Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Abstract: Apparatus is provided for handling gasket-forming material. This material is usually supplied in tubular cartridge form and is dispensed to a screen with a porous pattern which shapes the material to the desired gasket-configuration. The material is spread on the screen and forced through to the other side where the gasket pattern is applied to an adjacent transfer surface of a transfer pad. This pad with the pattern on the transfer surface is moved to a mateable surface of a workpiece located on a support spaced from the screen. The gasket-forming material is then transferred to the mateable surface. The gasket-forming material is dispensed from the cartridge with the aid of a cartridge holder having an opening at one end to receive a spout of the cartridge and having a plunger at the other end with a plunger rod extending outwardly therefrom. A fluid-operated cylinder is aligned with the plunger rod and has a piston connected with the rod.

Abstract: Apparatus is provided for applying a bead of gasket-forming material to a mateable surface of a workpiece. The apparatus includes a source of gasket-forming material and a screen having a predetermined pattern conforming to the desired bead of the gasket-forming material. A spreader applies the gasket-forming material to one side of the screen and the gasket pattern is then formed on an adjacent transfer surface of a transfer pad on the opposite side of the screen. Means are provided for moving the pad with the pattern on the transfer surface and engaging it with the mateable surface of a workpiece mounted on a support spaced from the screen, thereby forming a bead of gasket-forming material on the mateable surface. The transfer surface is moved through an arc of 180.degree. when moving between the screen and the workpiece surface.

Abstract: Apparatus is provided for applying a bead of gasket-forming material to a mateable surface of a workpiece. The apparatus includes a source of gasket-forming material and a screen having a predetermined pattern conforming to the desired bead of the gasket-forming material. A spreader applies the gasket-forming material to one side of the screen and the gasket pattern is then formed on an adjacent transfer surface of a transfer pad on the opposite side of the screen. Means are provided for moving the pad with the pattern on the transfer surface and engaging it with the mateable surface of a workpiece mounted on a support spaced from the screen, thereby forming a bead of gasket-forming material on the mateable surface. The transfer surface is moved through an arc of 180.degree. when moving between the screen and the workpiece surface.