Abstract: A new fiber optic ferrule has an alignment structure on a surface through which light passes. The alignment structure is preferably in the shape of a dog bone, allowing the alignment structure to align the fiber optic ferrule in a receptacle while reducing the influence of temperature on the alignment.

Abstract: An OSFP optical transceiver having split multiple fiber optical port using reduced amount of MPO terminations is provided that includes two adjacent sockets integrated into the optical port of the OSFP optical transceiver. The two adjacent sockets are vertically oriented with respect to the mounting baseplate of the OSFP optical transceiver, and each of the two adjacent sockets is adapted to receive an MPO receptacle that terminates the proximal end of a bundle of fibers. The OSFP optical transceiver also includes an optical connection between each socket and a corresponding lens in the OSFP optical transceiver, for transmitting optical signals received from other transceivers into the OSFP optical transceiver and optical signals generated in the OSFP optical transceiver to other transceivers.

Abstract: A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.

Abstract: A light module for illuminating an outer component of a vehicle, including: a housing for fastening the light module to the vehicle; a cover mounted on the housing; an inner space delimited between the housing and the cover; a printed circuit board in the inner space; a light source on the printed circuit board and configured for emitting an illumination beam-; and a light guide in the housing facing the light source and extending outside the inner space for guiding the illumination beam along the outer component. The light guide includes an optical fiber extending outside the inner space and a lens positioned between the light source and an entry opening of the optical fiber, such that the illumination beam emitted by the light source is focalized toward the entry opening of the optical fiber. A process for manufacturing such light module is also described.

Abstract: In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6).

Abstract: To provide an optical connector which enables suppression of crosstalk, an optical connector includes a housing, an optic transceiver and a lens body, wherein the lens body includes a light emitting side lens section configured to be interposed between a light emitting element and one optical fiber of a partner optical connector, a light receiving side lens section configured to be interposed between a light receiving element and another optical fiber of the partner optical connector, and a light receiving side lens surrounding section in an integrated manner. A light shield section is formed in the lens body, the light shield section being configured to suppress a portion of light emitted from the light emitting element which enters the light receiving element via the lens body. The light receiving side lens surrounding section is configured to be transparent at an end facing the partner optical connector.

Abstract: An optical ferrule includes at least one light affecting element configured to affect one or more characteristics of light from an optical waveguide as the light propagates in the optical ferrule, the light affecting element having an input surface. At least one receiving element receives and secures the optical waveguide to the ferrule so that an output surface of the waveguide is optically coupled to the input surface of the light affecting element. A waveguide stop limits movement of the waveguide toward the input surface of the light affecting element when the optical waveguide is installed in the receiving element. A space between the output surface of the optical waveguide and the input surface of the light affecting element is inaccessible to the optical waveguide when the optical waveguide is installed in the receiving element.

Abstract: A housing-attachable (HA) optical connector is removably attached to a housing that is initially designed for an electrical interface with a base electrical connector on a system board. An optical fiber terminates at one end to a chip optical connector and terminates at another end to the HA optical connector. The HA optical connector is positioned with respect to the housing such that when a portion of the printed circuit board of a removable module extending outside the housing comes into contact with a base electrical connector on a system board, the HA optical connector blind mates with a base-attachable (BA) optical connector on the system board. In this manner, electrical connectivity and optical connectivity are provided between the removable module and the system board.

Abstract: A method for designing a high-speed multichannel optical module. Components in an optical module are classified into a circuit part and an optical path part according to functions, and the circuit part and the optical path part are separately processed and then assembled to be an optical module. Thus, modular production is implemented, and multiple parts can be processed at the same time, thereby improving the production efficiency. Moreover, if any fault occurs to either of the parts, the part can be independently replaced and maintained, thereby preventing the entire optical module from being scrapped, facilitating control of the production costs, and improving the yield rate. Also disclosed in the present invention is a high-speed multichannel optical module, which is manufactured according to the design method above. The high-speed multichannel optical module employs a modular structure, and comprises a circuit part and an optical path part which are electrically connected.

Abstract: The present disclosure provides a TO-CAN cap. The TO-CAN cap includes a casing, the casing has a hollow cylindrical structure, and an inner wall of the casing has a protrusion portion at a first end portion in an axial direction of the casing; and an optical lens, the optical lens has an optical portion for refracting light and a rib portion at a periphery of the optical portion, a side surface of the rib portion having a concave portion complementary to the protrusion portion, where the casing and the optical lens are connected to each other through the protrusion portion and the concave portion.

Abstract: A test device configured to test a photonic integrated circuit (IC) is provided. The photonic IC includes at least one waveguide edge coupler, and the test device includes an optical coupler. The optical coupler is configured to be optically aligned with the photonic IC, and includes at least one focusing lens and a first reflector. The at least one focusing lens is aligned with the at least one waveguide edge coupler. A light from the waveguide edge coupler is focused by the focusing lens, reflected by the first reflector, and transmitted to a fiber connector in sequence, or a light from the fiber connector is reflected by the first reflector and focused onto the waveguide edge coupler by the focusing lens in sequence. A heterogeneously integrated structure is also provided.

Abstract: The present application provides an optical module, including a laser, a laser driving chip, and a lens component disposed above the laser and the laser driving chip, where an inner cavity wall of the lens component that faces towards the laser and the laser driving chip is provided with a transmitting lens; a surface of the transmitting lens and the inner cavity wall around the transmitting lens are coated with a reflective film; and there is no reflective film coated on a part or entire of a region, of the inner cavity wall of the lens unit, which is irradiated by a secondarily reflected laser light.

Abstract: A system includes a first free-air optical interconnect of a first electrical component, the first free-air optical interconnect configured to mechanically couple to a second free-air optical interconnect of a second electrical component to communicate optical signals between the first and second electrical components. When coupled, an attach mechanism of the first free-air optical interconnect can retain the second free-air optical interconnect a fixed distance from the communication interface of the first free-air communication interface, including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of a laser emitter configured to transmit laser energy across an air gap to a separate device, or a photodiode configured to detect laser energy received across the air gap from the separate device.

Abstract: A laser device includes: a plurality of collimating lenses collimate light emitted from the plurality of light sources; a plurality of holders each hold a pair of light sources and the collimating lens and which adjust emission positions and emission angles of the collimated light of the collimating lenses; a housing which holds the plurality of holders; a light condensing part which condenses each of the collimated light whose emission position and emission angle are adjusted; a heat exhausting member which exhausts heat generated from the plurality of light sources; and a heat transfer member which is disposed between the heat exhausting surfaces of the light sources and a heat absorbing surface of the heat exhausting member, includes an elastic part abutting against the heat exhausting surfaces and the heat absorbing surface, has heat conductivity, and transfers the heat from the heat exhausting surfaces to the heat absorbing surface.

Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axi

Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Abstract: Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.

Abstract: An electrical receptacle connector includes a insulated block, first receptacle terminals, second receptacle terminals, an insulated housing, and a metallic shell. A first surface of the insulated block includes a plurality of first engaging grooves for holding the first receptacle terminals, and a second surface of the insulated block includes a plurality second engaging grooves. Accordingly, when the insulated block is formed in a first molding procedure, the first receptacle terminals and the second receptacle terminals are respectively positioned on the insulated block. Next, a second molding procedure is applied to form the insulated housing out of the insulated block. Therefore, the difficulties in manufacturing the components of the connector and the cost for manufacturing the connector can be reduced, while the manufacturing efficiency of the connector can be improved.

Abstract: Provided are an optical alignment device applied to an assembly process of an optical transmitter and an optical receiver that include multi-channel optical elements and optical waveguide elements for optical communication, and an optical alignment method thereof. The optical alignment device includes an element fixing case with a mounting space formed thereinside and an element insertion hole communicating with the mounting space formed at an upper side thereof, and a light source mounted in the mounting space of the element fixing case and configured to emit light toward a lower side of an optical element or an optical waveguide element which is inserted into the element insertion hole to check a position of a core.

Abstract: A ferrule for an optical fiber connector has an external surface for alignment with a complementary surface of an alignment sleeve (i.e., the inside surface of a generally cylindrical or tubular sleeve). The external surface of the ferrule is generally cylindrical, having a sectional contact surface profile that is generally oval in shape. More specifically, a plurality of points of contact between the ferrule and the sleeve are defined along a curve in cross-section, wherein the center of curvature at each of the contact points along this contact point curve (i.e., the curve containing contact points that contribute to alignment) does not lie in the plane of the axis of the array of optical fibers.

Abstract: The invention relates to an optical transmitter assembly (OTA) for vertical coupling of light into a chip, and to a method for manufacturing the OTA. The OTA includes a laser diode, a microlens and a turning mirror mounted at a top face of a supporting substrate within a sealed enclosure, and an optical component, such as an optical isolator, a polarizer, or a microlens disposed in a substrate cavity that opens to the back face of the substrate. The optical component may be placed into the cavity after the enclosure is sealed.

Abstract: A modified MT fiber optic ferrule has optical fiber receiving holes by the front end to receive the ends of optical fibers inserted into and through the ferrule. The optical fiber receiving holes are aligned with optical fiber openings in the center of the ferrule and have lenses formed in the optical fiber receiving holes to collimate from or focus light into the optical fibers in the fiber optic ferrules. The front end of the fiber optic ferrule may also have integral mating surfaces.

Abstract: A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.

Abstract: A multi-channel laser device with a fiber array includes a housing and a ferrule. In the housing, laser components are arranged side by side, and each of the laser components is connected to a fiber array module through an optical isolator. The fiber array module includes thermal expanded fibers, and fibers out of the fiber array module are collected by the ferrule. The laser components are disposed on the same module board, and laser light radiated from the front end of a laser chip in each of the laser components is projected onto the optical isolator through a convex lens and then enters into the thermal expanded fiber. Such a structure may reach a relatively-high coupling efficiency and implement the coupling of arrayed laser components.

Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.

Abstract: A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic component mounted in the substrate, a cover mounted on the substrate and having a light-receiving chip disposed above the light-receiving hole, and a lens fixedly mounted in the light-receiving hole of the cover. Thus, the optical module integrated package not only have the chip and the electronic component integrated therein to reduce the packaging cost and to improve the yield but also provide a light filtering, focusing or diffusing effect to enhance optical recognition accuracy.

Abstract: A connectorized optical chip assembly connectable to an external optical fiber having a fiber connector is provided. The connectorized optical chip assembly includes a substrate, an optical chip having an on-chip optical waveguide and a connectorized interface. The connectorized interface includes an optical coupling element mounted in optical alignment with the on-chip optical waveguide. The connectorized interface includes a chip connector engaging the optical coupling element and configured for mating with the fiber connector of the external optical fiber, so as to provide an optical coupling of light between the optical coupling element and the external optical fiber. The connectorized optical chip assembly also includes a mechanical support structure supporting the connectorized interface onto the substrate. Preferably, the components of the connectorized optical assembly are made of materials heat resistant to temperatures used to melt solder in surface mount processes.

Abstract: A light-emitting device package and a lighting apparatus including the light-emitting device package are provided. The light-emitting device package may include a body, a light-emitting device provided on the body, a phosphor layer provided on the body and the light-emitting device, and a lens provided on the phosphor layer that refracts and reflects light discharged from the light-emitting device and having a lens body. The lens body may include a side portion, a recess having a curved surface and provided at a center of an upper surface of the lens body, and an edge portion having a convex rounded shape and provided between the recess and the side portion.

Abstract: An optical module-member is provided, including: a layer-shaped optical waveguide; a light-emitting unit substrate including an insulating substrate, light-emitting element-mounting portions where light-emitting elements are configured to be mounted so as to be optically connected to the optical waveguide, and driving element-mounting portions which are electrically connected to the light-emitting element-mounting portions where driving elements for driving the light-emitting elements are configured to be mounted; and a light-receiving unit substrate which is separated from the light-emitting unit substrate, the light-receiving unit substrate including: an insulating substrate, light-receiving element-mounting portions where light-receiving elements are configured to be mounted so as to be optically connected to the optical waveguide, and signal amplification element-mounting portions which are electrically connected to the light-receiving element-mounting portions and where signal amplification elements for

Abstract: Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.

Abstract: The embodiments of the present disclosure disclose an optical module, comprising a housing, an adaptor and an optical sub-module being provided inside the housing, the adaptor being fixed with the optical sub-module, wherein an optical port component is also provided inside the housing, the optical port component is located at one side of the adaptor far away from the optical sub-module, and an opening is formed at one end of the optical port component far away from the adaptor; a through hole for the optical port component is formed on an end surface of the optical port component close to the adaptor, the adaptor can pass through the through hole for the optical port component to be fixed with the optical port component, and an optical fiber can be inserted into the adaptor from the opening.

Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.

Abstract: An adapter panel arrangement including a chassis and a panel of adapters. The adapters defining open rearward cable connections and open forward cable connections of the panel arrangement. The adapters being arranged in arrays that slide independently of other adapter arrays to provide access to the open rearward and open forward cable connections.

Abstract: The method comprises: detecting the positions (uo, vo) and (u1, v1) of said photonic beam (L) according to the coordinate axes X, Y on a first and second plane XY, which cut an optical axis X at a first and second point, respectively; comparing the results of said positional detections (uo, vo) and (u1, v1), and: if there are discrepancies which lie outside the margin of error (p), adjusting the angle of the photonic beam (L) according to the angle ? and/or the angle ? in order to overcome said discrepancies; or if there are no discrepancies which lie outside said margin of error (p), considering the angle of said photonic beam (L) as being properly adjusted. The system is adapted to implement the method set out by the invention.

Abstract: A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.

Abstract: There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.

Abstract: A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic component mounted in the substrate, a cover mounted on the substrate and having a light-receiving chip disposed above the light-receiving hole, and a lens fixedly mounted in the light-receiving hole of the cover. Thus, the optical module integrated package not only have the chip and the electronic component integrated therein to reduce the packaging cost and to improve the yield but also provide a light filtering, focusing or diffusing effect to enhance optical recognition accuracy.

Abstract: An optical connector (1) for transferring light sent by fibers (2) and comprises a resin body (10) and a plurality of first lenses (11) and second lenses (12), the resin body (10) includes a bottom surface (102), a top surface (101) opposite to the bottom surface (102), a front surface (103) connecting the top surface (101) and the bottom surface (102), a first slant surface (106) and a second slant surface (105) form an angle with the bottom surface (102), the first lenses (11) are set on the first slant surface (106), the second lenses (121) are set on the second slant surface (105), the projections of the first lenses (11) and second lenses (12) that projected on the bottom surface (102) are not aligned with each other.

Abstract: A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.

Abstract: The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.

Abstract: A BOSA package comprising only one cylindrical TO package comprising a ROSA and a TOSA, and an optical port in optical communication with the ROSA and the TOSA. Also disclosed is a TO package comprising a TOSA for transmitting a first optical signal, a ROSA for receiving a second optical signal, an optical communication window, and a TFF positioned such that the first optical signal transmitted from the TOSA is reflected by the TFF toward the optical communication window and the second optical signal received from the optical communication window passes through the TFF and to the ROSA.

Abstract: An optical fiber attaching section, a photoelectric conversion device attaching section, and a lens are integrally formed by a light-transmitting resin material. The optical fiber attaching section is formed concentrically with an optical axis OA of the lens. A contact surface for the photoelectric conversion device in the photoelectric conversion device attaching section is formed having a tilt in relation to a plane that is perpendicular to the optical axis OA. As the photoelectric conversion device, a photoelectric conversion device is attached in which a contact surface for the photoelectric conversion device attaching section is formed in parallel with a light-receiving surface of a light-receiving element.

Abstract: Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses and an array of optical fiber ferrules held into alignment by a lens holder sub-assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub-assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror or prism used to direct light into the lens holder sub-assembly.

Abstract: An optical connector includes a printed circuit board, at least one emitter, at least one receiver, a coupler, and a number of positioning poles. The printed circuit board includes an assembling surface defining a number of first positioning recesses therein. The emitter and the receiver are electrically connected to the assembling surface of the printed circuit board. The coupler includes a bottom surface facing toward to the printed circuit board and at least two first lenses corresponding to the emitter and the receiver. The coupler defining a number of second positioning recesses in the bottom surface corresponding to the first positioning recesses. The positioning poles are positioned between the printed circuit board and the coupler, with one end of each positioning pole inserting and being fixed into a first positioning recess and the other end of each positioning pole inserting and being fixed into a second positioning recess.

Abstract: An optical receptacle includes a cylindrical optical fiber attaching section for attaching an end portion of an optical fiber by insertion; a cylindrical photoelectric conversion device attaching section that includes an inner circumferential surface into which a photoelectric conversion device having a light-receiving element is inserted and for attaching the photoelectric conversion device with an adhesive that is interposed within an annular adhesion space; and a lens for optically coupling the end portion of the optical fiber and the light-emitting element, and the lens is a Fresnel lens in which a second face that faces the light-receiving element includes a convex face.

Abstract: A fiber connector includes a case, a light emitting element, and a fiber. The case includes a lower seat and a fiber receiving portion connected to one end of the lower seat. The lower seat defines a receiving recess with an end surface. An optical coupling portion protrudes downward from the end surface. The fiber receiving portion defines a blind hole. The light emitting element is received in the receiving recess and faces the optical coupling portion. The fiber is received in the blind hole. Light rays emitted from the light emitting element are converged to the fiber by the optical coupling portion.

Abstract: A light-receiving package for flat-plate mounting which can make monitor reception sensitivity of an optical signal constant without increasing the size of a module.

Abstract: The present invention provides a plug for mounting on at least one cable having at least one optical conductor, the plug comprising a body and including at least one optoelectronic converter provided with connection means arranged inside the body in a manner that is removable and interchangeable.

Abstract: A photoelectric conversion device includes a circuit board, a light emitting module, a light receiving module, and an optical coupling lens. The circuit board includes two protrusions apart from each other. The light emitting module and the light receiving module are mounted on the circuit board and are apart from each other. The optical coupling lens includes a light incident surface, a first converging lens, a second converging lens and two through holes are defined therein for locating purposes. The first converging lens and the second converging lens are formed on the light incident surface. Centers of the through holes are aligned with centers of the protrusions to ensure the perfect alignment of the light emitting module with the first converging lens, and the perfect alignment of the light receiving module with the second converging lens.