Abstract: An apparatus and method for removing an unvulcanized are tread from a storage device (14) includes the step of inverting the tread (12) and transporting it to a roller conveyor in a single step. The tread (12) is picked up by a vacuum bar (80) fitted with a series of suction cups (76). Individual suction cups (76) can be selectively supplied with vacuum depending on the length of the tread (12). After the suction cups (76) have engaged the tread, the tread is raised from the storage device (14), inverted through 180 degrees, and then set onto a special slotted roller conveyor (130). The slotted roller conveyor (130) has a center slot (142) to receive the vacuum bar (80) as it passes therethrough. Side slots (144,146) in the conveyor receive arms (90,92) attached to the vacuum bar (80).

Abstract: An apparatus and method for lifting, rotating, and positioning heavy objects using a toggle device attached to a prime mover. The toggle is vertical at rest and can be inserted into the opening in the side of a pipe. The toggle is rendered horizontal inside the pipe by the activation of a solenoid and the pipe can then be lifted by the prime mover. The pipe can be rotated to any desired fixed position by a hydraulic cylinder moving a piston through a piston sleeve having spiral grooves. The entire lifting and positioning of a heavy object with the toggle device can be completed by a single user operating from within the prime mover.

Abstract: A technique is disclosed that allows alignment of substrates on a run-to-run basis by using the position data of one or more previously aligned substrates to determine a setpoint of a pre-alignment process for one or more subsequent substrates. The setpoint may also be determined on the basis of a predefined characteristic of the substrates to be aligned.

Abstract: A workpiece changing system capable of automatically changing a heavy workpiece using a robot. A jig for attaching a workpiece thereto is mounted on a jig mounting device. The jig mounting device comprises a jig mounting unit having a rotary member and a swing member. The rotary member rotates the jig and the workpiece on the jig and hold them at a desired rotary position. The tilting member swings around an axis to tilt the jig and the workpiece on the jig and hold them at a desired tilting position. As the jig and the workpiece on the jig can take a suitable orientation or posture for being handled by the handling robot, the handling robot can hold a heavy workpiece without exerting excessive load on the robot wrist.

Abstract: A method and apparatus is provided for determining workpiece drift from its nominal or intended position. The apparatus includes two proportionate sensors, each of which gives an output reading that depends upon how much of the sensor beam is blocked by an edge of the workpiece. A computer can calculate positional drift based upon these readings. Also disclosed is a method for aligning proportionate sensors to be parallel to one another.

Abstract: A substrate transporting apparatus includes a wafer transfer arm 10 for carrying a plurality of semiconductor wafers W being processed horizontally, a pitch changer 20 for carrying the wafers W at predetermined intervals vertically and a posture changing device 30 positioned between the wafer transfer arm 10 and the pitch changer 20, for changing the posture of the wafers W to the horizontal and vertical arrangements. The pitch changer 20 includes a first holding part 21A and a second holding part 21B which are adapted so as to elevate relatively to each other. The wafers W are held by either one of the holding parts 21A, 21B at the predetermined intervals. The posture changing device 30 has a pair of holders 31 between which the semiconductor wafers W is interposed. The holders 31 are respectively provided, on their sides opposing each other, with a plurality of holding grooves 32A, 32B for retaining the wafers W independently.

Abstract: There is provided a processing system for processing a processing object, capable of precisely and efficiently carrying out alignment during a teaching operation.

Abstract: An automated system for preparing weld land areas of panels to be welded to each other is disclosed. Generally, the system of the present invention includes a system for cleaning contaminants from such weld land areas. In one embodiment, the system for cleaning contaminants includes a system for blasting carbon dioxide granules or pellets against the weld land areas. In instances where the panels comprise aluminum, the system may further include a system for removing at least a first layer of aluminum oxide from the weld land areas. In one embodiment, the system for removing includes a system for moving a plurality of sheets of sand paper over the weld land areas. For purposes of moving the panels relative to the system for cleaning contaminants and/or the system for removing at least the first layer of aluminum oxide, the automated system of the present invention may further include a shuttle system for supporting and moving at least the first panel therethrough.

Abstract: There is disclosed an apparatus for supporting singulated electronic devices during a testing operation, comprising: a main body and a support member, wherein said support member is made of non-conducting high-resistivity material and comprises a plurality of recesses, each said recess being adapted to receive an individual singulated device. There is also disclosed a method for testing such devices in which the devices are carried on support members through a testing process including one or more environmental control chambers.

Abstract: A cylindrical article is positioned relative to a support surface by supporting the cylindrical article from a first pair of ball bearings contacting the cylindrical article adjacent to its first end, and a second pair of ball bearings contacting the cylindrical surface adjacent to its second end. At least one of the ball bearings is moved relative to the cylindrical article to reposition the cylindrical article. The repositioning may be performed under feedback control of actuators that move the ball bearings. The article may be fixed relative to the support surface after it is properly positioned.

Abstract: An object of the present invention is to enable the orientations of chip components accommodated in groove portions of an index table to be assuredly uniformized. When a polarity judgment device finds that the orientation of the chip component accommodated in the groove portion of the index table is opposite, the polarity inversion apparatus according to the present invention moves the chip component to the component accommodating inversion portion by using compressed air and the intake air from air inlet/outlet ports. Since the bottom surface of the inlet of the inversion portion is set so as to be lower than the base surface under the index table and the width of the inlet of the inversion portion is set so as to be wider than the width of the groove portion, the chip component can move to the inversion portion without getting stuck in the vicinity of the boundary.

Abstract: An object engaging tool and method for using same for manipulating bottle shaped objects with a mechanical arm are described. A first and second contact surface of the object engaging tool engage the body of an object when positioned over the object while the object is resting upright. The position of the object engaging tool is changed generally downwardly so the weight of the object is transferred to the object engaging tool and is supported in cantilevered relation thereupon. The object is moved into position and placed on a resting surface whereupon the object engaging tool is disengaged when the weight of the object is transferred to the resting surface. The object engaging tool may further be positioned over the object when resting in a horizontal position and the object engaged and weight transferred to the object engaging tool by changing the position of the object engaging tool upwardly.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: A method, device and trays for transferring ophthalmic lenses from one work station to another. The first tray supports the lenses after release from the mold. The second tray supports the lenses during further processing including surface treatment. The articles are precisely placed and inverted as they are transferred from the first tray unto the second tray. Additionally, both sides of the ophthalmic lenses may be plasma reacted while supported on the second tray.

Abstract: An automated system for preparing weld land areas of panels to be welded to each other is disclosed. Generally, the system of the present invention includes a system for cleaning contaminants from such weld land areas. In one embodiment, the system for cleaning contaminants includes a system for blasting carbon dioxide granules or pellets against the weld land areas. In instances where the panels comprise aluminum, the system may further include a system for removing at least a first layer of aluminum oxide from the weld land areas. In one embodiment, the system for removing includes a system for moving a plurality of sheets of sand paper over the weld land areas. For purposes of moving the panels relative to the system for cleaning contaminants and/or the system for removing at least the first layer of aluminum oxide, the automated system of the present invention may further include a shuttle system for supporting and moving at least the first panel therethrough.

Abstract: A method of picking up components for delivery to a circuit board in a pick and place machine includes moving a plurality of components along a channel from a receiving location to a pick-up location; moving the components to an elevated zone at the pick-up location; pivoting the components on the elevated zone to a desired orientation; and picking up the components with a pick-up head.

Abstract: Apparatus for repositioning eggs from a generally vertical position to a generally horizontal position such that injection/removal of material into/from the side of the egg can occur are provided. Each apparatus may include a cradle, an alignment member, and an orientation member. The cradle has an inclined, arcuate surface with an upper portion, a lower portion, and opposite side portions. The arcuate surface upper portion is configured to receive an end of a generally vertically oriented egg and to cause the egg to slide toward the lower portion such that the egg becomes positioned on the lower portion in an inclined orientation. The alignment member is operably positioned adjacent the cradle and is configured to engage an egg positioned on the arcuate surface lower portion in an inclined orientation and to releasably secure the egg in a predetermined alignment relative to the cradle.

Abstract: Robot arm (16) end effectors (10, 110, 210) of this invention rapidly and cleanly transfer semiconductor wafers (12) between a wafer cassette (14) and a processing station. The end effectors include proximal and distal rest pads (24, 26, 124, 126) having pad and backstop portions (32, 34, 132, 134) that support and grip the wafer either by wafer peripheral edge contact or within an annular exclusion zone (30) that extends inward from a peripheral edge of the wafer. An active contact point (50, 150, 222) is movable by a vacuum actuated piston (52, 152) between a retracted wafer-loading position and an extended position that urges the wafer against the distal rest pads to grip the wafer at its edge or within the exclusion zone. The end effector further includes fiber optic light transmission sensors (90, 102, 202, 214) for determining various wafer surface, edge, thickness, tilt, and location parameters.

Abstract: A roll of wound material is upended or turned 90° by a pivotable cart and a conventional forklift apparatus. The roll is supported on a pallet and has a central opening which extends substantially vertically. The cart includes a pair of perpendicular walls and a roller which is mounted on the walls adjacent the intersection between the walls. The forklift first loads the pallet and the roll onto one of the walls of the cart which extends horizontally. The forklift is then arranged so that one of its tines is below said one horizontal wall and a second tine is laterally outward of the roller. The forklift is raised to pivot said one wall about the roller until the second wall pivots into engagement with the second tine. The fork lift is then lowered so that the second wall pivots into a horizontal position. The roll is then supported on the second wall with the central opening extending horizontally.

Abstract: A material handling method and apparatus for flipping a workpiece. The method involves raising a retracted arm out of the worksurface to pivot the workpiece up and away from an edge of the worksurface. The workpiece is then slid in the direction of the edge before being guided thought the remainder of its 180 degree rotation. The guiding step further slides the workpiece toward the edge so that the workpiece is flipped at least partially in place. The apparatus for carrying out the method includes an arm and catcher plate both having an idle position below the worksurface. Pneumatic drives under microprocessor control pivot, slide and flip the workpiece, at least partially in place. An optical sensor array monitors a peripheral area around the worksurface which may be smaller than the workpiece. The drives may be halted upon the array sensing movement of the workpiece beyond a certain distance from the worksurface periphery.

Abstract: A substrate transporting apparatus includes a wafer transfer arm 10 for carrying a plurality of semiconductor wafers W being processed horizontally, a pitch changer 20 for carrying the wafers W at predetermined intervals vertically and a posture changing device 30 positioned between the wafer transfer arm 10 and the pitch changer 20, for changing the posture of the wafers W to the horizontal and vertical arrangements. The pitch changer 20 includes a first holding part 21A and a second holding part 21B which are adapted so as to elevate relatively to each other. The wafers W are held by either one of the holding parts 21A, 21B at the predetermined intervals. The posture changing device 30 has a pair of holders 31 between which the semiconductor wafers W is interposed. The holders 31 are respectively provided, on their sides opposing each other, with a plurality of holding grooves 32A, 32B for retaining the wafers W independently.

Abstract: Specimen edge-gripping prealigners (8, 80) grasp a wafer (10) by at least three edge-gripping capstans (12) that are equally spaced around a periphery (13) of the wafer. Each edge-gripping capstan is coupled by a continuous synchronous belt (14) to a drive hub (15, 84) that is rotated by a drive motor (18, 88). The belts are tensioned by idler pulleys (22, 92) that are rotated by a motive force (25, 96, 102). The edge-gripping capstans and the drive drums are mounted to hinged bearing housings (28, 112) that are spring biased to urge the capstans away from the drive hub. Deactivating the motive force rotates the idler plates into a belt tensioning position that draws the capstans inward to grip the periphery of the wafer. Once gripped, rotation of the drive hub is coupled through the tensioned belts to the capstans. Driving all the capstans provides positive grasping and rotation of the wafer without surface contact with the wafer and thereby reduces wafer damage and particle contamination.

Abstract: A substrate arranging apparatus has a carrier support table 40 for supporting thereon carriers C holding a plurality of wafers in arranged in a row, first support mechanisms 42, 43 capable of moving upward relative to the table 40 to support the wafers contained in the carriers C, and a second support mechanism 60 capable of supporting the even or the odd wafers among the wafers supported by the first support mechanisms 60 and of raising the wafers supported thereon relative to the rest of the wafers. The first support mechanisms 42, 43 or the second support mechanism is able to turn through an angle of 180° relative to the other. As a result, the wafer are arranged in a front-to-front and back-to-back disposition. Thus, the carrier support table, the loader mechanism and the substrate arranging section are integrally combined and the time needed for the transfer of the wafers is shortened.

Abstract: In centering a transfer device so that tweezers of the transfer device transfer a substrate to a predetermined delivery position on a spin chuck when the substrate is delivered to a coating unit by means of the transfer device, the substrate is transferred onto the spin chuck in the coating unit by means of the tweezers, a positional deviation amount of the substrate with respect to the delivery position on the chuck is detected by a detecting device, a positional deviation amount of the tweezers is computed based on this detection value, and a position at which the tweezers deliver the substrate is corrected based on the positional deviation amount of the tweezers. Thus, centering of the substrate transfer device can be performed automatically in a short time.

Abstract: Specimen edge-gripping prealigners (8, 80) grasp a wafer (10) by at least three edge-gripping capstans (12) that are equally spaced around a periphery (13) of the wafer. Each edge-gripping capstan is coupled by a continuous synchronous belt (14) to a drive hub (15, 84) that is rotated by a drive motor (18, 88). The belts are tensioned by idler pulleys (22, 92) that are rotated by a motive force (25, 96, 102). The edge-gripping capstans and the drive drums are mounted to hinged bearing housings (28, 112) that are spring biased to urge the capstans away from the drive hub. Deactivating the motive force rotates the idler plates into a belt tensioning position that draws the capstans inward to grip the periphery of the wafer. Once gripped, rotation of the drive hub is coupled through the tensioned belts to the capstans. Driving all the capstans provides positive grasping and rotation of the wafer without surface contact with the wafer and thereby reduces wafer damage and particle contamination.

Abstract: A wafer orienting apparatus for aligning a plurality of semiconductor wafers each of which has a v-notch formed on its outer periphery. The apparatus includes a cassette process carrier for supporting the plurality of wafers in parallel wafer supporting slots and wafer supporting means engaging the periphery of each wafer in an individual slot with the central axis of all wafers in coaxial alignment A supporting platform is placed over the cassette for supporting the wafers in an inverted position in which the wafers are substantially vertical and biased by their own weight against a multiplicity of orienting mechanisms. The orienting mechanisms are arranged to correspond to each wafer position within the cassette. The plurality of orienting mechanisms are integrated with the supporting platform so that all wafers within the cassette can be aligned during this aligning process.

Abstract: The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Abstract: A system for flipping a semiconductor workpiece on its thin edge for microscope inspection of a workpiece facet is disclosed. The system has a holding device attached to a handling block. The holding device picks a workpiece by one of its thin edges. The edge of the workpiece may be attached to the holding device by vacuum. Then an operator rotates the handling block ninety degrees, which in turn rotates the holding device and workpiece ninety degrees. After rotation, one of the workpiece facets faces upward and perpendicular to the microscope for proper inspection of the facet.

Abstract: A coil handling system, and a method of operating the same, comprises an indexer assembly having a pair of rotatable spindles mounted thereon for supporting a coil of material upon which binding straps are to be placed at predetermined circumferential positions by a strap binding assembly when the rotatable spindles index the coil of material to the predetermined circumferential positions.

Abstract: An apparatus and method for positioning packaged semiconductor devices having different rectangular shapes and sizes. A positioning apparatus includes an adjustable alignment guide releasably coupled to a base. The adjustable alignment guide may be positioned along a first axis to partially define a recess into which the packaged semiconductor devices are placed during positioning. The positioning apparatus may also include additional adjustable alignment guides that may be positioned along the first or a second axis to further define the recess into which the packaged semiconductor device is to placed during positioning. The adjustable alignment guides may have alignment surfaces against which the integrated circuit rests when placed into the recess that is partially defined by the alignment surfaces.

Abstract: An assembly for turning bundles includes a planar surface that receives bundles from an upstream station. A sensor detects movement of the bundle toward the surface and initiates a timing sequence. The sequence includes slowing the bundle over the surface so that it does not contact the stop at high speed. The stop is then retracted after the bundle movement is terminated and a portion of the surface is lifted and rotated through approximately ninety degress to re-orient the bundle. After the bundle is lowered to the planar surface, it is then advanced by a drive assembly from the surface toward a downstream station.

Abstract: A wafer orienting apparatus for aligning a plurality of semiconductor wafers each of which bas a v-notch formed on its outer periphery. The apparatus includes a cassette process carrier for supporting the plurality of wafers in parallel wafer supporting slots and wafer support means engaging the periphery of each wafer in an individual slot with the central axis of all wafers in coaxial alignment. A supporting platform is placed over the cassette for supporting the wafers in an inverted position in which the wafers are substantially vertical and biased by their own weight against a multiplicity of orienting mechanisms. The orienting mechanisms are arranged to correspond to each wafer position within the cassette. The plurality of orienting mechanisms are intergrated with the supporting platform so that all wafers within the cassette can be aligned during this aligning process.

Abstract: This invention provides a wafer inspecting apparatus which enables macroscopic inspection of the entire surface of a wafer. According to the wafer inspecting apparatus of this invention, the edge portion of a wafer 8 is held by suction with the distal ends of wafer holding portions 702 of a wafer holding arm 7, and first-time observation of the lower surface of the wafer 8 is performed. Then, the wafer 8 is transported onto a center table 6. The center table 6 is rotated through a predetermined angle. The edge portion of the wafer 8 is held by suction again with the distal ends of the wafer holding portions 702 of the wafer holding arm 7. Then, second-time observation of the lower surface of the wafer 8 is performed.

Abstract: Apparatus for detection of an edge of a generally disk-shaped workpiece, such as a semiconductor wafer, includes a light source positioned to direct a light beam at the surface of the workpiece near the edge thereof such that a first part of the light beam passes the workpiece and a second part of the light beam is intercepted by the workpiece. An angle between the light beam and a normal to the surface is equal to or greater than a critical angle that produces total internal reflection of the light beam in the workpiece. The apparatus further includes a mechanism for rotating the workpiece and a light sensor positioned to sense the first part of the light beam and to generate an edge signal that represents the edge of the workpiece as the workpiece is rotated. The apparatus may be used for sensing orientation and location of semiconductor wafers of different materials, including those which are transparent to the light beam.

Abstract: A stepper alignment method and apparatus for transferring circuit layout on a mask to a wafer precisely includes a stepper located in a susceptor and includes a vacuum chuck and a movable vacuum chuck. The wafer has two notches on its perimeter. The vacuum chuck has two sets of photo sensors mating against the notches and a central circular opening for housing the movable vacuum chuck therein. The movable vacuum chuck holds the wafer by means of vacuum force and is able to rotate and move linearly to align the notches of the wafer against the photo sensors accurately at high speed.

Abstract: A method and system are provided for flipping a tray of parts such as integrated circuit packages including a pair of flippable storage trays. A first storage tray has an upper surface which forms a grid of storage compartments wherein each of the storage compartments is adapted to hold a single integrated circuit package. Initially, the first tray is received at a flip station from a first part processing station. Then, the first and second trays are joined together so that they mate. Then, the mated first and second trays are inverted so that the packages are held in the second tray. Then, the first and second trays are separated and the second tray which now holds the plurality of packages is transferred to a second part processing station. Then, the cycle is repeated with a third tray of parts and the now empty first tray.

Abstract: Medicaments on a first pallet are transferred onto a second pallet, thereby reorienting the medicaments. The first pallet is received on a first lift plate and the second pallet is received on a second lift plate in vertical opposition to the first lift plate. A lift mechanism urges the first and second lift plates towards one another and the first and second lift plates are inverted so that the medicaments are transferred from said first pallet to said second pallet.

Abstract: A device and method for the automated rotating of semiconductor objects during the fabrication process is disclosed. The device uses a slotted base fixture with a channel, lifting members with ducts, and a vacuum. Semiconductor objects are rotated from a vertical position to a substantially horizontal essentially evenly spaced parallel configuration. The positioning of the semiconductor objects by the device is such that the facet end of each semiconductor object remains undisturbed. The configuration of the semiconductor objects allows for quick and easy transfer to a storage surface or transfer to further semiconductor processing steps.

Abstract: A method and apparatus for inverting planate articles, such as door and window assemblies, which are supported from below in the horizontal plane, such as at a workstation for carrying out fabrication procedures from above the article. The article is tilted to a near vertical position at a tilting station, moved horizontally away to provide clearance from the tilting station, rotated a half turn about its vertical axis, returned to the tilting station and tilted back to the horizontal attitude with the original underside now on top. A tilt table that rotates around a transverse axis intermediate its length supports the article at the horizontal and tilts it to the near vertical attitude. A carriage receives the tilted article from the tilt conveyer and supports it at the near vertical by a turntable on the carriage having supports that engages the leading end and back side of the article.

Abstract: A method for grasping, aligning and orienting an object uses first and second rotatable arm members each having object holders, respectively. An object holder each comprises a vacuum recess and alignment features to align the object in a fixed position in its respective vacuum recess. Rotation of first rotatable arm member into abutting contact with second rotatable arm member forms a formable vacuum chamber. Partially closed vacuum chamber has a closed end for positioning the object, a first wall defined by the first vacuum recess, an opposing spaced apart second wall defined by the second vacuum recess and an open end between the first and second walls for receiving the object in the partially closed vacuum chamber.

Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.

Abstract: The invention, in its various embodiments is a method and apparatus for uniformly orienting shafts which contain an operational feature on one end and which are blunt on the other end. In one aspect of the present invention, a machine feeds the shafts onto a surface containing one or more slots, where the slots are shaped to completely receive a shaft only when the shaft is in a preferred orientation. Shafts which are in the preferred orientation are oriented 180.degree. differently from shafts which are not in the preferred orientation. Shafts which are not in the preferred orientation will be dislodged from the slots and sent down a first exit chute. Shafts which are in the preferred orientation are sent down a second exit chute. The method comprises dispensing the shafts into slots on a surface where the slots are shaped to completely receive a shaft only when the shaft is in a preferred orientation, and selectively removing shafts which are not in the preferred orientation from the slots.

Abstract: A method and device for handling fabrication articles in an electronics application includes a pickup head with an array of article-holding slots aligned to receive the articles and includes a drive mechanism for tilting the pickup head. Cantilevered support members, such as support rods, have first ends attached to the pickup head and are arranged to form article-receiving regions that are generally aligned with the article-holding slots. In the preferred embodiment, the article-holding slots have a geometry for supporting the fabrication articles when the support members are in an upright condition, i.e. when the articles are vertically oriented. Also in the preferred embodiment, the device includes stops that prevent the articles from entering the slots when the support members are in a horizontal condition. The stops provide a controlled exit and entrance of the articles from and into the slots as the pickup head is tilted, thereby reducing the risk of breakage.

Abstract: A magnetic alignment apparatus (20) is provided for aligning a semiconductor die (11) and a packaging substrate (12) to enable aligned mounting therebetween. The alignment apparatus (20) includes a first magnetic device (23) coupled to the die (11) and adapted to generate a first magnetic field (25) oriented relative to a first reference point (26) of the die (11). A second magnetic device (27) is coupled to the substrate (12) and adapted to generate a second magnetic field (28) oriented relative to a second reference point (30) of the substrate (12). The first magnetic field (25) and the second magnetic field (28) cooperate to directionally align the first reference point (26) of the die substantially with the second reference point (30) of the substrate (12).

Abstract: A method of transporting a laser bar, such as from a facet coat holding fixture, and an apparatus for implementing the same. A vacuum collet is automatically positioned at a predetermined position vertically and horizontally offset with respect to a facet of the laser bar. A vacuum is then applied to the vacuum collet to pull the laser bar against it and hold the laser bar in place. Since the vacuum collet is offset horizontally as well as vertically from the bar, the laser bar flips by 90.degree. when the vacuum is applied such that the laser bar longitudinal surface winds up abutting a bottom surface of the vacuum collet, and contact with the laser bar facets is substantially avoided. The vacuum collet is then transported while the vacuum is maintained to thereby transport the laser bar.

Abstract: A method and apparatus for flipping or rotating a component 180 degrees. The apparatus includes a rotatable plate having a component opening where the component may pass through and a top and a bottom shutter where when the plate is rotated in a first direction, the top shutter closes and the bottom shutter opens and when the plate is rotated in a second, opposite direction, the bottom shutter closes and the top shutter opens. The top shutter and the bottom shutter may be coupled to a proximal and distal cam following bearing where the proximal and distal cam following bearings are located within a proximal and distal cam slot of a cam barrel.

Abstract: A fan shipping frame includes a frame assembly for supporting a loaded fan section of a jet aircraft engine. A plurality of caster assemblies attached to the shipping frame provide locomotive capability and adjustable height positioning so that a loaded fan section may be transferred onto the appropriate transport aircraft or vehicle. Rail members mounted on the frame assembly are alignable with rail members of a fan dolly so that the fan section may be directly transferred from the fan dolly onto the shipping frame. A template integral with the shipping frame enables the fan section to be mounted thereon. A platform assembly rotatably mounted to the shipping frame may be deployed to enable the fan section to be tilted or tipped from a vertical transport position to a horizontal transport position wherein the shipping frame may be transported in either position. A storage container mounted on the shipping frame stores the removed fan blades of the fan section in either position.

Abstract: A transfer device for wafers stacked in magazines has a vertically displaceable frame of a platform, with which the cover of the box surrounding the magazine in the closed condition. The magazine remains in the original position on the base of the box and is then supplied by a gripping device from this position to a processing system in which the wafers are removed from the magazine and are processed. A gripping device preferably has two extension arms arranged on both sides of the magazine as well as one stop element which can be caused to impact on the wafer edges. The stop element preferably has two lips consisting of an elastic material which lips can be caused to impact on the wafer edges. The device permits a very fast loading and unloading into or out of the processing system.

Abstract: A unitary prealigner and robot arm includes an upper arm, a forearm, and a hand that is equipped with vacuum pressure outlets to securely hold a specimen. The robot arm is carried atop a tube that is controllably positionable along a Z-axis direction. The prealigner is attached to the tube by a movable carriage that is elevatable relative to the robot arm. The prealigner further includes a rotatable chuck having a vacuum pressure outlet for securely holding a specimen in place within an edge detector assembly that senses a peripheral edge of the specimen. The prealigner may be elevated to receive a specimen from the robot arm or it may be lowered to allow clearance for the robot arm to rotate. In operation, the robot arm retrieves a specimen and places it on the prealigner, which performs an edge scanning operation to determine the effective center and specific orientation of the specimen.

Abstract: A vacuum collet for handling semiconductor piece parts is formed to include a plurality of separate vacuum ports, disposed in proximity to one another. By selectively turning the vacuum ports "on" and "off", with only one vacuum port turned "on" at a time, a semiconductor chip may be articulated through various 90.degree. rotations to provide the orientation required for placement of the semiconductor chip on a final assembly.