Abstract: A semiconductor memory device includes: a memory cell region including normal cells and row-hammer cells coupled to each of a plurality of rows, wherein the row-hammer cells of a selected row are suitable for storing first data and second data, the first data representing a number of accesses to the selected row and the second data denoting whether to refresh second adjacent rows of the selected row; and a refresh control circuit suitable for: selecting a sampling address based on the first data read from a row corresponding to an input address when an active command is inputted, determining, in response to a refresh command, whether to refresh first adjacent rows of a target row corresponding to the sampling address, and determining, in response to the refresh command, whether to refresh second adjacent rows of the target row based on the second data read from the target row.

Abstract: A semiconductor storage device includes first signal lines divided into groups respectively including m (m is an integer equal to or larger than 2) of the first signal lines; and second signal lines. A memory cell array includes memory cells provided to correspond to respective intersections of the first signal lines and the second signal lines. A selection voltage is applied to any of the first signal lines through m global signal lines. First transistors are provided to respectively correspond to the first signal lines and connected between the first signal lines and the global signal lines. First selection signal lines are provided to respectively correspond to the groups and connected to gate electrodes of the first transistors included in a corresponding one of the groups in common. First dummy signal lines are arranged between adjacent ones of the groups, to which a non-selection voltage is applied.

Abstract: A semiconductor device includes a memory cell array, a plurality of word lines, a plurality of bit line pairs, a column selection circuit coupling a bit line pair in a selected column in the plurality of bit line pairs to first and second output signal lines on the basis of a column selection signal, and a sense amplifier amplifying the voltage difference between the first and second output signal lines. The semiconductor device further includes: a scan flip flop to which the data can be input via a scan chain; and a voltage setting circuit setting the first and second output signal lines to voltage according to the data held in the scan flip flop in a scan test.

Abstract: Provided is a nonvolatile memory device including a resistive memory cell and semiconductor system using the same that is capable of setting the reference resistance value using resistance values of a plurality of memory cells. The nonvolatile memory device comprises one or more column lines, two or more row lines, a plurality of memory cells configured to be connected to the column lines and each of the row lines, and a reference resistance setting unit configured to enable a subset or all of the column lines and row lines and to set a reference resistance value.

Abstract: A memory includes a first bit line, a memory cell coupled to the first bit line, and a read assist device coupled to the first bit line. The read assist device is configured to pull a first voltage on the first bit line toward a predetermined voltage in response to a first datum being read out from the memory cell. The read assist device includes a first circuit configured to establish a first current path between the first bit line and a node of the predetermined voltage during a first stage. The read assist device further includes a second circuit configured to establish a second current path between the first bit line and the node of the predetermined voltage during a second, subsequent stage.

Abstract: Subject matter disclosed herein relates to accessing memory, and more particularly to operation of a partitioned bitline.

Abstract: A memory device includes; a memory cell array including a memory cell connected to a bit line, a page buffer unit receiving data from the memory cell via the bit line, and a contact unit providing an electrical path through which the data is communicated from the memory cell array to the page buffer unit, wherein the contact unit comprises a sub-bit line configured to connect the bit line via a first contact with the page buffer unit via a second contact.

Abstract: A main bit line is disposed between a reference main bit line and core main bit lines. A selection transistor disposed between a sub bit line connected to a cell and the main bit line can switch between a conductive state and a non-conductive state independently of other selection transistors. A dummy main bit line can be set to ground potential by a shield grounding section, and can be used as a shield line of the reference main bit line.

Abstract: A semiconductor memory device includes a bit line; two or more word lines; and a memory cell including two or more sub memory cells that each include a transistor and a capacitor. One of a source and a drain of the transistor is connected to the bit line, the other of the source and the drain of the transistor is connected to the capacitor, a gate of the transistor is connected to one of the word lines, and each of the sub memory cells has a different capacitance of the capacitor.

Abstract: A semiconductor memory device including a plurality of memory blocks each including a bit line to which a plurality of memory cells are connected, and a dummy bit line to which a plurality of dummy cells are connected; a reference cell; and a sense amplifier including a first input terminal to which selected memory cell of the plurality of memory cells is to be electrically connected via the bit line, and a second input terminal to which the reference cell is to be electrically connected, the dummy bit line of one memory block of the plurality of memory blocks different from another memory block of the plurality of memory blocks including the selected memory cell being to be electrically connected to the second input terminal of the sense amplifier.

Abstract: A memory device includes; a memory cell array including a memory cell connected to a bit line, a page buffer unit receiving data from the memory cell via the bit line, and a contact unit providing an electrical path through which the data is communicated from the memory cell array to the page buffer unit, wherein the contact unit comprises a sub-bit line configured to connect the bit line via a first contact with the page buffer unit via a second contact.

Abstract: A layout structure of bit line sense amplifiers for use in a semiconductor memory device includes first and second bit line sense amplifiers arranged to share and be electrically controlled by a first column selection line signal, and each including a plurality of transistors. In this layout structure, each of the plurality of transistors forming the first bit line sense amplifier is arranged so as not to share an active region with any transistors forming the second bit line sense amplifier.

Abstract: Disclosed is a semiconductor device including: a first switch controlling connection between a first data line pair a second data line pair; a first amplifier connected to the first data line pair; a second switch controlling the connection between the second data line pair and a third data line pair; a second amplifier amplifying data on the second data line pair and delivering the amplified data to the third data line pair; a third amplifier connected to the third data line pair; and a switch control circuit controlling the second switch. Based upon a first control signal that controls precharging and equalization of the first data line pair, the switch control circuit renders the second switch conductive when precharging and equalization of the first data line pair is not carried out, and renders the second switch non-conductive when precharging and equalization of the first data line pair is carried out.

Abstract: A semiconductor memory apparatus includes a sense amplifier coupled to a plurality of bit lines, a switching unit configured to cause the plurality of bit lines to be coupled to a first node in response to a switching signal, a mode selecting unit configured to selectively couple the first node to a pad or a ground terminal in response to a mode selection signal and a testing unit configured to supply current to the pad during a test mode.

Abstract: In a 4F2 memory cell designed using an SGT as a vertical transistor, a bit line has a high resistance because it is comprised of a diffusion layer underneath a pillar-shaped silicon layer, which causes a problem of slowdown in memory operation speed. The present invention provides a semiconductor storage device comprising an SGT-based 4F2 memory cell, wherein a bit line-backing cell having the same structure as that of a memory cell is inserted into a memory cell array to allow a first bit line composed of a diffusion layer to be backed with a low-resistance second bit line through the bit line backing cell, so as to provide a substantially low-resistance bit line, while suppressing an increase in area of the memory cell array.

Abstract: Method and device for controlling a memory access and correspondingly configured semiconductor memory A method and a device for controlling a memory access of a memory comprising memory cells are described. A completion of the memory access is determined by means of at least one dummy bit line. The at least one dummy bit line is connected to a plurality of memory cells of the memory cells of the memory such that a content of the at least one memory cell can be read out via the at least one dummy bit line. The at least one memory cell can be set to a predetermined potential. Each of said plurality of memory cells is connected to the at least one dummy bit line and to at least one dummy word line such that each of said plurality of memory cells can be set to the predetermined potential by means of the at least one dummy bit line and by means of the at least one dummy word line.

Abstract: In a 4F2 memory cell designed using an SGT as a vertical transistor, a bit line has a high resistance because it is comprised of a diffusion layer underneath a pillar-shaped silicon layer, which causes a problem of slowdown in memory operation speed. The present invention provides a semiconductor storage device comprising an SGT-based 4F2 memory cell, wherein a bit line-backing cell having the same structure as that of a memory cell is inserted into a memory cell array to allow a first bit line composed of a diffusion layer to be backed with a low-resistance second bit line through the bit line backing cell, so as to provide a substantially low-resistance bit line, while suppressing an increase in area of the memory cell array.

Abstract: A method of operating a memory circuit includes providing the memory circuit. The memory circuit includes a memory cell; a word line connected to the memory cell; a first local bit line and a second local bit line connected to the memory cell; and a first global bit line and a second global bit line coupled to the first and the second local bit lines, respectively. The method further includes starting an equalization to equalize voltages on the first and the second local bit lines; stopping the equalization; and after the step of starting the equalization and before the step of stopping the equalization, writing values from the first and the second global bit lines to the first and the second local bit lines.

Abstract: A semiconductor memory device includes a plurality of memory cells configured to correspond to each of a plurality of word lines for storing data; a plurality of reference memory cells configured to include first and second magnetic memory devices, whose lower electrodes are commonly connected to each other, to generate a reference current corresponding to each of the memory cells; and a sense amplification unit configured to sense and amplify the reference current and a data current corresponding to a memory cell connected to an activated word line among the word lines.

Abstract: A semiconductor memory device simultaneously selects an object cell and a counter cell which connect with a common bit line, simultaneously activates sub-word lines of the object cell and the counter cell after predetermined levels are written in the object cell and the counter cell, simultaneously read data of the object cell and the counter cell from the common bit line, and hence, determines whether the object cell is normal or defective, based on a voltage level of the common bit line. Thereby, the defective cell in the semiconductor memory device can be reliably detected.

Abstract: In a 4F2 memory cell designed using an SGT as a vertical transistor, a bit line has a high resistance because it is comprised of a diffusion layer underneath a pillar-shaped silicon layer, which causes a problem of slowdown in memory operation speed. The present invention provides a semiconductor storage device comprising an SGT-based 4F2 memory cell, wherein a bit line-backing cell having the same structure as that of a memory cell is inserted into a memory cell array to allow a first bit line composed of a diffusion layer to be backed with a low-resistance second bit line through the bit line backing cell, so as to provide a substantially low-resistance bit line, while suppressing an increase in area of the memory cell array.

Abstract: A dummy memory cell for detection of write completion timing is provided as a replica of a memory cell. When assisting a write operation by power supply control and substrate potential control of the memory cell, the timing of ending the write assist operation is determined by a voltage control circuit based on information about the dummy memory cell. For example, the voltage control circuit performs, in a data write operation in the memory cell, the write assist operation of decreasing the voltage of a source power supply allocated to P-channel MOS load transistors using a pull-down transistor. Thereafter, at the time when completion of the data write operation in the dummy memory cell is detected, the voltage control circuit ends the write assist operation and restores the voltage of the source power supply to the original level using a pull-up transistor.

Abstract: A method of operating a memory circuit includes providing the memory circuit. The memory circuit includes a memory cell; a word line connected to the memory cell; a first local bit line and a second local bit line connected to the memory cell; and a first global bit line and a second global bit line coupled to the first and the second local bit lines, respectively. The method further includes starting an equalization to equalize voltages on the first and the second local bit lines; stopping the equalization; and after the step of starting the equalization and before the step of stopping the equalization, writing values from the first and the second global bit lines to the first and the second local bit lines.

Abstract: An integrated circuit and a design structure are disclosed. An integrated circuit may comprise: a data retaining device; a charge storing device coupled to the data retaining device such that a use of the data retaining device triggers a charging of the charge storing device by a charge source; and means for measuring a potential of the charge storing device, the measuring means being communicatively coupled to a calculating mean which determines a relative amount of usage of the data retaining device based on the measured potential.

Abstract: A layout structure of bit line sense amplifiers for use in a semiconductor memory device includes first and second bit line sense amplifiers arranged to share and be electrically controlled by a first column selection line signal, and each including a plurality of transistors. In this layout structure, each of the plurality of transistors forming the first bit line sense amplifier is arranged so as not to share an active region with any transistors forming the second bit line sense amplifier.

Abstract: A multi-level dynamic memory device includes a bit line pair that is divided into a main bit line pair and a sub-bit line pair, first and second sense amplifiers that are connected between the main bit line pair and between the sub-bit line pair, first and second coupling capacitors that are cross-coupled between the main bit pair and the sub-bit pair, respectively; and first and second correction capacitors that are connected in parallel to the first and second coupling capacitors, respectively, and whose capacitance is adjusted by a control voltage signal.

Abstract: To fully evaluate a real signal line and a real memory cell adjacent to a dummy signal line and utilize dummy signal line as real signal line, a semiconductor memory includes at least one real signal line connected to real memory cells driven by a real driver and at least one dummy signal line outside the real signal line connected to dummy memory cells, driven by a dummy driver. Real driver and dummy driver drive the real signal line and the dummy signal line synchronous with a common timing signal generated by an operation control circuit. Consequently, a stress evaluation is also performable, e.g., on a real signal line outside of a memory cell array under the same condition of a real signal line on the inner side. Dummy signal line is driven using common timing signal and evaluated, thus being usable as a redundancy signal line to relieve failure.

Abstract: An integrated circuit device (e.g., a logic device or a memory device) having a memory cell array including a plurality of word lines (e.g., first and second word lines) and a plurality of word line segments (e.g., first and second word line segments) wherein each word line segment is coupled to an associated word line (e.g., a first segment is associated with the first word line and a second segment is associated with the second word line). The memory cell array further includes a plurality of memory cells, wherein each memory cell includes a transistor having a first region, a second region, a body region, wherein the body region is electrically floating, and a gate coupled to an associated word line via an associated word line segment.

Abstract: In a semiconductor memory device, in addition to a sense amplifier connected to bit lines of a memory cell array having a plurality of memory cells in a disconnectable manner, the sense amplifier performing confinement operation to disconnect the bit lines of the memory cell array and amplify a data signal during data sense operation from the memory cells, there is provided a timing adjustment circuit adjusting timing related to confinement operation in the sense amplifier, so as to allow adjusting of timing of the confinement operation and setting of timing of the confinement operation.

Abstract: A multi-level dynamic memory device includes a bit line pair that is divided into a main bit line pair and a sub-bit line pair, first and second sense amplifiers that are connected between the main bit line pair and between the sub-bit line pair, first and second coupling capacitors that are cross-coupled between the main bit pair and the sub-bit pair, respectively; and first and second correction capacitors that are connected in parallel to the first and second coupling capacitors, respectively, and whose capacitance is adjusted by a control voltage signal.

Abstract: A magnetic memory array. A first bit line provides a first writing magnetic field to a magnetic memory cell. A second bit line provides a second writing magnetic field to a reference magnetic memory cell. A word line provides a third writing magnetic field to the magnetic memory cell and a fourth writing magnetic field to the reference magnetic memory cell. The third writing magnetic field exceeds the fourth writing magnetic field.