Arrangements For Numerical Indication (epo) Patents (Class 374/E1.006)
  • Mirroring in three-dimensional stacked memory
    Patent number: 9378104
    Abstract: A method for mirroring in three-dimensional-stacked memory includes receiving a plurality of thermal profiles from a plurality of memory chips. The method also includes ranking the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles and forming a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips. The method also includes forming a second group of memory chips from the plurality of memory chips distinct from the first group of memory chips based on the first ranked list of memory chips. The method also includes pairing a first memory chip from the first group of memory chips and a second memory chip from the second group of memory chips, and mirroring the pairing of memory chips.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: June 28, 2016
    Assignee: International Business Machines Corporation
    Inventors: Diyanesh B. Chinnakkonda Vidyapoornachary, Saravanan Sethuraman, Kenneth L. Wright
  • Mirroring in three-dimensional stacked memory
    Patent number: 9361195
    Abstract: A method for mirroring in three-dimensional-stacked memory includes receiving a plurality of thermal profiles from a plurality of memory chips. The method also includes ranking the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles and forming a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips. The method also includes forming a second group of memory chips from the plurality of memory chips distinct from the first group of memory chips based on the first ranked list of memory chips. The method also includes pairing a first memory chip from the first group of memory chips and a second memory chip from the second group of memory chips, and mirroring the pairing of memory chips.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: June 7, 2016
    Assignee: International Business Machines Corporation
    Inventors: Diyanesh B. Chinnakkonda Vidyapoornachary, Saravanan Sethuraman, Kenneth L. Wright