Abstract: A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a microelectromechanical systems (MEMS) motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.

Abstract: Embodiments may provide techniques that protect voice-controllable devices and systems such that the microphone can be shielded from attacking modulated laser beams. Embodiments may provide a physical device that may include two or more layers of integrated material that sits on top of the microphones of the voice-controllable devices and/or systems. The device may act as a physical barrier against the injected malicious laser beams while allowing sound waves reach the microphone for normal operation. For example, in an embodiment, an apparatus may comprise a first layer including at least one opening and a second layer including at least one opening, wherein the at least one opening in the first layer and the at least one opening in the second layer are arranged so as to block the passage of light, but to allow the passage of sound.

Abstract: An electronic device is disclosed. The electronic device includes a device magnet designed to magnetically couple with an accessory device magnet. The electronic device further includes a display assembly and a magnetic field sensor configured to detect the accessory device magnet, thereby providing an indication that the accessory device is covering the display assembly. The electronic device further includes a shunt assembly designed to reduce the magnitude of the magnetic field of the device magnet, as determined by the magnetic field sensor, while allowing the magnetic field from the accessory device to sufficiently reach the magnetic field sensor. As such, the magnetic field sensor can be placed near the device magnet without triggering the magnetic field sensor. The electronic device may further include a microphone. Communication between the microphone and an integrated circuit can cease based on the magnetic field sensor detecting the accessory device magnet.

Abstract: A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portion of the substrate and one or more standoffs formed of the solder mask material. The one or more standoffs and the layer of solder mask material comprising a single, contiguous structure. The MEMS die is disposed on the one or more standoffs and is coupled to the substrate via a bonding material. The bonding material forms an acoustic seal between the substrate and the MEMS die.

Abstract: An audio system receives an audio signal from a digital microphone, which has an analog-digital converter with a controllable sampling rate. In response to a determination that a predetermined trigger phrase is not detected in the decimated audio signal, the sampling rate of the analog-digital converter in the digital microphone is controlled such that the audio signal has a first sample rate. In response to a determination that the predetermined trigger phrase is detected in the decimated signal, the sampling rate of the analog-digital converter in the digital microphone is controlled such that the audio signal has a second sample rate higher than the first sample rate, and the audio signal is applied to a spoof detection circuit, to determine whether the received signal contains live speech or replayed speech.

Abstract: Briefly, in accordance with one or more embodiments, a display includes a housing comprising a first surface and a second surface opposite to the first surface. The second surface comprises a transparent material covering the second surface and the housing includes two or more microphone ports disposed along a parting line between the first surface and the second surface exterior to the transparent material. The housing further includes two or more microphones coupled with the two or more microphone ports. A microphone signal processing system may be utilize to increase directional sensitivity of the two more microphones toward an audio source. An angle detector to detect an angle of the may be utilized to accommodate the directional sensitivity provided by the microphone signal processing system.

Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

Abstract: The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.

Abstract: A waterproof membrane of the present disclosure has an insertion loss of 5.0 dB or less for sound with a frequency of 1 kHz, and an insertion loss of 5.0 dB or less for sound with a frequency of 10 kHz when a permeation region for sound of the waterproof membrane has an area of 1.3 mm2. The waterproof membrane of the present disclosure can cope with further size reduction of the permeation region. A waterproof member of the present disclosure includes the above-mentioned waterproof membrane of the present invention and a support member joined to the waterproof membrane.

Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.

Abstract: A Microphone module (101) is disclosed which comprises a MEMS-microphone capsule (102), a PCB (103) and a sealing element (104), wherein the PCB (103) comprises on its top surface (108) a first groove (115) which opens at a first end (115a) into the first passage (109) and the PCB (103) further comprises on its top surface (108) a second groove (116) which opens at a first end (116a) into the second passage (110) and wherein the sealing element (104) is arranged on the top surface (108) of the PCB (103) and that the sealing element (104) covers the first groove (115) and the second groove (116) in such a way that the first groove (115) is transformed into a first channel (117) and the second grove (116) is transformed into a second channel (118).

Abstract: The invention provides a terminal device having a main body, a sounding assembly and a cover plate. The sounding assembly includes a housing and a sounding body. The housing has an accommodating groove and a first sounding channel. The main body has a second sounding channel and a first sound emitting hole. The cover plate has a first through hole. When the sounding assembly is located at the first position, the sound is propagated to the outside through the first through hole, the second sounding channel and the first sound emitting hole in sequence. When the sounding assembly is located at the second position, the sound is propagated to the outside through the first sounding channel. The present invention improves the problem that the sound effect is affected by airflow sound, piano sound, etc., generated by the terminal device in the speaker mode.

Abstract: An apparatus for an audio sound system may include a speaker unit that may include a speaker housing configured to be selectively, at least partially, illuminated. The speaker unit may further include an illumination source configured to at least partially illuminate the speaker housing.

Abstract: An MEMS microphone comprises a substrate; a cover covering the substrate and forming an acoustic cavity with the substrate, wherein the substrate of the acoustic cavity is provided with: an acoustic transducer disposed in a first region of the substrate; an integrated circuit chip comprising a first bonding pad and a second bonding pad, wherein the first bonding pad is connected to the acoustic transducer via lead wires, the second bonding pad communicates with a groove formed at a bottom of the integrated circuit chip; a metal connection layer is formed on a surface of the groove and a portion where the metal connection layer extends to a bottom surface of the integrated circuit chip serves as a metal connection area. The integrated circuit chip is connected to a second region of the substrate through the metal connection area.

Abstract: The present disclosure relates to an acoustic output apparatus. The acoustic output apparatus may include an earphone core including at least one acoustic driver for outputting sound though one or more sound guiding holes set on the acoustic output apparatus, a controller configured to cause the at least one acoustic driver to output sound, a power source assembly configured to provide electrical power to the earphone core, the one or more sensors, and the controller, and an interactive control component configured to allow an interaction between a user and the acoustic output apparatus.

Abstract: There is provided a microphone assembly, comprising a base body portion comprising a top plate at its distal end; and a dome portion mounted at the distal end of the base body portion and having a perforated structure with at least 50% of outwardly facing surface area of the dome portion being formed by open areas, the dome portion made of a plastic material; at least one microphone capsule located within the dome portion, and an RF antenna located within the dome portion, the top plate comprising a reflection cone pointing towards the dome portion in order to reflect sound axially impinging on the reflection cone radially outwardly.

Abstract: A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.

Abstract: To provide a sound pickup device which is worn on an ear of a user and used. A sound pickup device includes: a sound pickup part; and a holding part that includes a sound transmission part and is configured to hold the sound pickup part in an ear canal of a user. The holding part includes a ring body having an opening portion that serves as the sound transmission part, and one or more arms each of which has one end coupled to the ring body and another end supporting the sound pickup part. The ring body is inserted into a cavum concha of the user and is locked in a vicinity of an intertragic notch. The holding part holds the sound pickup part so that a microphone hole is oriented to outside of the ear canal and the microphone hole is positioned on a farther side of an entrance of the ear canal.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly comprises an enclosure, a single micro-electro-mechanical systems (MEMS) transducer, a substrate layer, and an application housing. The single MEMS transducer is positioned within the enclosure. The substrate layer supports the single MEMS transducer. The application housing supports the substrate layer and defining at least a portion of a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and at least a portion of a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: An acoustic device including a motor disposed in a housing having a non-porous elastomeric membrane disposed across an acoustic path defined by a sound port of the housing is disclosed. The motor may be embodied as MEMS transducer configured to generate an electrical signal responsive to an acoustic signal, or as some other electromechanical device. The membrane has a compliance that is 1 to 100 times a compliance of the acoustic device without the membrane, wherein the membrane prevents ingress of contaminants (e.g., solids, liquids or light) via the sound port while permitting propagation of the acoustic signal along the acoustic path without significant loss.

Abstract: Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.

Abstract: A semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures; a membrane disposed opposite to the plate and including a plurality of corrugations, and a conductive plug extending through the plate and the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate includes a semiconductive member and a tensile member, and the semiconductive member is disposed within the tensile member.

Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.

Abstract: An animal emotion estimation device includes: a sound collector configured by an elastic member having a recess, a sound concentrating microphone provided on the bottom portion of the recess, and an impact absorber covering the entire of the elastic member and the sound concentrating microphone; a harness to mount the sound collector on an animal; a converter that filters and converts the sound collected through the sound collector into a heart rate signal; an estimation portion that estimates the emotion of the animal based on the heart rate signal; and an output unit that supplies information showing the estimation estimated by the estimation portion.

Abstract: A microphone assembly for an external surface of a vehicle comprises a microphone housing, a microphone assembly, and a wind break member. The microphone housing comprises a housing support. The microphone is disposed in the microphone housing. The wind break member has a base and a wind break portion. The base of the wind break member comprises a floor surface, a leading edge, and a trailing edge opposite the leading edge. The wind break portion of the wind break member is disposed proximate the leading edge of the base. The microphone housing is disposed on the base of the wind break member proximate the wind break portion. The wind break portion comprises a top surface that forms a first angle relative to the base of the wind break member. The top surface has one of a concave shape, a convex shape, and a compound concave and convex shape.

Abstract: A micro-electro-mechanical system (MEMS) microphone assembly including an enclosure having a top side and a bottom side that define a first chamber having a first volume and an acoustic inlet port formed through one of the top side or the bottom side. The assembly further including a MEMS microphone mounted within the first chamber, the MEMS microphone defining a second chamber having a second volume and a diaphragm having a first side interfacing with the first chamber and a second side interfacing with the second chamber. The assembly also including an acoustically absorbent material within one of the first chamber or the second chamber, the acoustically absorbent material to cause a simulated acoustic enlargement of the first volume or the second volume, respectively.

Abstract: A device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an interior surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall; a third sidewall attaching the first sidewall to the second sidewall; and a first contact pad disposed on an exterior surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor.

Abstract: A device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an interior surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall; a third sidewall attaching the first sidewall to the second sidewall; and a first contact pad disposed on an exterior surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor.

Abstract: A shotgun microphone unit which includes a housing, a microphone capsule, a shotgun tube having a longitudinal axis, and a shotgun mounting for mounting the shotgun tube with the microphone capsule within the housing. The shotgun mounting has an axial and a radial mounting, wherein the axial mounting is softer than the radial mounting.

Abstract: A microphone includes a base with a port extending therethrough, and a microelectromechanical system (MEMS) device coupled to the base. The MEMS device includes a diaphragm, a back plate, and a substrate. The substrate forms a back-hole. A capillary structure is disposed in the back-hole of the substrate, the cover, adjacent to the MEMS, or combinations thereof. The capillary structure includes a plurality of capillaries extending through the capillary structure. The capillary structure may have at least one hydrophobic surface and is configured to inhibit contaminants from outside the microphone from reaching the diaphragm via the port. In some embodiments, the capillary structure may protect against EMI.

Abstract: A microphone includes a base; a first micro electro mechanical system (MEMS) device and a second MEMS device disposed on the base. The first MEMS device has a first diaphragm and a first back plate, and the second MEMS device has a second diaphragm and a second back plate. The first MEMS device and the second MEMS device are arranged such that positive pressure moves the first diaphragm towards the first back plate, and the positive pressure simultaneously moves the second diaphragm of the from second back plate.

Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.

Abstract: A hearing device, e.g. a hearing aid, having a protection system is disclosed. The device includes an input unit for receiving an acoustic signal from a user's surroundings and providing a corresponding audio signal, and an output unit receiving said audio signal and providing an audible signal to the user, where the hearing device further includes a barrier element for protecting elements of the hearing device. Furthermore, the disclosure relates to a hearing device inlet system.

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.

Abstract: A microphone includes a main body surrounding a longitudinal axis that extends in a top-bottom direction, a battery holder mounted to the main body, and a protective cover. The protective cover has a cover body pivotally connected to and openably covering the battery holder for retaining a battery therein, and a positioning unit connected to the cover body. The protective cover is pivotable about a pivot axis transverse to the top-bottom direction to turn upward and downward and to move between a closed position, where the positioning unit engages the battery holder, and an opened position, where the positioning unit is disengaged from the battery holder in a direction transverse to the top-bottom direction.

Abstract: Disclosed is a host communication module, which is provided in a host device that can be connected to a slave device, including: a host power communication unit, in a transmission mode, receiving a power voltage for driving an active slave device from the host device and allowing the host device and the active slave device to perform power communication using the power voltage, and in a reception mode, receiving a power pulse from the active slave device and allowing the host device and the active slave device to perform power communication using the power pulse and a terminal connection unit transmitting or receiving the power pulse to or from the active slave device via a microphone jack provided in the host device.

Abstract: Multi-path signal processing for microelectromechanical systems (MEMS) sensors is described. An exemplary MEMS sensor apparatus can comprise a single MEMS sensor element and an associated integrated circuit (IC) that facilitates generating multiple output signals having different output signal electrical characteristics required by a host system. Provided implementations can minimize cost and IC die area of associated MEMS sensor apparatuses and systems by employing one or more signal multiplexers (MUXs) on a single common signal path from the single MEMS sensor element. In addition, various methods of generating multiple output signals having different output signal electrical characteristics from a single MEMS sensor element are described.

Abstract: A microphone apparatus is disclosed. A microphone apparatus according to an exemplary embodiment includes a vibration membrane disposed inside a case and formed on an upper surface of a main substrate; an acoustic component including an absorbing unit cut over a predetermined section toward the outside of a fixed membrane and having a predetermined pattern; a microphone module including a semiconductor chip electrically connected to the acoustic component inside the case; and a printed circuit board on which the microphone module is mounted.

Abstract: A sound transducer includes a housing with a sound port and a MEMS structure disposed in an interior space of the housing. The MEMS structure and the sound port are acoustically coupled to each other. The MEMS structure separates a front volume from a back volume of the housing. At least one vent hole of the MEMS structure allows a gas exchange between the front volume and the back volume. The sound port allows a liquid to enter the front volume. Further, the MEMS structure prevents liquid from entering the back volume.

Abstract: An audio apparatus includes a housing, a piezoelectric vibration unit provided to the housing and having a piezoelectric element, and a communication unit for receiving an audio signal. When a received audio signal is applied to the piezoelectric element while a load of the audio apparatus is applied to the piezoelectric vibration unit, the piezoelectric element is deformed causing deformation of the piezoelectric vibration unit, whereby a contact surface in contact with the audio apparatus vibrates and generate a sound.

Abstract: A boot is used to cover an inlet of a microphone of an auditory prosthesis. The boot prevents water, sweat, and other debris from damaging the microphone or entering the prosthesis housing. Additionally, the boot can include structure that helps dampen vibrations within the auditory prosthesis, thus improving microphone performance.

Abstract: A circuit board module for a sound transducer assembly for generating and/or detecting sound waves in the audible wavelength spectrum includes a circuit board, which features a recess with a first opening. At least a part of a MEMS sound transducer is arranged in the area of the first opening, such that the recess at least partially forms a cavity of the MEMS sound transducer. The recess features a second opening opposite to the first opening, such that the recess extends completely through the circuit board. A sound transducer assembly includes such a circuit board.

Abstract: A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected.

Abstract: A technique capable of accurately recognizing a voice input from a user and to uniform likelihood of depression of an outer skin is provided. A voice recognition device P includes an exoskeleton 5, a cushion member 6 that has elasticity and covers the exoskeleton 5, an outer skin 7 that covers the cushion member 6, a microphone 3 fixed to the exoskeleton 5, and a voice recognition unit 4 that recognizes a voice obtained by the microphone 3. In a voice input area 11, which is on an outer side of the microphone 3, the cushion member 6 has zero thickness. In a position in the vicinity of the microphone 3 that does not overlap the microphone 3, spring members 13 that are extended from the exoskeleton 5 to the outer skin 7 and are less compressed and deformed than the cushion member 6 are arranged.

Abstract: A microphone and a method for producing a microphone are disclosed. The microphone includes a substrate, a spring element plastically elongated in a direction perpendicular to the substrate, a transducer element in electrical contact with the substrate by way of the spring element and a cover to which the transducer element is fastened, the cover is arranged in such a way that the transducer element is arranged between the cover and the substrate.

Abstract: A MEMS microphone assembly has an enclosure enclosing a volume of air. A MEMS microphone chip is provided within the enclosure. First and second acoustic ports are formed in the enclosure, defining first and second fluid paths between the volume of air and air outside the enclosure. The MEMS microphone responds to a pre-determined linear interpolative value between two independent pressure signals supplied via first and second ports according to the potentiometic ratio of the acoustic impedances of the first and second ports.

Abstract: A condenser microphone is provided that can ensure the fixation of an electroacoustic transducer inside a unit case and the grounding of the electroacoustic transducer, regardless of variations in manufacture of the unit case and a circuit board. A condenser microphone unit includes an electroacoustic transducer and a unit case accommodating the electroacoustic transducer. The unit case includes at least one protrusion that is disposed on the inner circumferential surface of the unit case. The electroacoustic transducer is fixed inside the unit case with the protrusion.

Abstract: In an embodiment, a semiconductor structure includes a multi-chip package system (MCPS). The MCPS includes one or more dies, a molding compound extending along sidewalls of the one or more dies, and a redistribution layer (RDL) over the one or more dies and the molding compound. The semiconductor structure also includes at least one sensor coupled to the RDL, with the RDL interposed between the at least one sensor and the one or more dies. The semiconductor structure further includes a substrate having conductive features on a first side of the substrate. The conductive features are coupled to the RDL. The substrate has a cavity extending from the first side of the substrate to a second side of the substrate opposite the first side, and the at least one sensor is disposed in the cavity.

Abstract: One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.