Abstract: A two transistor ternary random access memory (TTTRAM) circuit includes an voltage/current input, an input/output switch, a first transistor, a first pull up resistor, a second transistor, and a second pull up resistor. The first transistor has a first emitter, a first collector connected to the input/output switch, and a first base. The first pull up resistor is connected to the first emitter and the voltage/current input. The second transistor has a second emitter connected to ground, a second collector, and a second base connected to the input/output switch. The second pull up resistor is connected to the first base, the second collector, and the voltage/current input.

Abstract: A signal processing device is produced. The signal processing device including a first transistor with high off-state resistance, a second transistor which controls conduction between two different nodes, a capacitor which holds electric charge, and a current control element such as a transistor or a resistor. The first node to which a gate of the second transistor and a second electrode of the current control element are connected, and the second node to which one of a source and a drain of the first transistor, a first electrode of the capacitor, and a first electrode of the current control element are connected. The capacitance (including a parasitic capacitance) of the second node is greater than ten times the capacitance (including a parasitic capacitance) of the first node. The capacitance does not affect the first node; thus, a boosting effect is large and charge retention characteristics are favorable.

Abstract: There is a need to highly integrate a circuit area of content addressable memory (CAM) and ensure faster operation thereof. A priority encoder and row decoder portion shares a row address register including more than one row. Each row of the row address register corresponds to each entry of a TCAM array mat and retains each address. Each row of the row address register corresponds to each word line and match line of the TCAM array mat. Writing data to the TCAM array mat activates word line for a row retained in the row address register corresponding to a specified address. Searching for the TCAM array mat activates a match line for the TCAM array mat. The row address register for the corresponding row stores the address of an entry for the TCAM array mat matching search data.

Abstract: A semiconductor device includes first to fourth memory cells and each memory cell includes a first gate electrode, a ferroelectric film, a semiconductor film, a source electrode, a drain electrode, a paraelectric film and a second gate electrode. The ferroelectric film is interposed between the first gate electrode and the semiconductor film, the source electrode and the drain electrode are interposed between the semiconductor film and the paraelectric film. The first gate electrode, the ferroelectric film, the source electrode, and the drain electrode constitute a first semiconductor transistor. The second gate electrode, the paraelectric film, the source electrode, and the drain electrode constitute a second semiconductor transistor.

Abstract: A memory device is provided. The memory device includes a plurality of memory cells and a controller to write data to and read data from the memory cells. Each memory cell includes a first semiconductor material having a spontaneous polarization, a resistive ferroelectric material having a switchable spontaneous polarization, and a second semiconductor material having a spontaneous polarization, the resistive ferroelectric material being positioned between and in contact with the first and second semiconductor materials. The memory device can be configured to store energy that can be released by applying a voltage pulse to the memory device.

Abstract: A data holding device according to the present invention includes a loop structure portion LOOP for holding data using a plurality of logic gates (NAND3 and NAND4) connected in a loop, a nonvolatile storage portion (NVM) for storing in a nonvolatile manner the data held in the loop structure portion (LOOP) by using the hysteresis characteristics of ferroelectric elements, a circuit separating portion (SEP) for electrically separating the loop structure portion (LOOP) and the nonvolatile storage portion (NVM), and a set/reset controller (SRC) for generating a set signal (SNL) and reset signal (RNL) based on data stored in the nonvolatile storage portion (NVM), wherein the plurality of logic gates are each set and reset to an arbitrary output logic level in accordance with the set signal (SNL) and reset signal (RNL).

Abstract: A spin MOSFET includes: a first ferromagnetic layer provided on a semiconductor substrate, and having a fixed magnetization direction perpendicular to a film plane; a semiconductor layer provided on the first ferromagnetic layer, including a lower face opposed to the upper face of the first ferromagnetic layer, an upper face opposed to the lower face, and side faces different from the lower and upper faces; a second ferromagnetic layer provided on the upper face of the semiconductor layer, and having a variable magnetization direction perpendicular to a film plane; a first tunnel barrier provided on the second ferromagnetic layer; a third ferromagnetic layer provided on the first tunnel barrier; a gate insulating film provided on the side faces of the semiconductor layer; and a gate electrode provided on the side faces of the semiconductor layer with the gate insulating film being interposed therebetween.

Abstract: Provided is a memory cell including: a ferroelectric transistor; a plurality of switching elements electrically connected to the ferroelectric transistor; and a plurality of control lines for transmitting individual control signals to each of the plurality of switching element for separately controlling the plurality of switching elements. The plurality of switching elements are configured to be separately controlled on the basis of the individual control signals so as to prevent each electrode of the ferroelectric transistor from being floated.

Abstract: It is made possible to provide a spin MOSFET that can minimize the increase in production costs and can perform both spin injection writing and reading. A spin MOSFET includes: a substrate that has a semiconductor region of a first conductivity type; first and second ferromagnetic stacked films that are formed at a distance from each other on the semiconductor region, and each have the same stacked structure comprising a first ferromagnetic layer, a nonmagnetic layer, and a second ferromagnetic layer stacked in this order, the second ferromagnetic stacked film having a film-plane area different from that of the first ferromagnetic stacked film; a gate insulating film that is formed on a portion of the semiconductor region, the portion being located between the first ferromagnetic stacked film and the second ferromagnetic stacked film; and a gate that is formed on the gate insulating film.

Abstract: A memory device and method for manufacturing the memory device are provided. The memory device including a first electrode, a first ferroelectric polymer layer over the first electrode, a second electrode over the first ferroelectric polymer layer, a second ferroelectric polymer layer over the second electrode, a third electrode over the second ferroelectric polymer layer, and a protective layer between the first and second ferroelectric polymer layers. The first, second and third electrodes and the first and second ferroelectric polymer layers define first and second ferroelectric capacitor structures, the second electrode being common to the first and second ferroelectric capacitor structures.

Abstract: Static-based comparators and methods for comparing data are disclosed. The static-based comparator is configured to selectively switch at least one comparator output in response to a comparison of corresponding data with compare data, and a validity indicator for the data. If the validity indicator indicates valid data, the static-based comparator switches to drive the comparator output indicating either a match or mismatch between corresponding compared data. If the validity indicator indicates invalid data, the static-based comparator provides a mismatch on the comparator output without switching the static-based comparator regardless of whether or not the data matches the compare data. In this manner, the static-based comparator does not dissipate power switching the comparator output for data marked invalid. The static-based comparator can be employed in content addressable memories (CAMs) for comparing one or more bits of tag data to corresponding bit(s) of compare data.

Abstract: A reference voltage generation circuit includes a first node settable at a reference voltage to be any one of a plurality of voltage levels, a second node set at a pre-charge voltage, first and second switches connected in series between the first and second nodes, a plurality of capacitors, each capacitor comprising a first end connected to a connection node between the first and second switches and a second end settable at an independent voltage level, a switch controller configured to turn off the first switch and turn on the second switch in an initial state, and then to turn off the second switch, and then to turn on the first switch, and a voltage controller configured to individually set a voltage at the second end of each capacitor after the first switch is turned on.

Abstract: A ferro-electric random access memory apparatus has a memory cell array in which a plurality of memory cells each formed of a ferro-electric capacitor and a transistor are arranged, word lines are disposed to select a memory cell, plate lines are disposed to apply a voltage to a first end of the ferro-electric capacitor in a memory cell, and bit lines are disposed to read cell data from a second end of the ferro-electric capacitor in the memory cell. The ferro-electric random access memory apparatus has a sense amplifier which senses and amplifies a signal read from the ferro-electric capacitor onto the bit line. The ferro-electric random access memory apparatus has a bit line potential control circuit which exercises control to pull down a voltage on an adjacent bit line adjacent to the selected bit line onto which the signal is read, before operation of the sense amplifier at time of data readout.

Abstract: A system code is stored in a first nonvolatile memory. The first nonvolatile memory and a second nonvolatile memory are heated during assembly of an electronic device including the first nonvolatile memory and a second nonvolatile memory. The heating is to a temperature sufficient to change a state of at least some memory cells in the second nonvolatile memory device. After the heating, the system code stored in the first nonvolatile memory is copied into the second nonvolatile memory. The first nonvolatile memory may he less vulnerable to temperature-related data alteration than the second nonvolatile memory. For example, the first nonvolatile memory may include a NAND flash memory and the second nonvolatile memory may include a variable resistance memory.

Abstract: A memory device is provided. The memory device including memory cells having at least three stacked electrodes spaced apart pairwise by dielectric material so that the pairs of electrodes form respective capacitor layers. The capacitors are connected electrically in parallel to each other. The dielectric material is optionally ferroelectric material, in which case the capacitors are ferrocapacitors.

Abstract: An array of ferroelectric memory cells that allows imprint mitigation includes ferroelectric memory cells respectively coupled to word lines, plate lines, and bit lines; a word line driver for driving the word lines; a plate line driver for driving the plate lines; a bit line driver for driving the bit lines; and an isolation device driver for driving isolation devices coupled between the bit lines and a plurality of bit lines. The method for mitigating imprint includes coupling the bit lines to a respective plurality of sense amplifiers, turning on a word line and pulsing a plate line associated with a row of ferroelectric memory cells, disconnecting the bit lines from the respective sense amplifiers, driving the plate line low and the bit lines high, driving the plate line high and the bit lines low, driving the plate line low and floating the bit lines, driving the bit lines with the sense amplifier, and turning off the word line and precharging the bit lines.

Abstract: A memory includes word lines; plate lines; first to eighth bit lines; cell transistors; ferroelectric capacitor connected in parallel with cell transistors; sense amplifiers, wherein cell transistors and ferroelectric capacitors configure cells, the cells are connected in series to configure first to eighth cell blocks, the cell blocks are connected to the same word lines, first ends of the cell blocks are respectively connected to the bit lines, second ends of the cell blocks are respectively connected to the different plate lines, one of the first to the fourth bit lines and one of the fifth to the eighth bit lines are configured to be selectively connected to the sense amplifier during an operation, numbers of the cells connected in series between the bit lines and the plate lines are different in the first to the fourth cell blocks, and are different in the fifth to the eighth cell blocks.

Abstract: A ferroelectric memory according to an embodiment of the present invention includes a memory cell array including plural memory cells, and provided with plural word lines, plural bit lines, and plural plate lines, each of the plate lines corresponding to at least two of the word lines, an access control circuit configured to perform an access operation to a selected cell which is selected from the memory cells, and a refresh control circuit configured to perform a refresh operation, in a background of the access operation, on a refresh cell which is selected from the memory cells, the refresh control circuit performing the refresh operation when a plate line connected to the selected cell and a bit line connected to the selected cell are at the same potential after the access operation.

Abstract: A magnetic random access memory includes: a magnetic recording layer including a ferromagnetic layer and having perpendicular magnetic anisotropy; and a magnetic reading layer provided on the magnetic recording layer and used for reading information. The magnetic recording layer includes: a magnetization switching area having reversible magnetization; a first magnetization pinned area connected to a first boundary of the magnetization switching area and having magnetization whose direction is pinned in a first direction; and a second magnetization pinned area connected to a second boundary of the magnetization switching area and having magnetization whose direction is pinned in a second direction. The magnetic reading layer includes: a magnetic sensing layer whose direction of magnetization changes based on a direction of the magnetization of the magnetization switching area; a nonmagnetic barrier layer provided on the magnetic sensing layer; and a pinned layer provided on the nonmagnetic barrier layer.

Abstract: Provided is a semiconductor device that includes: a base insulating film 25 formed above a silicon substrate 10; a ferroelectric capacitor Q formed on the base insulating film 25; multiple interlayer insulating films 35, 48, and 62, and metal interconnections 45, 58, and 72 which are alternately formed on and above the capacitor Q; and conductive plugs 57 which are respectively formed inside holes 54a provided in the interlayer insulating films 48 and are electrically connected to the metal interconnections 45. In the semiconductor device, a first capacitor protection insulating film 50 is formed on an upper surface of the interlayer insulating film 48 by sequentially stacking a first insulating metal oxide film 50a, an intermediate insulating film 50b having a relative dielectric constant lower than that of the interlayer insulating film 48, and a second insulating metal oxide film 50c; and the holes 54a are also formed in the first capacitor protection insulating film 50.

Abstract: A CAM column structure includes an interface that drives search data to a plurality of CAM cells via a search line pair. The CAM cells are divided into sections, each section including: a set of CAM cells, a bit line pair coupled to the set of CAM cells, a sense amplifier coupled to the bit line pair, a tri-state read buffer configured to drive read data from the sense amplifier to the search line pair, and a pair of tri-state write buffers configured to drive write data from the search line pair to the bit line pair. In one embodiment, the pair of tri-state write buffers is replaced by a pair of switches that couple the search line pair to the sense amplifier. The search line pair may be segmented by tri-state buffers, which are controlled to drive the search, read and write data along the search line pair.

Abstract: A method (300) of identifying failing bits in a ferroelectric memory device including at least one ferroelectric capacitor includes (302) writing same state data to the first capacitor, and (304) baking the first capacitor for a first specified period of time at a first selected temperature. A same state read (306) is performed on the first capacitor after the baking. Based on the results from the same state read, it is determined whether an error occurred. The first specified period of time can be from 10 minutes to 2 hours and the first selected temperature can be in a range from 85° C. to 150° C. A repair can be performed (310) to corrected detected errors. A related method (500) can detect imprinted bits using a same state write (502), followed by a relatively high temperature bake (504), then a same state read (506). An opposite state date write (508) is performed followed by a relatively low temperature bake (510), and then an opposite state data read (512) to identify opposite state error or imprint.

Abstract: A nonvolatile programmable logic circuit using a ferroelectric memory performs a nonvolatile memory function and an operation function without additional memory devices, thereby reducing power consumption. Also, a nonvolatile ferroelectric memory is applied to a FPGA (Field Programmable Gate Array), thereby preventing leakage of internal data and reducing the area of a chip.

Abstract: A ferroelectric semiconductor storage device includes: a block having a plurality of ferroelectric memory cells connected in series, each of the plurality of ferroelectric memory cells including a ferroelectric capacitor and a transistor connected in parallel to both ends of the ferroelectric capacitor; a word line connected to each of the transistors; a selection transistor connected to one end of the block; a bit line connected to the selection transistor; and a plate line connected to the other end of the block. The number of ferroelectric memory cells connected in each block in the ferroelectric semiconductor storage device is odd.

Abstract: A method (300) of identifying failing bits in a ferroelectric memory device including at least one ferroelectric capacitor includes (302) writing same state data to the first capacitor, and (304) baking the first capacitor for a first specified period of time at a first selected temperature. A same state read (306) is performed on the first capacitor after the baking. Based on the results from the same state read, it is determined whether an error occurred. The first specified period of time can be from 10 minutes to 2 hours and the first selected temperature can be in a range from 85° C. to 150° C. A repair can be performed (310) to corrected detected errors. A related method (500) can detect imprinted bits using a same state write (502), followed by a relatively high temperature bake (504), then a same state read (506). An opposite state date write (508) is performed followed by a relatively low temperature bake (510), and then an opposite state data read (512) to identify opposite state error or imprint.

Abstract: The ferroelectric memory apparatus stores data, and includes: a ferroelectric memory element; a temperature sensor which detects a temperature of the apparatus; a control unit that outputs a control signal indicating a voltage, the voltage increasing as the temperature detected by the temperature sensor decreases; and a voltage generating unit that generates the voltage indicated by the control signal outputted by the control unit, and to supply the generated voltage to the ferroelectric memory element. This provides a ferroelectric memory apparatus which can recover from effects of thermal stress suffered after shipment—i.e., reduction in the polarization amount needed for data retention as well as imprint degradation—using a relatively simple configuration.

Abstract: A nonvolatile programmable logic circuit using a ferroelectric memory performs a nonvolatile memory function and an operation function without additional memory devices, thereby reducing power consumption. Also, a nonvolatile ferroelectric memory is applied to a FPGA (Field Programmable Gate Array), thereby preventing leakage of internal data and reducing the area of a chip.

Abstract: The invention concerns semiconductor latches capable of memorizing any programmed information even after power supply has been removed. Used is a ?m BiCMOS EPROM process but it is applicable in any other process having hot electron injection devices like EPROM, Flash EEPROM.

Abstract: The invention relates to a semiconductor element used for a nonvolatile semiconductor storage device or the like, a semiconductor storage device using the same, a data writing method thereof, a data reading method thereof and a manufacturing method of those, and has an object to provide a semiconductor element in which scaling and integration of cells are possible, storage characteristics of data are excellent, and reduction in power consumption is possible, a semiconductor storage device using the same, a data writing method thereof, a data reading method thereof, and a manufacturing method of those.

Abstract: A nonvolatile memory cell, a memory device and a corresponding production method are disclosed. In one embodiment, a memory material region is in this case provided as memory element between a first electrode device and a second electrode device. The memory material region can be activated by means of at least one species. The memory material region is formed with or from a nanostructure.

Abstract: A semiconductor device comprising a substrate and a ferroelectric capacitor formed on the substrate. The ferroelectric capacitor includes a lower electrode, an upper electrode and a ferroelectric film interposed between the lower and upper electrodes. The ferroelectric capacitor having sidewalls receded from sidewalls of the upper electrode.

Abstract: A ferroelectric memory device, which includes a vertical ferroelectric capacitor having an electrode distance smaller than a minimum feature size of lithography technology being used and suitable for the miniaturization, and a method of manufacturing the same are disclosed. According to one aspect of the present invention, it is provided a ferroelectric memory device comprising an MIS transistor formed on a substrate, and a ferroelectric capacitor formed on an interlevel insulator above the MIS transistor, wherein a pair of electrodes of the ferroelectric capacitor are disposed in a channel length direction of the MIS transistor to face each other putting a ferroelectric film in-between, and wherein a distance between the electrodes of the ferroelectric capacitor is smaller than a gate length of the MIS transistor.

Abstract: A semiconductor device includes: a semiconductor substrate; a MOS transistor formed in the semiconductor substrate and having an insulated gate and source/drain regions on both sides of the insulated gate; a ferroelectric capacitor formed above the semiconductor substrate and having a lower electrode, a ferroelectric layer and an upper electrode; a metal film formed on the upper electrode and having a thickness of a half of or thinner than a thickness of the upper electrode; an interlayer insulating film burying the ferroelectric capacitor and the metal film; a conductive plug formed through the interlayer insulating film, reaching the metal film and including a conductive glue film and a tungsten body; and an aluminum wiring formed on the interlayer insulating film and connected to the conductive plug. A new problem near an upper electrode contact is solved which may otherwise be caused by adopting a W plug over the F capacitor.

Abstract: A memory system of the present invention includes a memory device having a nonvolatile memory and an access device which accesses the memory device. The memory device has a detection unit to detect a temperature of the memory device, a determination unit to determine an operating condition in accordance with the detected temperature and a notification unit to notify the access device of the determined operating condition. The access device has an interface unit to connect to the memory device and a controlling unit to control the interface unit in accordance with the notified operating condition from the memory device.

Abstract: A CAM cell array according to embodiments of the present invention include an array of CAM cells, each of the CAM cells comprising a first cell, the first cell including a non-volatile storage element coupled to at least one first data line and a match line; a match line controller coupled to the match line; and a data line controller coupled to the data lines, wherein a write operation is performed by changing a state of the non-volatile storage element by providing data to the at least one data line, wherein a read operation is performed by determining the state of the non-volatile storage element through the at least one data line, and wherein a comparison operation is performed by applying data to the at least one data line and determining a match condition on the match line.

Abstract: When an address storing/comparing circuit stores no address identical to an external input address in read operation, in a main memory read data is written back to a data storing area after data read therefrom, and data indicating a sum of a predetermined value and a value of the read data is written to a history storing area after data read therefrom. In a sub memory, after data read from a history storing area, data read from the data storing area of the main memory is written to a data storing area and the data indicating the sum of the predetermined value and the value of the data read from the history storing area of the main memory is written to the history storing area, when the value of the data read from the history storing area of the main memory is larger than that of the sub memory.

Abstract: A nonvolatile programmable logic circuit using a ferroelectric memory performs a nonvolatile memory function and an operation function without additional memory devices, thereby reducing power consumption. Also, a nonvolatile ferroelectric memory is applied to a FPGA (Field Programmable Gate Array), thereby preventing leakage of internal data and reducing the area of a chip.