Abstract: The invention relates to a material for electrodes to be used in resistance welding. The working life of electrodes, particularly of those to be used in the spot welding of coated sheets, is now relatively short. The invention introduces a new electrode material in the form of a copper alloy containing, in addition to the conventional ingredients, at least 20 ppm tellurium or other chalcogene, such as selenium or sulphur; owing to this new electrode material according to the invention, the service life of an electrode increases substantially.

Abstract: The subject of this invention is the development of new alloys along with new processing approaches for the utilization of the alloys. A particular class of alloys comprises at least one noble metal selected from the group comprising gold, palladium, silver and copper and an amount of between about 0.20 weight percent and about 0.80 weight percent of at least one metalloid selected from the group of metalloids consisting of boron, phosphorous, silicon and lithium. Rapid solidification technology in powder fabrication and the addition of metalloids have been combined to produce a new class of palladium based alloys. The metalloid additions greatly increase the hardness, enhance the fine grain structure and aid sintering densification. Net-shape forming is a benefit derived from the characteristics of the new alloys.

Abstract: The present invention relates to a copper wire for use in sound or image reproducing systems, such as audio, video and television systems, etc., and a method for manufacturing the same. The copper wire consists of high purity copper in which silver and sulfur contents are both not more than 0.5 ppm and preferably has a crystal grain size not less than 0.02 mm and is unidirectionally solidified or single crystallized. Such a copper wire is manufactured by continuously casting electrodeposited copper which has been obtained by refining by re-electrolysis of electrolytic copper, using a specially arranged casting apparatus having a mold projecting to an electrolytic bath.

Abstract: An enhanced machining oxygen-free copper alloy is provided which contains at least 0.02% by weight silver and from 25 to 100 parts per million sulfur. The copper alloy is anneal resistant and has sufficient ductility to permit cold working.

Abstract: New alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2 (where x ranges between 0 and 1 and preferably has a value of about 0.75) and CuIn.sub.y Ga.sub.(1-y) Se.sub.2 (where y ranges between 0 and 1 and preferably has a value of about 0.90) in the form of single crystals with enhanced structure perfection, which crystals are substantially free of fissures are disclosed. Processes are disclosed for preparing the new alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2. The process includes placing stoichiometric quantities of a Cu, Ag, In, and Se reaction mixture or stoichiometric quantities of a Cu, In, Ga, and Se reaction mixture in a refractory crucible in such a manner that the reaction mixture is surrounded by B.sub.2 O.sub.3, placing the thus loaded crucible in a chamber under a high pressure atmosphere of inert gas to confine the volatile Se to the crucible, and heating the reaction mixture to its melting point.

Abstract: Reactive metal-precious metal ductile alloys containing controlled amounts of Cu and Ni and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: A silver-copper-titanium brazing alloy foil was produced by a rapid solidification processing method(s). The composition ranged from 10 to 50 weight percent copper, 0.1 to 9.5 weight percent titanium and the balance silver. Since the method provides high cooling rates, at least 10000.degree. C. per second, unique alloy structures and properties were obtained. This resulting foil can be used in the as cast form, it can be rolled down to a thinner dimension having also a more uniform surface finish, or it can be punched into preforms.

Abstract: A liquid metal ion source for emitting P ions, wherein a Cu alloy which contains at most 25 at. % of P and if necessary, further contains Ag, C or Si, and/or B is melted and fed to an emitter tip so as to generate an ion beam under a high electric field.

Abstract: Titanium-silver alloys containing specified amounts of silver and titanium and controlled amounts of copper, aluminum and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials. These alloys also may contain controlled amounts of tin, palladium, indium and mixtures thereof.

Abstract: Reactive metal-precious metal ductile alloys containing controlled amounts of Cu and Ni and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: Brazing alloys of copper-indium-titanium alloy can be used to braze ceramic to metal. Other elements such as gold, manganese, palladium, nickel, aluminum, tin singly or in combination can also be added.

Abstract: A contact material for a vacuum circuit breaker consists essentially of copper as the basic component, and, as the other components, 35% by weight or below of chromium and 50% by weight or below of tantalum, the total quantity of chromium and tantalum in said contact material being 10% by weight and above.

Abstract: A method for the preparation of electrolytic manganese dioxide is provided employing improved cathodes, said cathodes being characterized by their reduced tendency to corrode and undergo buildup of current inhibiting scale under electrolytic conditions. The improved cathodes are fabricated from copper comprised of at least about 99.95 weight percent of copper, from about 0.001 to about 0.085 weight percent of silver and up to about 0.003 weight percent of phosphorous. The weight ratio of phosphorous to silver in said copper cathode will be no greater than about 2.0 to 1.0.

Abstract: Anticorrosion copper alloy essentially consisting of 4.5-32 wt % of Ni, 0.3-2.5 wt % of Fe, one or more elements selected from 0.01-1.0 wt % of In, 0.003-0.2 wt % of Pd and 0.003-0.1 wt % of Pt, and the balance of Cu and normal impurities. Further, an anticorrosion copper alloy essentially consisting of 4.5-22 wt % of Ni, 1.3-2.5 wt % of Fe, one or more elements selected from 0.1-1.0 wt % of In, 0.01-0.2 wt % of Pd and 0.01-0.1 wt % of Pt, and the balance of Cu and normal impurities; and said Fe being kept in a state of solid solution in a matrix of said copper alloy.