Abstract: A sensor assembly is provided for a power bus. The power bus exhibits a number of characteristics, such as a temperature. The sensor assembly includes an enclosure having a housing and a base. At least one sensor such as, for example, a temperature sensor, is housed within the enclosure. The sensor (e.g., temperature sensor) senses a corresponding one of the number of characteristics (e.g., temperature) of the power bus. A power supply is housed within the enclosure, and cooperates with the power bus to provide electrical power to the sensor. An elongated fastener fastens the enclosure to the power bus. The base of the enclosure is adjustable with respect to the housing of the enclosure in order to secure the power bus between the housing and the base. The elongated fastener extends around the enclosure and the power bus in order to secure the enclosure to the power bus.

Abstract: For applications in a facility where a power conversion apparatus is frequently started and stopped, a power conversion apparatus and a power cycle longevity estimation method are provided which improve an ease of use of the facility. The power conversion apparatus comprises power conversion circuits to supply ac power of variable voltage and variable frequency, a detection circuit to detect a temperature of the power semiconductor in the power conversion circuits, and a computation device to calculate a power cycle longevity of the power semiconductor based on a maximum temperature rise detected by the detection circuit.

Abstract: A battery condition detection apparatus is composed of a semiconductor element, and a lead frame and mold resin. The semiconductor element is composed of plural diodes connected in series as a temperature sensitive element for detecting a temperature of a battery and a communication circuit for outputting a temperature detection result to an outside device such as ECU mounted on a vehicle. The semiconductor element is mounted on the lead frame having high heat conductivity rather than that of the mold resin. The semiconductor element and the lead frame are completely sealed with the mold resin. The battery condition detection apparatus is mounted on a battery case which accommodates the battery of a vehicle so that the lead frame of high heat conductivity is directly contacted to the battery case. The heat conductivity of the lead frame is more than 100 times of that of the mold resin.

Abstract: Two vertically offset thermistors for sensing a fluid such as oil and refrigerant in a compressor shell are monitored by a method that takes into account rapidly changing conditions within the shell. The system can determine the fluid's sump temperature, high/low liquid levels, and can determine whether the thermistors are sensing the fluid as a liquid, gas, or a mixture of the two, such as a foam or mist of liquid and gas. For greater accuracy, thermistor readings can be dithered and filtered to provide temperature or voltage values having more significant digits than the readings originally processed through a limited-bit A/D converter. For faster response, limited microprocessor time is conserved by sampling thermistor readings at strategic periods that enable the microprocessor to identify certain conditions and temperatures via simple delta-temperature ratios and undemanding equations rather than resorting to exponential functions or lookup tables to determine time constants.

Abstract: A cooling system is provided for controlling temperature in a power electronic device. The power electronic device includes a semiconductor having a major surface. The cooling system includes a temperature sensor coupled to the major surface of the semiconductor; and a control circuit coupled the temperature sensor. The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature.

Abstract: An infrared inspection and reporting process and system obtains inspection data on site via a portable computer. An actual temperature of a component derived from an infrared image and a temperature delta between the temperature of the component and the maximum temperature for the component is calculated to determine if there is a problem. A criticality level is assigned for each problem component from a plurality of criticality levels each having a predetermined range for the temperature delta. The criticality level provides an accurate and consistent assessment of component conditions. The inspection data is up linked to a home server from the portable computer and is made available to the customer via an interactive, on-line web application. The customer can interact with the inspection dating including an interactive prediction of energy savings if the problem component is repaired.

Abstract: Current reading means detects an output current of a current source whose output current varies with a variation in temperature and outputs a value proportional to the output current. The temperature of the current source corresponding to the output value of the current reading means which is proportional to the output current of the current source is measured, and a parameter for converting the output value to temperature information is determined from the output value of the current reading means and the measured value of the temperature of the current source corresponding to the output value. The output value of the current reading means is converted to the temperature information using the determined parameter.

Abstract: The temperature detector comprises a thermistor embedded in varnish, a connector, a lead wire connecting the thermistor and the connector to each other, and a transfer suppressing portion provided between the thermistor and the connector and suppressing the movement of the varnish on the surface of the lead wire. The suppressing portion comprises a protection tube surrounding the lead wire and a grommet filled in a space inside the protection tube.

Abstract: A semiconductor device including a temperature sensor includes a pull up circuit, a pull down circuit, a first additional current path, and a second additional current path. The pull up circuit is configured to generate a pull up current that contributes to generation of a first output current. The pull down circuit is operably coupled to the pull up circuit at an output node and configured to generate a pull down current that contributes to generation of a second output current. The first additional current path, when enabled, is configured to combine a first additional current with the pull up current to comprise the first output current. The second additional current path, when enabled, is configured to combine a second additional current with the pull down current to comprise the second output current. Respective enablement of the first additional current path and the second additional current path is complementary.

Abstract: An apparatus that allows for the testing of multiple wraps of cable in environments of varying temperature, pressure, and in different fluids in a single apparatus, and can be tested against the varying loads the cable may encounter is disclosed. In the illustrative embodiment of the present invention, the multiple wraps of cable are simulated by layering electrically-insulated portions of the cable on top of one another inside an environmentally controlled container. This container has two parts: a thermally-insulated container and a pressure container.

Abstract: A sensing platform for monitoring a transmission system, and method therefor, may include a sensor that senses one or more conditions relating to a condition of the transmission system and/or the condition of an environment around the transmission system. A control system operatively associated with the sensor produces output data based on an output signal produced by the sensor. A transmitter operatively associated with the control system transmits the output data from the control system.

Abstract: The installation contains a current conductor producing Joulean heat in the operating state, a cooling element and a monitoring device. The cooling element has a condensable working medium and an evaporator, which can be heated by the current conductor of the installation, and a condenser which has been withdrawn from the heating effect of the current conductor. The monitoring device comprises at least one sensor for detecting a parameter of the cooling element and an evaluation unit, which receives output signals from the sensor. In the evaluation unit, the output signals of the sensors are evaluated and a signal describing the state and/or the functionality of the cooling element is formed there. This installation is characterized by high operational reliability with a high current-carrying capacity and dimensions which are kept small.

Abstract: A temperature sensor mounting structure for a battery module that is formed by connecting single cells together in series including: a temperature-measuring device that detects the temperature of the battery module; a covering device that covers the temperature-measuring device; and movement-restricting devices that are removably engaged with the battery module and restrict the movement of the covering device.

Abstract: Provided is a micro heater, which includes an elastic thin film formed by sequentially depositing a first silicon oxide layer, a silicon nitride layer and a second silicon oxide layer, a heating part, a heat spreading structure and a heating part electrode, which are patterned on the elastic thin film, and an insulating layer formed on the heating part, the heat spreading structure and the heating part electrode. Here, the heat spreading structure is perpendicularly connected to the heating part at a connection portion.

Abstract: A device for monitoring the temperature surrounding a circuit, including: a charge storage element; a charge evacuation device; and a thermo-mechanical switch connecting the storage element to the evacuation element, the switch being capable of closing without the circuit being electrically powered, when the temperature exceeds a threshold.

Abstract: An electronic thermometer includes a housing having a display, a power, and a processor, wherein the display and the power are electrically connected to the processor; a sensing member having an end extended out of the housing, wherein the sensing member is electrically connected to the processor; and an automatic switch having two electrodes extended out of the housing and separated from each other, wherein the electrodes are electrically connected to the processor respectively. The automatic switch is normally turned off because the electrodes are not conducted, and the automatic switch is turned on automatic when the electrodes touch water to cause the electrodes conducted.

Abstract: The present invention relates to an apparatus, which works according to galvanic principles, in particular to a lithium-ion accumulator or, respectively, a lithium-ion cell, with at least two electrode devices (10; 20), in particular, a cathode and an anode, in particular, a separator device (30), arranged between two electrode devices, the apparatus (2) comprises, according to the invention, at least one or a plurality of glass fibers (18, 28, 38) which are configured or, respectively, operable as temperature sensor. It can comprise a net (16, 26, 36) formed by glass fibers, or an arrangement of a plurality of glass fibers, which are arranged substantially in parallel to each other, wherein at least one glass fiber (18, 28, 38) is configured or operable as temperature sensor.

Abstract: Temperature monitoring system for power transformers submerged in oil applied preferentially in transformers submerged in oil and it presents several facilities in the sense of becoming temperature monitoring more reliable and safe, with highlight for the redundant measurement of temperature of the top of the oil; self-calibration of the temperature measurement entrances by means of internal references and specific electronic circuits; timing between successive activation of the groups of forced cooling when the deactivation of monitoring system on screen; internal watches with auxiliary alimentation without battery; safety reinforced in the alarms signalling for elevated temperature and finally automatic adjustment of the alarm values of the temperature differential of the commuter of derivations in load.

Abstract: A temperature detection apparatus includes a transformer, a thermostat attached directly to an electrically conductive site of the heating element and has contacts that become short-circuited or come into an open-circuit condition depending on whether or not the temperature of the heating element is equal to or higher than a predetermined value, the contacts being connected to a secondary coil in the transformer, a DC voltage source and a transistor configured to supply required AC power to a primary coil in the transformer, a current detection resistor configured to detect a current flowing through the primary coil in the transformer, and a comparison circuit detecting a voltage generated across the current detection resistor when a current flows through the current detection resistor, the comparison circuit outputting an alarm signal when the current flowing through the primary coil in the transformer exceeds a preset threshold current.

Abstract: An integrated circuit comprises a power device located on a die. The power device is operably coupled to a processing function, wherein the signal processing function is operably coupled to two or more temperature sensors. A first temperature sensor is operably coupled to the power device to measure a temperature of the power device and the second temperature sensor is located, such that it measures a substantially ambient temperature related to the die. The signal processing function determines the temperature gradient therebetween.

Abstract: A rechargeable ear thermometer which comprises a planar main body, a planar ear probe panel integral with the planar main body, an ear probe extending from the planar ear probe panel, a power source within the planar main body, and a mechanism at bottom of the planar main body for recharging the power source. An angle is formed between the planar main body and the planar ear probe panel to allow a proper approach to an ear of a person with the ear probe, without having the planar main body pushed up against a face of the person while taking a temperature reading of the person.

Abstract: An improved system and method measuring a temperature in a power controller is provided. The system includes a circuit board, a solid state switching device, a heat sink, and a temperature sensor. The solid state switching device may be mounted on the circuit board and controls the switching of power to an industrial load. The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in thermal communication with an exposed portion of a trace on the circuit board. The temperature sensor may be in thermal communication with the trace. As such, the temperature sensor may be in thermal communication with the solid state switching device through the trace of the circuit board.

Abstract: An uninterruptible power supply (UPS) is configured to be coupled to a power source at an input node and to a load at an output node. The UPS is synthetically loaded (e.g., to a maximum rated load) by transferring current from the output node to the input node. Concurrent with synthetically loading the UPS, a temperature of an electrical conductor of the UPS is monitored. The monitoring of the temperature of the electrical conductor may include receiving a temperature sensor signal representative of the temperature of the electrical conductor from a temperature sensor (e.g., a self-powered wireless temperature sensor) mounted on the electrical conductor. The invention may be embodied as methods, apparatus and computer-readable media.

Abstract: A connector for a pressure vessel includes a connector assembly having a first plurality of contacts, and a receiver assembly configured to be positioned within a receiver aperture formed in a closure of the pressure vessel and having a second plurality of contacts. The receiver assembly is configured to receive the connector assembly and place each of the first plurality of contacts in electrical contact with a corresponding one of the second plurality of contacts. A seal is provided between the connector assembly and the wall of the pressure vessel, for substantially sealing the receiver aperture from pressure within the vessel. The connector assembly is configured to be coupled to a product carrier, and sensors positioned in the vessel are coupled via the connector assembly to a data acquisition unit. When the closure is lowered onto the vessel, the receiver assembly contacts the connector assembly coupled to the carrier, closing the electrical contacts connecting the sensors to the acquisition unit.

Abstract: The combination of a temperature sensor and an inclination sensor or the combination of a temperature sensor and a tension monitor properly positioned in conjunction with an energized electrical conductor produces outputs that are dependent on the conductor's average temperature in real time. A transmitter is used to communicate this information in real time to a central location such that up to optimal or maximum power transmission is feasible through the conductor while maintaining a safe clearance to the ground. This allows for close monitoring of thermal expansion resulting from increased load as well as varying environmental conditions.

Abstract: A device for recording the pressure and the temperature in an intake manifold of an internal combustion engine, a pressure sensor and a temperature sensor being situated in a common housing, and an evaluation of a signal of the temperature sensor being provided outside the housing. An EMC protective circuit is provided in this context, which is integrated into the housing and/or is situated on the housing, and is electrically connected to the temperature sensor.

Abstract: Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.

Abstract: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

Abstract: A method of operating an electrical machine including: providing a brushless excitation system including a diode rectifier having at least one diode; sensing heat energy generated by the at least one diode; detecting a deviation of the generated heat energy from the at least one diode, and generating a signal indicating a failed or faulty diode if the deviation in generated heat energy exceeds a predetermined threshold deviation level.

Abstract: A thermal code output circuit is provided, comprising a pulse signal generator configured to receive multiple period signals and generate a pulse signal in response to a test mode signal, a thermal code output unit configured to output multiple thermal codes in response to the pulse signal, and a strobing signal output unit configured to output the pulse signal or a reference voltage selectively as a strobing signal in response to the test mode signal.

Abstract: Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.

Abstract: A solar-powered temperature measuring apparatus includes: a case, at least one part of a surface thereof including a solar panel used for converting visible light to electric energy; a first connection portion, positioned in the case; and a temperature measurer, accepted in the case, including: a main body; a second connection portion, positioned on the main body and used for connecting with the first connection portion; and a charging element, connected electrically to the second connection portion and used for storing electric energy generated form the solar panel. By this means, visible light is converted to electric energy to conform to each country's current environmental protection policies, and the charging element may be charged at any time to solve the problem of a conventional clinical thermometer being unable to be used due to insufficient cell power.

Abstract: A temperature monitor for monitoring plural locations on an electrical bus structure. The temperature monitor includes an infrared sensor for receiving infrared energy from a plurality of discrete predetermined locations on the bus structure, a first member defining a stationary first mask, a second member defining a rotating second mask, and a drive member driving the second member in rotation relative to the first member. Rotation of the second member relative to the first member defines an aperture translated across the first mask member to provide a moving line-of-sight that extends from the sensor and that scans to each of the discrete predetermined locations on the bus structure.

Abstract: A semiconductor memory device includes a thermosensor that senses present temperatures of the device and confirms whether the temperature values are valid. The thermosensor includes a temperature sensing unit, a storage unit and an initializing unit. The temperature sensing unit senses temperatures in response to a driving signal. The storage unit stores output signals of the temperature sensing unit and outputs temperature values. The initializing unit initializes the storage unit after a predetermined time from an activation of the driving signal. A driving method includes driving the thermosensor in response to the driving signal, requesting a re-driving after a predetermined time from the activation of the driving signal, and re-driving the thermosensor in response to the driving signal input again.

Abstract: A system and method are provided for diagnosing temperature sensor operation in an exhaust aftertreatment system. Temperature signals from first, second and third temperature sensors and a flow signal are received by a control circuit. The three temperature sensors are positioned in fluid communication with an exhaust flow path fluidly coupled to an exhaust manifold of an internal combustion engine, and the flow signal represents the flow rate of exhaust gas through the exhaust flow path. The control circuit determines average temperature differentials between each of the first, second and third temperature sensors as functions of the flow signal and corresponding ones of the first, second and third temperature signals, and produces a diagnostic fail signal if any of the differences between the average temperature differentials exceed a threshold value.

Abstract: Aspects of a method and system for an energy efficient temperature sensing crystal integrated circuit (TSCIC) are provided. In this regard, one or more circuits in a temperature sensing crystal integrated circuit (TSCIC) may be configured to control power consumption of the TSCIC. The one or more circuits in the TSCIC may comprise a memory and a crystal. The one or more circuits in the TSCIC may be operable to generate an indication of temperature of the crystal. The one or more circuits in the TSCIC may be configured to control a current supplied to the crystal within the TSCIC, wherein the configuring is based on phase noise requirements of a signal generated by the crystal. Generation of the temperature indication may be enabled or disabled. The enabling or disabling may occur based on a rate of change of a temperature in the TSCIC.

Abstract: A protective element for a measuring probe, in particular a measuring probe for use in the exhaust system of a motor vehicle, includes at least one temporarily water-binding layer which binds water chemically and/or physically in a first operating state and releases the bound water in a second operating state. A corresponding measuring probe, honeycomb body and motor vehicle are also provided.

Abstract: An improved method and apparatus for setting a trip-point temperature value for detection of an over-temperature condition in a chip when a reading from a main temperature sensor exceeds the trip-point temperature value. In one embodiment, the trip-point temperature value is set to a known temperature limit value offset by a temperature difference, ?T. ?T is calculated by taking the difference between a reading of the main temperature sensor and a reading of another temperature sensor, remote from the main temperature sensor, while a heat-generating circuit is enabled. The main temperature sensor is distal from heat-generating circuit on the chip and the remote temperature sensor is proximate the heat-generating circuit. For multiple heat-generating circuits on the chip, a ?T is determined for each of the heat-generating circuits, and the largest ?T is used to calculate the trip-point temperature value. Advantageously, the largest ?T determination may be done only once.

Abstract: The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.

Abstract: A cooling system is provided for controlling temperature in a power electronic device. The power electronic device includes a semiconductor having a major surface. The cooling system includes a temperature sensor coupled to the major surface of the semiconductor; and a control circuit coupled the temperature sensor. The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature.

Abstract: A power supply temperature sensor and system includes a power supply housing configured to receive at least one power supply unit, such as a battery cell. The power supply housing includes an aperture which provides communication between the battery cell and an ambient environment outside the power supply housing. A sensor having a sensing element is configured to sense a temperature of the battery cell, and a sensor housing surrounds at least a portion of the sensor, including at least a portion of the sensing element. This electrically isolates the sensing element from the battery cell. A portion of the sensor housing is configured to be disposed through the aperture in the power supply housing to make contact with the battery cell to facilitate conductive heat transfer between the battery cell and the sensor housing, thereby facilitating an accurate measurement of the temperature of the battery cell.

Abstract: The present invention relates to a method of measuring the temperature of the P-N junction within the light-emitting region of a quasi-continuous-wave or pulsed semiconductor laser diode device. A series of relatively short and low current monitor pulses are applied to the laser diode in the period between the main drive current pulses necessary to cause the semiconductor to lase. At the sufficiently low current level of the monitor pulses, the laser diode device does not lase and behaves similar to an electronic diode. The voltage across the laser diode resulting from each of these low current monitor pulses is measured with a high degree of precision. The junction temperature is then determined from the measured junction voltage using their known linear relationship.

Abstract: A detachable, magnetic tagging mechanism, and a system and method for using it, for conveying information related to control over the sensing of parameters, such as the heating of cookware or other food containers, to a reader communicating with, e.g., heating controls of a heater. The tagging mechanism may be removably attached to the cookware or other food container, is heat-resistant, and its shape can be changed to accommodate the heating of different sizes and shapes of cookware or other items. The tagging mechanism, system and method of the invention may be employed with different types of heaters, such as but not limited to magnetic induction heaters, and may communicate with readers using RFID or other technology and other communication modes and media.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: A temperature measuring probe with a hollow outer shell including an electrically conductive section and an electrically insulating section. A temperature sensor including a resonator is disposed in the electrically conductive section and electrically conductively connected to the electrically conductive section. An antenna including a shortened monopole is disposed in the electrically insulating section. The temperature sensor and the antenna are electrically conductively connected to each other. A respective material and respective dimension of the electrically insulating section and the antenna are matched such that an effective resistance of the antenna is approximately equal to an effective resistance of the temperature sensor in an operating frequency range of the temperature sensor.

Abstract: A wireless device monitors the temperature of a fluctuating thermal environment. The device may be contained within a thermal cycling machine. The device may comprise sensors, signal translators, an intelligent complex formula converter and protocol arbitration unit, portable power source, electromagnetic transmitter/receiver and antenna to receive various commands and to deliver the instantaneous temperature of various physical points to a control device located outside of the thermal cycling machine. The device is capable of monitoring the temperature fluctuations within a thermal cycler without the need to interfere with normal operation by a cable or wiring harness. In accordance with some embodiments of the present inventions, a temperature monitoring system is disclosed that includes a controller and a temperature monitoring device. The temperature monitoring device may include a core and a cartridge. The core includes a processor and a wireless transmitter.

Abstract: A temperature sensing system for a flange mounted device is provided. The temperature sensing system (100) can be comprised of a flexible wiring board (102). The temperature sensing system can be further comprised of a temperature sensing device (122) mounted to the flexible wiring board. The flexible wiring board can have one or more conductive traces (114a, 114b, 114c) disposed thereon. The conductive traces can form an electrical connection with the temperature sensing device. The temperature sensing system can also comprise a thermal pad directly connected to the temperature sensing device. The thermal pad can be formed of a thermal conductor. The thermal pad can also have a thermal contact surface. The thermal contact surface can be sized and shaped for direct physical contact with a portion of the device (302), wherein thermal energy is communicated directly from the thermal pad to the temperature sensing device. A method for sensing a temperature of a flange mounted device is also provided.

Abstract: There are provided a heater with temperature detecting device capable of accurately detecting the temperature of a laminated sheet heater (the temperature of a heater element) by a temperature detecting device, a battery structure provided with this heater with temperature detecting device, and a heater unit. A first heater with temperature detecting device includes a first laminated sheet heater and a temperature detecting device. In this first heater, a first metal sheet includes a part protruding outward in a lamination direction of a laminated heater to provide at least part of an accommodation space in which the temperature detecting device is accommodated.

Abstract: Measurement circuit components are included in an integrated circuit fabricated on a semiconductor substrate. These measurement circuits are connected to a voltage regulation circuit that provides the integrated circuit voltage source. These measurement circuits provide signals to control the voltage regulation circuit to adjust the voltage output to the integrated circuit based upon a measurement values obtained on the semiconductor device. These measurements include temperature and IR drop at locations on the semiconductor substrate, along with the frequency response of integrated circuit.

Abstract: A temperature measuring device includes a temperature sensor and at least two printed circuit boards connected together and extending transversely to one another for establishing an electrical connection between the temperature sensor and a connecting cable.