Abstract: A semiconductor device and an operating method thereof comprise peripheral circuits configured to apply an erase voltage to memory cells when performing an erase operation, and sense a voltage change of bit lines by an erase verification voltage applied to word lines of the memory cells when performing an erase verification operation to thereby detect cells which are not erased, and a control circuit configured to control the peripheral circuits by changing a sensing reference level for determining the voltage change of the bit lines when the cells which are not erased are detected when performing the erase verification operation, so that the erase verification operation is repeatedly performed.

Abstract: A circuit and method erase at power-up all data stored in a DRAM chip for increased data security. All the DRAM memory cells are erased by turning on the transistors for the DRAM storage cells simultaneously by increasing the body voltage of cells. In the example circuit, the body voltage is increased by a charge pump controlled by a power-on-reset (POR) signal applying a voltage to the p-well of the memory cells. The added voltage to the p-well lowers the threshold voltage of the cell, such that the NFET transistor of the memory cell will turn on. With all the devices turned on, the data stored in the memory cells is erased as the voltage of all the cells connected to a common bitline coalesce to a single value.

Abstract: A circuit and method erase at power-up all data stored in a DRAM chip for increased data security. All the DRAM memory cells are erased by turning on the transistors for the DRAM storage cells simultaneously by increasing the body voltage of cells. In the example circuit, the body voltage is increased by a charge pump controlled by a power-on-reset (POR) signal applying a voltage to the p-well of the memory cells. The added voltage to the p-well lowers the threshold voltage of the cell, such that the NFET transistor of the memory cell will turn on. With all the devices turned on, the data stored in the memory cells is erased as the voltage of all the cells connected to a common bitline coalesce to a single value.

Abstract: A method of operating a nonvolatile memory device comprises reading erase number information which is updated and stored whenever erasure is performed, setting program start voltages and step voltages based on the erase number information, and performing a program operation based on the program start voltages and the step voltages.

Abstract: A method for data storage includes predefining an order of programming a plurality of analog memory cells that are arranged in rows. The order specifies that for a given row having neighboring rows on first and second sides, the memory cells in the given row are programmed only while the memory cells in the neighboring rows on at least one of the sides are in an erased state, and that the memory cells in the given row are programmed to assume a highest programming level, which corresponds to a largest analog value among the programming levels of the cells, only after programming all the memory cells in the given row to assume the programming levels other than the highest level. Data is stored in the memory cells by programming the memory cells in accordance with the predefined order.

Abstract: A method is provided for operating a nonvolatile memory comprising memory cells stacked on a substrate. The method comprises counting a number of program loops performed in a first program operation of selected memory cells connected to a selected wordline, and controlling an increment of a program voltage between successive program loops of a second program operation of the selected memory cells according to the counted number.

Abstract: A memory string includes a semiconductor layer, a charge accumulation layer, and a conductive layer. The semiconductor layer extends in a direction perpendicular to the semiconductor substrate and functions as a body of a memory cell. The charge accumulation layer may accumulate charges. The conductive layer sandwiches the charge accumulation layer with the semiconductor layer, and functions as a gate of the memory cell. The control circuit performs, before a read operation, a refresh operation of rendering the selected memory cell and a non-selected memory cell conductive to conduct a current from a first end to a second end of the memory string.

Abstract: A system for wear-leveling of a non-volatile memory may include a controller configured to allocate memory blocks in the non-volatile memory, a logical-to-physical table populated with pointers to memory blocks in the nonvolatile memory, and a wear-leveling table configured to store two or more pointers to unallocated memory blocks in the non-volatile memory. The unallocated memory blocks are previously allocated to store data by the controller according to the pointers in the logical-to-physical table. The controller is further configured to identify two or more pointers in the wear-leveling table and to store data to the two or more memory blocks associated with the identified pointers.

Abstract: Memory devices utilizing memory cells including a resistive element and a diode coupled in series between two conductors. The diodes include a ruthenium material and a silicon material. The diodes further include an interface on the silicon material of ruthenium or ruthenium silicide. A ruthenium silicide interface may be a polycrystalline ruthenium silicide.

Abstract: A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is stored in a non-volatile manner as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time.

Abstract: A ferroelectric memory device having a NAND array of a plurality of ferroelectric memory cells includes: a fully depleted channel layer; a gate electrode layer; and a ferroelectric layer located between the channel layer and the gate electrode layer. The data of the plurality of ferroelectric memory cells is erased by applying a first erase voltage to a bit line and a common source line and applying a second erase voltage to a string selection line and a ground selection line.

Abstract: Techniques and corresponding circuitry are presented for the detection of broken wordlines in a memory array. An “inter-word-line” comparison where the program loop counts of different word-lines are compared in order to determine whether a word-line may be defective. The number of programming pulses needed for the cells along a word-line WLn is compared to the number needed for a preceding word-line, such as WLn or WL(n?1), to see whether it exceeds this earlier value by a threshold value. If the word-line requires an excessive number of pulses, relative the earlier word-line, to complete programming, it is treated as defective.

Abstract: A method for clearing data stored in a complementary metal-oxide semiconductor (CMOS) chip of a computing device. The computing device further includes a CMOS jumper connected to the CMOS chip, and a general purpose input/output (GPIO) interface connected to the CMOS jumper. The method configures a GPIO pin of the GPIO interface as an output port, controls the GPIO pin to generate a GPIO signal with a high level, and outputs the GPIO signal with the high level to the CMOS jumper. After receiving a command of clearing data stored in the CMOS chip, the method pulls down the GPIO signal from the high level to a low level, to clear the data stored in the CMOS chip.

Abstract: Erase operations and apparatus configured to perform the erase operations are suitable for non-volatile memory devices having memory cells arranged in strings. One such method includes biasing select gate control lines of a string of memory cells to a first bias potential, biasing access lines of a pair of the memory cells to a second bias potential and biasing access lines of one or more remaining memory cells to a third potential. A ramping bias potential is applied to channel regions of the string of memory cells substantially concurrently with or subsequent to biasing the select gate control lines and the access lines, and floating the select gate control lines in response to the ramping bias potential reaching a release bias potential between an initial bias potential of the ramping bias potential and a target bias potential of the ramping bias potential.

Abstract: A non-volatile semiconductor memory device includes a memory cell array and a control circuit. A control circuit performs an erase operation providing a memory cell with a first threshold voltage level for erasing data of a memory cell, and then perform a plurality of first write operations providing a memory cell with a second threshold voltage level, the second threshold voltage level being higher than the first threshold voltage level and being positive level. When the control circuit receives a first execution instruction from outside during the first write operations, the first execution instruction being for performing first function operation except for the erase operation and the first write operations, the circuit performs the first function operation during the first write operations.

Abstract: A memory device and method, such as a flash memory device and method, includes a memory having a plurality of nonvolatile memory cells for storing stored values of user data. The memory device and method includes a memory controller for controlling the memory. The memory controller includes an encoder for encoding user write data for storage of code values as the stored values in the memory. The encoder includes an inserter for insertion of an indicator as part of the stored values for use in determining when the stored values are or are not in an erased state. The memory controller includes a decoder for reading the stored values from the memory to form user read data values when the stored values are not in the erased state.

Abstract: An apparatus includes a first memory die including a first memory core, a second memory die including a second memory core, and a periphery die coupled to the first memory die and to the second memory die. The periphery die includes periphery circuitry corresponding to the first memory core and periphery circuitry corresponding to the second memory core. The periphery die is responsive to a memory controller and configured to initiate a first memory operation at the first memory core and a second memory operation at the second memory core.

Abstract: A control circuit is configured to set a drain-side select transistor and a source-side select transistor connected to a selected memory string to non-conductive states. The control circuit is configured to apply a first voltage to a non-selected word line connected to a gate of a non-selected memory cell in the selected memory string. The control circuit is configured to apply a second voltage to a selected word line connected to a gate of a selected memory cell in the selected memory string. The second voltage is smaller than the first voltage in an erasing operation.

Abstract: A non-volatile semiconductor memory device includes a plurality of memory strings, a plurality of memory blocks, a plurality of source-lines, and a control circuit. Each of the memory strings includes a plurality of stacked memory transistors. Each of the memory blocks includes the memory strings. Each of the source-lines are connected to the respective memory strings. The control circuit is configured to output signals to a switch circuit depending on the types of operations for the memory transistors. The switch circuit is capable of connecting the plurality of source-lines electrically and commonly depending on the signals.

Abstract: Nonvolatile semiconductor memory device of an embodiment includes: a memory cell array including a plurality of first and second lines intersecting each other and plural memory cells provided at intersections of the first and second lines and having data written and erased upon application of voltages of the same polarity; and a writing circuit configured to select first and second lines and supply a set or reset pulse to the memory cell through the selected first and second lines. In an erase operation, the writing circuit repeatedly supplies the reset pulse to a selected memory cell until data is erased, by increasing or decreasing voltage level and voltage application time of the reset pulse within a reset region. The reset region, or an aggregate of combinations of voltage level and voltage application time of the reset pulse, is a region where voltage level and voltage application time are negatively correlated.

Abstract: A nonvolatile memory device includes a plurality of memory cells and a plurality of monitor cells. The method of operating the device includes erasing the plurality of memory cells and the plurality of monitor cells, programming at least one first memory cell among the plurality of memory cells to a first program state, programming at least one first monitor cell among the plurality of monitor cells to the first program state, and refreshing data stored in the plurality of memory cells according to a result read from the at least one first monitor cell during a read operation of the at least one first monitor cell.

Abstract: An elapsed time with respect to a programming operation on a memory cell of a nonvolatile memory is determined, a read voltage is adjusted based on the determined elapsed time and a read operation is performed on the memory cell using the adjusted read voltage. Determining the elapsed time may be preceded by performing the programming operation in response to a first access request and determining the elapsed time may include determining the elapsed time in response to a second access request. Memory systems supporting such operations are also described.

Abstract: A method for driving a semiconductor memory device includes controlling a plurality of erase voltages for a plurality of memory blocks, respectively, comparing the plurality of controlled erase voltages, and determining whether or not to enable the plurality of memory blocks for a subsequent write operation in response to a result of the comparison.

Abstract: A method for operating a non-volatile memory device includes selecting a word line of a plurality of word lines in response to a program command and an received address, determining whether the selected word line is a word line set among the word lines, performing an erase operation on a second word line group of the word lines in response to a result of the determining, and performing a program operation on the selected word line.

Abstract: A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different.

Abstract: The erasing of data stored in a nonvolatile memory is performed using multiple partial erase operations. Each partial erase operation has a time duration that is shorter than the minimum time duration of an erase operation that is needed to reliably erase the data stored in the storage location. However, the sum of the time durations of the multiple partial erase operations is sufficient to reliably erase the data in the storage location. In one example, during a partial erase operation, a voltage is applied to a memory storage transistor to remove some, but not necessarily all, of the charge stored on a charge storage layer of the transistor. Following multiple partial erase operations, sufficient charge is removed from the charge storage layer to ensure reliable data erasure.

Abstract: A two-terminal memory cell including a Schottky metal-semiconductor contact as a selection device (SD) allows selection of two-terminal cross-point memory array operating voltages that eliminate “half-select leakage current” problems present when other types of non-ohmic devices are used. The SD structure can comprise a “metal/oxide semiconductor/metal” or a “metal/lightly-doped single layer polycrystalline silicon.” The memory cell can include a two-terminal memory element including at least one conductive oxide layer (e.g., a conductive metal oxide—CMO, such as a perovskite or a conductive binary oxide) and an electronically insulating layer (e.g., yttria-stabilized zirconia—YSZ) in contact with the CMO. The SD can be included in the memory cell and configured electrically in series with the memory element. The memory cell can be positioned in a two-terminal cross-point array between a pair of conductive array lines (e.g., a bit line and a word line) across which voltages for data operations are applied.

Abstract: In an erase method of a flash device, including a page buffer configured to transfer a virtual voltage in response to a discharge signal and further comprising strings each including memory cells and coupled to the page buffer via a respective bit line, applying a ground voltage to a gate of each of the memory cells and erasing the memory cells coupled to a selected bit line by supplying the virtual voltage wherein the virtual voltage is applied to the selected bit line and a unselected bit line.

Abstract: A non-volatile memory device includes a first metal-oxide-semiconductor (CMOS) device coupled to a bit line and a word line and a second CMOS device coupled to the first CMOS device. The second CMOS device is also coupled to a complementary bit line and a complementary word line. The first and second CMOS devices are complementary to one another. An output node is coupled between the first CMOS device and the second CMOS device. A method of programming a non-volatile field programmable gate array (NV-FPGA) includes coupling an information handling system to the FPGA, performing a block erase of a plurality of memory cells in the FPGA, verifying that the block erase is successful, programming an upper page of the FPGA, verifying that the upper page programming is successful, programming a lower page of the FPGA and verifying that the lower page programming is successful.

Abstract: A semiconductor memory device includes a memory cell array configured as an arrangement of memory cells each arranged between a first line and a second line and each including a variable resistor. A control circuit controls a voltage applied to the first line or the second line. A current limiting circuit limits a current flowing through the first line or the second line to a certain upper limit or lower. In a case where a writing operation or an erasing operation to a memory cell is implemented a plural number of times repeatedly, the current limiting circuit sets the upper limit in the writing operation or erasing operation of the p-th time higher than the upper limit in the writing operation or erasing operation of the q-th time (q<p).

Abstract: In one embodiment, the semiconductor device, includes a non-volatile memory cell array, and a control unit configured to generate a mode signal indicating if a flash mode has been enabled. A write circuit is configured to write in the non-volatile memory cell array based on the mode signal such that the write circuit disables erasing the non-volatile memory cell array if the flash mode has not been enabled and instructions to erase one or more cells of the non-volatile memory cell array is received.

Abstract: In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array.

Abstract: Systems and methods are disclosed for modifying soft-programming trims of a non-volatile memory device, such as a flash memory device. The soft-programming trims may be modified based on a count of erase pulses applied to memory cells of the memory device. The number of erase pulses used to erase memory cells may be indicative of accumulated charge in the memory cell. The start voltage, step size, pulse width, number of pulses, pulse ramp, ramp rate, or any other trim of the soft-programming operation may be modified in response to the number of erase pulses.

Abstract: Methods of operating memory devices include storing data of a first type in a first set of logical erase blocks and storing data of a second type in a second set of logical erase blocks. The logical erase blocks of the first set of logical erase blocks each have a first size the logical erase blocks of the second set of logical erase blocks each have a second size different than the first size.

Abstract: Disclosed are erase methods for a memory device which includes a substrate and a plurality of cell strings provided on the substrate, each cell string including a plurality of cell transistors stacked in a direction perpendicular to the substrate. The erase method includes applying a ground voltage to a ground selection line connected with ground selection transistors of the plurality of cell strings; applying a ground voltage to string selection lines connected with selection transistors of the plurality of cell strings; applying a word line erase voltage to word lines connected with memory cells of the plurality of cell strings; applying an erase voltage to the substrate; controlling a voltage of the ground selection line in response to applying of the erase voltage; and controlling voltages of the string selection lines in response to the applying of the erase voltage.

Abstract: A method for data storage includes predefining an order of programming a plurality of analog memory cells that are arranged in rows. The order specifies that for a given row having neighboring rows on first and second sides, the memory cells in the given row are programmed only while the memory cells in the neighboring rows on at least one of the sides are in an erased state, and that the memory cells in the given row are programmed to assume a highest programming level, which corresponds to a largest analog value among the programming levels of the cells, only after programming all the memory cells in the given row to assume the programming levels other than the highest level. Data is stored in the memory cells by programming the memory cells in accordance with the predefined order.

Abstract: A write-once read-many times memory device is made up of first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrode. The memory device is programmed by providing a charged species from the passive layer into the active layer. The memory device may be programmed to have for the programmed memory device a first erase activation energy. The present method provides for the programmed memory device a second erase activation energy greater than the first erase activation energy.

Abstract: A circuit and method erase at power-up all data stored in a DRAM chip for increased data security. All the DRAM memory cells are erased by turning on the transistors for the DRAM storage cells simultaneously by increasing the body voltage of cells. In the example circuit, the body voltage is increased by a charge pump controlled by a power-on-reset (POR) signal applying a voltage to the p-well of the memory cells. The added voltage to the p-well lowers the threshold voltage of the cell, such that the NFET transistor of the memory cell will turn on. With all the devices turned on, the data stored in the memory cells is erased as the voltage of all the cells connected to a common bitline coalesce to a single value.

Abstract: A non-volatile semiconductor memory device, which comprises (i) an interface having an input for receiving an input clock and a set of data lines for receiving commands issued by a controller including an erase command; (ii) a module having circuit components in a feedback loop configuration and being driven by a reference clock; (iii) a clock control circuit capable of controllably switching between a first state in which the reference clock tracks the input clock and a second state in which the reference clock is decoupled from the input clock; and (iv) a command processing unit configured to recognize the commands and to cause the clock control circuit to switch from the first state to the second state in response to recognizing the erase command. The module consumes less power when the reference clock is decoupled from the input clock than when the reference clock tracks the input clock.

Abstract: In one embodiment, a bit-line interface is disclosed. The bit-line interface has a multiplexer having a plurality of bit-line outputs, and a write path coupled to a multiplexer signal input. The bit-line interface also has a read path coupled to the multiplexer signal input, wherein the read path and the write path share at least one component.

Abstract: Provided is a nonvolatile semiconductor memory device capable of performing a writing action for a memory cell at high speed. The device includes a memory cell array having a first sub-bank and a second sub-bank each having a plurality of nonvolatile memory cells arranged in a form of a matrix; a row decoder shared by the first sub-bank and the second sub-bank; a first column decoder and a second column decoder provided in the first sub-bank and the second sub-bank, respectively; and a control circuit arranged to execute alternately a first action cycle to perform a programming action in the first sub-bank and a reading action for a programming verifying action in the second sub-bank and a second action cycle to perform the reading action for the programming verifying action in the first sub-bank and the programming action in the second sub-bank.

Abstract: A semiconductor memory device includes memory cells, a source line, a word line, a bit line, and a driver circuit. The memory cells are formed on a semiconductor layer and have a charge accumulation layer and a control gate on the charge accumulation layer. The word line is connected to gate of the memory cell. The bit line is electrically connected to a drain of the memory cell. The source line is electrically connected to a source of the memory cell. The driver circuit varies potential of the semiconductor layer in conjunction with potential of the source line.

Abstract: An erase sequence of a non-volatile storage device includes an erase operation followed by a soft programming operation. The erase operation applies one or more erase pulses to the storage elements, e.g., via a substrate, until an erase verify level is satisfied. The number of erase pulses is tracked and recorded as an indicia of the number of programming-erase cycles which the storage device has experienced. The soft programming operation applies soft programming pulses to the storage elements until a soft programming verify level is satisfied. Based on the number of erase pulses, the soft programming operation time is shortened by skipping verify operations for a specific number of initial soft programming pulses which is a function of the number of erase pulses. Also, a characteristic of the soft programming operation can be optimized, such as starting amplitude, step size or pulse duration.

Abstract: A word-line driver includes first, second and third transistors. The first transistor includes a gate terminal driven by a first group selection signal, a first conduction terminal driven by a second sub-group selection signal and a second conduction terminal coupled to the word-line. The second transistor includes a gate terminal driven by a second group selection signal, a second conduction terminal driven by the second sub-group selection signal, and a first conduction terminal coupled to the word-line. The third transistor includes a gate terminal driven by a third the group selection signal, a first conduction terminal driven by a first sub-group selection signal, and a second conduction terminal coupled to the word-line.

Abstract: The present invention includes: a circuit board which is provided with an electronic circuit part; a first case and a second case (7) that cover the electronic circuit part; a fixing screw that fixes the first case and the second case (7); a tamper switch that outputs a signal indicating that the switch member is in a first state or second state; and a cap block (11) which is attached to the second case (7) so that the tamper switch keeps the first state only when the cap block (11) covers the fixing screw.

Abstract: Memory cells in which an erase and write operation is performed by injecting electrons from a substrate and extracting the electrons into a gate electrode constitute a semiconductor nonvolatile memory device. That is a gate extraction semiconductor nonvolatile memory device. In that device, if an erase bias is applied in a first process of an erase and write operation, memory cells in an overerase condition occur and the charge retention characteristics of such memory cells are degraded. The present invention provides a semiconductor nonvolatile memory device using means for writing all the memory cells in an erase unit before applying the erase bias, and then applying the erase bias.

Abstract: A method for storing data into a memory is provided. In this method, at first, data desired to be written into the memory is provided, wherein the data comprises a plurality of data records. Then, a memory space of the memory for storing the data is provided. Thereafter, a data-writing step is performed to write the data into the memory. In the data-writing step, at first, it is determined that if the values of all the data records of the data are cleared values to provide a first determined result. Then, it is determined that if the data matches an erasing unit of the memory to provide a second determined result. Thereafter, the contents of the memory space are erased, when both the first determined result and the second determined result are yes.

Abstract: A semiconductor disk wherein a flash memory into which data is rewritten in block unit is employed as a storage medium, the semiconductor disk including a data memory in which file data are stored, a substitutive memory which substitutes for blocks of errors in the data memory, an error memory in which error information of the data memory are stored, and a memory controller which reads data out of, writes data into and erases data from the data memory, the substitutive memory and the error memory. Since the write errors of the flash memory can be remedied, the service life of the semiconductor disk can be increased.

Abstract: A two-terminal memory cell including a Schottky metal-semiconductor contact as a non-ohmic device (NOD) allows selection of two-terminal cross-point memory array operating voltages that eliminate “half-select leakage current” problems present when other types of non-ohmic devices are used. The NOD structure can comprise a “metal/oxide semiconductor/metal” or a “metal/lightly-doped single layer polycrystalline silicon.” The memory cell can include a two-terminal memory element including at least one conductive oxide layer (e.g., a conductive metal oxide—CMO, such as a perovskite or a conductive binary oxide) and an electronically insulating layer (e.g., yttria-stabilized zirconia—YSZ) in contact with the CMO. The NOD can be included in the memory cell and configured electrically in series with the memory element. The memory cell can be positioned in a two-terminal cross-point array between a pair of conductive array lines (e.g., a bit line and a word line) across which voltages for data operations are applied.

Abstract: A method of driving phase change memory device which reduces or prevents unwanted heat disturbances from interfering with memory states in adjacent memory cells is presented. The phase change memory cells are disposed at word and bit line intersections. The method includes collectively erasing all of the memory cells as a unit in the bit line into a reset state. The method then includes individually programming only selected memory cells of the memory cells into set states.