Abstract: Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

Abstract: The invention relates to an optical connector arrangement wherein the connector and the converter are connected by short plastic fiber sections. The aim of the invention is to provide one such connector arrangement which can be produced in a simple and cost-effective manner, can be easily and economically mounted on a circuit carrier and reliably and efficiently soldered to the conductors thereof, enables a modular assembly, and is at least partially heat-resistant during the assembly in such a way that, for example, a vibration-resistant reflow soldering can be carried out. To this end, the fiber sections are connected to a double ferrule which is fixed to the converters by means of a clamp. A false cover can be used for the transport and soldering.

Abstract: An optical transmission connector comprises a holder unit, a shutter mechanism unit for opening and closing an optical plug housing unit for housing an optical plug, an element housing unit for housing a photoelectric effect element, and a fixing metal plate for fixing the holder unit to a mounting board. The fixing metal plate has a fixing terminal unit which is butted and engaged with a side portion of the holder unit, and is protruded from a bottom portion of the holder unit at an appropriate position, so that the fixing terminal unit can be fitted into the mounting board. A bent portion is formed in the fixing terminal unit in a length direction thereof. The fixing metal plate has a positioning concave portion, corresponding to a positioning convex portion, and is in a shape which is fitted into a fitting slit.

Abstract: An optical module includes: an optical element; a support member for supporting the optical element; a lid member that seals the optical element with respect to the support member; a sealing member that is provided to bond the lid member with the supporting member; and a case with a lens provided such that the lens is disposed on an optical path of light oscillated by the optical element, wherein the case with the lens is opposed in an optical axis direction of light passing through the lens to and in contact with the supporting member.

Abstract: Optical components are aligned within an optoelectronic device using a composite adhesive material. An optical subassembly of the optoelectronic device includes a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance. The spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

Abstract: An optical channel monitor assembly for simultaneously measuring the optical power levels of multiple series of dense wavelength division multiplexed channels or the like traveling on separate optical fibers in an optical communications system includes an arrayed waveguide grating router having a first side and a second side, the first side including a first plurality of ports and the second side including a second plurality of ports, the first plurality of ports in optical communication with the second plurality of ports, wherein the first side includes a first input port for collectively receiving a first series of optical channels, wherein the second side includes a first plurality of output ports for individually delivering the first series of optical channels, wherein the second side includes a second input port for collectively receiving a second series of optical channels, and wherein the first side includes a second plurality of output ports for individually delivering the second series of optical cha

Abstract: An opto-electronic device comprising opto-electronic circuitry on a lead-frame and an optical guide receptacle for receiving an optical guide coupler, the opto-electronic circuitry comprises signal conversion means whereby an optical signal can be converted into an electrical signal or vice versa, the optical guide receptacle comprises means for guiding reception of an optical guide coupler whereby an optical guide coupler is optically aligned with the signal conversion means when received by said optical guide receptacle.

Abstract: An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., ?40° C.?+85° C.).

Abstract: The present invention is to provide an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver of the invention comprises upper and lower housings (11, 12), a holder (81), optical assemblies (51, 61), a cover (14), a substrate (15) and a grip (13). The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate exposes outside the transceiver, the shield gasket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

Abstract: Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.

Abstract: An electronic device comprises a hollow housing defining an enclosed cavity therewithin, an electronic unit disposed within the cavity, and a potting compound filling the cavity in the housing and encapsulating at least one electronic component of the electronic unit. The potting material has a compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi. A method for manufacturing the electronic device comprises the steps of: providing the housing with the enclosed cavity therewithin, inserting the electronic unit into the cavity, providing the potting material, and introducing the potting material into the cavity so that a space around the electronic unit is filled with the potting material to encapsulate the electronic unit.

Abstract: An optoelectronic device having a hermetically sealed optoelectronic component and to a method of forming the device, which may for example be an optical transmitter or receiver device for use in a fiber optic communications network. The optoelectronic device comprises a first sub-assembly and a second sub-assembly, the first sub-assembly comprising at least one optoelectronic component. The optoelectronic component is optically aligned with the at least one optical element along an optical axis to form a housing for the optoelectronic component, the sub-assemblies being joined by at least two joins across the interface including at least one non-hermetic join and separate from the non-hermetic join(s) a hermetic join that extends fully around the optical axis to seal hermitically the optoelectronic component within the housing.

Abstract: A structure that possesses the combined properties of carrying signals through the provision of a series of electrical conductors, and by optical signals through the intermediary of a series of optical waveguides. This imparts a particular advantage thereto for the fabrication of optical data links, providing a convenient, compact method of interconnecting electrical paths to transducer chips and to waveguide structures. This approach solves the problem of connecting polymer waveguides to VCSEL (Vertical-Cavity-Surface-Emitting Laser) arrays, thereby avoiding the problem of damaging fragile wire bonds. A method is also provided which utilizes the foregoing structure.

Abstract: The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

Abstract: A bi-directional transmitting and receiving device for the connection of optical fiber is mainly to apply one side of a T shape shell to connect an optical fiber, while another side of the shell in line with the optical fiber is arranged an optical transmitter, with an optical receiver being arranged at the third side of the shell, wherein the optical transmitter is a packaging structure of Transistor Outline can (TO-can) having a cup shape lid, of which underside is inclined 45 degrees to transmitted light beam, and wherein a hollow window in the underside of the lid is arranged a light splitting filter, which is just positioned at the beam path of the optical receiver.

Abstract: An optical module has plural optical units each having an optical communication device that performs conversion between an electrical signal and an optical signal, and a socket that the optical communication device is fitted in. The optical units are aligned and detachably connected to each other by a part of the socket in contact with the socket of the adjacent optical unit.

Abstract: A board-mounted optical connector is provided which enables high-density wiring of optical fibers on a board. The board-mounted optical connector is a board-mounted optical connector having a housing comprising: a first housing component, and a second housing component. The first housing component has a housing space accessible through an opening formed in at least a portion of a side wall and houses portions of optical fiber members that are partially laid along the top surface of a board and are bent at nearly right angle to the board together with an optical component connected to the optical fiber members in the housing space through the opening. The second housing component is attached to the first housing component and can close the opening of the housing space with the portions of the optical fiber members and the optical component connected to the optical fiber members housed in the first housing component.

Abstract: The present invention is to provide an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver of the invention comprises upper and lower housings (11, 12), a holder (81), optical assemblies (51, 61), a cover (14), a substrate (15) and a grip (13). The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate exposes outside the transceiver, the shield bracket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

Abstract: The present invention generally relates to an air cavity plastic package for a high frequency optical device. In one aspect, a module package for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing having an upper cavity formed therein and a lower plastic housing having a lower cavity formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors disposed in the lower housing, each conductor having an upper end and a lower end, wherein the upper end is connectable to a chip disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided.

Abstract: An optical module including: a housing formed of ceramics and having a base portion and a frame portion provided on the base portion; an optical element provided inside the frame portion; a cover member for the housing, the cover member being formed of a transparent substrate; and a connector with a lens provided so that the lens is disposed above the housing. The optical module may include a sealing member for bonding the housing and the cover member.

Abstract: Optoelectronic packages with one or more feed-throughs having a cutout allow optical fibers that have been coupled to a component (e.g., an optical component, an electrical component, a structural component) to be fed through more easily than a package having feed-throughs without a cutout. In one embodiment, the cut in the feed-through is on the opposite side of the initial direction of the threading. That is, if the fiber is to come from above the feed-through, the cut is placed on the bottom of the feed-through. The placement of the cut on the feed-through allows a fiber previously attached to a component to be fed through without excessive curvature of the fiber.

Abstract: An exemplary embodiment provides for a cable connection apparatus wherein a connector is mounted on a disk drive chassis, or a sub-assembly attachable to a chassis, such that a cable that connects to the connector will do so along an axis parallel to the chassis or subassembly that the connector is coupled to as opposed to a more typical perpendicular coupling. As a result, the cable will not stick straight out from the back of the drive and the drive footprint is also reduced.

Abstract: A bidirectional transmitting and receiving device for the connection of optical fiber is mainly to apply one side of a T shape shell to connect an optical fiber, while another side of the shell in line with the optical fiber is arranged an optical transmitter, with an optical receiver being arranged at the third side of the shell, wherein the optical transmitter is a packaging structure of Transistor Outline can (TO-can) having a cup shape lid, of which underside is inclined 45 degrees to transmitted light beam, and wherein a hollow window in the underside of the lid is arranged a light splitting filter, which is just positioned at the beam path of the optical receiver.

Abstract: An optical power monitor having a reduced number of component parts, easy to assemble, capable of facilitating positioning for achieving improved optical coupling, and having a reduced size and a reduced manufacturing cost. A pigtail fiber in which the center axis of an optical fiber is shifted from the center axis of the columnar capillary by 0.020 to 0.150 mm is used. The pigtail fiber and a photo diode are provided in a cylindrical tube with the pigtail fiber center axis and the photo diode center axis aligned with each other. The pigtail fiber and the photo diode can be adjusted to the optimum position in the cylindrical tube by adjustment in the longitudinal direction, thus advantageously simplifying the adjustment process in comparison with that in the conventional optical power monitor in which adjustments by movement in the radial direction, movement in the longitudinal direction and rotation about the center axis are made.

Abstract: An optical transceiver has: an optical subassembly that has a built-in chip portion and a receptacle portion; a board electrically connected to one end of the built-in chip portion; a housing that houses the optical subassembly and the board; and a holding member to hold the optical subassembly.

Abstract: A semiconductor laser module includes a laser holder, a semiconductor laser, a sleeve, an optical fiber, an annular member, and a flexible member. The laser holder has an end portion and is formed with a through-hole opened on the end portion. The semiconductor laser is provided on the laser holder and has a light-emitting portion for emitting a laser beam passing through the through-hole. The sleeve is fixed to the end portion so as to block the through-hole and is formed with an insertion hole. The optical fiber is disposed in the insertion hole and has an incident face. The laser beam is capable of entering the incident face. The annular member is provided on the end portion of the laser holder to encircle outside of the sleeve to be separated from the sleeve with a space between the annular member and the sleeve. The flexible member is affixed to the sleeve and the annular member for covering the space.

Abstract: The invention relates to an optoelectronic module for optical signals of two optical data channels for arrangement on a main circuit board of an assembly, having a housing, which has an underside for arrangement of the optoelectronic module on a main circuit board. The arrangement further includes a printed circuit board arranged in the housing, having a first optical coupling region and a second optical coupling region for the coupling of optical waveguides, wherein the first and second coupling regions are arranged on the printed circuit board. The first optical coupling region is arranged at a smaller distance from the underside of the housing than the second optical coupling region. The invention achieves an efficient utilization of the end area of an assembly.

Abstract: A monolithic cable assembly includes a communication cable and cable connectors coupled to either end of the communication cable. The communication cable includes at least one optical communication channel. The cable connectors include a physical end connector for electrically coupling to a data device connector, optoelectronic components for converting data signals between an electrical realm and an optical realm, and a passively aligned integrated lens cover. The integrated lens cover includes at least one optical pathway for coupling optical data signals between the at least one optical communication channel and the optoelectronic components.

Abstract: A method of assembling an optical device comprising an optical ferrule (1) is provided, according to which said one optical ferrule (1) is secured to a first substrate (3) so as to form an optical subassembly (13); the method further comprises providing a second substrate (9) comprising a main surface (9a) and at least one groove (9b) extending from said main surface to a predefined depth and securing said optical subassembly (13) to said second substrate (9) in such a way that said at least one optical ferrule (1) is at least partially received into said at least one groove (9b). There is further provided an optical device assembled according to this method.

Abstract: A multimedia patching box including a generally rectangular housing. The housing includes a first wall positioned opposite from a second wall. The housing also includes opposing third and fourth walls that extend between the first and second walls. A panel is mounted adjacent the front of the housing. The panel is mounted to pivot about a pivot axis between an open position and a closed position. The pivot axis is located adjacent to the third wall of the housing and extends generally along the third wall of the housing. A plurality of multimedia connectors are mounted on the panel. The housing defines at least one cable access opening defined through at least one of the first and second walls at a location adjacent the third wall. A cable management structure is connected to the back side of the panel. The cable management structure defines a cable guiding channel that extends generally along the pivot axis of the panel and generally aligns with the at least one cable access opening.

Abstract: An optical transmission device configured from a case that holds an optical element that receives and/or transmits light, the case being provided with a plug insertion hole into which a plug for transmitting an optical signal is inserted; and a shutter mechanism having a shutter that opens and closes the plug insertion hole; wherein the case is provided with an installation part that holds the shutter such that it can rotate freely, and wherein the shutter mechanism can be installed from the outside to the installation part.

Abstract: Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.

Abstract: An optical module capable of suppressing an increase in the number of the components and the complexity of the structure is provided. The optical module has a box package, and a cylindrical sleeve portion extending from a front wall of the package. This sleeve portion has a lens holder holding a lens. The lens holder and the front wall of the package are connected by projection-welding.

Abstract: The present invention is an optical device achieving miniaturization, functional integration, and cost reduction, and comprises an optical element chip, an optical fiber assembly comprised of an optical fiber, a first ferrule, and a second ferrule, a package containing and enveloping the optical element chip and having an opening for introducing the optical fiber assembly, and a support pipe mounted on an extension of the opening to support an introductory part of the optical fiber into the package together with the second ferrule constituting the optical fiber assembly to be introduced into the package and to hermetically seal the package, wherein the second ferrule is fixed inside the support pipe, one end thereof protrudes toward an inner part of the package, and another end substantially protrudes at a tip part of the support pipe by a length required for the airtight fixing.

Abstract: An optical device module includes a stub ferrule for guiding a laser light to an optical fiber to be connected, a sleeve for holding an optical-connector ferrule of the optical fiber to be connected and the stub ferrule, a holder for fixing the stub ferrule and the sleeve, and an adapter for connecting the holder and an optical module, in which the sleeve is formed by a nonmetallic material, reducing the structure of metal portion and restraining the antenna effect when electromagnetic noise enters.

Abstract: The invention relates to a compact transmitter optical sub-assembly (OSA), which can be used in small form factor optical transceivers. To limit back reflections from entering the laser cavity, the laser is disposed on a silicon optical bench (SiOB) at an acute angle to the longitudinal axis of the OSA. A portion of the light from the laser cavity passes through the back end of the laser cavity for measuring by a monitor photodiode. A rear beam steering lens redirects the portion of light into a v-groove in the SiOB and off of a reflective surface formed in the end thereof to the monitor photodiode, which is positioned face down over the v-groove.

Abstract: An optical axis adjusting method for adjusting a tilt angle of an optical axis in two regions optically coupled in a holding member includes the steps of: roughly adjusting the optical axis by irradiating a first region on the holding member with a laser beam; and finely adjusting the optical axis by irradiating a second region on the holding member with a laser beam. One of the two regions is set as a reference point. The first region is located closer to the reference point, while the second region is located further from the reference point.

Abstract: An optical-electronic interface may include a circuit substrate, an electrical component mounted on the substrate, an optical component mounted off the substrate, and a flexible interconnect having a first end electrically connected to the optical component and second end electrically connected proximate to the optical component. The electrical component may include electrical leads and the circuit substrate may include electrically conductive traces connected to the electrical leads. The second end of the flexible interconnect may be electrically connected directly to the electrical leads of the electrical component or directly to the electrically conductive traces at a position located proximate to the electrical component.

Abstract: An anti-reflective optical film is provided. The anti-reflective optical film includes a file of optical elements. Each of the optical elements includes: a first planar surface and a second smoothly curved surface having a full internal reflection (FIR) and extending from the first planar surface to form a curved elongated shape. The first planar surface receives an entrance light that exits an area of the second smoothly curved surface.

Abstract: A method of manufacturing an optical communication module, and a mold and a lead frame that are suitable for the method are provided. The method comprises the steps of: placing in a mold the lead frame on which a ferrule and an optical communication facility section are mounted; pressing the ferrule by a moving part that can be stopped at a given position relative to the mold (lower mold tool) such that the distal end of the ferrule is positioned at a proper location within the mold; and filling a resin into the mold, wherein a displacement and a reactive force generated in the lead frame when it is pressed are absorbed by springs provided in the lead frame when it is pressed are absorbed by springs provided in the lead frame such that a catching portion for coupling to a connector is formed with high accuracy at a proper position relative the distal end of the ferrule.

Abstract: An optical subassembly is provided that includes an optical component mounted to a substrate. In addition, the optical subassembly includes a lens package having a lens that is optically coupled with the optical component. The lens package cooperates with the substrate to define a hermetic chamber within which the optical component is disposed. The optical subassembly can be made as an integrated subassembly having both transmit and receive components within the hermetic chamber. Methods in accordance with the present invention include techniques for producing hermetically sealed optical subassemblies in mass-production.

Abstract: Method and apparatus for mounting an optical fiber for coupling to a high power light source, the fiber being secured to its mount with a low refractive index adhesive. The low refractive index adhesive serves to reduce the coupling of light traveling within the fiber to the fiber mount, thereby reducing undesirable, potentially destructive heating in the fiber mount. The adhesive preferably comprises sol gel.

Abstract: In one example, an optical transceiver is provided that includes a ROSA and a TOSA received within a block portion of an OSA block. The OSA block also includes two groups of adjustable elements, one group for each of the ROSA and the TOSA. The adjustable elements of the first group engage the block portion so as to contact the ROSA, and the adjustable elements of the second group engage the block portion so as to contact the TOSA. The position of the adjustable elements in each respective group can then be varied as necessary to locate and/or maintain the ROSA and TOSA in desired positions and orientations relative to, for example, respective optical connector ports of the optical transceiver.

Abstract: A hinge position sensor comprises first and second members connected together to provide a hinge, and an optical fibre or wave-guide connected between the first and second members to provide a communication link between the first and second members. A laser or LED is coupled to the optical fibre or wave-guide to transmit optical signals between the first and second members and the optical signal is received by a photo-detector. The optical fibre or wave-guide is physically distorted by actuation of the hinge such that light escapes from the optical fibre or wave-guide. The optical power level received by the photo-detector is used to determine the position of the hinge.

Abstract: In a semiconductor laser apparatus, semiconductor laser devices are mounted on a loading face of a radiation base portion produced from a radiation material in a mount board, and the radiation base portion and a cap portion constitute an envelope surrounding the semiconductor laser devices. Further, the radiation base portion and interconnections formed on and an extending face of the radiation base portion constitute an external connection terminal. Therefore, heat generated by the semiconductor laser devices is efficiently transferred to the radiation base portion produced from a radiation material. Further, constituting the external connection terminal allows a leadless configuration to be implemented. Thus, a semiconductor laser apparatus which is sufficient in radiation characteristics and is capable of supporting a low-profile specification is provided.

Abstract: An electrical-optical coupling device. An apparatus according to an embodiment of the present invention includes a first trench defined in a first semiconductor substrate. A first reflector is defined at a first end of the first trench in the first semiconductor substrate. The first reflector is angled with respect to an axis of the first trench. A first optical fiber is disposed in the first trench at a second end of the first trench. An optical source is mounted to the first semiconductor substrate proximate to the first trench. The optical source is optically coupled to the first optical fiber via the first reflector.

Abstract: At least one exemplary embodiment is directed to an optical element driving apparatus which includes a first actuator configured to drive an optical element in accordance with a deformation target value, a sensor arranged to measure a position and an orientation of the optical element, a second actuator configured to drive the optical element in accordance with position and orientation target values and an output of the sensor, and a correcting unit configured to correct a measurement error of the sensor caused by deformation of the optical element.

Abstract: The invention relates to an optoelectronic emission module comprising a housing (B), which has electrical terminal contacts (5) for supplying and/or carrying away electric signals or for supplying electrical power. Said emission module also has at least one optical emission element (13), which is arranged inside the housing (3), and has at least one optical waveguide (17), which is held inside or on the housing (3) and in whose injection end (19) the light emitted by the at least one optical emission element (13) can be injected. The at least one optical emission element (13) and the injection end (19) of the at least one optical waveguide (17) are mounted on a supporting element. The invention also relates to a method for producing an emission module of the aforementioned type.

Abstract: A device for sending or receiving optical signals wherein an opto-electrical transducer (5), an associated glass fiber (8) and other elements (6, 7) of a sending or receiving circuit are arranged on a common support; namely, a circuit board (1) comprising different multiple layers of insulation material and intermediate layers of metal, with a recess (2) containing an opening (3) and a bottom (4) on which conducting tracks are located, where at least some of them are impedance-matched. The transducer (5) and the other elements (6, 7) are located entirely in the recess (2) and are connected to the conducting tracks. At least some of the conducting tracks protrude laterally from the recess (2) into the surrounding edge areas of the circuit board (1), where at least some are connected to impedance-matched conductors (11) which extend to a common surface inside the circuit board (1) and respectively end on a contact surface (12).

Abstract: An optical to RF interface connector has a cellular housing that has a back most portion configured for press fitting into a hole of the housing of an electro-optical apparatus, with the hole and back most portion of the shell being key to one another to insure proper orientation of the connector. The press fitting is further configured for providing both an RF seal, and moisture seal. The frontmost portion of the connector shell is configured for securely coupling to an optical interface male connector that is attached to an end of a fiber optic cable. The innermost portion of a connector shell is further configured for receiving and retaining therein either a auto detector or light detecting device for converting optical signals received from the fiber optic cable into electrical signals for processing, or is light transmitting device for converting electrical signals into optical signals for transmission over the associated fiber optic cable.