Circuits Arrangements For Indicating A Predetermined Temperature (epo) Patents (Class 374/E3.002)
  • Patent number: 10480839
    Abstract: In order to improve a refrigerant compressor comprising a drive motor and a compressor unit which compresses a refrigerant entering through a suction inlet and allows it to exit through a pressure outlet in such a way that it works as reliably as possible, it is proposed that the refrigerant compressor comprise a compressor monitoring system which is integrated into a compressor control system and which determines a compressor condition by means of a first condition value that corresponds to a first saturation temperature in the suction inlet and a second condition value that corresponds to a second saturation temperature in the pressure outlet, and which compares the compressor condition with permissible compressor conditions lying in a given deployment field of a deployment diagram and initiates a process of switching-off the refrigerant compressor if the compressor condition departs from the deployment field.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: November 19, 2019
    Assignee: Bitzer Kuehlmaschinenbau GmbH
    Inventor: Rolf Blumhardt
  • Patent number: 9086330
    Abstract: A circuit includes a comparator, a first circuit, and a second circuit. The comparator has a first input node and a second input node. The first circuit is configured to output a temperature-dependent voltage at the first input node of the comparator. The first circuit includes a current mirror configured to generate a first reference voltage. The second circuit is configured to output a second reference voltage at the second input node of the comparator responsive to a digital code and the first reference voltage.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: July 21, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chan-Hong Chern, Steven Swei
  • Patent number: 8384395
    Abstract: A circuit for controlling temperature of a semiconductor chip includes a first heating element that is built into the semiconductor chip. The first heating element generates heat to increase the temperature of the semiconductor chip. The chip also includes a temperature controller that is coupled to the first heating element and built into the semiconductor chip. The temperature controller controls the temperature to enable testing of the semiconductor chip at a desired temperature.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: February 26, 2013
    Assignee: Texas Instrument Incorporated
    Inventors: Ravindra Karnad, Sudheer Prasad, Ram A Jonnavithula