Abstract: The present invention provides an optical connector coupled to an optical receptacle, wherein the optical connector comprises an outer housing, a coupling module, and a latch structure. The coupling module is arranged in the outer housing for slidably connecting to the outer housing. When the latch structure is rotated to a first position, the optical connector is unable to be released from the optical receptacle; and when the latch structure is rotated to a second position, the outer housing is allowed to slide relative to coupling module whereby the optical connector is released from the optical receptacle. In one alternative embodiment, the present invention further provides an optical module and an operation method for locking the optical connector into the optical receptacle, or releasing the optical connector from the optical receptacle.

Abstract: There is provided a method for fabricating an optical printed circuit board. The method includes preparing a first printed circuit board portion with an array of optical fibers attached thereon, assembling an optical fiber connector with the first printed circuit board portion such that the optical fiber connector is arranged at ends of the array of optical fibers, and attaching one or more second printed circuit board portions to the first printed circuit board portion to form an optical printed circuit board with the optical fiber connector embedded therein. The optical fiber connector includes an engagement mechanism arranged for engagement with an external optical device.

Abstract: An optical communication device includes two optical transmitting devices, two optical receiving devices, an optical path component, and an optical fiber adapter. A first converging lens packaged in each of the optical transmitting devices converges a light beam emitted by a light source, and provides the converged light beam for the optical path component. A second converging lens packaged in each of the optical receiving devices converges a light beam from the optical path component, and provides the converged light beam for a photoelectric detection element. The optical path of the optical communication device is simplified and the process costs are reduced. In addition, the quantity of used lenses is reduced, correspondingly reducing the quantity of optical coupling dimensions between mechanical parts and improving production efficiency of combined passive optical network (Combo PON) products.

Abstract: The application provides an optical fiber splice with an adjustable sleeve, which comprises: a carrier, an optical fiber cable and an adjustable sleeve. The carrier has a first fixed end and a second fixed end along an optical fiber extension direction. The optical fiber cable has a cable part and an optical fiber outlet part. The optical fiber outlet part extends from the cable part and is fixed to the first fixed end. The adjustable sleeve is sleeved on the cable part. An outer peripheral surface of the adjustable sleeve is provided with a plurality of positioning features. Wherein in the optical fiber extension direction, the positions of the positioning features disposed on the adjustable sleeve are deviated from each other by a distance. One of the positioning features is fixed to the second fixed end.

Abstract: A planar lightwave circuit (PLC) assembly is used for a transceiver module that includes a circuit board having photodetectors mounted at a spacing from one another. A transmitter mounted on the circuit board is configured to transmit optical signals for a network. The PLC assembly includes at least one PLC chip and at least one fiber array. The PCL chip mounts on the transmitter and is configured to receive optical signals for the network. The fiber array has optical fibers connecting between the PLC chip and the photodetectors. The array's first end connected to the PLC chip has a first pitch between the optical fibers, while the array's second end has at least one connector connected adjacent the photodetectors and having a second fiber pitch, which is greater than the first pitch and is configured to the spacing of the photodetectors.

Abstract: A connector for a system circuit board or a power module is provided. The connector includes a main body and an optical connection mechanism. The main body includes a first connecting terminal and a second connecting terminal. The first connecting terminal and the second connecting terminal are power contacts or signal contacts. The optical fiber connection mechanism is embedded within the main body. The optical fiber connection mechanism is disposed between the first connecting terminal and the second connecting terminal. Since the optical fiber connection mechanism is embedded within the main body, it is not necessary to specifically remove the optical fiber cable when the power module is detached from the cabinet. Moreover, the appearance of the product is more aesthetically-pleasing, and the maintaining speed and the product reliability are increased.

Abstract: Apparatuses and methods for input receiver circuits and receiver masks for electronic memory are disclosed. Embodiments of the disclosure include memory receiver masks having shapes other than rectangular shapes. For example, a receiver mask according to some embodiments of the disclosure may have a hexagonal shape. Other shapes of receiver masks may also be included in other embodiments of the disclosure. Circuits, timing, and operating parameters for achieving non-rectangular and various shapes of receiver mask are described.

Abstract: A light-emitting cable structure includes a light-emitting cable, a first circuit board, second circuit board, at least one light-emitting module and a covering casing. By placing a plurality of signal groups in the light-emitting cable below a plurality of optical fibers in the light-emitting cable for a certain distance and placing the signal groups outside the vertical projection of the optical fibers towards the signal groups, the light in the optical fibers is allowed to be emitted by the vertical projection, so that users can observe the light transmitted in the optical fibers from all sides of the light-emitting cable structure, which greatly increases the attractiveness of the product to consumers.

Abstract: An optical fiber inspection system may include an alignment guide having a sleeve portion and a mechanical key structure. The sleeve portion may comprise a first opening arranged to be proximal to one or more optical components in an inspection device and a second opening arranged to be distal to the one or more optical components when the alignment guide is removably engaged with the inspection device. The mechanical key structure may be located adjacent to the second opening and have a shape to engage a geometry of one or more recesses in a bulkhead. Accordingly, the alignment guide may stabilize the inspection device at a particular angle relative to an end face of an object in a field of view of the one or more optical components when a shaft of the inspection device is inserted into the bulkhead.

Abstract: To resolve an issue related to the calibration of optical cameras in transducer-based mid-air haptic systems, the magnification of the motion induced on an optical camera by an acoustic field modulated at specific frequencies reveals very small temporal variations in video frames. This quantized distortion is used to compare different acoustic fields and to solve the calibration problem in an automatized manner. Further, mechanical resonators may be excited by ultrasound when it is modulated at the resonant frequency. When enough energy is transferred and when operating at the correct frequency, a user in contact with the device can feel vibration near areas of largest displacement. This effect can be exploited to create devices which can produce haptic feedback while not carrying a battery or exciter when in the presence of an ultrasonic source.

Abstract: An opto-electric hybrid board is capable of being mounted on a connector having a bottom wall. The opto-electric hybrid board sequentially includes an optical waveguide and an electric circuit board toward one side in a thickness direction of these. The optical waveguide includes an under clad layer, a core layer disposed on a one-side surface of the tinder clad layer, and an over clad layer disposed on the one-side surface of the under clad layer so as to cover the core layer. The under clad layer is in contact with an other-side surface in the thickness direction of the electric circuit board. The one-side surface in the thickness direction of the electric circuit board is capable of being placed on the bottom wall.

Abstract: The present invention provides an optical connector electrically coupled to an optical receptacle. The optical connector comprises a connector body, and a sliding member. The connector body inserted into the optical receptacle comprises a housing and a boot structure detachably arranged in the housing. The sliding member is slidably coupled to the housing wherein the boot structure is restrained inside the housing or is removed from the housing according to a sliding position of the sliding member.

Abstract: This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.

Abstract: Disclosed herein are techniques for aligning a collimator assembly with an array of LEDs. According to certain embodiments, a method includes using lithography to form a first plurality of contact pads and a second plurality of contact pads on a backplane; bonding a plurality of dies to the first plurality of contact pads, wherein each of the plurality of dies comprises a plurality of light emitting diodes; forming a first plurality of features on the second plurality of contact pads; and aligning a plurality of lenses on an assembly with the plurality of dies by coupling a second plurality of features on the assembly with the first plurality of features on the second plurality of contact pads.

Abstract: A cable assembly is provided. The cable assembly includes a cable element, a plug element to which a terminal end of the cable element is connected and which is configured to be plugged into a plug receptor, a sensor and an analysis engine. The sensor is disposed along the cable element or in the plug element and is configured to sense a manipulation of at least one of the cable element and the plug element relative to the plug receptor and to issue signals indicative of sensing results. The analysis engine is receptive of the signals and is configured to analyze the signals to determine a type of the manipulation and to determine whether to take an action responsive to the manipulation.

Abstract: A cell site includes a tower, a multi-service terminal mounted to the tower and a base transceiver station in communication with the multi-service terminal. The multi-service terminal includes a housing and a plurality of adapters mounted to the housing. Each of the adapters includes an outer port accessible from outside the housing and an inner port accessible from inside the housing.

Abstract: Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.

Abstract: An electro-optical assembly comprises a substrate having a support-surface, and a photonic integrated circuit (PIC) mounted with a contact surface on the support-surface. The (PIC) comprises an integrated optical waveguide structure defining at least two waveguide end faces, at an edge surface of the PIC, perpendicular to its contact surface, and forming optical ports. An optical coupling device, mounted with a contact surface on the support-surface, optically connects at least two optical fibers to the PIC and comprises an optical waveguide structure-defining at least two front waveguide end faces provided at a front edge surface thereof, perpendicular to its contact surface. The number of front waveguide end faces corresponds to the number of the waveguide end faces. The optical coupling device is positionable during an active positioning process to align the respective waveguide end faces. A method of manufacturing such an electro-optical assembly is also provided.

Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.

Abstract: A light-emitting row-type connection line assembly, which includes two connectors, a plurality of light-emitting lines, a plurality of connection lines and a plurality of light sources to make the plurality of light-emitting lines emit light. Each of the two connectors is provided with a plurality of ports for connecting the plurality of connection lines, and the plurality of ports are arranged spaced apart and in multiple rows. Each of the two connectors is provided with a light-emitting portion. The light-emitting portion is provided with a plurality of slots for connecting the plurality of light-emitting lines. The number of the plurality of slots is the same with that of ports in each row. A spacing between adjacent two slots is the same with that between adjacent two ports. The plurality of light-emitting lines are covered by a coating layer to form a light-emitting line row.

Abstract: A semiconductor device includes a semiconductor wafer chip, a semiconductor device layer, and a reflectance reducing layer. The semiconductor wafer chip includes a device region and a peripheral region around the device region. The peripheral region includes a plurality of voids aligned along a side surface of the semiconductor wafer chip at a predetermined depth from a first surface of the semiconductor wafer chip. The semiconductor device element layer is on the first surface in the device region. The reflectance reducing layer is on the first surface of the semiconductor wafer chip in the peripheral region, that reduces a reflection of laser light incident from a second surface of the semiconductor wafer chip.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for clock synchronizing an optical system and multiple leaf systems. In some implementations, an apparatus includes a receiver comprising: a local oscillator laser providing a local oscillator signal, a detector circuit operable to receive a first optical signal and detect first data carried by the first optical signal based on the local oscillator signal, a reference clock circuit supplying a clock signal, a digital signal processor (DSP) operable to receive the first data and supply a control signal to the reference clock circuit based on the first data, the reference clock circuit being operable to adjust the clock signal based on the control signal; and a transmitter operable to output a second optical signal carrying second data, the second data having an associated rate that is based on the clock signal.

Abstract: Accordingly, there are disclosed herein active cables and methods that enable direct connection between different generations of network interface ports or ports supporting different standards. One illustrative embodiment is an active 1:N breakout cable that includes a unary end connector connected by electrical conductors to each of multiple split end connectors. The unary end connector is adapted to fit into a network interface port of a primary host device to provide output PAM4 electrical signals that convey a multi-lane outbound data stream to the primary host device and to accept input PAM4 electrical signals that convey multi-lane inbound data stream from the primary host device.

Abstract: An alignment coupler is provided to facilitate active alignment of the optical bench to the optical connector. The optical bench and the coupler together form an optical bench based connector.

Abstract: Methods and systems for CWDM MUX/DEMUX designs for silicon photonics interposers are disclosed and may include an optical transceiver including a silicon photonics interposer, a polarization splitter, a lens array, and a prism with a coarse wavelength division multiplexing (CWDM) coating and a high reflectivity (HR) coating. The polarization splitter, lens array, and prism are coupled to the silicon photonics interposer. An input optical signal of a plurality of different wavelengths and polarizations may be received. Signals of different polarization may be spatially separated using the polarization splitter and signals of a first wavelength range may be reflected into the lens array using the CWDM coating while signals in a second wavelength range may be passed through. Signals of the second wavelength range may be reflected to the lens array using the HR coating, and optical signals may be coupled into the silicon photonics interposer using the lens array.

Abstract: An electronic device and a method for transmitting electromagnetic radiation are disclosed. The electronic device includes (a) a component carrier with a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; (b) a component embedded in the component carrier and configured for providing an electric radio frequency signal; (c) an antenna structure formed in the component carrier and configured for emitting electromagnetic radiation in response to receiving the provided electric radio frequency signal; and (d) a radiation lens formed in the component carrier and configured for spatially manipulating the emitted electromagnetic radiation and directing the spatially manipulated emitted electromagnetic radiation to an environment of the component carrier. Further described is an electronic device and a method for receiving electromagnetic radiation.

Abstract: A cable, a manufacturing method, and a communications method, employing preset transmit-side equalization to provide enhanced performance and/or to reduce receive-side equalization requirements. One illustrative cable embodiment includes: a first data recovery and re-modulation (DRR) device that exchanges inbound and outbound multi-lane data streams with a first host interface port via a first end connector plug; a second DRR device that exchanges inbound and outbound multi-lane data streams with a second host interface port via a second end connector plug; and electrical conductors connecting the first and second DRR devices to convey electrical transit signals therebetween. The first DRR device converts between said electrical transit signals and said inbound and outbound multi-lane data streams for the first host interface port, and the second DRR device converts between said electrical transit signals and said inbound and outbound multi-lane data streams for the second host interface port.

Abstract: A mobile device comprises a plurality of transmitters and receivers, each configured for optical wireless communication, wherein the plurality of transmitters and/or receivers are arranged on at least three surfaces of the mobile device such that each of the three surfaces has a respective at least one of the transmitters and/or each of the three surfaces has a respective at least one of the receivers.

Abstract: An electrical harness including at least one upstream connector arranged to be electrically connected to a computer, at least one downstream connector arranged to be connected to a complementary connector of an electromechanical actuator, and at least one electric wire electrically connecting the upstream connector and the downstream connector, the electric wire configured such that primary digital control signals produced or transferred by the computer travel over the electric wire via the upstream connector. The electrical harness may also include an electronic unit integrated in the electrical harness, the electronic unit configured to transform the primary digital control signals into analog control signals and to transmit the analog control signals to the electromechanical actuator via the downstream connector.

Abstract: An optical transceiver comprises an optical port, paired transmitter optical sub-assemblies (TOSAs), paired receiver optical sub-assemblies (ROSAs) and a printed circuit board (PCB) including an electrical circuit electrically connected to the paired TOSAs and the paired ROSAs. And the optical transceiver comprises a housing configured to house the optical port, the paired ROSAs, the paired TOSAs, and the PCB, so that the paired ROSAs are arranged between the optical port and the PCB in the first direction and the paired TOSAs are arranged between the paired ROSAs and the PCB in the first direction.

Abstract: An optical interconnect device may include a multi-fiber connector at a first end of the optical interconnect device. The optical interconnect device may include an edge coupled connector at a second end of the optical interconnect device. The optical interconnect device may include a plurality of optical fibers disposed inside the multi-fiber connector and the edge coupled connector to optically couple the multi-fiber connector to the edge coupled connector, wherein the multi-fiber connector and the edge coupled connector rigidly interconnect to structurally support the optical interconnect device.

Abstract: An optical connector according to the present disclosure includes: optical transmission paths that have end faces aligned in a predetermined region, and transmit optical signals. The optical transmission paths correspond to transmission channels or reception channels. The optical transmission paths of the transmission channels and the reception channels are arranged to have point symmetry about a center of the predetermined region. This configuration allows for a connection even if a direction of an optical connector is changed.

Abstract: One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.

Abstract: A transfer control apparatus transfers video data obtained by image capturing in an image capturing and displaying apparatus to an image processing apparatus, and transfers video data generated by the image processing apparatus to the image capturing and displaying apparatus. In the transfer control apparatus, a first converter outputs an optical signal converted from an electrical signal representing the video data, an optical fiber transfers the optical signal, a second converter outputs an electrical signal converted from the optical signal transferred by the optical fiber, and a metal wire transfers a control signal indicating whether it is possible to communicate the video data by a communication unit of the image capturing and displaying apparatus. Operations of the first and second converters are controlled based on the control signal.

Abstract: A fiber optic cassette includes a housing with a base and a cover. The base defines an open front between first and second sidewalls, which transition into first and second curved rear wall portions. The first and second curved rear wall portions define an adapter mount therebetween forming at least one pocket. A signal entry location defined by at least one MPO adapter is positioned within the pocket and defines an exterior port and an interior port. A fiber optic cable connectorized by an MPO format connector is mated to the exterior port. An adapter block defining a plurality of second fiber optic adapters is mounted to the base via a first snap-fit interlock to close the open front, each second fiber optic adapter including an exterior port and an interior port.

Abstract: A transceiver printed circuit board (PCB) includes an integrated circuit (IC) with at least two different functionality, a photodiode and a laser. The IC has a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side. The photodiode and the laser are both located in a first space beside the first side. The functionality of a transimpedance amplifier, a laser driver, and a clock and data recovery is integrated into the IC.

Abstract: Provided is a patch panel, comprising: a circuit board; and an SFP, SFP+, or QSFP+ connector connected to a plurality of radio frequency coaxial (RF coaxial) connections via conductive traces of the circuit board, the RF coaxial connections configured to extend functionality of the SFP, SFP+, or QSFP+ socket of a computing device coupled to the patch panel from a rear end of the computing device to a front end of the computing device.

Abstract: An optical connection member is used for optical connection of a plurality of optical fibers, the optical connection member including: an end surface facing another optical connection member at the time of the optical connection; and a holding portion holding the plurality of optical fibers, wherein the holding portion is provided with a plurality of holding holes which are opened in the end surface, extend from the end surface in a first direction intersecting with the end surface, and hold the plurality of optical fibers, the end surface includes a first area, a second area, and a third area which are sequentially arranged along a second direction intersecting with the first direction, openings of the plurality of holding holes are arranged in a row in the second direction in the first area and the third area.

Abstract: An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.

Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.

Abstract: An electrical connector assembly includes an electrical connector mounted upon a printed circuit board, and a heat sink fastening seat mounted upon the printed circuit board and beside the connector. The heat sink fastening seat includes a pair of metallic mounting bars spaced from each other and located by two lateral sides of the connector in the transverse direction. A pair of alignment posts are formed on the corresponding mounting bars, respectively. A pair of metallic spring blades are respectively, in the vertical direction, aligned with and mounted upon the corresponding mounting bars for cooperation with the corresponding components of the heat sink for fastening.

Abstract: The following steps are provided: encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to the series of connector components in the row direction using a first resin member; dicing the multiple connector components on the support member encapsulated using the first resin member into row units in the row direction; molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; and dicing off the multiple molded connector components on the support member in the column direction one by one.

Abstract: The following steps are provided: encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to the series of connector components in the row direction using a first resin member; dicing the multiple connector components on the support member encapsulated using the first resin member into row units in the row direction; molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; and dicing off the multiple molded connector components on the support member in the column direction one by one.

Abstract: An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.

Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

Abstract: This optical receptacle is provided with: an optical receptacle main body provided with a plurality of first optical surfaces and a plurality of second optical surfaces; and an optical filter. Light emitted from a photoelectric conversion element becomes incident on the first optical surfaces. The second optical surfaces allow light which becomes incident on the first optical surfaces, and passes through the inside, to exit towards an end surface of an optical transmission body. The optical filter is disposed so as to face some of the plurality of second optical surfaces, and attenuates the amount of light from the facing second optical surfaces. The optical filter is disposed with respect to at least one of the one or more second optical surfaces facing the optical filter, such that positional deviation between the first optical surfaces and the second optical surfaces is taken into consideration.

Abstract: In an optical module including an optical axis adjustment mechanism, the reliability of fixation of a movable portion is enhanced while an adhesive is prevented from flowing out to an unintended portion. An optical module includes an element portion, a manipulation lever, a bank, a support spring, and a reservoir portion. The bank includes a lever-opposing portion having a step face facing a longitudinal side face of the manipulation lever. The support spring is connected at both ends to the element portion and the bank. The reservoir portion is surrounded in a bay shape, in a plan view, by the manipulation lever, the element portion, the support spring, and the bank and stores the adhesive fixing the lever to the substrate. The reservoir portion includes, in the vicinity of a handle of the manipulation lever, an outflow blocking portion blocking the outflow of the adhesive before curing.

Abstract: A method of adjusting the parallelism of a surface of a block of optical fibers with a surface of a semiconductor chip or wafer laid on an XY table, including the steps of: a) providing a sensor rigidly attached to the XY table and a handling arm supporting the block, said surface facing the XY table; b) for each of three non-aligned points of the surface of the block, displacing with respect to each other the XY table and the block in the X and/or Y directions to place the sensor opposite the point, and estimating, with the sensor, the distance along the Z direction between the point and the sensor; and c) modifying the orientation of the block by means of the handling arm to provide the desired parallelism.

Abstract: A co-frequency full-duplex antenna structure includes a receiving antenna, a transmitting antenna for transmitting a signal of a predetermined wavelength, and a signal reflection apparatus for reflecting the signal transmitted by the transmitting antenna, so as to realize that a path difference between a reflected signal formed when the signal transmitted by the transmitting antenna reaches the receiving antenna after being reflected and a direct signal formed when the signal transmitted by the transmitting antenna directly reaches the receiving antenna is an odd number of times as much as one half of the predetermined wavelength.