Abstract: A gripping unit grips a base having a thickness that is defined by an upper side and a lower side thereof and that conveys a product on the upper side. The gripping unit has a pair of first guides with corresponding guide surfaces in contact with the base. The guide surfaces extends as far as beneath the lower side of the base.

Abstract: A system includes trays of a plurality of different widths and an unloading system for unloading cartons from the trays. The trays (20; 20?; 20?) each comprise a base (22) and a pair of end walls (30) extending upward from the base. The unloading system (200; 200?) comprises a plurality of fingers (202A-202I). Each of the end walls comprise a plurality of vertical slots (40) open to an upper edge of the end wall. The fingers are positioned and dimensioned to pass through the slots of the trays as the trays are delivered by the tray delivery conveyor to lift contents of the trays. The fingers are positioned so that some fingers pass through the slots of each of the different widths, but others pass only through slots of wider said widths.

Abstract: The invention relates to a feeder device (1) for insertion machines for printed circuit boards, comprising a housing, a drive motor (3, 3?), a gear unit (5) and a pin wheel (6) engaging with a transport tape. The drive motor and the gear unit are arranged on a common side wall (2) of the housing such that the axles thereof are perpendicular to the side wall. It is the object of the invention to provide a narrow structural design of the feeder device, which also allows easy mounting. To this end, the rotor (14, 14?) of the drive motor (3) is rotatably mounted on only one axle (4, 4?) which is fixedly connected to the side wall (2) of the housing.

Abstract: A discharge hopper for a tray discharge station for serially discharging shaft trays filled with rod-shaped products includes a conveying element for carrying away the products flowing from the shaft trays and a connecting device for coupling the shaft trays to be emptied to the conveying element. The connecting device is arranged substantially parallel to and spaced apart from the conveying element to form a channel for the product flow and includes an opening for passage of the products from the shaft tray into the channel. In the region of the connecting device there is provided a closure unit to open and close the opening. The closure device is coupled to a movable actuating element so that the closure device can be opened and closed shaft by shaft in relation to the shaft tray to be emptied.

Abstract: A work attracting apparatus and a work attracting method that uses a Bernoulli chuck or the like as a work attraction section and that can ensure the perfect operation of attracting and receiving. The work attraction section (Bernoulli plate 1 and Bernoulli arm 2) attracts a wafer 14 being transported in; a movement section (moving unit 3 and speed variable actuator 10) moves the work attraction section in a direction of transport of the wafer 14; a work detector 4 detects the wafer 14 being transported at a predetermined position and outputs a detection signal; and a controller 5, when receiving the detection signal, controls the movement section to move together with the wafer 14 being transported and makes the work attraction section operate.

Abstract: A method and apparatus for the handling and containment of a cover tape peeled from a pocket tape in a component feeder are disclosed. A single folding pulley comprising inclined sides and an undercut at the hub folds the adhesive contaminated edges back onto themselves so as to captivate the adhesive therebetweeen. A cover tape reservoir, having an internal cavity defined by a curved perimeter and treated sides, stores the folded cover tape. The remaining reservoir capacity is monitor in software for fullness. The cover tape is corrugated to allow for maximum packing density with a minimum of voids as it is pushed into the reservoir.

Abstract: The invention concerns a process and a device for unloading a mail piece container, open at the top, with sidewalls that slant toward the outside, that is loaded with mail pieces that stand upright next to one another. According to the invention, the mail piece stack, after having been compressed, is held by holding supports that are inserted into the container and that feature driven revolving conveyor bands. While the supports are being inserted, the conveyor bands are driven in such a way that the conveyor band segments in contact with the mail piece stack are motionless with respect to the mail pieces. Next, the container is tilted by >90° along with the mail pieces and the holding supports. After the container is tilted back somewhat, a base plate is inserted and the whole ensemble is tilted back to the point where the stack stands on the horizontally positioned base plate. Then the container is removed towards the bottom.

Abstract: A pellet picking apparatus for separating a pellet adhered on an adhesive sheet from the sheet and picking the pellet thus separated is provided, which prevents the pellet from being damaged during the pellet picking process without lowering the productivity. This apparatus comprises (a) a stage having a surface with which a lower face of the adhesive sheet is contacted; the pellet being adhered on an upper face of the sheet; the stage having a suction hole that pulls down the sheet; the suction hole having a suction end to be contacted with the sheet on the surface of the stage; the stage being movable in a horizontal plane with respect to a specific reference position; and (b) a collet for holding the pellet by a suction force; the collet having a suction end to be contacted with the pellet; the collet being capable of holding the pellet by the suction force at the suction end.

Abstract: A system and method for transporting semiconductor wafers in a semiconductor processing system, which may include a transport module and a process chamber. The system includes a container configured to house a plurality of semiconductor wafers, where the container is a separate component from the semiconductor processing system. A semiconductor wafer transport device is disposed in the transport module, which is configured to extend into the container from the transport module and deliver the semiconductor wafers to the process chamber.

Abstract: The present invention is a method and apparatus for parting and peeling-back the cover tape on a carrier tape (consisting of a component tape with pockets therein and cover tape thereover) in order to expose the component for retrieval by an automated assembly system. More specifically, the cover tape is parted along one edge, or slit in the middle for wider component tapes. The cover tape flap(s) created by the parting operation are then retracted back away from the region above the component, whereby the component is exposed for retrieval at the pick-up location. Subsequent to the pick-up location the carrier tape, with the parted cover tape flap(s) still attached thereto, is directed to a waste receptacle or similar disposal mechanism, avoiding the need for a separate cover tape take-up reel.

Abstract: For stripping selected chips from a wafer of diced chips adhered, bottom surface down, to a flexible, elastic membrane, the bottom surface of the membrane is disposed against an apertured plate of a vacuum chuck for firmly holding the membrane in place with a group of the chips directly overlying push-up pins vertically movable through slots through the apertured plate. Selected pins are fired upwardly with sufficient speed to dislodge struck chips, but not non-selected adjacent chips, off the membrane and to hurl them, in free flight, upwardly against an overlying chip catching member. The stripped and caught chips are then transferred for storage or use.