Abstract: A memory device is provided. The memory device includes a memory array of a plurality of memory elements, a plurality of word lines or word line pairs, a plurality of bit line pairs, and a plurality of common source lines. Each of the memory elements includes two memory cells. The memory device is configured for calculating an energy value based on a plurality of state signals and a plurality of coefficients, and the two memory cells of each of the memory elements are configured for performing an individual selection such that one of the two memory cells of each of the memory elements receives two corresponding state signals from a corresponding word line or a corresponding word line pair and a corresponding bit line pair and generates an output current into a corresponding common source line for calculating the energy value.

Abstract: A memory controller is disclosed. The memory controller is configured to be connected to one or more memory devices via an address and control (RQ) bus. Each of the memory devices have on-die termination (ODT) circuitry connected to a subset of signal lines of the RQ bus, and the memory controller is operable to selectively disable the ODT circuitry in at least one memory device of the one or more memory devices.

Abstract: Disclosed herein are memory devices and related methods and techniques. A cell in the memory device may be associated with an intervening transistor, the intervening transistor being configured to isolate the cell from adjacent cells under a first operating condition and to provide a current to a bit line associated with the cell under a second operating condition.

Abstract: Data encoding system and method for implementing robust non-volatile memories. A data bit is stored using two memory cells. The data bit is represented by setting a voltage level of a first memory cell to a first voltage level and setting a voltage level of a second memory cell to a second voltage level. In one embodiment, the first voltage level and the second voltage level are of opposite polarity. In one embodiment, to store a data bit having the value “0,” the first memory cell is set to a first voltage level and the second memory cell is set to a second voltage level of opposite polarity to the first voltage level, and to store a data bit having the value “1,” the first memory cell is set to a third voltage level and the second memory cell is set to a fourth voltage level of opposite polarity to the third voltage level.

Abstract: Flash memory systems and methodologies are provided for providing multiple virtual ground decoding schemes in a flash device. The flash device can include sector configure registers for selecting a specific ground scheme at sector level. The sector configure registers can select a decoding scheme from multiple virtual ground decoding schemes including a conventional dual bit decoding scheme and a single program and erase entity decoding scheme. Since the single program and erase entity decoding scheme can emulate EEPROM functionality in a flash device, the combination of the conventional dual bit decoding scheme and the single program and erase entity decoding scheme can provide both dual bit high density storage and EEPROM emulation in a single flash device.

Abstract: A memory cell for storing 1-bit data is formed by using at least two memory elements in the OTP type nonvolatile memory using a memory element that have two states and can transit only in one direction. In the OTP type nonvolatile memory using a memory element that has two states of an H state (a first state) and an L (a second state) state (hereinafter simply referred to as H and L) and can electrically transit only in one direction from L to H, a memory cell for storing 1-bit data is formed by using two or more memory elements.

Abstract: Data encoding system and method for implementing robust non-volatile memories. A data bit is stored using two memory cells. The data bit is represented by setting a voltage level of a first memory cell to a first voltage level and setting a voltage level of a second memory cell to a second voltage level. In one embodiment, the first voltage level and the second voltage level are of opposite polarity. In one embodiment, to store a data bit having the value “0,” the first memory cell is set to a first voltage level and the second memory cell is set to a second voltage level of opposite polarity to the first voltage level, and to store a data bit having the value “1,” the first memory cell is set to a third voltage level and the second memory cell is set to a fourth voltage level of opposite polarity to the third voltage level.

Abstract: A p-type pillared layer, made of a silicon single crystal, is formed on a bit line formed of an n-type diffusion layer by expitaxial growth. An FET, in which a gate electrode is provided through an insulating film and a side surface of the pillared layer is served as a channel area, is formed around the pillared layer. Also, a lower electrode, formed of an n-type silicon layer contacting an upper portion of the pillared layer, an insulating film, and an upper electrode are sequentially provided to surround the FET, thereby constituting a capacitor. The receptive elements are overlaid on each other in a vertical direction, so that a processing margin becomes zero and the wire connecting the respective elements is omitted, and a degree of integration of a semiconductor memory can be improved.