Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: Disclosed herein are system, apparatus, article of manufacture, method and/or computer program product embodiments, and/or combinations and sub-combinations thereof, for a remote control system that improves one or more of directionality, target specificity, signal specificity, and bandwidth. An example embodiment is a remote control system that includes a radiation source configured to generate an infrared radiation projection based on one or more remote control codes to control a device. The remote control system further includes an optical controller configured to adjust one or more parameters associated with the infrared radiation projection before the infrared radiation projection is emitted to the device.

Abstract: Provided is a connector plug includes: an optical device module having an optical engine that generates an optical signal or receives an optical signal; an optical fiber alignment guide member having an optical fiber insertion channel formed on one surface of the optical device module so that optical fibers are seated; and an optical component that is seated in an optical component alignment guide groove formed adjacent to the optical fiber alignment guide member on one surface of the optical device module, wherein the optical engine includes an optical device which is formed adjacent to the optical component on one surface of the optical device module, and which radiates an optical signal or receives an optical signal in the horizontal direction, and an optical integrated circuit (IC) installed in the optical device module and controlling the optical device.

Abstract: A light-emitting device includes a plurality of light-emitting elements, a photodetector, an optical member and a bonding portion. The light-emitting elements include a first light-emitting element configured to emit first light and a second light-emitting element configured to emit second light. The photodetector is configured to receive a part of light emitted from each of the light-emitting elements. The photodetector has a first bonding surface. The optical member has a second bonding surface and a first inner side surface. The first inner side surface is continuous from the second bonding surface. The light emitted from each of the plurality of light-emitting elements is configured to pass through the optical member. The bonding portion bonds the photodetector and the optical member with the bonding portion being in contact with the first bonding surface, the second bonding surface, and at least a part of the first inner side surface.

Abstract: Disclosed herein are system, apparatus, article of manufacture, method and/or computer program product embodiments, and/or combinations and sub-combinations thereof, for a remote control system that improves one or more of directionality, target specificity, signal specificity, and bandwidth. An example embodiment is a remote control system that includes a radiation source configured to generate an infrared radiation projection based on one or more remote control codes to control a device. The remote control system further includes an optical controller configured to adjust one or more parameters associated with the infrared radiation projection before the infrared radiation projection is emitted to the device.

Abstract: A method for managing optical transceivers includes obtaining laser measurements for a laser operating in an optical transceiver in a network device, obtaining a failure profile for the laser, making a first determination that the laser measurements match the failure profile, and based on the first determination, initiating a remediation action for the optical transceiver.

Abstract: According to one embodiment, a light source includes a plurality of light-emitting elements each including one or more surface-emitting lasers; and a plurality of detecting elements located on a same substrate as the light-emitting elements. The detecting elements individually detect quantities of output light of the light-emitting elements.

Abstract: Systems and methods for collecting information regarding optical connections in an FDH are disclosed. An example FDH includes: a bulkhead having a plurality of passive optical couplers, each of the plurality of passive optical couplers having a respective first port adapted to receive an end of a respective first optical fiber, a respective second port adapted to receive an end of a respective second optical fiber, and a respective passive optical activity indicator configured to expose (i) a portion of first light propagating in the respective first optical fiber when the first optical fiber is received in the first port, and (ii) a portion of second light propagating in the respective second optical fiber when the second optical fiber is received in the second port; and an image sensor configured to capture one or more images of the respective passive optical activity indicators of the plurality of passive optical couplers.

Abstract: Systems and methods are provided for provisioning of telecommunications signals in moving trains. Scattering panels may be utilized for redirecting wireless signals, such as by scattering them, to provide better communication performance on the moving trains. The scattering panels may be configured to scatter the signals, such as by reflecting them. The scattering panels may be configured for operation in conjunction with a number of antennas that communicate the signals being scattered via the scattering panels.

Abstract: A hinge assembly configured for attachment to two objects is described herein. The hinge assembly includes: a flexible circuit board having planar conductive circuitry and including at least one preformed undulation in a region of the flexible circuit board, wherein the at least one undulation is configured to allow the flexible circuit board to bend at the region; and a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to allow attachment of the flexible circuit board to the two objects, wherein the flexible circuit board is configured to movably and electrically connect the two objects.

Abstract: A pluggable module includes an outer housing having a cavity between an upper wall and a lower wall. A circuit card is received in the cavity having a card edge configured to be received in a card slot of a communication connector. A circuit card holder engages the circuit card and holds the circuit card in the cavity of the outer housing. The circuit card holder includes a locating fin at a top of the circuit card holder. The locating fin has a sacrificial upper edge configured to engage the outer housing to locate the circuit card holder and the circuit card in the cavity. The sacrificial upper edge is deformed when engaging the outer housing to press the circuit card holder and the circuit card in a downward biasing direction.

Abstract: Described herein is an apparatus including a continuous wave idler and an optical coupler that provide an optical signal having a power greater than optical channels carrying data, and positioned at a cross-over point between two spectral bands, with each band encompassing multiple optical channels.

Abstract: Provided is an optical communication module. The optical communication module includes: an optical device configured to provide an optical output from an electrical input; a circuit board on which the optical device is mounted and which is configured to provide the electrical input to the optical device; a temperature compensation element mounted on a side of the circuit board; and a mechanical switch connected to the temperature compensation element and configured to turn on/off according to ambient temperature for supplying or interrupting power to the temperature compensation element. The optical communication module includes the temperature compensation element configured to heat or cool the optical device according to ambient temperature, thereby maintaining proper modulation performance and optical power over a wide range of temperature in low-temperature and high-temperature environments.

Abstract: In optical receivers, cancelling the DC component of the incoming current is a key to increasing the receiver's effectiveness, and therefore increase the channel capacity. Ideally, the receiver includes a DC cancellation circuit for removing the DC component; however, in differential receivers an offset may be created between the output voltage components caused by the various amplifiers. Accordingly, an offset cancellation circuit is required to determine the offset and to modify the DC cancellation circuit accordingly.

Abstract: A semiconductor package includes a photonic integrated circuit, an encapsulating material, and a redistribution structure. The photonic integrated circuit includes a coupling surface, a back surface opposite to the coupling surface and a plurality of optical couplers disposed on the coupling surface and configured to be coupled to a plurality of optical fibers. The encapsulating material encapsulates the photonic integrated circuit and revealing the plurality of optical couplers. The redistribution structure is disposed over the encapsulating material and the back surface of the photonic integrated circuit, wherein the redistribution structure is electrically connected to the photonic integrated circuit.

Abstract: A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.

Abstract: An electro-optical aggregator system includes: a system board; a plurality of cards electrically connected to the system board, the plurality of cards each comporting with a standard form factor; and an electro-optical aggregator card comporting with the standard form factor and trafficking electrical signals with the plurality of cards, the electro-optical aggregator card including an optical transceiver chip through which the trafficked signals are optically communicated.

Abstract: An apparatus can include an optical transceiver having a body with a first end at which a circuitry interface is located to facilitate transfer of data between a network appliance and the optical transceiver. The apparatus further includes a four-cable interface at a second end of the body. The four-cable interface releasably receives four independently releasable connectors for transfer of optical signals between the optical transceiver and respective ferrules of the four independently releasable connectors. In some examples, a carrier may be provided that is releasably connected with the four-cable interface and that includes four sockets for respectively independently receiving the four independently receivable connectors so as to facilitate collective insertion and removal of the four independently releasable connectors relative to the four-cable interface.

Abstract: A light source device and a method of manufacturing a light source device are provided. The light source device includes a base. A light-emitter is above the base. A cap is joined to the base to cover the light-emitter. The cap includes an opening in a position corresponding to the light-emitter. A first light guide is in communication with the opening for guiding, to outside of the cap, light emitted by the light-emitter. A first ferrule is provided around the first light guide. The first ferrule is joined to an edge of the opening in a state in which the first ferrule is in the opening.

Abstract: An improvement is achieved in the reliability of a semiconductor device. Over an insulating layer, an optical waveguide and a p-type semiconductor portion are formed. Over the p-type semiconductor portion, a multi-layer body including an n-type semiconductor portion and a cap layer is formed. Over a first interlayer insulating film covering the optical waveguide, the p-type semiconductor portion, and the multi-layer body, a heater located over the optical waveguide is formed. In the first interlayer insulating film, first and second contact holes are formed. A first contact portion electrically coupled with the p-type semiconductor portion is formed continuously in the first contact hole and over the first interlayer insulating film. A second contact portion electrically coupled with the cap layer is formed continuously in the second contact hole and over the first interlayer insulating film.

Abstract: Provided herein is a semiconductor device. The semiconductor device may include conductive layers each including a line, and a pad which is coupled with the line and has a thickness greater than that of the line, the conductive layers being stacked such that the pads are exposed; insulating layers interposed between the conductive layers; first spacers each of which is interposed between the pad of the corresponding upper conductive layer and the pad of the corresponding low conductive layer; and second spacers covering the respective first spacers.

Abstract: A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.

Abstract: A connection system for a quantum computer that employs constant impedance connectors with attenuation or filtering components or both embedded therein or within an adaptor removably insertable within an adaptor housing for use in a cryogenically cooled quantum computer. The connection system provides a higher density of cables traversing through a hermetic sealed top plate, and which are accessible to chill blocks to reduce the thermal energy from the signal lines. Attenuators or filter circuits are embedded in the constant impedance connector housings, or provided in adaptors that connect on each end to form mating constant impedance connections, in order to reduce signal strength as the signal progresses through the cryogenic environment and to remove extraneous electrical signal noise.

Abstract: A method includes forming a stack of semiconductor die. The stack includes a first semiconductor die, a second semiconductor die and a third semiconductor die. The first semiconductor die is stacked above the second semiconductor die and the third semiconductor die is stacked above the first semiconductor die. A first optical transmitter and a first optical receiver are provided in the first semiconductor die, a second optical transmitter is provided in the second semiconductor die, and a second optical receiver is provided in the third semiconductor die. A first optical signal is transmitted from the first optical transmitter in the first semiconductor die to the second optical receiver in the third semiconductor die. A second optical signal is transmitted from the second optical transmitter in the second semiconductor die to the first optical receiver in the first semiconductor die.

Abstract: Techniques are disclosed for providing relatively short distances between multi-channel transmitter optical subassemblies (TOSAs) and associated transmit connecting circuit in order to reduce losses due to signal propagation delays, also sometimes referred to as signal flight time delays. In an embodiment, a TOSA includes a plurality of laser assemblies disposed along a same sidewall of the TOSA along a longitudinal axis. The TOSA may be disposed within an optical transceiver housing in a transverse orientation, whereby a longitudinal center line of the multi-channel TOSA is substantially perpendicular to the longitudinal axis of the optical transceiver housing. The TOSA may be positioned adjacent an end of the optical transceiver housing having a transmit connecting circuit. Thus each of the plurality of laser assemblies may be positioned at a relatively short distance, e.g., 120 microns or less, away from the transmit connecting circuit.

Abstract: Various example implementations are directed to circuits and methods for communicating between disparate processor circuits. According to an example implementation, a circuit arrangement includes a plurality of processor circuits and an inter-processor communication circuit. The inter-processor communication circuit is configured to provide, for each pair of the processor circuits, a respective communication channel between the pair of processor circuits. The inter-processor communication circuit includes a plurality of buffers including a respective first buffer and a respective second buffer for each communication channel. An access control circuit included in the inter-processor communication circuit is configured to restrict write access to the respective first buffer to the first processor circuit and restrict write access to the respective second buffer to the second processor circuit.

Abstract: Embodiments of the present invention include systems for launching primary or secondary payloads or actuating other launch vehicle or payload or instrumentation devices. The system includes an adapter assembly and at least one sequencer mounted to the adapter assembly. The sequencer includes: controller boards, each of the controller boards having a controller for controlling deployment of the payloads and data files; output ports coupled to the controller boards and configured to transmit signals from the controller boards to dispensers therethrough, deployment mechanisms containing the payloads, the adapter assembly having channels for accommodating the dispensers; and a detector coupled to the controller boards and adapted to detect an external signal and, in response to the external signal, to send an initiation signal to the controller boards. The system also includes at least one power supply coupled to the sequencer and adapted to provide an electrical power to the sequencer.

Abstract: A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.

Abstract: Chassis for an automated test system including a housing and at least a first and a second backplane in the housing. The first backplane provides electrical connections for at least one functional module of a first type when engaged with the first backplane, while the second backplane provides electrical connections for at least one functional module of a second type different than the first type when engaged with the second backplane. The first and second backplanes include electrical circuitry to enable signals to be provided for the functional modules when engaged therewith. A bottom of the housing includes ducts to enable cooling of both types of functional modules when engaged with the housing.

Abstract: A first resistor connected in parallel to a semiconductor optical modulator having first ends, the first resistor and first ends connected to a reference potential. A first end of a first transmission line is connected to second ends of the semiconductor optical modulator and the first resistor. A second transmission line is connected in series to the first transmission line and has an impedance lower than that of the first resistor. A first end of the second transmission line is connected to a second end of the first transmission line. A third transmission line is connected in series to the first and second transmission lines and has an end connected to a second end of the second transmission line, and has an impedance equal to that of the first transmission line. A second resistor and a capacitor are connected in series between the third transmission line and the reference potential.

Abstract: Wavelength division multiplexing and demultiplexing (WDM) TOSA and ROSA TO-can assemblies are provided that are capable of transmitting and receiving optical data signals, respectively, having more than three wavelengths, that can be packaged in smaller packages than those used for existing BOSAs and tri-OSAs, that can be manufactured without requiring a large amount of plant retooling or capital investment, and that can be made available in the market relatively quickly.

Abstract: The present invention roughens at least a partial region of an outer planar surface of at least one of an optical case and a lid of a laser scanner; thus, electrification of the optical case to be caused by friction with another member or a person is reduced, and damage to an electronic component is prevented.

Abstract: A transmitter for transmitting audio signals via infrared light includes a first mounting board and a first plurality of narrow angle LED emitters and a first plurality of wide angle LED emitters attached to a front surface of the first mounting board. The first plurality of narrow angle LED emitters and the first plurality of wide angle LED emitters are configured to emit a beam of infrared light having a wide portion and a narrow portion, the wide portion being proximate the LED emitters and the narrow portion being distal to the LED emitters. An infrared audio system includes a transmitter and an expansion transmitter. The expansion transmitter may include a second plurality of narrow angle LED emitters and a second plurality of wide angle LED emitters. A method of making a transmitter includes attaching a plurality of narrow angle LED emitters and a plurality of wide angle LED emitters to a mounting board of a transmitter.

Abstract: Aspects of the present disclosure are directed toward apparatuses, systems, and methods that include a first gateway circuit in an optical access network connecting a plurality of end-of-network users to a central node, the first gateway circuit connecting one of the plurality of end-of-network users to the central node via fiber optic data lines. Further, the first gateway circuit is configured and arranged to: relay a first set of data between the end-of-network user and the central node using a packet-switching communication protocol, and relay a second set of data between the end-of-network user and the central node using an optical flow switching communication protocol.

Abstract: The invention provides a device, system, and method for receiving and transmitting fare collection data with a dynamic fare collection data probe. Specifically, the dynamic fare collection data probe automatically adjusts gain to allow for faster data rates and compensate for variances within emitter and detector parameters associated with a fare collection system.

Abstract: A receptacle assembly with improved EMI leakage reduction and construction is described. The assembly includes a housing in the form of a guide frame that has a hollow interior which accommodates the insertion of an electronic module therein. A heat sink is provided to dissipate heat generated during operation of a module and the heat sink has a base portion that defines a ceiling of the hollow interior. An opening in the top of the guide frame provides an attachment location for the heat sink. A separately formed base plate is inserted into the housing and it defines a bottom of the interior of the housing.

Abstract: A network element of a transport network has three fabrics housed within a single shelf of a telco rack, namely a packet fabric, an electrical fabric and an optical fabric. A stream of traffic including a plurality of lambdas is received at a trunk interface of such a shelf. The optical fabric in the shelf performs optical switching on the stream to replace a first lambda in the stream with a second lambda. The first lambda is converted within the shelf into an electrical signal. Also within the shelf, first frames are recovered from the electrical signal. The packet fabric in the shelf is used to perform packet switching on the first frames to generate a flow of second frames. The flow of second frames is transmitted at a client interface of the shelf.

Abstract: An optical layer monitoring apparatus and method thereof are provided. According to an embodiment of the present invention, an optical layer monitoring apparatus including an optical time domain reflectometer (OTDR) function so as to monitor an optical path of a passive optical network (PON), and a method for improving accuracy of measured monitoring results using the optical layer monitoring apparatus are provided. Therefore, it is possible to enable a user to continuously detect distortion or attenuation along the optical path, and to quickly recover from the distortion or attenuation along the optical path when distortion or attenuation is detected.

Abstract: The present invention relates to an optical communication module, which includes: a first bidirectional multiplexer; a second bidirectional multiplexer; an optical fiber for connecting the first bidirectional multiplexer and the second bidirectional multiplexer to each other; one or more first light emitting devices connecting to the first bidirectional multiplexer, and operating in a first light emitting wavelength band; one or more first light receiving devices connecting to the first bidirectional multiplexer, and operating in a first light receiving wavelength band; one or more second light receiving devices connecting to the second bidirectional multiplexer, and operating in a second light receiving wavelength band; and one or more second light emitting devices connecting to the second bidirectional multiplexer, and operating in a second light emitting wavelength band.

Abstract: A system includes an optical transmitter package comprising an optical transmitter to generate optical transmission signals based on electrical transmission signals. The system also includes an optical receiver package comprising an optical receiver to generate electrical reception signals based on optical reception signals. The system further includes a printed circuit board (PCB) on which the optical transmitter package and the optical receiver package are mounted. The PCB includes a heat generating circuit component. The optical transmitter package can be mounted to the PCB to subjected to less heat from the heat generating circuit component than the optical receiver package.

Abstract: An opto-isolator with a compensation circuit is disclosed. The compensation circuit may be configured to compensate degradation of the light source of the opto-isolator. The compensation circuit may comprise a circuit for counting an extended use of the isolator. When the count value exceeds a predetermined count value, the compensation circuit may be configured to compensate the degradation of the light source by adjusting the driver of the light source. In another embodiment, an electrical control system having such opto-isolator is illustrated.

Abstract: A communications networking having reduced transmission latency and improved reliability is described. To reduce signal transmission latency, network management data is removed from a data stream to prioritize the transmission of payload data at higher transmission rates. Management data is returned to the data stream in such a way that it minimizes an impact to payload transmission rates. To improve communications network reliability, the network is configured to form a primary communication path and a redundant communication path. Upon failure of a transceiver at one node, the network engages redundant transceivers on a per-node basis thereby using a segment of the redundant communication path. The data stream is returned to the primary communication path upon circumvention of the failed transceiver.

Abstract: An optical communication module in which the pin arrangement can be applied flexibly. An optical communication module has an outer shape formed based on normal standards and which is able to communicate with a host-side circuit board, etc. to which it is fitted, via a predetermined communication interface; wherein the optical communication module exchanges input/output I/F information with the circuit board, etc., and the communication interface can be switched to another communication interface based on these input/output I/F information.

Abstract: A transceiver card for a telecommunications box for transmitting data over a first optical fiber and receiving data over a second optical fiber. The card has transmitter for transmitting data over the first optical fiber, the transmitter having a laser and a modulator, a fiber output optically connected to the laser for connecting the first optical fiber to the card, a fiber input for connecting the second optical fiber to the card, a receiver optically connected to the fiber input for receiving data from the second optical fiber, and an OTDR optically connected between the transmitter and the fiber output or between the receiver and the fiber input. An energy level detector is also provided between the receiver and the fiber input.

Abstract: Embodiments of the present disclosure provide a laser diode. The laser diode includes: a semiconductor substrate, a waveguide layer and a light wave limiting layer. The waveguide layer is disposed on the semiconductor substrate, and comprises a quantum well layer. The light wave limiting layer is disposed on a surface of the waveguide layer, and is configured to limit a light wave to be transmitted in the waveguide layer. The quantum well layer includes a plurality of quantum well regions that are disposed along a transmission direction of the light wave, and the quantum well regions respectively have gain peaks of different wavelengths. The embodiments of the present disclosure further provide a manufacturing method of a laser diode and a passive optical network system using the laser diode.

Abstract: A light-receiving device array includes a photodiode array that is provided with plural light-receiving sections each of which includes a first conductivity type electrode and a second conductivity type electrode, and a carrier, wherein the carrier includes plural pair of electric lines each of which is formed from a first electric line connected to the first conductivity type electrode of each light-receiving section, and a second electric line connected to the second conductivity type electrode of the light-receiving section, a first ground electrode that extends between one pair of electric lines of the plural pair of electric lines and a pair of electric lines adjacent to the one pair of electric lines, and a second ground electrode that is formed on a part of the rear surface and is electrically connected to the first ground electrode.

Abstract: In a multi-chip module (MCM), integrated circuits are coupled by optical waveguides that convey optical signals. The optical waveguides provide dedicated point-to-point optical links between all pairs of the integrated circuits. Moreover, for a given point-to-point optical link between a given pair of integrated circuits, other integrated circuits in the integrated circuits steal access on the given point-to-point optical link when communicating information to one of the given pair of integrated circuits so that the given point-to-point optical link is shared by more than the given pair of integrated circuits. Furthermore, the integrated circuits recover errors in messages in the optical signals corrupted by collisions on the given point-to-point optical link using erasure coding. In this way, the MCM may provide an optical network with increased bandwidth relative to a point-to-point optical network.

Abstract: Multiple pins extend from the outside to the inside of an optical sub-assembly. A light receiver or a light transmitter is arranged inside the optical sub-assembly. A receiver circuit and transmitter circuit (TX) are arranged inside the optical sub-assembly and connected between the multiple pins and the light receiver and the light transmitter. The receiver circuit comprises a receiver communication interface in order to transform an output signal of the light receiver into a communication signal, and wherein the transmitter circuit comprises a transmitter communication interface to transform a communication signal into an input signal of the light transmitter. A control interface is connected with the receiver circuit and the transmitter circuit arranged inside the optical sub-assembly, wherein the control interface is connectable to two of the multiple pins.

Abstract: A gearbox IC is incorporated into an optical communications system to enable an optical link that incorporates the system to achieve data rates that are at least double that which are currently achievable in optical links. The gearbox IC is compatible with ASIC designs currently used in optical fiber links. The gearbox IC enables the data rate of the optical fiber link to be dramatically increased without requiring a redesign of the ASIC that is currently used in the optical fiber link. The gearbox IC performs data rate conversion and phase alignment for bit streams being transferred via the gearbox IC between the ASIC and an optical transceiver module of the optical communications system.

Abstract: Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs, and a set of one or more chip identification pads formed on each IC. Each set of chip identification pads has an electrical connection pattern. The electrical connection pattern of each set is distinct from the electrical connection pattern on every other set. Each distinct electrical connection pattern represents a unique identifier of the corresponding IC thereby enabling the controller to distinguish between the ICs.