Abstract: A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

Abstract: A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiring post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.

Abstract: A semiconductor laser apparatus of the present invention includes: a semiconductor laser chip 1 having an electrode 11 formed on a surface of the semiconductor laser chip 1; a heat sink 3 for the semiconductor laser chip 1; a submount 2 disposed between the semiconductor laser chip 1 and the heat sink 3 and bonded to the semiconductor laser chip 1 and the heat sink 3; and recessed marks 13 formed on the surface of the semiconductor laser chip 1 by partially removing the electrode 11, wherein the semiconductor laser chip 1 is longer in the resonator direction than in a direction orthogonal to the resonator direction, and the recessed marks 13 are disposed within a predetermined distance from each of the front and rear end faces of the semiconductor laser chip.

Abstract: An integrated, low profile, high power laser light emission device is disclosed. The integrated laser light emission device provides uniform heat dissipation, as well as uniform pumping of the laser gain medium without the need for a pumping cavity. The laser system includes a pump diode array that can be mounted directly to a laser gain medium without intervening correcting optics hardware. Heat generated by the laser light emission device is cooled by a single cooling system. In the laser device, a pump diode array is preferably a Vertical-Cavity Surface-Emitting Laser (VCSEL) array. VCSEL arrays are mounted on the laser gain crystal by a metal cavity frame or metal stilts. The slightly elevated mounting of the VCSEL's enables increased cooling and maximizing the quantity of VCSEL's on the laser gain medium in order to achieve highly efficient and high power laser light output.

Abstract: A VCSEL array device formed of a monolithic array of VCSELs and short circuited mesas is disclosed. The VCSELs can be spaced symmetrically or asymmetrical, in a manner to improve power or speed, or in phase and in parallel. The VCSELs are connected to a first metal contact pad formed on a heat-spreading substrate. The short-circuited mesas are formed alongside the VCSELs and are bonded to and form a short circuit to a second metal contact pad on the grounding substrate. Each VCSEL is encompassed by a thick metal heat sink to increase the height of VCSEL mesas. The structure of the heat sink, the VCSELs and the shorting mesas reduce parasitic impedance thereby increasing output power and high frequency response. The VCSELs and shorting mesas can be packaged as a coplanar waveguide in a ground-signal-ground configuration that improves signal modulation characteristics.

Abstract: A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.

Abstract: A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion.

Abstract: Methods and apparatus for broad tuning of single wavelength quantum cascade lasers and the use of light output from such lasers for highly sensitive detection of trace gases such as nitrogen dioxide, acetylene, and vapors of explosives such as trinitrotoluene (TNT) and triacetone triperoxide (TATP) and TATP's precursors including acetone and hydrogen peroxide. These methods and apparatus are also suitable for high sensitivity, high selectivity detection of other chemical compounds including chemical warfare agents and toxic industrial chemicals. A quantum cascade laser (QCL) system that better achieves single mode, continuous, mode-hop free tuning for use in L-PAS (laser photoacoustic spectroscopy) by independently coordinating gain chip current, diffraction grating angle and external cavity length is described. An all mechanical method that achieves similar performance is also described. Additionally, methods for improving the sensor performance by critical selection of wavelengths are presented.

Abstract: A laser arrangement has at least one laser diode apparatus with a side surface which laterally limits the laser diode apparatus. The laser arrangement has a plurality of active regions arranged laterally side by side and configured to generate radiation. The laser diode apparatus is arranged on a mount. The distance between the side surface and an edge which laterally limits the mount on the part of the side surface is shorter than the distance between the side surface and the active region closest to the side surface. Additionally or alternatively, the distance between the side surface and the edge is shorter than one of the distances between two adjacent active regions of the laser diode apparatus.

Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.

Abstract: A monolithic pumped laser cavity design is disclosed. Elements of the laser cavity, such as gain material, Q-switch, reflector, and outcoupler, are contact bonded together with a thermally conductive epoxy. The assembly is then operatively coupled to a heat sink (e.g., by mechanical or chemical means). The assembly is potted in thermally conductive potting material. The stacked elements or a subset thereof may be bonded to heat sink mounts and/or face cooling layers. In this fashion, various elements can be easily assembled and bonded together to provide the desired combination of laser energy, pulse width, and repetition frequency. The thermally conductive potting material provides structural integrity, as well as thermal management by extracting heat from the encased assembly to the heat sink. The optional heat sink mounts and face cooling operate to further extract heat and reduce thermal loading. Outcoupling to fiber may also be provided.

Abstract: A semiconductor gain-structure functions as a gain-element in a laser-resonator. The gain-structure is bonded to a diamond heat-spreader that is peripherally cooled by a heat-sink configured to allow access to the gain-structure by laser-radiation circulating in the laser-resonator. In one example, the gain-structure is used as a transmissive gain-structure in a traveling-wave ring-resonator. In another example, the gain-structure surmounts a mirror-structure which functions as an end-mirror of a standing-wave laser-resonator.

Abstract: According to the present invention, a laser light source comprises plural semiconductor lasers (2), a solid laser (4), a non-linear material (3) as a wavelength conversion element, a reflection coat (5) formed on one facet of the solid laser, and a reflection coat (6) formed on one facet of the non-linear material (3), and the solid laser and the wavelength conversion element are disposed between the both reflection coats to constitute a laser resonator, and plural pump parts (8) in the solid laser (4) which are pumped by the plural semiconductor lasers are separated from each other by 300 ?m or more. Thereby, interference between transverse modes of laser oscillation is avoided, thereby providing a high-power, stable, and compact solid laser light source with which a stable high output power can be obtained.

Abstract: Various embodiments of a multi-laser system are disclosed. In some embodiments, the multi-laser system includes a plurality of lasers, a plurality of laser beams, a beam positioning system, beam focusing optics, a thermally stable enclosure and a temperature controller. The thermally stable enclosure is configured to thermally and mechanically couple to a flow cell. The thermally stable enclosure substantially comprises a material with high thermal conductivity. The thermally stable enclosure can have a relatively small volume.

Abstract: A semiconductor laser system includes a diode laser tile. The diode laser tile includes a mounting fixture having a first side and a second side opposing the first side and an array of semiconductor laser pumps coupled to the first side of the mounting fixture. The semiconductor laser system also includes an electrical pulse generator thermally coupled to the diode bar and a cooling member thermally coupled to the diode bar and the electrical pulse generator.

Abstract: An optical transmission control circuit includes: an analog input section which receives optical transmission states as an analog values; an A/D conversion section which converts the analog values into digital values; a value storage section which stores maximum value of the digital values provided by the A/D conversion section; an output register which outputs a value to a host apparatus; and a control section which controls the maximum value storage section to store the maximum value of the digital values therein and controls the output register to output the maximum value to the host apparatus.

Abstract: A semiconductor laser beam device, comprising a stem type package having a base part and a heat sink part, wherein the heat sink part is cylindrically formed so as to be concentric to the base part, a groove is formed along the axial direction of the heat sink part, and a semiconductor laser beam element is disposed at the bottom part of the inner wall surfaces of the groove whereby the radiating capability of the semiconductor laser beam device can be increased by increasing the volume of the heat sink part, and the element can be protected by the groove.

Abstract: The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).

Abstract: The present invention relates to a semiconductor laser apparatus having a structure for preventing the corrosion of a refrigerant flow path in a heat sink and for cooling a semiconductor laser array stably over a long period of time. The semiconductor laser apparatus comprises a semiconductor laser stack in which a plurality of semiconductor laser units are stacked, a refrigerant supplier, a piping for connecting these components, and a refrigerant flowing through these components. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. Each of the semiconductor laser units is constituted by a pair of a semiconductor laser array and a heat sink. The heat sink has a refrigerant flow path.

Abstract: When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.

Abstract: A laser module (1) with at least two laser units (3) are adjusted such that the emitted beams of the laser units (3) converge. The laser units (3) exhibit cooling channels (5) that are provided with a cooling medium. At least one of the laser units has a curved adjustment surface (10) which his mounted to a facing mounting surface (9) of a mounting unit (2) such that a cooling channel opening in the adjustment surface (9) is located opposite an additional cooling channel opening in the mounting surface (10).

Abstract: Alerts, such as laser driver current alarms, are triggered in an optoelectronic device based on dynamic digital diagnostics, such as operating temperature. Optoelectronic devices may execute microcode structured to represent a formulaic relation between a first parameter (e.g., temperature) and an indicator value for a second parameter (e.g., laser driver current). The microcode may further be structured to cause the optoelectronic device to access the first parameter, calculate an indicator value for the second parameter based on the accessed first parameter using the formulaic relation, access the second parameter, and compare the indicator value with the second parameter to determine whether to trigger an alert. If the second parameter exceeds the indicator value, the alert may be triggered, and may be indicative of potentially imminent optoelectronic device failure.

Abstract: In a semiconductor device where a semiconductor element having an asymmetric temperature distribution during an operation is mounted, inner leads on the right and left ends have asymmetric lengths, so that the right and left regions of a semiconductor element mounting part have different sizes. The semiconductor element is mounted so as to have a high-temperature region side in a wide region of the mounting part, and the inner leads are wire bonded at the center to the wide region of the mounting part. It is thus possible to provide a small semiconductor device in which a long semiconductor element is mounted with heat dissipation.

Abstract: A laser diode illuminator device and a method for optically conditioning the output beam radiated from such a device, so that highly-demanding illumination application requirements that call for high output powers within a specified field of illumination can be addressed. At the heart of the device is a two-dimensional stack of laser diode bars wherein the linear array of beamlets radiated by each laser diode bar is optically conditioned through its passage in a refractive-type micro-optics device followed by a cylindrical microlens. The micro-optics device performs collimation of the linear array of beamlets along the fast axis of the bars, and it also acts as a beam symmetrization device by interchanging the divergences of the laser beamlets along the fast and slow axes. The cylindrical microlens is for collimation of the beamlets along the slow axis.

Abstract: A compact mid-IR laser device utilizes a quantum cascade laser to provide mid-IR frequencies suitable for use in molecular detection by signature absorption spectra. The compact nature of the device is obtained owing to an efficient heat transfer structure, the use of a small diameter aspheric lens and a monolithic assembly structure to hold the optical elements in a fixed position relative to one another. The compact housing size may be approximately 20 cm×20 cm×20 cm or less. Efficient heat transfer is achieved using a thermoelectric cooler TEC combined with a high thermal conductivity heat spreader onto which the quantum cascade laser is thermally coupled. The heat spreader not only serves to dissipate heat and conduct same to the TEC, but also serves as an optical platform to secure the optical elements within the housing in a fixed relationship relative on one another.

Abstract: To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the comb-shaped submount is placed between the heat sink and the comb-shaped submount. With this configuration, a thermal stress acting between the comb-shaped submount and the device mounted thereon is relaxed, and as a result, long-term reliability of bonding parts between the comb-shaped submount and the device is enhanced.

Abstract: The present invention relates to an external-cavity laser module comprising a thermoelectric cooler (TEC) including an upper carrier plate having an upper surface, said TEC being configured to stabilize the temperature of the upper surface at a substantially constant temperature. The laser module further comprises a laser assembly mounted on an optical bench, which is in thermal coupling with said upper surface, said laser assembly comprising a gain medium for emitting an optical beam into the external cavity and an end mirror.

Abstract: A laser diode array is formed on a heat sink having an insulating layer in which a plurality of grooves is formed through the ceramic layer and to or into the heat sink. A laser diode stack is soldered to the ceramic layer.

Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).

Abstract: There is provided a light-emitting module which suppresses wavelength drift. A light-emitting module according to the invention includes a stem and a cap fixed to the upper surface of the stem. A thermo-electric cooler is mounted on the stem and a base is mounted on the thermo-electric cooler. A laser diode is mounted on one side of the base. A thermistor that measures the temperature of the laser diode is mounted on another side. The other side includes an overhung portion that blocks radiant heat transmitting from the cap toward the thermistor.

Abstract: A vertical external cavity surface emitting laser (VECSEL) using end pumping in which a pumping beam is recycled using a pumping beam reflection layer to increase pumping beam absorption is provided. The VECSEL includes: an active layer for generating and emitting signal light; an external mirror that is separated from and faces a top surface of the active layer and transmits a first portion of the signal light and reflects a second portion of the signal light to the active layer; a first reflection layer contacting a lower surface of the active layer and reflecting the signal light to the external mirror; a pump laser for emitting the pumping beam toward the lower surface of the active layer to excite the active layer; and a second reflection layer contacting the top surface of the active layer and reflecting a portion of the pumping beam back to the active layer.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: The laser device (22) is formed by a stack of laser diodes (4) arranged on plates (6) formed of a material that is electrically conductive and a good heat conductor. In order to obtain a high level of heat evacuation efficiency towards the cooling body (10) and to prevent electric short-circuiting problems, each plate has at the bottom end (24) thereof, an electrically insulating layer deposited on the surface thereof prior to being fixed to the cooling body by a securing material (26) that is preferably a good heat conductor, formed in particular by a braze layer. According to the invention, the insulating layer covers the end face of each plate and also goes up along the lateral faces of the latter over a certain height. The securing material is arranged under the end of the plate and also partially covers the insulating layer along the lateral faces of the plate.

Abstract: To achieve a solid-state laser element capable of outputting a high-power laser, in a planar waveguide type solid-state laser element that causes a plurality of fundamental laser beams to oscillate in a direction of an optic axis within a flat plate-like laser medium, and forms a waveguide structure in a thickness direction of the laser medium, which is a direction perpendicular to a principal surface of the flat plate-like laser medium, the laser medium is separated in a principal-surface width direction of the laser medium, which is a direction perpendicular to the direction of the optic axis and the thickness direction of the laser medium, by a groove extending in the direction of the optic axis within the laser medium.

Abstract: A VCSEL array device formed of a monolithic array of VCSELs and short circuited mesas is disclosed. The VCSELs can be spaced symmetrically or asymmetrical, in a manner to improve power or speed, or in phase and in parallel. The VCSELs are connected to a first metal contact pad formed on a heat-spreading substrate. The short-circuited mesas are formed alongside the VCSELs and are bonded to and form a short circuit to a second metal contact pad on the grounding substrate. Each VCSEL is encompassed by a thick metal heat sink to increase the height of VCSEL mesas. The structure of the heat sink, the VCSELs and the shorting mesas reduce parasitic impedance thereby increasing output power and high frequency response. The VCSELs and shorting mesas can be packaged as a coplanar waveguide in a ground-signal-ground configuration that improves signal modulation characteristics.

Abstract: An optical communications circuit has a communications light signal source and a heat pump coupled to cool the signal source. A controller monitors a current and a temperature of the signal source, and regulates the temperature. The controller updates a heat pump control limit parameter for the heat pump, based on the monitored current. Other embodiments are also described and claimed.

Abstract: In an element wherein a plurality of ridges (16, 36) are arranged in parallel, supports (17, 37) are formed to sandwich each of the ridges (16, 36). More specifically, on an outer side of the ridge (16) in the element, the first support (17a) is formed, and on an inner side in the element, the second support (17b) is formed. On an outer side of the ridge (36) in the element, the first support (37a) is formed, and on an inner side in the element, the second support (37b) is formed. Thus, even when a resist is applied on an element surface and spin-coating is performed at the time of manufacturing the element, the resist on the inner side than the ridges (16, 36) in the element can be prevented from flowing into a groove between the ridges to a certain extent by means of the second supports (17b, 37b), and a resist film thickness on the inner sides of the ridges (16, 36) in the element can be prevented from being considerably small compared with that on the outer sides in the element.

Abstract: A laser diode lighting device for use in and powered through an incandescent, halogen, or fluorescent light bulb alternating current socket is provided. The lighting device includes a laser diode light, a regulation circuit and a base. The regulation circuit converts an alternating current input to a direct current output. The base is adapted to fit within a conventional light bulb alternating current socket. In addition to the laser diode light, regulation circuit and base, the invention can further include a heat sink that removes heat from the laser diode light, regulation circuit and combinations thereof The laser diode light, regulation circuit, base, and heat sink take the form of a lighting device that is exchangeable with conventional light bulbs in traditional lighting fixtures.

Abstract: Laser driving apparatus in which a temperature is controlled such that an optical output is maximum, even when a laser device using an optical wavelength conversion element is used in a backlight source of a liquid crystal display that adjusts light dynamically. Current detection section 5 detects an average value of a driving current by which laser device 1 is pulse-driven. Optical detection section 3 detects an average value of an optical output from laser device 1. Efficiency detection section 9 calculates a ratio of an output from optical detection section 3 to an output from current detection section 5. A temperature setting value at which an efficiency value which is a result of the computation is maximum is provided to temperature control section 7 and a temperature of nonlinear optical crystal 12 of laser device 1 is controlled, whereby laser device 1 is driven such that the optical output from laser device 1 is always maximum.

Abstract: Provided is a device capable of oscillating a plurality of oscillation modes within a laser medium for obtaining a fundamental wave output which is easy in output scaling and high in luminance, thereby enabling a second harmonic conversion which is high in efficiency. The device includes: a laser medium (5) that is planar, has a waveguide structure in a thickness direction of a cross-section that is perpendicular to an optical axis (6), and has a cyclic lens effect in a direction perpendicular to the optical axis (6) and the thickness direction; a clad (4) that is bonded onto one surface of the laser medium (5); and heat sink (3) that is bonded onto one surface side of the laser medium (5) through the clad (4), and in the device, a laser oscillation includes a laser oscillation that oscillates in a waveguide mode of the laser medium (5), and a laser oscillation that oscillates in a plurality of resonator modes that are generated by a cyclic lens effect of the laser medium (5).

Abstract: A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.

Abstract: A laser apparatus includes: a plurality of laser diodes respectively having light-emission points and being fixed to a block so that the light-emission points are aligned along a direction; and a collimator-lens array integrally formed to contain a plurality of collimator lenses which are arranged along a direction and respectively collimate laser beams emitted from the plurality of laser diodes. The block has a lens-setting surface which is flat, perpendicular to optical axes of the plurality of laser diodes, and located on the forward side of the plurality of laser diodes at a predetermined distance from the light-emission points, and the collimator-lens array is fixed to the block so that an end surface of the collimator-lens array is in contact with the lens-setting surface.

Abstract: Systems and methods for controlling the modulation current of a laser included as a component of an optical transmitter, such as an optical transceiver module, are disclosed. Control of the modulation current, which affects various laser operational parameters, including extinction ratio and optical modulation amplitude, enables operation of the laser to be optimized, thereby enabling reliable transceiver performance to be achieved. In one embodiment, a method for modifying the modulation current in an optical transceiver module includes first sensing analog voltage data that proportionally relates to an actual modulation current of the laser. Once sensed, the analog voltage data are converted to digital voltage data. Using the digital voltage data, the actual modulation current of the laser is determined, then a desired modulation current is determined. Should a discrepancy exist between the actual and desired modulation currents, the actual modulation current is modified to match the desired current.

Abstract: A method and circuit is disclosed for a laser system wherein the power of the laser signal is kept at a constant near optimum value and a portion of an frequency doubled output signal is monitored and detected so that noise within the frequency doubled output signal can be minimized. A feedback signal is used to dither the temperature of a frequency doubled crystal so as to minimize the noise in the frequency doubled output signal.

Abstract: In a semiconductor lasers using quantum well gain medium, a quantum well stack is mounted in an epi-down configuration. The epitaxial side of the device may be directly bonded to an efficient heat transport system so that heat may more easily leave the quantum well stack layers and be disposed at a heatsink. Such a device runs cooler and exhibits reduced loss mechanisms as represented by a laser system loss-line. External cavity systems using this configuration may permit a high degree of tunability, and these systems are particularly improved as the tuning range is extended by lowered cavity losses.

Abstract: A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than ?15° C. and not more than ?5° C.

Abstract: A laser source device includes: a plurality of lasers; wavelength converting elements that convert wavelengths of a plurality of light beams emitted from the plurality of lasers; a temperature sensor that detects the temperatures of the wavelength converting elements; and a temperature controlling unit that controls the temperatures of the wavelength converting elements on the basis of an output of the temperature sensor.

Abstract: A surface emitting semiconductor laser device comprising at least one surface emitting semiconductor laser (21) having a vertical emitter (1) and at least one pump radiation source (2), which are monolithically integrated alongside one another onto a common substrate (13), is described. The semiconductor laser device additionally has a heat-conducting element (18), which is in thermal contact with the semiconductor laser (21) and has a mounting area provided for mounting on a carrier (27). Methods for producing such a surface emitting semiconductor laser device are furthermore described.

Abstract: A one-chip semiconductor laser device for use in a semiconductor laser apparatus has a structure in which a red semiconductor laser device and an infrared semiconductor laser device are stacked on a blue-violet semiconductor laser device. The blue-violet semiconductor laser device is manufactured by forming semiconductor layers on a GaN substrate. Each of the red semiconductor laser device and the infrared semiconductor laser device is manufactured by forming semiconductor layers on a GaAs substrate. The modulus of elasticity of GaAs is smaller than the modulus of elasticity of GaN. The length of each of the red semiconductor laser device and the infrared semiconductor laser device is longer than the length of the blue-violet semiconductor laser device.

Abstract: A method and apparatus for maintaining an alignment of a laser diode with an optical fiber is disclosed. A mounting plate is made of a first material, and mounted on the mounting plate is a first substrate made of a second material. A semiconductor laser, with a light emitting side, is mounted on the first substrate. Separated from the first substrate by a predetermined distance is a second substrate made of a third material, and mounted on the second substrate is an optical fiber. The optical fiber is mounted, such that, the optical fiber is adjacent to and aligned with the light emitting side of the semiconductor laser. The first, second, and third materials making up the mounting plate, the first substrate, and the second substrate respectively, facilitate maintenance of the alignment between the optical fiber and the light emitting side of the semiconductor laser.