM core group.

Abstract: An integrated circuit device including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include a logic circuit block LB, a grayscale voltage generation circuit block GB, data driver blocks DB1 to DB4, and a power supply circuit block PB. The data driver blocks DB1 to DB4 are disposed between the logic circuit block LB and the grayscale voltage generation circuit block GB, and the power supply circuit block PB.

Abstract: Systems and methods that facilitate characterization of a flash memory device are presented. A characterization component can be associated with a regulator component included in a memory device to facilitate setting and measuring respective drain voltage levels for programming, erase, and soft programming operations at address bit combinations available for the respective operations. The characterization component can utilize external address bits that can be fixed when performing the operations to minimize disruption to the drain voltage measurement flow.

Abstract: A memory cell array includes reference cells each associated with a plurality of data cells of the array.

Abstract: A memory cell array has a plurality of series connected memory cells connected to word lines and bit lines and arranged in a matrix. A select transistor selects from the word lines. A control circuit controls potentials of the word lines and bit lines in accordance with input data, and controls a data write operation, a data read operation, and a data erase operation executed on the memory cells. The select transistor is formed on a substrate. For a read operation, the substrate is supplied with a first negative voltage, a selected word line is supplied with a first voltage (first voltage?first negative voltage), and unselected word lines are supplied with a second voltage.

Abstract: A semiconductor integrated circuit device includes a data circuit and a group of bit line application voltage terminals to which different voltages are applied. The data circuit holds program data to be programmed into a memory cell and changes the data held according to a verify result from the memory cell. Then, the data circuit selects one of the bit line application voltage terminals based on the data held therein and applies voltage of the selected bit line application voltage terminal to a bit line BLe or BLo.

Abstract: A semiconductor device whose operation frequency and power supply voltage are dynamically controlled according to a load subjected to a process to be performed is disclosed. The semiconductor device includes a memory cell array having SRAM cells arranged in an array form, word lines connected to the SRAM cells for respective rows, a row decoder which selects the word lines one by one during normal operation and multi-select word lines which are not adjacent to each other during low-voltage operation, a load circuit which sets the level of the selected word line to potential lower than power supply voltage, and a controller which controls the row decoder and load circuit to selectively control selection of the word lines and the load circuit.

Abstract: A voltage regulator provides an operation voltage to a memory system and a transient voltage supply adjusts the operation voltage provided by the voltage regulator during transient events of the memory system.

Abstract: A memory is disclosed having one or more logic level reinforcement circuits (LLRC's) coupled to each wordline. Each LLRC has an input and an output, both of which are coupled to a corresponding wordline. The LLRC senses a present logic level on the wordline. If the present logic level is a first logic level, then the LLRC outputs a first logic level reinforcement signal onto the wordline to push the voltage on the wordline towards a desired voltage for that logic level. If the present logic level is the second logic level, then the LLRC outputs a second logic level reinforcement signal onto the wordline to push the voltage on the wordline towards a desired voltage for that logic level. By doing so, the LLRC compensates for the undesirable effects of gate leakage, and enables the memory to operate effectively and efficiently despite the gate leakage.

Abstract: A multi-level dynamic memory device includes a bit line pair that is divided into a main bit line pair and a sub-bit line pair, first and second sense amplifiers that are connected between the main bit line pair and between the sub-bit line pair, first and second coupling capacitors that are cross-coupled between the main bit pair and the sub-bit pair, respectively; and first and second correction capacitors that are connected in parallel to the first and second coupling capacitors, respectively, and whose capacitance is adjusted by a control voltage signal.

Abstract: An integrated circuit device having a display memory, wherein a plurality of first power supply interconnects VSSL for supplying a first power supply voltage VSS to memory cells MC are formed in a metal interconnect layer in which a plurality of wordlines WL are formed; and wherein a plurality of second power supply interconnects VDDL for supplying a second power supply voltage VDD to the memory cells are formed in another metal interconnect layer in which a plurality of bitlines BL are formed, the second power supply voltage VDD being higher than the first power supply voltage VSS. A plurality of bitline protection interconnects SHD are formed in a layer above the bitlines BL, and each of the bitline protection interconnects SHD at least partially covers one of the bitlines BL in a plan view.

Abstract: An internal voltage generator for a semiconductor memory device is provided. The internal voltage generator includes a first reference voltage generator for generating a first reference voltage, a second reference voltage generator for generating a second reference voltage, a core voltage generator for raising a core voltage based on the first reference voltage, and a core voltage discharger for discharging the core voltage depending on the second reference voltage.

Abstract: An integrated circuit device having a display memory, wherein a plurality of first power supply interconnects for supplying a first power supply voltage to a plurality of memory cells are provided in a metal interconnect layer in which a plurality of bitlines are formed; wherein a second power supply interconnect for supplying a second power supply voltage to the memory cells is provided in a metal interconnect layer in which a plurality of wordlines are formed, the second power supply voltage being higher than the first power supply voltage; wherein a plurality of bitline protection interconnects are formed in a layer above the bitlines, each of the bitline protection interconnects at least partially covering one of the bitlines in a plan view; and wherein a third power supply interconnect for supplying a third power supply voltage to circuits of the integrated circuit device other than the display memory is provided in a layer above the bitline protection interconnects, the third power supply voltage being

Abstract: A voltage regulator for a static random access memory operating either in a standby mode or a operation mode is provided. The voltage regulator includes a reference voltage generating circuit for generating a reference voltage, a first control circuit connected to the reference voltage generating circuit for providing power supply during the standby mode of the SRAM, and a second control circuit connected to the reference voltage generating circuit for providing power in response to an enabling signal during the operation mode of the SRAM.

Abstract: Voltage glitch detection circuits and methods thereof. The voltage glitch detection circuit may include a monitoring memory array including at least one memory cell storing reference data, a monitoring sense amplifier receiving stored reference data from the monitoring memory array, amplifying the received stored reference data in response to an operation control signal and outputting data based on the reference data, a data storage circuit including at least one latch to store the reference data and a comparator circuit receiving and comparing the data output from the monitoring sense amplifier and the stored reference data from the data storage circuit, and outputting a detection signal based on the comparison.

Abstract: A multi-level semiconductor memory device for storing multi-level data having three or more values is implemented by utilizing a nonvolatile memory device for storing 2-valued data. Identification of successive 16-bit data externally applied is performed with external address bit AA [2], and a storage block is selected with external address bit AA [23]. Upper word data LW and lower word data UW are compressed into byte data of 8 bits, respectively, and stored in a memory cell array.

Abstract: A memory sense amplifier includes a sample and hold circuit followed by a differential amplifier. The sample and hold circuit samples a reference voltage on a bit line of a memory circuit when the sense amplifier is reset and a signal voltage on the same bit line when a signal representing a data bit is present in the bit line. The differential amplifier amplifies the difference between the signal voltage and the reference voltage.

Abstract: An internal voltage generator according to the present invention stably supplies an internal voltage regardless a level of power voltage input from a source external to a semiconductor memory device. The present invention includes a dead zone controller to generate a reference voltage, a high reference voltage and a low reference voltage based on an inputted power voltage; and an internal power generator to generate an internal power based on the reference voltage by comparing the internal power with the high reference voltage and the low reference voltage.

Abstract: A single-ended sensing circuit is provided for use with a memory circuit including a plurality of bit lines and a plurality of memory cells connected to the bit lines. The sensing circuit includes at least one charge sharing circuit and at least one switching circuit connected to the charge sharing circuit. The switching circuit is operative to selectively connect the charge sharing circuit to at least a given one of the bit lines as a function of a first control signal supplied to the switching circuit. The sensing circuit further includes at least one comparator circuit connected to the given bit line. The comparator circuit is operative to generate an output signal indicative of a logical state of a memory cell connected to the given bit line. The charge sharing circuit is operative to remove an amount of charge on the given bit line so as to reduce a voltage on the given bit line in conjunction with a read access of the memory cell.