Abstract: A photonic Y-splitter includes a substrate, first optical waveguides disposed in the substrate on a first layer, the first optical waveguides may be flared at a first end and inverse tapered toward a second end and may be substantially mirror images of one another, and a second optical waveguide disposed in the substrate on a second layer, above the first layer, the second optical waveguide being centered over the first optical waveguides and longitudinally arranged between the first end and the second end.

Abstract: A semiconductor device include: a first bus waveguide; a first silicon ring optically coupled to the first bus waveguide; a backup silicon ring optically coupled to the first bus waveguide; a first heater and a second heater configured to heat the first silicon ring and the backup silicon ring, respectively; and a first switch, where the first switch is configured to electrically couple the first silicon ring to a first radio frequency (RF) circuit when the first switch is at a first switching position, and is configured to electrically couple the backup silicon ring to the first RF circuit when the first switch is at a second switching position.

Abstract: In one embodiment, systems and method for detecting the intent of a connected optics/cable to operate in either a breakout mode or a non-breakout mode are provided. When a optics/cable is used to connect a port of a spine node to ports of one or more leaf nodes, initially both the spine node and the leaf nodes may automatically configure themselves to operate in breakout mode depending on the optics. Later, the spine node and one or more leaf nodes may exchange speed and optics information using a link layer discovery protocol or another protocol. If the exchanged speed and optics information indicates a mismatch, then the spine node or the leaf node may retain the breakout mode. If the exchanged speed and optic information do not indicate a mismatch, then the spine nodes and the leaf nodes may automatically re-configure themselves in non-breakout mode.

Abstract: The disclosed subject matter relates generally to photonic integrated circuit chips, semiconductor assemblies or packagings, and a method of forming the same. More particularly, the present disclosure relates to placement of optical fibers on a photonics chip, and a semiconductor assembly including the photonics chip.

Abstract: Disclosed is an optical connector cable including a plurality of optical fibers, a lens module, and an adhesive portion. Each of the plurality of optical fibers extends in a first direction. The lens module includes a placement structure configured to place the plurality of optical fibers thereon in order in a second direction intersecting the first direction and a plurality of lenses optically coupled to tip ends of the plurality of optical fibers. The adhesive portion fixes the plurality of optical fibers to the placement structure with an adhesive. The adhesive portion includes a first adhesive portion located near the tip ends of the plurality of optical fibers and a second adhesive portion located behind the first adhesive portion in the first direction. The second adhesive portion has a Young's modulus higher than that of the first adhesive portion.

Abstract: An optical modulator includes: an encoder that encodes an input data signal; a branch circuit that branches an optical signal into first and second optical signals; a first arm through which the first optical signal branched at the branch circuit passes; a first phase shifter group on the first upper arm that adjusts a phase shift amount of the first optical signal that passes through the first arm; a second arm through which the second optical signal branched at the branch circuit passes; a second phase shifter group on the second arm that adjusts a phase shift amount of the second optical signal that passes through the second arm such that a sign of the phase shift amount of the second optical signal becomes opposite to a sign of the phase shift amount of the first optical signal; and a multiplexing circuit that multiplexes the first optical signal.

Abstract: An optical coupler includes a substrate, a mirror layer, a plurality of coupling gratings, a plurality of waveguides, and an oxide layer. The substrate includes a first surface, a second surface opposite to the first surface, and a concave portion exposed from the first surface. The mirror layer is disposed in the concave portion. The coupling gratings are disposed above the mirror layer. The waveguides are laterally aligned with the coupling gratings. The concave portion faces both the coupling gratings and the waveguides. The oxide layer is bonded on the first surface. The coupling gratings and the waveguides are disposed on the oxide layer.

Abstract: A device providing efficient transformation between an initial optical mode and a second optical mode includes first, second and third elements fabricated on a common substrate. The first element includes first and second active sub-layers supporting initial and final optical modes with efficient mode transformation therebetween. The second element includes a passive waveguide structure supporting a second optical mode. The third element, at least partly butt-coupled to the first element, includes an intermediate waveguide structure supporting an intermediate optical mode. If the final optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in the second or third elements facilitates efficient transformation between the intermediate optical mode and the second optical mode. Precise alignment of sub-elements formed in one of the elements, relative to sub-elements formed in another one of the elements, is defined using lithographic alignment marks.

Abstract: A fused fibre coupler comprising: a single mode fibre, SMF, and an orbital angular momentum fibre, OAMF, the fibres having a coupling portion in which the fibres are longitudinally aligned side by side and fused at least over a coupling length in which the SMF and OAMF are tapered such that the diameter of the SMF and the diameter of the OAMF give the fibres matching effective refractive indices for a single mode of the SMF and an orbital angular momentum, OAM, mode of the OAMF for a coupled wavelength of light.

Abstract: A method of manufacturing an optical engine includes bonding a plurality of laser diodes directly or indirectly to a base substrate and coupling at least one laser diode driver circuit to the laser diodes. In operation the at least one laser diode driver circuit selectively drives current to the laser diodes. The method further includes bonding a plurality of collimation lenses to the base substrate proximate the plurality of laser diodes and bonding a cap including at least one wall and at least one optical window to the base substrate. The method also includes bonding a grating waveguide combiner proximate the optical window of the cap. In operation, the grating waveguide combiner receives a plurality of beams of light at a respective plurality of input grating couplers and combines the plurality of beams of light to provide a collimated aggregated beam of light at an output grating coupler.

Abstract: A fiber module (1B) according to the present disclosure includes an input-side optical fiber (11), an output-side optical fiber (12), a ferrule (20) in which the input-side optical fiber and the output-side optical fiber are insertable in both ends and a groove (32) is formed in a direction orthogonal to a longitudinal direction (D1) in the middle of the longitudinal direction, a dielectric multilayer film filter (30) inserted in the groove, and an input-side GI fiber (15) and an output-side GI fiber (16) joined by fusion to respective terminal portions of the input-side optical fiber and the output-side optical fiber. The dielectric multilayer film filter is interposed between an end surface (15f) of the input-side GI fiber and an end surface (16f) of the output-side GI fiber in the longitudinal direction.

Abstract: Provided is a quantum dot (QD) light modulator and an apparatus including the QD light modulator. The QD light modulator may include a QD-containing layer including QDs having light-emission characteristics, a refractive index change layer arranged adjacent to the QD-containing layer, and a reflector arranged facing the QD-containing layer. The refractive index change layer may include a carrier density change area in which a carrier density changes, and the carrier density change area may be arranged adjacent to the QD-containing layer. The light-emission characteristics of the QD-containing layer may be modulated according to a change in a property of the refractive index change layer. The QD light modulator may further include a nano-antenna structure arranged on the QD-containing layer.

Abstract: An optical network and a method are described. In the method, an orchestrator of an optical communication system receives an operation to execute, the operation being to activate or deactivate a service within a transmission signal of the optical communication system, the optical communication system having a span and an amplifier coupled to and supplying optical signals into each span. Network status data for each span within the optical communication system is retrieved, and the list of operations is analyzed with the network status data including existing data traffic on the fiber optic line to select a subset of the list of operations to execute that maintains the transmission signal below a bit error rate threshold. The orchestrator issues one or more signals to cause the one or more service within the subset of the list of operations to be activated or deactivated on the optical communication system.

Abstract: Integrated-optics systems are presented in which an active-material stack is disposed on a coupling layer in a first region to collectively define an OA waveguide that supports an optical mode of a light signal. The coupling layer is patterned to define a coupling waveguide and a passive waveguide, which are formed as two abutting, optically coupled segments of the coupling layer. The lateral dimensions of the active-material stack are configured to control the shape and vertical position of the optical mode at any location along the length of the OA waveguide. The active-material stack includes a taper that narrows along its length such that the optical mode is located completely in the coupling waveguide where the coupling waveguide abuts the passive waveguide. In some embodiments, the passive layer is optically coupled with the OA waveguide and a silicon waveguide, thereby enabling light to propagate between them.

Abstract: Techniques and circuitry for wavelength monitor and control are disclosed herein. The disclosed wavelength monitor and control circuitry and techniques are designed to realize a multi-channel DWDM optical link by using a photonic receiver that dynamically adjusts resonant wavelengths of the microring drop filter (MDF), as needed. The wavelength monitor and control circuitry can monitor and control the resonant wavelengths of multiple MDFs for a DWDM silicon photonics receiver with minimum power and area overhead. In an embodiment, circuitry for an optical receiver comprises an MDF having resonant wavelength for multiple DWDM channels, and circuitry to control and monitor the resonant wavelength of the MDF in real-time and in manner that compensates for deviation between actual resonant wavelength of the MDF and the incident optical wavelength of the MDF.

Abstract: An optically-downconverting channelizer is disclosed for W-band detection. The channelizer includes an input waveguide configured to carry an inputted signal having a plurality of wavelengths including a desired wavelength and a plurality of ring resonators arranged in parallel and coupled at spaced apart locations along the input waveguide for receiving the inputted signal, wherein each of the plurality of ring resonators is configured to pass a selected wavelength signal to an output end. The channelizer further includes a control waveguide that carries a second signal having a wavelength that differs from the desired wavelength by a predetermined amount, and a plurality of detectors coupled to respective output ends of the ring resonators, the plurality of detectors configured to produce channelized RF output signals representative of desired RF bands.

Abstract: Structures including a waveguide core and methods of fabricating a structure that includes a waveguide core. A dielectric layer including a trench with a first sidewall and a second sidewall, and a waveguide core positioned inside the trench between the first and second sidewalls of the trench. The waveguide core has a first width, and the trench has a second width between the first and second sidewalls that is greater than the first width.

Abstract: An endoscope includes: an insertion unit; an imaging unit to image a subject under examination and output an electrical image signal; a light modulation device to output an optical image signal based on the electrical image signal output from the imaging unit; a first light cable inserted in the insertion unit to transmit light emitted by a communication light source to the light modulation device; and a second light cable inserted in the insertion unit to transmit the optical image signal output from the light modulation device outside the insertion unit. The communication light source is different from an illumination light source emitting an illumination light for illuminating the subject under examination. The light modulation device modulates the light transmitted by the first light cable to generate the optical image signal.

Abstract: This variable wavelength laser device comprises a first semiconductor chip having first and second waveguides disposed in parallel, and a second semiconductor chip having an optical circuit optically connected to the first and second waveguides that, in conjunction with the first and second waveguides, constitute a resonator. Each of the first and second waveguides has two or more surface electrodes. The second semiconductor chip has a plurality of electrodes joined to the surface electrodes of the first and second waveguides.

Abstract: In various embodiments, a light-emitting diode arrangement is provided. The light-emitting diode arrangement includes a first substrate with a first light-emitting diode which is arranged on the first substrate such that light emitted by it radiates in a main emission direction of the light-emitting diode arrangement, and a second substrate with a second light-emitting diode which is arranged on the second substrate such that light emitted by it radiates in the main emission direction of the light-emitting diode arrangement. The second substrate is arranged above the first substrate, such that the second substrate at least partly covers the first substrate.

Abstract: A light detection and ranging (LiDAR) system according to the present disclosure comprises an optical source to emit an optical beam. The LiDAR system comprises a PSR comprising a silicon nitride based waveguide to split and rotate a target return signal of the optical beam from a target. The silicon nitride based waveguide includes a first silicon nitride segment and a second silicon nitride segment. The first silicon nitride segment includes a first layer and a second layer. The first silicon nitride segment has tapered widths along a longitudinal direction. The second silicon nitride segment includes a silicon nitride adiabatic coupler. The LiDAR system further comprises an optical element to generate a local oscillator (LO) signal and a PD to mix the target return signal with the LO signal to generate a heterodyne signal to extract information of the target.

Abstract: A modular and scalable high-power fiber laser system is configurable to generate 1 kW or more of laser output, and includes one or more separable pump modules separately disposed from each other, each pump module including a plurality of fiber-coupled component pump sources optically combined by one or more fiber-based pump module pump combiners, each pump module providing one or more pump module fiber outputs, and a gain module separately disposed from the one or more separable pump modules and including one or more gain module pump fiber inputs optically coupled to corresponding ones of the pump module fiber outputs, and including a gain fiber optically coupled to the one or more gain module pump fiber inputs, the gain fiber configured to generate a gain module fiber output power scalable in relation to the number and power of said pump module fiber outputs coupled to the gain fiber.

Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).

Abstract: Thermal control is provided for external light sources for silicon photonics based pluggable modules. In one embodiment, an apparatus comprises a first circuit board; a light source disposed upon the first circuit board; a silicon photonics modulator; a connector comprising a first portion and a second portion, wherein: the first and second portions are physically matable and separable; mating the first and second portions of the connector optically couples the first and second portions, the first portion is disposed upon the first circuit board, and is optically coupled to an output of the light source, and the second portion is optically coupled to an input of the silicon photonics modulator; and a thermal controller to control a temperature of the light source. Some embodiments disable the light source when the connector is separated.

Abstract: A method of providing electrical isolation between subsections in a waveguide structure for a photonic integrated device, the structure comprising a substrate, a buffer layer and a core layer, the buffer layer being located between the substrate and the core and comprising a dopant of a first type, the first type being either n-type or p- type, the method comprising the steps of prior to adding any layer to a side of the core layer opposite to the buffer layer: selecting at least one area to be an electrical isolation region, applying a dielectric mask to a surface of the core layer opposite to the buffer layer, with a window in the mask exposing an area of the surface corresponding to the selected electrical isolation region, implementing diffusion of a dopant of a second type, the second type being of opposite polarity to the first type, and allowing the dopant of the second type to penetrate to the substrate to form a blocking junction.

Abstract: Provided is an optical circuit element, and more particularly, is an optical circuit element that splits one optical signal into two polarization signals, or couples two polarization signals into one optical signal. The optical circuit element includes a plurality of input couplers to which an optical signal is input, a plurality of output couplers from which an optical signal is output, a first path and a second path configured to connect the input couplers and the second couplers to each other, and at least one wave plate.

Abstract: A photonic integrated circuit comprises a substrate and a passive layer, which is formed on the substrate and incorporates a passive photonic device. The circuit also comprises a layer of III-V material. The layer of III-V material is arranged in a recess of the passive layer and incorporates an active photonic device. The layer of III-V material is configured such that light can be transferred between the passive photonic device and the active photonic device. This photonic integrated circuit provides the advantages of an active device formed from III-V material in an arrangement that is easily planarized, which enables close integration between the active device and electronic components.

Abstract: The evanescent optical coupler is constituted by an IOX waveguide and an optical fiber. The IOX waveguide is formed in a glass substrate and has a tapered section that runs in an axial direction. The IOX waveguide supports a waveguide fundamental mode having an waveguide effective index NW0 that varies within a range ?NW0 as a function of the axial direction. The IOX waveguide can also support a few higher-order modes. The optical fiber supports a fiber fundamental mode having a fiber effective index NF0 that falls within the waveguide effective index range ?NW0 of the waveguide fundamental mode of the tapered section of the IOX waveguide. A portion of the optical fiber is interfaced with the tapered section of the IOX waveguide to define a coupling region over which evanescent optical coupling occurs between the optical fiber and the IOX waveguide.

Abstract: A chip mounting method includes providing a first substrate including a light transmissive substrate having first and second surfaces, a sacrificial layer provided on the first surface, and a plurality of chips bonded to the sacrificial layer, obtaining first mapping data by testing the chips, the first mapping data defining coordinates of normal chips and defective chips among the chips, disposing a second substrate below the first surface, disposing the normal chips on the second substrate by radiating a first laser beam to positions of the sacrificial layer corresponding to the coordinates of the normal chips, based on the first mapping data, to remove portions of the sacrificial layer thereby separating the normal chips from the light transmissive substrate, and mounting the normal chips on the second substrate by radiating a second laser beam to a solder layer of the second substrate.

Abstract: An optical interconnect structure connecting a VCSEL laser or a photodetector to a fiber cable with a 3D polymer waveguide is described. The waveguide has a vertical portion at one end of a horizontal trench portion joined by a 45 degree sidewall. The vertical portion interfaces with VCSEL laser arranged on a flexible circuit board. The other end of the horizontal trench portion connects to a fiber via a mechanical transport connector. The flexible structure also holds driver, receiver, pad, amplifier, RF chip and transmission lines. A method of fabrication includes: patterning a polymer cladding layer into a horizontal trench and a 45 degree side wall by applying multiple exposure techniques; filling horizontal trench and 45 degree side wall cavity to form a core followed by planarizing the core layer to remove excess core; patterning a vertical cavity aligned with the 45 degree side wall to form a reflector.

Abstract: An optical sensor includes an optical device including a microresonator, laid out to guide a light beam along a closed loop optical path, and an injection and/or extraction waveguide, optically coupled to the microresonator; a photodetector, arranged at the output of the injection and/or extraction waveguide; and an analysis device, receiving a signal supplied by the photodetector, and deducing therefrom information relative to a displacement. The microresonator is constituted of a plurality of elementary waveguides spaced apart from each other, and arranged one after the other according to a loop shaped layout. The optical sensor offers increased sensitivity to the measurement of nanometric displacements.

Abstract: The disclosure provides a Butler Matrix. The Butler Matrix includes: a plurality of couplers having a circuit of a cuboid structure, a plurality of crossover lines, a plurality of three-dimensional crossover lines having a three-dimensional structure, and a plurality of phase shifters. The phase shifters, the crossover lines, and the three-dimension crossover lines are been coupled between one of the couplers and the other of the couplers.

Abstract: Light guide assemblies including first, second and third light guides, a first optical coupling component disposed between and attached to the first and second light guides, and a second optical coupling component disposed between and attached to the second and third light guides are described. The first optical coupling component is adapted to couple light between the first and second light guides, and the second optical coupling component is adapted to couple light the between second and third light guides. The first light guide, the second light guide and the first optical coupling component are coextensive over a first region of the assembly, and the second light guide, the third light guide and the second optical coupling component are coextensive over a different second region of the assembly.

Abstract: An optical engine includes a substrate provided with terminals configured to connect to a connector provided on another substrate, a light receiver/emitter mounted on the substrate, and a cover covering the substrate. The light receiver/emitter is any one of a light receiver, a light emitter, and an element having functions of both the light receiver and the light emitter.

Abstract: A method for manufacturing a laser diode device includes providing a substrate having a surface region and forming epitaxial material overlying the surface region, the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active layer region. The epitaxial material is patterned to form a plurality of dice, each of the dice corresponding to at least one laser device, characterized by a first pitch between a pair of dice, the first pitch being less than a design width. Each of the plurality of dice are transferred to a carrier wafer such that each pair of dice is configured with a second pitch between each pair of dice, the second pitch being larger than the first pitch.

Abstract: An optoelectronic device having three substantially planar substrates arranged such that one of the substrates is orthogonal to the other two substrates. In an example embodiment, the first substrate may have one or more photonic devices configured to emit or receive light traveling substantially orthogonally with respect to a major plane of the first substrate. The second substrate has an optical waveguide circuit thereon that is edge-coupled to receive (or transmit) the light from (to) the one or more photonic devices. The third substrate has an electrical circuit thereon and is connected to form an L-shaped junction with the first substrate, the L-shaped junction providing electrical connections between the corresponding electrical transmission lines located on the first and third substrates, e.g., to communicate electrical signals with the one or more photonic devices. In some embodiments, the optoelectronic device can be used to implement an optical transmitter or receiver.

Abstract: Apparatuses and methods for photonic communication and photonic addressing are disclosed herein. An example apparatus includes a plurality of photonic sources, a plurality of memory die, a logic die. Each of the plurality of photonic sources provides a photonic signal of a different wavelength and are provided to a first photonic path. Each memory die of the plurality of memory die includes a photonic modulation circuit coupled to the first photonic path, and further includes a photonic detector circuit coupled to a second photonic path. Each memory die of the plurality of memory die is associated with and addressed by a respective wavelength of a photonic signal. The logic die is coupled to the first and second photonic paths, and includes a plurality of photonic circuits. Each of the photonic circuits of the plurality of photonic circuits is associated with a respective wavelength of a photonic signal.

Abstract: A display panel includes waveguides, wires and a pixel array. The pixel array includes a plurality of pixel units. The pixel units are arranged in a plurality of columns and a plurality of rows. Each pixel unit includes a pixel electrode, a light filtering unit, and a photo transistor. The light filtering unit is coupled to one of the waveguides. The photo transistor is electrically connected to the pixel electrode and one of the wires, and is coupled to the light filtering unit. The waveguide transmits a light control signal. Each wire transmits an electric control signal. The light filtering unit is configured to receive a sub control signal from the waveguides to which the light filtering unit is coupled and filter out a specific optical signal according to the received sub control signal as an input signal of the photo transistor.

Abstract: A photonic integrated chip device having a common optical edge interface is provided and specifically a device comprising: a photonic integrated circuit (PIC) chip comprising: an optical circuit; and an electrical interface configured to receive electrical signals for controlling the optical circuit; and, a common optical interface side of the PIC chip comprising: at least one input configured to receive light into the PIC chip to the optical circuit; and at least one output configured to convey at least one optical signal from the optical circuit out of the PIC chip, the electrical interface located on one or more electrical interface sides of the PIC chip different from the common optical interface side.

Abstract: Field-installable mechanical splice connectors for making optical and/or electrical connections in the field are disclosed. One embodiment is a hybrid mechanical splice connector having an electrical portion and an optical portion that includes at least one electrical contact, a shell, and at least one body for receiving at least one field optical fiber and securing the electrical contact. The connector includes a mechanical retention component for securing at least one optical field fiber to the at least one body. Another embodiment is directed to a mechanical splice connector having at least one body for receiving at least one field optical fiber, a mechanical retention component for securing at least one optical field fiber to the at least one body, and at least one lens attached to the at least one body.

Abstract: An optical switch, comprising: a first optical waveguide, a first optical add path, a second optical add path and a micro-ring resonator. The micro-ring resonator is operable to add a first optical signal at a preselected wavelength received from the first optical add path to the first optical waveguide to travel in a first direction through the first optical waveguide. The micro-ring resonator is further operable to add a second optical signal at the preselected wavelength received from the second optical add path to the first optical waveguide to travel in a second direction through the first optical waveguide opposite to the first direction. There is also provided an optical drop switch, an optical switching apparatus, an optical communications network node and an optical communications network.

Abstract: A system (10) and method that facilitates the delivery of power and fiber communications together is provided. The system and method enables quick and easy connection of a hybrid cable (12) to telecommunication equipment. The system provides a sealed robust connection for both conductors (78, 80) and fibers (50) at a single location (56). It can be used to avoid the need for local powering of fiber based communication devices and networks.

Abstract: An optical receiver module that recovers signals from a wavelength multiplexed optical signal is disclosed. The optical receiver module includes photodiodes (PDs) arranged in an array by a pitch, an amplifier that integrates trans-impedance amplifiers (TIAs) each corresponding to the PDs, and a sub-mount that mounts the PDs thereon. The sub-mount provides metal patterns on which the PDs are mounted by the flip-chip bonding. The metal patterns compensate a difference between the pitch of the arrayed PDs and another pitch of the TIAs in the amplifier as maintaining the characteristic impedance thereof substantially equal to each other.

Abstract: An optical fiber splicer includes a fiber fixing portion, a first optical fiber fixed to the fiber fixing portion, a clamp portion which is capable of holding and fixing an extending portion extended from the fiber fixing portion of the first optical fiber and a tip portion of a second optical fiber optically connected to the extending portion of the first optical fiber between a base member and a pressing member being openable and closable with respect to the base member, and a solid index matching material which is attached to a tip surface of the extending portion of the first optical fiber and is interposed between the first optical fiber and the second optical fiber.

Abstract: An optical waveguide includes a substrate, a first core provided over the substrate and having a first taper region that extends from one side toward the other side and has a sectional area that decreases toward the other side, and a plurality of second cores provided over the substrate and over or under the first core with a first cladding layer sandwiched therebetween and extending in parallel to the substrate and the first core.

Abstract: Embodiments herein relate to a photonic integrated circuit (PIC) with an on-chip optical isolator. The PIC may comprise a laser, a waveguide coupled with the laser, and a closed loop resonator coupled to the laser through the waveguide. A magneto-optical (MO) layer is over and in contact with the waveguide and the closed loop resonator. The closed loop resonator may comprise a first polarization rotator (PR) and a second PR. A light from the laser in transverse electric (TE) mode through the waveguide is rotated in the first PR to a light in transverse magnetic (TM) mode, and the light in TM mode is rotated in the second PR to light in TE mode. The isolator may further comprise a micro-heater over or along a side of the waveguide and separated from the closed loop resonator; and a feedback control loop connected to the closed loop resonator and the micro-heater.

Abstract: A system comprises a first optical component comprising at least one waveguide and at least one self-alignment feature; and a second optical component comprising at least another waveguide and at least another self-alignment feature; wherein the self-alignment feature of the second optical component engage to assist in optically-coupling the waveguide of the first optical component and the waveguide of the second optical component when the first optical component has a manufacturing tolerance in a given geometric dimension and is mounted in the second optical component.

Abstract: A method forms a vertical output coupler for a waveguide that propagates light along a horizontal propagation direction, through a waveguide material that overlies a buried oxide layer. The method includes etching the waveguide to remove a portion of the waveguide. The etching forms at least a first plane that is at an edge of the waveguide, is adjacent to the removed portion of the waveguide, and is tilted at a vertical angle between 20 degrees and 70 degrees with respect to the propagation direction. The method further includes coating the first tilted plane with a reflective metal to form a mirror, such that the mirror reflects the light into a direction having a vertical component.

Abstract: An optical switch, comprising: a first optical waveguide, a first optical add path, a second optical add path and a micro-ring resonator. The micro-ring resonator is operable to add a first optical signal at a preselected wavelength received from the first optical add path to the first optical waveguide to travel in a first direction through the first optical waveguide. The micro-ring resonator is further operable to add a second optical signal at the preselected wavelength received from the second optical add path to the first optical waveguide to travel in a second direction through the first optical waveguide opposite to the first direction. There is also provided an optical drop switch, an optical switching apparatus, an optical communications network node and an optical communications network.

Abstract: An optical transceiver that provides a receiver optical module including a plurality photodiodes (PDs) each biased through internal bias lines, signal lines carrying driving signals to an optical transmitter module, and external bias lines each connected to the internal bias lines. One of the internal bias lines connected to one of the external bias lines arranged closest to the signal lines has a length shorter than lengths of the other internal bias lines so as not to affect EMI noises induced from the signal lines to the other internal bias lines.