Abstract: Disclosed is a blast furnace apparatus includes: a rotating chute; a profile measurement device configured to measure surface profiles of a burden charged into the furnace; and a tilt angle controller configured to control a tilt angle of the chute, in which the device includes a radio wave distance meter installed on the furnace top and configured to measure the distance to the surface of the burden, derives the profiles on a basis of distance data for the entire furnace obtained by scanning a detection wave of the distance meter in the furnace in a circumferential direction, and includes at least one of arithmetic units configured to command during rotation, on a basis of the surface profiles obtained, the controller to change the tilt angle of the chute, or a controller to change a rotational speed of the chute or a feed speed of the burden fed to the chute.

Abstract: According to an example aspect of the present invention, there is provided a system for solar radiation correction in radiosonde temperature measurements, the system comprising a radiosonde having a temperature sensor configured to determine a temperature of the atmosphere at different altitudes, at least one light sensing assembly comprising a light sensor, and a light collector configured to collect light from different solar radiation angles at the different altitudes, and the system further comprising control electronics or a computing device configured to calculate for each altitude a solar radiation correction based on the signal received by the light sensor in order to obtain a corrected temperature reading for each altitude.

Abstract: A sensor placement optimization device is provided, which may include a preprocessing circuit and an operational circuit. The preprocessing circuit may perform a pre-process for the sensing signals of a plurality of temperature sensors, installed on a machine tool, to generate a pre-processed data. The operational circuit may execute a normalization for the pre-processed data to generate a normalized data, perform a principal component analysis for the normalized data to generate a dimensionality-reduced data and implement a principal component regression for the dimensionality-reduced data to obtain the contributions of the temperature sensors. Then, the operational circuit may rank the temperature sensors according to the contributions thereof to generate a ranking result and execute a screening process according to the ranking result to select at least one redundant sensor from the temperature sensors; afterward, the operational circuit may remove the redundant sensor from the temperature sensors.

Abstract: In an example implementation, a sintering system includes optical fiber installed into a sintering furnace. A support structure inside the furnace is to support a token green object in a predetermined position and to hold a distal end of the fiber adjacent to the predetermined position. A light source is operably engaged at a proximal end of the fiber to transmit light through the fiber into the furnace. A light detector is operably engaged at the proximal end of the fiber to receive reflected light through the fiber that scatters off a surface of the token green object.

Abstract: The present disclosure discloses an infrared thermometer for a magnetic induction identification probe cap, including the body of the infrared thermometer, at an upper end of which is a temperature probe designed with a cap, of which an inner side wall is beset with a magnet block; in the infrared thermometer body ata lower end of the temperature probe is a magnetic induction element connected with a main control unit of the body of the infrared thermometer; when the cap covers the temperature probe or is removed there-from, the magnetic induction between the magnet block and the magnetic induction element enables magnetic induction output control signals. For the infrared thermometer applicable for both forehead temperature measurement and ear canal temperature measurement, the magnetic induction identification probe cap switches between a forehead temperature measurement mode and an ear canal temperature measurement mode.

Abstract: The present invention limits measurement error and sensor element damage. When a contact-type sensor (200) is placed in contact with skin (10), a gap (200a) is formed between the skin (10) and a sensor element (214). The contact-type sensor (200) is provided with a water-repellent resin base plate (212) and a water-absorbing sheet (211) that, together with the skin (10) and the sensor element (214), surround the gap (200a).

Abstract: A clinical grade consumer physical assessment system generates clinical grade physical assessment information for a patient based on a plurality of consumer grade measurements taken from different body portions of the patient using a consumer device. The system operates to correlate the plurality of consumer grade measurements, which have low resolution and accuracy, to a clinical grade result that is adequate for clinical purposes.

Abstract: An oven appliance includes a sensor that is positioned coplanar with a broil heating element in a plane that is perpendicular to a vertical direction. The sensor is also positioned at a center portion of the broil heating element and/or between terminal ends of the broil heating element along a lateral direction that is perpendicular the vertical direction. A sensor shield is positioned between the broil heating element and the sensor in the plane that is perpendicular to the vertical direction.

Abstract: A substrate support assembly includes a ceramic plate, a cooling plate coupled to the ceramic plate, and an optical guide coupled to the cooling plate. The ceramic plate comprises a top surface, a bottom surface and a first channel, wherein the top surface is to support a substrate. The cooling plate comprises a second channel. The optical guide is to direct light onto the substrate. At least a portion of the optical guide is disposed in the first channel in the ceramic plate and the second channel in the cooling plate.

Abstract: A photothermal deflection measuring system includes a substrate, a detecting light source, a detecting unit, and a processor. The substrate includes a plurality of positioning structures, on each of which supports a cell emitting heat outside a surface thereof. The detecting light source is utilized to project a detecting light passing through a specific position outside the surface whereby the detecting light is deflected due to a thermal gradient caused by the emitted heat. The detecting unit is arranged at a side of the cell for receiving the deflected detecting light thereby generating an optical deflection signal corresponding to a deflection of the deflected detecting light. The processor is configured to receive the optical deflection signal, analyze the optical deflection signal and determine a heat value corresponding to the specific position out side the surface of the cell according to the optical deflection signal.

Abstract: A method involves determining multiple temperatures of an object from spectral data collected from the object. The spectral data covers a plurality of wavelengths. The method comprises using a computer to (a) assign an initial value for residual radiation; (b) identify a black body profile that best fits the spectral data over the plurality of wavelengths; (c) remove radiation corresponding to the identified profile from the residual radiation; and (d) return to (b) until the residual radiation reaches a termination criterion.

Abstract: A heat transfer sensor includes a support body, a first thermocouple probe, a second thermocouple probe, and a third thermocouple probe. Each thermocouple probe is mounted to the support body and includes a hollow cylinder, a thermocouple, and an insulator. The thermocouple is mounted to an interior of the associated hollow cylinder and is configured to generate a first voltage based on a temperature of the associated hollow cylinder. The insulator is mounted between the associated hollow cylinder and the top wall. The first hollow cylinder has an emissivity ?0.25. The second hollow cylinder has an emissivity ?0.75. The third thermocouple probe has an emissivity that is >0.25 and <0.75 or measures a temperature of an environment surrounding the support body. A convective heat transfer and an incident radiation are computed using the first and second voltage and either the third voltage or the air temperature.

Abstract: A sensor interface or network of interfaces utilizes high-temperature electronics to operate at elevated temperatures for applications that include aircraft and automobile engines, vehicle frames, refineries, nuclear and chemical production plants, and in downhole drilling for petroleum and natural gas. The interface or network provide connectors for a variety of sensors with analog and digital outputs, and can in turn provide data to an automated electronic control system or a monitor. Because the sensor interface may be placed in so-called “hot zones” nearer to the sensors being monitored than other systems that use conventional electronics, the sensor interface can increase noise immunity, increase reliability, decrease cost, reduce weight, and increase space.

Abstract: A remote sensor control system provides a sensor reading from an insulated environment at a certain interval dependent upon the threat level. The remote sensor control system has a control module and a remote module. The control module is disposed outside the insulated environment. The control module includes an energy source configured to produce an energy beam. The remote module is disposed at least partially within the insulated environment. The remote module is configured to receive the energy beam from the energy source. The remote module includes a battery, a sensor reader configured to sample a sensor, and an optical power gate configured to provide power from the battery to the sensor reader upon receiving said energy beam from the energy source.

Abstract: According to some embodiments of the present invention there is provided a method of using an earphone output speaker as a microphone for a phone call between two and/or more participants, or for measuring biometric data of a user. The method may comprise playing a received signal to an electro-acoustic output transducer of an earphone. The method may comprise instructing an audio processing circuit of a local client terminal to record an audio signal from the same electro-acoustic output transducer. The method may comprise calculating a voice signal and/or a biometric measurement based on a function combining the recorded audio signal, the received signal, and filtration coefficients, using a processing unit of the local client terminal. The method may comprise sending the voice signal and/or a biometric measurement through an output interface of the local client terminal.

Abstract: Provided are: an infrared temperature sensor which is reduced in film deformation and achieves higher accuracy, while ensuring reliability; and a device which uses this infrared temperature sensor. An infrared temperature sensor is provided with: a film which absorbs infrared light; a case which covers and holds the film so as to form airtight spaces between itself and the film, and which is provided with a light guide part that has an opening and guides infrared light and a shielding part that has a shielding wall and shields infrared light; ventilation portion which allow air permeation between the spaces and the outside; a heat-sensitive element for infrared detection, which is arranged on the film at a position that corresponds to the light guide part; and a heat-sensitive element for temperature compensation, which is arranged on the film at a position that corresponds to the shielding part.

Abstract: A system and method for calibrating an imaging system includes a shutter that is moveable in to the optical path of the imaging system to generate an image of the shutter surface, which is flat and uniform. The shutter can be moved in and out of the optical path between first and second positions. The shutter is heated while in the second position and then returned to the first position. Data sets generated at two different temperatures enable the image generated by the imaging system in normal use to be to be adjusted for responsivity and variation in DC offset of the specific pixel array.

Abstract: A measuring object for use in a heating apparatus for the thermal treatment of substrates is described, wherein the measuring object is the substrate to be treated or an object which in use has a substantially known temperature relation to the substrate to be treated, wherein the measuring object comprises a surface having at least one surface area, which acts as a measuring surface for an optical temperature measurement. A predetermined structure in the form of a plurality of recessions is formed in the surface area, in order to influence the emissivity of the surface area.

Abstract: A high SNR in-situ measurement of sample radiance in a low-temperature ambient environment is used to accurately characterize sample emissivity for transmissive, low-emissivity samples. A low-e mirror is positioned behind the sample such that the sample and low-e mirror overfill the field-of-view (FOV) of the radiometer. The sample is heated via thermal conduction in an open environment. Thermal conduction heats the sample without raising the background radiance appreciably. The low-e mirror presents both a low emission background against which to measure the sample radiance and reflects radiance from the back of the sample approximately doubling the measured signal. The low-e mirror exhibits a reflectance of at least 90% and preferably greater than 98% and an emissivity of at most 7.5% and preferably less than 2% over the spectral and temperature ranges at which the sample emissivity is characterized.

Abstract: A system for calibrating sensors in a wafer is provided. The system includes a container for containing liquid and configured to accommodate the wafer in the liquid; a temperature controller for controlling a temperature of the liquid; and an electrical connection mechanism for receiving electrical signals to the sensors when the temperature of the liquid reaches a preset level during operation. The system also includes a device that receives the signals from the sensors and calibrates the sensors based on the temperature of the liquid and the received signals from the sensors.

Abstract: A semiconductor device manufacturing method includes an element forming step of forming an element structure on a front surface of a substrate and forming a back structure on a back surface of the substrate, and a film forming step of performing film forming on a front surface of the element structure while measuring the temperature of the substrate by using a radiation thermometer that applies infrared rays of a wavelength ?i to the back structure to obtain an infrared emissivity of the substrate. The back structure has a first layer exposed to the outside and a second layer in contact with the first layer, the refractive index of the second layer being smaller than that of the first layer, and the layer thickness of the first layer is set in a range from (2n?1)?i/8 to (2n+1)?i/8, with n being a positive even number.

Abstract: A temperature probe includes a handle and a shaft extending from the handle. The shaft includes a distal end, a proximal end, and a tip at the distal end. The temperature probe also includes a capacitance sensor disposed on one of the handle and the shaft, the capacitance sensor configured to measure a change in capacitance when positioned proximate a conductor. The temperature probe further includes a temperature sensor disposed on the shaft, the temperature sensor configured to measure a body cavity temperature of a patient.

Abstract: A liquid discharging apparatus includes a discharge unit that is capable of discharging a liquid, a heating unit that is capable of heating a medium onto which the liquid is discharged, a detection unit that detects an energy that is emitted from a detection range, a control unit that is capable of changing an output of the heating unit on the basis of an energy that the detection unit detects, and a sensing target portion, which has a sensing target surface from which an energy is detected by the detection unit, and the sensing target surface is processed in order to reduce mirror reflection of input light.

Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic.

Abstract: A surface of an object is irradiated using an infrared light beam. The infrared light beams reflected at the object are received by an infrared camera which captures a first intensity of the reflected infrared light beams on a detector of the infrared camera. Ambient radiation reflected at the object and the characteristic radiation of the object are detected by capturing a second intensity of the reflected ambient radiation and the characteristic radiation of the object on the detector of the infrared camera. The emissivity of the object is calculated based on the first intensity and the second intensity.

Abstract: A method of determining a temperature of a patient includes measuring a first temperature of the patient with a temperature device without contacting the patient with the device, and measuring a second temperature of the patient by contacting a measurement site of the patient with the device. The method also includes determining a temperature value indicative of a core temperature of the patient based on the first and second temperatures.

Abstract: A process measurement system for measuring a parameter of a work surface includes a light source configured to provide a material processing beam, an optical delivery system optically coupled to the light source and configured to homogenize and direct the material processing beam to the work surface, the optical delivery system including a process optic for optically coupling the material processing beam to the work surface in a predetermined way, the optical delivery system including a delivery waveguide having an output face optically coupled to the process optic, and an optical pyrometer in optical communication with the optical delivery system and configured to receive a pyrometer signal emitted from the work surface and coupled into said output face.

Abstract: An assembly including an optically excited infrared nondestructive testing active thermography system is disclosed. The optically excited infrared nondestructive testing active thermography system includes one or more illumination sources, at least one first reflector, at least one second reflector and a computing resource. The at least one first reflector is arranged about the one or more illumination sources. The at least one first reflector has a near focal point and a far focal point. The one or more illumination sources is/are positioned at least proximate the near focal point of the at least one first reflector. The at least one second reflector is positioned at least proximate the far focal point. The computing resource is communicatively-coupled to a motor that is coupled to the at least one second reflector for manipulating the at least one second reflector between at least: a first spatial orientation and a second spatial orientation.

Abstract: A method for monitoring a processing region of a workpiece on which laser processing is being carried out, in which method the radiation emitted by the processing region is detected by a detector system in a space-resolved manner, wherein the radiation of the processing region is detected for each elemental area of the processing region imaged onto the detector system at least two wavelengths simultaneously. Accurate process monitoring may thereby be carried out.

Abstract: After flash irradiation on a semiconductor wafer is started and then the temperatures of front and back surfaces of the semiconductor wafer become equal to each other, the temperature of the back surface of the semiconductor wafer, which has a known emissivity, is measured with a radiation thermometer. The emissivity of the front surface of the semiconductor wafer is calculated based on the intensity of radiated light from a black body having an equal temperature to the temperature of the back surface thereof, and the intensity of radiated light actually radiated from the front surface of the semiconductor wafer. Then, the temperature of the front surface of the semiconductor wafer heated by the flash irradiation is calculated based on the calculated emissivity and the intensity of the radiated light from the front surface of the semiconductor wafer that has been measured after the flash irradiation is started.

Abstract: A method and apparatus measuring temperature of a steel sheet. A reference plate including a temperature controller is disposed opposite to the steel sheet. The reference plate temperature of the reference plate is measured by a contact thermometer. A radiation pyrometer is trained on the steel sheet at an angle such that alternate reflection of radiation energy by the reference plate and the objective steel sheet occurs once or twice. The radiosity of the steel sheet is measured by the radiation pyrometer. A temperature obtained by converting the radiosity into a temperature of a blackbody that radiates energy equivalent to the radiosity is used as a radiosity temperature. The temperature controller executes a control operation to make the temperature of the reference plate coincide with the radiosity temperature. The radiosity temperature is used as the temperature of the steel sheet.

Abstract: An infrared thermometer includes a probe and an infrared sensor. The probe with an infrared target absorbs thermal radiation to provide a substantially consistent source of infrared radiation and an aperture for preventing contamination of the infrared target while permitting the transmission of thermal radiation to the target. The infrared sensor is configured for sensing infrared radiation from the infrared target. The infrared target is positioned within the probe such that it absorbs thermal radiation that comes from the aperture and thereafter emits thermal radiation to the infrared sensor.

Abstract: An inexpensive thermopile temperature detector is particularly adapted to monitoring of electrical equipment, such as a power bus bar, within an enclosed area such as a cabinet. The detector may have a plastic housing, a thermopile sensor and a plastic Fresnel lens. Each sensor also includes a calibrated element such that, but for calibration, the same sensor may be used for various applications for different target sizes and distance or, more generally, with respect to effective target percentage of field of view.

Abstract: A milliwave melter monitoring system is presented that has a waveguide with a portion capable of contacting a molten material in a melter for use in measuring one or more properties of the molten material in a furnace under extreme environments. A receiver is configured for use in obtaining signals from the melt/material transmitted to appropriate electronics through the waveguide. The receiver is configured for receiving signals from the waveguide when contacting the molten material for use in determining the viscosity of the molten material. Other embodiments exist in which the temperature, emissivity, viscosity and other properties of the molten material are measured.

Abstract: A system for curing a binders applied to glass fibers is disclosed. The curing of the binder is accomplished by passing the binder coated glass fibers through a curing oven having one or more temperature zones. The temperature of the binder coated glass fibers is monitored and the temperature in the curing oven is adjusted to ensure proper heating of the glass fibers thereby ensuring uniform curing of the binder composition. Temperature measurements are made either as the product traverses the oven or as the cured product exits the curing oven. The invention is particularly useful for curing acrylic thermoset binders and formaldehyde-free binders.

Abstract: A test source that combines infrared energy and visible light to produce a uniform output of energy in the visible and infrared spectra is disclosed. The test source includes an infrared energy source and a visible light source. The infrared energy source has a white coating thereon. The visible light source emits visible light onto the infrared light source, which generates a combination of infrared energy and visible light outwardly into the surrounding atmosphere.

Abstract: Infrared Ir Thermometer Calibration Systems and Methods are Disclosed in which the temperature of an IR thermometer calibration system is controlled such that radiation emitted by a target at a given input temperature is equal to the radiation emitted by a graybody heated to the input temperature and having an emissivity equal to an emissivity setting of an IR thermometer to be calibrated using the IR thermometer calibration system.

Abstract: A method and apparatus measuring temperature of a steel sheet. A reference plate including a temperature controller is disposed opposite to the steel sheet. The reference plate temperature of the reference plate is measured by a contact thermometer. A radiation pyrometer is trained on the steel sheet at an angle such that alternate reflection of radiation energy by the reference plate and the objective steel sheet occurs once or twice. The radiosity of the steel sheet is measured by the radiation pyrometer. A temperature obtained by converting the radiosity into a temperature of a blackbody that radiates energy equivalent to the radiosity is used as a radiosity temperature. The temperature controller executes a control operation to make the temperature of the reference plate coincide with the radiosity temperature. The radiosity temperature is used as the temperature of the steel sheet.

Abstract: A method of precisely measuring temperature of an object without having to setting the emissivity of the object over a wide temperature range from low to high temperature with a single radiation thermometer. The temperature-measuring device of the present invention includes a reference object having an emissivity of substantially 1 in a prescribed wavelength range; a bandpass filter transmitting radiant energy in the prescribed wavelength range; and a radiation thermometer for observing temperature by taking in the radiant energy transmitted through the bandpass filter.

Abstract: An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second radiation source configured to emit radiation at a second wavelength different from the heating wavelength and at a lower power than the first radiation source. Radiation from the second radiation source is directed onto the substrate. The apparatus further includes a first detector configured to receive reflected radiation at the second wavelength and a computer system configured to receive an output from the first detector and adjust a focus plane of the first radiation source relative to the substrate. The second radiation source is configured to have substantially the same focus plane as the first radiation source.

Abstract: Body temperature measurements are obtained by scanning a thermal radiation sensor across the side of the forehead over the temporal artery. A peak temperature measurement is processed to compute an internal temperature of the body as a function of ambient temperature and the sensed surface temperature. The function includes a weighted difference of surface temperature and ambient temperature, the weighting being varied with target temperature through a minimum in the range of 96° F. and 100° F. The radiation sensor views the target surface through an emissivity compensating cup which is spaced from the skin by a circular lip of low thermal conductivity.

Abstract: A method of precisely measuring temperature of an object without having to setting the emissivity of the object over a wide temperature range from low to high temperature with a single radiation thermometer. The temperature-measuring device of the present invention includes a reference object having an emissivity of substantially 1 in a prescribed wavelength range; a bandpass filter transmitting radiant energy in the prescribed wavelength range; and a radiation thermometer for observing temperature by taking in the radiant energy transmitted through the bandpass filter.

Abstract: According to one embodiment of the invention a method for determining the location of a potential defect in a device includes scanning a surface of the device with a temperature sensor while operating the device. The method also includes measuring a temperature of the device by a temperature sensor at a plurality of locations while scanning. Based upon the measured temperatures, a temperature profile is constructed for the device. The method also includes comparing the constructed temperature profile to a reference profile to determine a location of the potential defect in the device.

Abstract: In some embodiments, a temperature measuring apparatus is provided with a light receiving portion having a plurality of light receiving units for measuring heat quantity of divided temperature detecting area in a noncontact manner, a thermal sensor for detecting temperature of each of the plurality of light receiving units, a calculation portion for calculating a temperature of each of the divided temperature detecting areas based on the temperature obtained by the thermal sensor and the relative temperature difference obtained by the light receiving portion, a correction information holding portion for holding correction information on known reference temperature of the temperature detecting area and its corresponding calculated result outputted from the calculation portion obtained when heat quantity of the temperature detecting area is set to the reference temperature, and a correction portion for correcting the calculated result of the calculation portion based on the correction information.

Abstract: A method of producing a calibration wafer having at least a predetermined emissivity, including providing a wafer of semiconductor material; subjecting the bulk material of the wafer to doping with foreign atoms and/or generating lattice defects to obtain the predetermined emissivity; and coating the wafer to obtain a further optical characteristic.

Abstract: When the emissivity ? on the reverse face of a substrate 10 is measured during annealing processing for the substrate 10, films made from a material that varies the emissivity ?, such as a first DPS film 15 used for forming a plug 15A, a second DPS film 17 used for forming a capacitor lower electrode 17A and a third DPS film 20 used for forming a capacitor upper electrode 20A, are formed on the top face of the substrate 10. On the other hand, no film made from a material that varies the emissivity ?, such as a DPS film, is formed on the reverse face of the substrate 10.

Abstract: A temperature determining device is composed of a temperature detecting unit that detects a temperature of a determination object member based on an intensity of infrared rays from the object member, a unit for determining a temperature for correction that determines a temperature of an opposing member opposed to the object member or a temperature of a member whose temperature changes in correlation to a change in the temperature of the opposing member, and a calculating unit that corrects the detected temperature obtained by the temperature detecting unit using the temperature as the temperature for correction obtained by the unit for determining a temperature for correction. Thus, stable temperature determination can be performed accurately without being influenced by infrared rays from around a determination object member.

Abstract: The invention relates to a device for measuring the temperature of substrates, notably semiconductor wafers. The device comprises at least one radiation sensor for measuring the radiation emitted by the substrate and an element (19) which restricts the field of vision of the radiation sensor and is positioned between the substrate and the radiation sensor. The substrate temperature can be determined correctly and simply, even if the substrate vibrates or is tilting, owing to the fact that the edges (20) of the element extend in a straight line. The invention also relates to a corresponding method.

Abstract: In a system for thermal processing of a semiconductor substrate, an RTP system employs a reflector plate which is highly reflective of radiation in a target wavelength range, and less reflective of radiation outside that target wavelength range. In one embodiment, the reflector plate has a highly reflective portion overlying a less reflective portion, wherein the highly reflective portion is highly reflective of radiation in the target wavelength range. As radiation emitted by the substrate is received on the reflector, the radiation in the target wavelength range is reflected, thereby facilitating measurement of the substrate temperature by the pyrometer(s), while radiation outside the target wavelength range is absorbed, thereby facilitating cooling of the substrate.

Abstract: The present invention is generally directed to various methods of controlling the formation of metal silicide regions, and a system for performing same. In one illustrative embodiment, the method comprises forming a layer of refractory metal above a feature, performing at least one anneal process to convert a portion of the layer of refractory metal to at least one metal silicide region on the feature, and measuring at least one characteristic of at least one metal silicide region while the anneal process is being performed. In another illustrative embodiment, the method comprises forming a layer of refractory metal above a feature, performing at least one anneal process to convert a portion of the layer of refractory metal to at least one metal silicide region on the feature, and performing at least one scatterometric measurement of the metal silicide region after at least a portion of the anneal process is performed to determine at least one characteristic of the metal silicide region.