Abstract: Apparatus for treating containers includes a handling device for the containers wherein the handling devices has a movable carrier with which the containers can be moved on a transport path, and wherein the handling devices is assigned at least one handling station, wherein the transport speed of the handling device can be controlled in such a way that the transport speed of the handling device can be synchronised with the transport speed of the transport device and/or a further transport device during transfer and/or discharge of the containers and the transport speed of the handling device can be reduced after the transfer of the containers.

Abstract: An organic light-emitting diode (OLED) deposition system includes two deposition chambers, a transfer chamber between the two deposition chambers, a metrology system having one or more sensors to perform measurements of the workpiece within the transfer chamber, and a control system to cause the system to form an organic light-emitting diode layer stack on the workpiece. Vacuum is maintained around the workpiece while the workpiece is transferred between the two deposition chambers and while retaining the workpiece within the transfer chamber. The control system is configured to cause the two deposition chambers to deposit two layers of organic material onto the workpiece, and to receive a first plurality of measurements of the workpiece in the transfer chamber from the metrology system.

Abstract: A method and apparatus for loading substrates in an inspection station is disclosed herein. In one embodiment a loading module is disclosed that includes a loading station for two or more substrate cassettes, a first lane comprising a first conveyor that is substantially aligned with one of the two or more substrate cassettes and a conveyor system, a second lane comprising a second conveyor that is substantially aligned with another of the two or more substrate cassettes and positioned in a spaced-apart relation relative to the first lane, and a lateral transfer module positioned between the first lane and the second lane that is adapted to move substrates from the second lane to the first lane.

Abstract: An automated system for transferring articles from a container. An item transfer system includes retainers configured to secure a first tray and a second tray, a movable paddle assembly, a frame, and a plurality of actuators. The system is configured to transfer articles from the first tray to the second tray by an automated process including securing the articles within the first tray with the paddle assembly, rotating the frame by approximately 90° to 100°, moving the paddle assembly in a series of linear translations to remove the items from the first tray and place the items into the second tray, rotating the frame back to its initial orientation, and releasing the items into the second tray.

Abstract: An apparatus for loading live turkeys from a barn floor to cages on a transport trailer. A continuous motorized drive chain moves attached, solid sheets that are loaded with turkeys from the barn floor into the cage, and then back to the loading position. The drive chain is looped around first and second sprockets. Each rectangular sheet is rotationally connected at two of its corners to the drive chain forming a fixed end and a loose end. When the drive chain rounds the barn end, the loose end of the sheet slides upwards on a guide flap to keep the top of the sheet facing up. The sheets are driven forward to the cages, round the end at the cage end, pulled backwards from the cages toward the barn end, and then driven forward again, all without stopping the motion of the drive chain.

Abstract: Systems and methods for releasing semiconductor dies from an adhesive tape or film. In some embodiments, a semiconductor manufacturing device may include: a chuck plate configured to support an array of semiconductor dies, where each die in the array has a top surface and a bottom surface, where each die's bottom surface is bonded to an adhesive tape, and where the chuck plate comprises one or more channels configured to apply a negative pressure to the adhesive tape; and a tape release element having an irregular surface, the tape release element disposed between the chuck plate and the adhesive tape.

Abstract: The invention relates to a vertical unload system for an unit load device, comprising a framework, the framework delimiting a cargo space arranged on a ground load deck and the framework comprising an unload deck for unloading shipments out of the unit load device and comprising an elevator, whereby the unload deck is arranged distant above the ground load deck and extends in an offset plane adjacent to the cargo space, the cargo space and/or the elevator comprises rollers for loading and unloading the unit load device into and out of the elevator, and the elevator is adapted for vertically elevating the unit load device between the ground load deck and the unload deck such that the unit load device is stoppable at any intermediate stop locations.

Abstract: The invention relates to an unload access system for an unit load device, comprising a framework, the framework delimiting a cargo space arranged on a ground load deck and the framework comprising an unload deck for unloading shipments out of the unit load device, whereby the unload deck is arranged distant above the ground load deck and extends in an offset plane adjacent to the cargo space, the unload deck comprises a movable platform, and the platform extends coplanar with the unload deck and is movable between a retracted position and a maximum extracted position, whereby in the maximum extracted position the platform overlaps at least partly the cargo space by extending into the cargo space and in the retracted position the platform does not overlap the cargo space.

Abstract: In one embodiment, a tray that includes a dielectric frame structure, a re-adherable pad and a marking is disclosed. The dielectric frame structure includes a recessed region where the re-adherable pad is formed. A plurality of integrated circuits is placed on a re-adherable surface of the re-adherable pad. The marking on the dielectric frame that is reflective of a given input-output pin position for each integrated circuit in the plurality of integrated circuits in the tray. In addition to that, two methods are also disclosed. First, a method of handling the integrated circuits using the tray is disclosed. Second, a method of forming the tray is also disclosed.

Abstract: Disclosed is a container offload system for shipping containers, silos, and other storage containers. The offload system is comprised of a longitudinal body with spacers attached to the bottom section, in contact with a commodity. Commodity passes through gaps between the spacers into an offload channel. The commodity is offloaded from the container or silo through the offload channel. The offload system is built into containers or may be retrofitted. Furthermore, versions of the offload system may be retrofitted to fit in the hull of a marine vessel. In one version, the offload system is removable.

Abstract: Pick and place tape release techniques and tools that allow thin, fragile semiconductor dies to be removed from wafer tape with reduced tape release forces applied to the semiconductor dies. For example, a method for removing semiconductor die from wafer tape includes mounting a wafer ring having wafer tape and one or more dies attached to the wafer tape, and aligning an ejector pin assembly under a target die to be removed from the wafer tape. The ejector pin assembly includes a vacuum housing, an ejector pin, a suction plate, and an aperture formed in the suction plate in alignment with the ejector pin. A vacuum is generated in the vacuum housing to draw the tape against a surface of the suction plate.

Abstract: A substrate transfer apparatus unloads a substrate from a transfer container in which a cover body airtightly closes a substrate unloading opening formed at a front surface of a container main body and multiple substrates are accommodated in the form of shelves. The substrate transfer apparatus includes a load port to which the transfer container is loaded; a detection unit configured to detect an accommodation status of the substrate in the container main body that is loaded to the load port and separated from the cover body; a substrate transfer device configured to enter the container main body and unload the substrate; and a correction device configured to correct the accommodation status of the substrate in the container main body before the substrate is unloaded from the container main body by the substrate transfer device when the detection unit detects abnormality in the accommodation status.

Abstract: An overhead-conveying transport bag for automatically unloading a loaded piece good includes a basic structure as well as a separate receiving device, which is arranged adjacent thereto. Unloading of the transport bag is performed through one of the front sides of the basic structure which is open and at least the lateral sides of the receiving device are formed such that the base is liftable into an unloading position of the transport bag, in which the base is lifted into the bottom of the basic structure.

Abstract: A carrier supporting apparatus is configured to support a carrier containing a plurality of plate-like objects to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of one object to be processed. The carrier supporting apparatus comprises a placing table adapted to place the carrier thereon, a lifting member that can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism. When raised, the lifting member raises a bottom face of the object to be processed, which is supported on a set of the lowermost supporting stages in the carrier, and lifts it up from the supporting stages.

Abstract: A system for unstrapping and unsleeving a tray is provided. The system comprises a tray-transport configured to transport a tray in the system, a strap cutter configured to cut a strap on the tray, a strap-removal portion configured to remove the strap cut by the strap cutter, and an unsleeving station configured to remove a sleeve from the tray. The unsleeving station is configured to remove the sleeve from the tray after the strap-removal portion removes the cut strap.

Abstract: An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.

Abstract: A device for unloading a container having a removal opening has a rotatably mounted supporting surface mounted to turn around a first turning axis, a rotatably mounted retaining device, and a synchronizing device. The unloading device causes a container on the supporting surface to tilt so that the removal opening of the tilted container points obliquely or vertically downwards. The retaining device prevents an article inside the tilted container from moving linearly through the removal opening. The retaining device is mounted to turn around a second turning axis. The synchronizing device is configured for synchronizing turning of the supporting surface around the first turning axis and the retaining device around the second turning axis. The synchronized turning of the supporting surface and retaining device causes the container standing on the supporting surface to tilt such that the removal opening of the tilted container points obliquely or vertically downwards.

Abstract: A target position detection apparatus for a robot includes: a robot including an arm configured to be freely moved in at least two directions of X and Y axes, the arm having a wrist axis provided at a distal end of the arm and configured to be freely moved in a horizontal direction, and the wrist axis being provided with an end effector; and a control unit adapted for driving a memory to store a teaching point therein and controlling an operation of the robot such that the end effector will be moved toward the teaching point stored in the memory.

Abstract: A substrate processing system includes a control section configured to control a series of transfer operations and preset to control operation of a container transfer apparatus, operation at a substrate access area, and operation of a substrate handling apparatus independently of each other. The control section includes a schedule creating portion configured to create a transfer schedule by individually adjusting operation timing of the container transfer apparatus, operation timing at the substrate access area, and operation timing of the substrate handling apparatus such that, in a state while a first lot of substrates are treated in the processing system, but the container transfer apparatus and the substrate access area are unoccupied, a container with a second lot of unprocessed substrates stored therein is transferred onto the substrate access area, thereby minimizing total transfer time.

Abstract: Automatically processing secure containers housing valuable documents includes receiving a secure container in a secure container processing unit, opening the secure container using an extraction module operatively coupled to the secure container processing unit, removing the valuable documents from the secure container using the extraction module, transferring the valuable documents to an external processing apparatus, and closing the secure container using the extraction module.

Abstract: A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism.

Abstract: A system for transporting and storing rod shaped articles, including a loading station, the loading station including an inlet aperture, an outlet aperture, a rotor rotatably disposed within the loading station, and a buffer container. The system also including an unloading station, the unloading station including an inlet aperture, a transfer conduit, a rotor rotatably disposed within the unloading station, and a buffer container. The system further including a mobile container selectively coupleable to the loading station and the unloading station, and further including an inlet/outlet aperture defined in a wall thereof and a plurality of translatable magazines disposed within the mobile container.

Abstract: In one embodiment, a method can include providing first and second intermediate structures, each having first and second surfaces. Also, the method can include placing the first surface of the first intermediate structure adjacent to the first surface of the second intermediate structure, such that the first and second intermediate structures are in a stacked relationship. Additionally, the method can include simultaneously removing at least a portion of each of the second surfaces of the first and second intermediate structures while in the stacked relationship. Furthermore, the method can include forming a plating layer on each of the first and second surfaces of each of the first and second intermediate structures. Moreover, the method can include forming a magnetic layer on the second surface but not the first surface of each of the first and second intermediate structures.

Abstract: A system and method for stocking and/or restocking shelves. The system includes a support member and a top platform coupled to the support member. The top platform is configured to receive at least one of a container of product and individual items to be at least one of stocked and restocked. The system includes a base portion coupled to the support member, wherein the base portion is configured to facilitate positioning the system relative to a shelf to be at least one of stocked or restocked. A height of the top platform is configured to be adjusted to a user-selected height and fixed at the user-selected height prior to receiving the at least one of the container of product and the individual items.

Abstract: A manufacturing apparatus and associated method for handling disks disposed in merged pairs in a carrier is provided, wherein spacings between adjacent pairs of the disks are greater than spacings between disks forming each pair. The apparatus includes a first disk contacting surface defining a first cavity that is sized to receivingly engage a selected one of the pairs of disks. A second disk contacting surface defines second and third cavities that are sized to receivingly engage individual disks of the selected pair of disks, wherein disks that are operably engaged in the cavities are spatially separated more adjacent the second disk contacting surface than at the first disk contacting surface.

Abstract: An automatic product distribution system is disclosed. The product distribution system includes a distribution platform and a transportation platform. The distribution platform is used for distributing the products in the main storage unit into the secondary storage unit. The transportation platform is used for transporting the main storage unit and the secondary storage unit. The transportation platform transports the main storage unit and the secondary storage unit to the distribution platform and the distribution platform executes a distribution operation. After the distribution operation is finished, the transportation platform transports the secondary storage unit out of the distribution platform and transports another secondary storage unit to the distribution platform so that the distribution platform executes a distribution operation again. Thereby, the distribution platform can continuously execute the distribution operations.

Abstract: A wafer transfer machine transfers wafers from either of a first wafer cassette (55) and a second wafer cassette (56) having incompatible registration features into the other, and includes a support plate (30) having a top surface (38) for supporting the first and second wafer cassette. A first and second registration bosses attached to the top surface extend upward into registration features of the first and second wafer cassette, respectively. A carriage (1) is supported by and movable in opposite directions along a track mechanism (41A,B) that is attached in fixed relationship to the support plate (30). First and second wafer pushing members (10A,B) are supported by the carriage. Each wafer pushing member can be moved to push wafers in one of the wafer cassettes into the other by moving the carriage in one direction or the other.

Abstract: A disk processing device holds and rotates a disk with a spindle. Processing tapes are supplied out and wound up by a tape reel unit so as to sandwich and be pressed on both surfaces of the disk through contact rollers. As a crankshaft is rotated, a sliding plate rotates around it and a slidable shaft rotates around a fulcrum part while sliding along the sliding plate such that the contact roller undergoes a reciprocating motion in a radial direction of the disk together with a slider rotatably attached to the slidable shaft.

Abstract: A package removal device is for removing a package (5) from a component band (1) to expose a carrier band (2). The package removal device includes a stand (10), a first scrolling unit includes a first gear (52), and a second scrolling unit includes a second gear (85). The stand includes a platform (12) with an import end (14a) and an export end (14b). The export end includes a locating gear (18) mounted thereon, a first exit (24), and a second exit (22). The component band is separated into the package and the carrier band in the export end. The first gear meshes with the second gear to output the package from the first exit. The locating gear engages the carrier band to output the carrier band from the second exit.

Abstract: An apparatus for feeding components from a packaged component band includes a stand defining a platform allowing the packaged component band passing therealong, a first guiding unit installable to the stand beside the platform, and a second guiding unit installable to the stand next to the another end of the platform. The first guiding unit is urged to remove a package from the packaged component band to expose components at one end of the platform and guides the package toward another end of the platform. The second guiding unit accepts the package from the first guiding unit and accelerates movement of the package passing therethrough. The second guiding unit includes a first friction pulley urged to rotate, and a second friction pulley rotatably movable together with the first friction pulley and engagable with the package when the package engagably passes therethrough.

Abstract: A device for unloading a container having a removal opening has a rotatably mounted supporting surface mounted to turn around a first turning axis, a rotatably mounted retaining means, and a synchronizing means. The unloading device causes a container on the supporting surface to tilt so that the removal opening of the tilted container points obliquely or vertically downwards. The retaining means prevent an article inside the tilted container from moving linearly through the removal opening. The retaining means is mounted to turn around a second turning axis. The synchronizing means is configured for synchronizing turning of the supporting surface around the first turning axis, wherein the retaining means turns around the second turning axis. The synchronized turning of the supporting surface and retaining means causes the container standing on the supporting surface to tilt such that the removal opening of the tilted container points obliquely or vertically downwards.

Abstract: A portable medical waste disposal assembly that offers convenience and safety during use, disposal and maintenance of the disposal assembly. The portable and sanitizable medical waste disposal assembly includes a waste receptacle mounted within a unitary frame providing increased strength and stability to the disposal assembly so as to facilitate transport and sanitization. A positive closure system mounts to the unitary frame and operably interconnects to a slidable lid on the waste receptacle such that the waste receptacle is maintained in a closed disposition unless specifically opened by a user. The positive closure system can be adapted so as to adjustably retain the waste receptacle within the unitary frame while allowing for quick release of the waste receptacle at a time of disposal of the receptacle's contents.

Abstract: Various methods and apparatus for simultaneously processing two single-sided hard memory disks is provided. Disks are positioned in pairs, with one surface of one disk positioned adjacent one surface of the second disk, with the disk surfaces touching or with a slight separation between them. In this back-to-back orientation, the disk pairs may be processed using conventional double-sided disk processing equipment and techniques. However, each disk will not have two active surfaces. Because of the positioning of the disks during processing, only one surface of each disk will be subjected to full processing. Therefore, each disk will only have one active side.

Abstract: A device for transporting a material strand, in particular a sticky plastic material strand. The device includes a transport unit for transporting the material strand and a discharge unit for discharging a separating powder. The discharge unit is arranged to apply the separating powder directly onto an underside of the material strand.

Abstract: A carrier tape for a tape and reel machine includes at least one edge having a plurality of sprocket openings therein. The carrier tape also includes a first row of aperture cavities and a second row of aperture cavities. Electrical components are contained in the first and second row of aperture cavities. In some embodiments, the electrical components carried are the same, and in other embodiments, the electrical components carried in the first row differ from the electrical components carried in the second row.

Abstract: A movable portion of a substrate carrier handler is extended into a transport path along which a substrate carrier transport system transports a substrate carrier, respective kinematic coupling events are detected between corresponding interface elements of the movable portion and the substrate carrier, respective signals are generated in response thereto, and an alignment offset between the substrate carrier and the substrate carrier transport system is determined based on the signals. A movable portion matches an elevation, position, and/or a speed/velocity of a substrate carrier moving along the transport path. Sensors for detecting kinematic coupling and generating signals in response thereto are provided on the movable portion. An end effector includes a support with interface elements and sensors for detecting kinematic coupling and generating respective signals.

Abstract: A semiconductor device producing apparatus is disclosed. The apparatus includes a carrier-holding stage for placing a carrier; first, second and third stages each for holding first and second boats one at a time, each boat holding one or more substrates; a boat transfer mechanism for transferring the boats among the first, second and third stages; and a substrate transfer mechanism for transferring the substrate(s) from the carrier to the boat held by the first stage. A controller controls the first stage, the boat transfer mechanism and the substrate transfer mechanism so that the boat transfer mechanism transfers one of the boats from the second stage to the first stage, the substrate transfer mechanism then transfers the substrate(s) from the carrier to the boat held by the first stage, and the first stage then moves the boat into the processing chamber for processing.

Abstract: A substrate handling robot includes an arm drive mechanism. A first arm is connected to the arm drive mechanism. A multiple substrate batch loader is connected to the first arm. A second arm is also connected to the arm drive mechanism. A single plane end effector is connected to the second arm. The multiple substrate batch loader produces a vacuum signal indicative of how many substrates are held by the multiple substrate batch loader. A vacuum signal interpreter alters the movement of the first arm in response to the substrate load number. An object sensor is connected to the second arm. The object sensor assesses the number of substrates in a cassette adjacent to the multiple substrate batch loader. A substrate loading sequence controller controls the first arm and the second arm in response to the number of substrates in the cassette, such that the second arm removes substrates from the cassette in such a manner as to facilitate complete loading of the multiple substrate batch loader.

Abstract: A semiconductor wafer transfer equipment transfers a plurality of semiconductor wafers, held in grooves of carriers in an erected state, to a boat using first and second wafer elevators equipped with a comb-teeth portion and a wafer grip and transfer unit. The first and second wafer elevators correspond to the carriers and the boat and are equipped with a position correction mechanism which corrects positions of comb-teeth openings of comb-teeth members provided on the comb-teeth portion, corresponding to semiconductor wafers housed in the grooves of the carriers.

Abstract: The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.

Abstract: Various methods and apparatus for handling a plurality of disks and repositioning them into pairs is provided. In one embodiment, a nest is configured to hold a cassette and includes a nest. The nest includes a curved surface with ribs or teeth extending therefrom which define a row of grooves. The grooves are dimensioned to hold a pair of disks in concentric contact merge orientation and the teeth facilitate movement of pairs of disks into the grooves.

Abstract: A robot constructed according to the present disclosure is adapted to grasp and move a plurality of wafers simultaneously. Such robot includes movable arm and wrist rotatably mounted thereto, with a multi-wafer robotic hand coupled to the wrist of the robot. Wafers can be transferred by inserting end effectors between the wafers in a receptacle, grasping the desired wafers, relocating the hand to another wafer receptacle, and releasing of the wafers into the second receptacle.

Abstract: A method and apparatus for automatically picking up hosiery articles (20) from a container (7), e.g., socks, knee socks, and the like in which an actuator (4) comprised of a support (5), to which a grasping device (6) is suspended, picks up the hosiery articles (20) at a loading position and moves them to an unloading position. The grasping device (6) is lowered into the container until the grasping device (6) contacts the free surface of the bulk of hosiery articles (20). The actuator (4) continues to be lowered according to a brief additional stroke and the grasping device (6) delays the closure even after a first contact with the free surface of hosiery articles (20). The grasping device (6) is then detected and closed onto hosiery articles (20) grasping at least one of them. The grasping device (6) them moves to the unloading position by means of the actuator (4) where the grasping device (6) opens and releases the hosiery article (20).

Abstract: Methods and apparatus for high speed workpiece handling are provided. The method for workpiece handling includes removing a workpiece from a first cassette with a first robot, transferring the workpiece from the first robot directly to a second robot without transferring the workpiece to a transfer station, placing the workpiece on a workpiece holder at a processing station with the second robot, and transferring the workpiece from the workpiece holder to the first cassette with the first robot following processing. End effectors of the first and second robots may each have a plurality of vertical positions for efficient workpiece handling. Displacement error and rotational error of the workpiece may be sensed and corrected without use of a transfer station. The methods and apparatus may be used for handling semiconductor wafers.

Abstract: The picking of a semiconductor chip from a foil takes place by means of a chip gripper which bears on a bondhead and can be deflected in a predetermined direction and with the aid of a needle. An inductive sensor serves the precise measurement of the deflection of the chip gripper with reference to the bondhead.

Abstract: A substrate storage cassette and a method of orienting a substrate disposed therein are provided. In one embodiment, the substrate storage cassette includes a plurality of flanges pairs disposed between a first lateral sidewall coupled in a spaced-apart relation to a second lateral sidewall. Each of the flange pairs adapted to support a substrate thereon. At least a first alignment feature disposed between the flange pair and adapted to mate with an orientation feature of the substrate when the substrate is in a predefined orientation.

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay: A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plurality of processing chambers for performing vacuum processing to the sample and a vacuum transfer means for transferring the sample. Both of the plan views of the cassette block and the vacuum processing block are nearly rectangular, and the width of the cassette block is designed larger than the width of the vacuum processing block, and the plan view of the vacuum processing apparatus is formed in an L-shape or a T-shape.

Abstract: A system, method, and apparatus, for resistor tube feeding is disclosed. A tube magazine comprising a length of tubing and adapted for receiving precision resistor cores and compressed air is disclosed. The tube magazine may be connected to a laser spiraller and a terminal welder. The process of filling the tube magazine may be electronically controlled.

Abstract: An article holder has sensors that detect whether an article held in the holder is a workpiece or a piece of packaging material. Examples are end effectors suitable for picking up semiconductor wafers and packaging material from a pod or some other carrier.