Abstract: A memory device is disclosed that includes a row of storage locations that form plural columns. The plural columns include data columns to store data and a tag column to store tag information associated with error locations in the data columns. Each data column is associated with an error correction location including an error code bit location. Logic retrieves and stores the tag information associated with the row in response to activation of the row. A bit error in an accessed data column is repaired by a spare bit location based on the tag information.

Abstract: An antifuse comprised of an NMOS transistor or an NMOS capacitor includes a first terminal coupled to a gate electrode, a second terminal coupled to a diffusion layer, and a gate insulating film interposed between the gate electrode and the diffusion layer. A programming circuit includes a first programming circuit which has first current drive capability and which performs first programming operation and a second programming circuit which has second current drive capability larger than the first current drive capability and which performs second programming operation to follow the first programming operation. In the first programming operation, the first programming circuit breaks down the gate insulating film by applying a first programming voltage between the first terminal and the second terminal. In the second programming operation, the second programming circuit applies a second programming voltage lower than the first programming voltage between the first terminal and the second terminal.

Abstract: A memory array that includes a SOI substrate and lateral bipolar junction transistors (BJTs) fabricated on the SOI substrate. The BJTs form first and second inverters cross coupled to form a memory cell. A read circuit outputs the binary state of the memory cell. A power supply is configured to supply a Vdd voltage to the read circuit and to supply a Vcc and a Vee voltage to the first set of lateral bipolar transistors and the second set of lateral bipolar transistors, wherein the Vee voltage is at least zero volts and the Vcc voltage is greater than the Vee voltage and is equal to or less than the Vdd voltage.

Abstract: A memory array that includes a SOI substrate and lateral bipolar junction transistors (BJTs) fabricated on the SOI substrate. The BJTs form first and second inverters cross coupled to form a memory cell. A read circuit outputs the binary state of the memory cell. A power supply is configured to supply a Vdd voltage to the read circuit and to supply a Vcc and a Vee voltage to the first set of lateral bipolar transistors and the second set of lateral bipolar transistors, wherein the Vee voltage is at least zero volts and the Vcc voltage is greater than the Vee voltage and is equal to or less than the Vdd voltage.

Abstract: A circuit for programming a fuse is disclosed. The circuit includes a voltage supply terminal (Vf) and a semiconductor controlled rectifier (222, 224). The fuse is coupled between the voltage supply terminal and the semiconductor controlled rectifier. A switching circuit (200, 202, 208, 210) is coupled to the semiconductor controlled rectifier.

Abstract: A signal driving device includes a constant current circuit configured to provide a constant current, a first mirror circuit configured to generate a mirror current from the constant current and provide a voltage according to the mirror current of the constant current, a circuit comprising a switch device and configured to provide a driver current, a second mirror circuit configured to generate a mirror current of the driver current and output a voltage that includes a voltage drop caused when the mirror current of the driver current flows through a replica switch device, and a differential amplifier configured to receive the voltage from the first mirror circuit and the voltage from the second mirror circuit to provide a biased voltage for the bias circuit and thereby induce the driver current.

Abstract: A re-writable resistance-switching memory cell includes first and second capacitors in series. The first and second capacitors may have balanced electrical characteristics to allow nearly concurrent, same-direction switching. The first capacitor has a first bipolar resistance switching layer between first and second conductive layers, and the second capacitor has a second bipolar resistance switching layer between third and fourth conductive layers. The first and third conductive layers are made of a common material, and the second and fourth conductive layers are made of a common material. In one approach, the first and second bipolar resistance switching layers are made of a common material and have common thickness. In another approach, the first and second bipolar resistance switching layers are made of materials having different dielectric constants, but their thickness differs in proportion to the difference in the dielectric constants, to provide a common capacitance per unit area.

Abstract: A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell.

Abstract: Disclosed is a memory element, a stack, and a memory matrix in which the memory element can be used. Also disclosed is a method for operating the memory matrix, and to a method for determining the true value of a logic operation in an array comprising memory elements. The memory element has at least a first stable state 0 and a second stable state 1. By applying a first write voltage V0, this memory element can be transferred into the high-impedance state 0 and by applying a second write voltage V1, it can be transferred into the likewise high-impedance state 1. By applying a read voltage VR, the magnitude of which is smaller than the write voltages V0 and V1, the memory element exhibits different electrical resistance values. In the parasitic current paths occurring in a memory matrix, the memory element acts as a high-impedance resistor, without in principle being limited to unipolar switching.

Abstract: A memory device is provided. The memory device includes a memory array; a first circuit electrically connected to the memory array, and causing the memory array to be operated in a first mode; and a second circuit electrically connected to the memory array, and causing the memory array to be operated in a second mode.

Abstract: One time programming memory and methods of storage and manufacture of the same are provided. Examples relate to microelectronic memory technology and manufacture. The one time programming memory includes a diode (10) having a unidirectional conducting rectification characteristic and a variable-resistance memory (20) having a bipolar conversion characteristic. The diode (10) having the unidirectional conducting rectification characteristic and the variable-resistance memory (20) having the bipolar conversion characteristic are connected in series. The one time programming memory device of this example takes the bipolar variable-resistance memory (20) as a storage unit, programming the bipolar variable-resistance memory (20) into different resistance states so as to carry out multilevel storage, and takes the unidirectional conducting rectification diode (10) as a gating unit.

Abstract: A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell.

Abstract: A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell.

Abstract: The present invention relates to electronic driver circuits, and more particularly, to low power electronic driver circuits having low manufacturing costs. The present invention is a circuit design that utilizes two transistor types that can be manufactured together thereby reducing the number of processing steps and masks and resulting in lower cost.

Abstract: The invention relates, among other things, to a memory cell for storing at least one piece of bit data. Said memory cell comprises at least two electrical terminals and a semiconductor structure with a band curve (EL) that has at least one potential well. The charged state of the potential well with charge carries can be increased by applying a supply voltage (Us=Uspeis) to the two terminals, can be reduced by applying a discharge voltage (Us=Usperr), and can be maintained by applying a maintaining voltage (Us=Ubei), the respective charged state of the potential well defining the piece of bit data of the memory cell. According to the invention, the semiconductor structure has a space charge region (Wn) while the potential well is formed by a semiconductor heterostructure.

Abstract: A shift register including an electrical fuse and a method of operating the shift register are disclosed. The shift register includes a register flip-flop group circuit and a plurality of output circuits respectively receiving a plurality of enable signals. Each output circuit includes a fuse control flip-flop receiving one of the plurality of enable signals and outputting a fuse control signal in response to the one enable signal. Each output circuit also includes an electrical fuse receiving the fuse control signal and outputting an electrical fuse mode signal, and a multiplexer outputting either the register output signal or the electrical fuse mode signal as a final output signal in accordance with the one enable signal.

Abstract: An antifuse cell includes a select transistor, a blocking transistor, and an antifuse. The select transistor allows for selection of the antifuse cell among an array of antifuse cells, while the blocking transistor limits the amount of voltage that may be directly applied to the select transistor. The antifuse may comprise a capacitor. Current used to program an antifuse cell is controlled using a programming current regulator. The programming current regulator may include components that form a current mirror with components of the antifuse cell to tightly control programming current through the antifuse. Dynamic current flowing through a substrate of an antifuse cell is limited using a current limiting resistor directly in series with an antifuse of the antifuse cell. The current limiting resistor minimizes or prevents excessive programming current.

Abstract: An ECC based system and method within an integrated circuit memory for self-repair of a failed memory element is disclosed. The method includes processing, within the integrated circuit, data and check bits retrieved from addressed memory locations therein. The locations of memory failures are automatically recorded within the integrated circuit. Logic circuits within the integrated circuit automatically identify failure patterns based on the locations. Based on the identified failure patterns, logic circuits within the integrated circuit then permanently replace a failed memory element with an appropriate redundancy element, using devices such as electronic fuse or antifuse. In this manner, the integrated circuit automatically identifies and effects self repair of a failed memory element therein.

Abstract: A read block is formed from a plurality of TMR elements stacked in the vertical direction. One terminal of each TMR element in the read block is connected to a source line through a read select switch. The source line extends in the Y-direction and is connected to a ground point through a column select switch. The other terminal of each TMR element is independently connected to a corresponding one of read/write bit lines. Each read/write bit line extends in the Y-direction and is connected to a read circuit through the column select switch.

Abstract: Dual-bit nitride read only memory (NROM) cell with parasitic amplifier and method of fabricating and reading the same. A NROM cell comprises a semiconductor substrate with a first well region having a conductive type opposite that of the substrate disposed therein. A second well region having a conductive type opposite to the first well region is disposed in the first well region. A gate dielectric layer is disposed over portions of the second well region, wherein the gate dielectric layer comprises a nitride layer. A conductive layer is disposed on the gate dielectric layer to form a gate. And, a pair of first doped regions having a conductive type opposite to the second well region are symmetrically disposed in the second well region of both sides of the gate, wherein one of the first doped regions, the second well region and the first well region constitute a parasitic current amplifier.

Abstract: A memory device is described which has an n-channel field effect transistor coupled between a memory cell and a data communication line. An NPN bipolar junction transistor is also coupled between the memory cell and the data communication line in parallel to the n-channel access transistor. A base connection of the NPN bipolar junction transistor is described as coupled to a body of the n-channel access transistor. During operation the n-channel field effect transistor is used for writing data to a memory cell, while the NPN bipolar junction transistor is used for read operations in conjunction with a current sense amplifier circuit. The access transistors are described as fabricated as a single vertical pillar.

Abstract: A memory device is described which has an n-channel field effect transistor coupled between a memory cell and a data communication line. An NPN bipolar junction transistor is also coupled between the memory cell and the data communication line in parallel to the n-channel access transistor. A base connection of the NPN bipolar junction transistor is described as coupled to a body of the n-channel access transistor. During operation the n-channel field effect transistor is used for writing data to a memory cell, while the NPN bipolar junction transistor is used for read operations in conjunction with a current sense amplifier circuit. The access transistors are described as fabricated as a single vertical pillar.