Phosphorus, Arsenic, Antimony, Or Bismuth Containing Patents (Class 420/499)
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Patent number: 5334346Abstract: This invention relates to a high performance copper alloy and its manufacturing methods for electrical and electronic parts which have good electrical conductivity, superior mechanical properties, and high thermal stability of tin-lead plating. The copper alloy consisting essentially of copper and from copper-nickel-silicon-phosphor-magnesium alloys for semiconductor leadframe alloys consisting essentially of copper and from 0.5 to 2.4% by weight nickel, from 0.1 to 0.5% by weight silicon, from 0.02 to 0.16% by weight phosphorus, and from 0.02 to 0.2% by weight magnesium.Type: GrantFiled: February 18, 1993Date of Patent: August 2, 1994Assignees: Poongsan Corporation, Young G. KimInventors: Young G. Kim, In Y. Hwang
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Patent number: 5286444Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.Type: GrantFiled: June 18, 1992Date of Patent: February 15, 1994Assignee: Taiho Kogyo Co., Ltd.Inventors: Takashi Tomikawa, Yoshio Kumada
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Patent number: 5167726Abstract: Lead inclusion in copper-containing wrought alloys is coming into disfavor due to health and environmental considerations. Machinability, as well as retention of workability properties, associated with lead inclusion are assured by bismuth together with a modifying element, phosphorous, indium or tin, with such modifying element minimizes the workability-precluding embrittlement otherwise associated with bismuth. Fabrication of product dependent upon properties of the large variety of lead-containing alloys is so permitted by use of lead-free material.Type: GrantFiled: May 15, 1990Date of Patent: December 1, 1992Assignee: AT&T Bell LaboratoriesInventors: Dominic N. LoIacono, John T. Plewes
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Patent number: 5137685Abstract: Machinable copper alloys having a reduced lead concentration are disclosed. An additive to the alloy accumulates both at the grain boundaries and intragranularly. The additive facilitates chip fracture or lubricates the tool. One additive is a mixture of bismuth and lead with the lead concentration below about 2% by weight.Type: GrantFiled: March 1, 1991Date of Patent: August 11, 1992Assignee: Olin CorporationInventors: David D. McDevitt, Jacob Crane, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh
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Patent number: 5077005Abstract: There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of______________________________________ 10-100 ppm In (indium), 10-1000 ppm Ag (silver), 10-300 ppm Cd (cadmium), 10-50 ppm Sn (tin), 10-50 ppm Sb (antimony), 3-30 ppm Pb (lead), 3-30 ppm Bi (bismuth), 3-30 ppm Zr (zirconium), 3-50 ppm Ti (titanium) and 3-30 ppm Hf (hafnium), ______________________________________and the balance copper. S (sulfur) and O (oxygen) as unavoidable impurities are controlled to amounts of less than 3 ppm S, and less than 5 ppm O, respectively. Other unavoidable impurities are controlled to less than 3 ppm in total amount. The alloy is very suitable for applications such as forming magnet wires and other very thin wires, lead wires for electronic components, lead members for tape automated bonding (TAB) and the like, and members for printed-circuit boards.Type: GrantFiled: February 27, 1990Date of Patent: December 31, 1991Assignee: Nippon Mining Co., Ltd.Inventor: Masanori Kato
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Patent number: 5066456Abstract: A phosphorous copper based alloy having combined tin and antimony contents up to approximately six percent each for brazing filler metal joining copper and copper alloys producing strong clean joints at lower brazing temperatures. Silver added in amounts of 1-18% offers the ability to lower brazing temperatures further.Type: GrantFiled: August 10, 1990Date of Patent: November 19, 1991Assignee: J. W. Harris Co., Inc.Inventors: Richard E. Ballentine, Joseph W. Harris
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Patent number: 5019157Abstract: Disclosed is a method of making a eutectic mixture of copper and tricopper phosphide by reacting elemental copper with phosphine. The elemental copper is heated to a temperature above about 714.degree. C. and the liquid eutectic mixture runs off of the cooper as it is formed, exposing more copper for reaction. The liquid eutectic mixture can be used as a source of copper and phosphorus in making metal alloys.Type: GrantFiled: July 24, 1989Date of Patent: May 28, 1991Assignee: Occidental Chemical CorporationInventors: Harry E. Buckholtz, George T. Miller
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Patent number: 4971758Abstract: A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3% Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, and the balance of Cu and inevitable impurities. The copper-based alloy connector can withstand use for a long term in a high-temperature and high-humidity environment.Type: GrantFiled: April 18, 1990Date of Patent: November 20, 1990Assignee: Mitsubishi Shindoh Co., Ltd.Inventors: Takeshi Suzuki, Tadao Sakakibara, Seiji Noguchi, Takao Fukatami
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Patent number: 4853184Abstract: The invention relates to contact material for vacuum interrupter, and in order to be splendid in the breakdown voltage ability and increase the interrupting ability, a contact material is constituted by containing copper and chromium, and moreover adding one component selected from silicon, titanium, zirconium and aluminum as another component, and is used in a vacuum interrupter.Type: GrantFiled: December 16, 1985Date of Patent: August 1, 1989Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Naya Eizo, Nagata Yoshikazu, Horiuchi Toshiaki, Okumura Mitsuhiro, Demizu Michinosuke, Harima Mitsuhiro, Asakawa Shigeki, Asakawa Masuo
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Patent number: 4732732Abstract: A phosphor bronze alloy excellent in migration resistance, which containing from 3.0 to 9.0% by weight of Sn, from 0.03 to 0.35% by weight of P, from 1.0 to 5.0% by weight of Zn, and the substantial balance of Cu and impurities. The phosphor bronze alloy according to this invention is excellent in the migration resistance as comparable with that of brass without degrading the solderability or electrical conductivity.Type: GrantFiled: November 13, 1986Date of Patent: March 22, 1988Assignee: Kabushiki Kaisha Kobe Seiko ShoInventors: Motohisa Miyafuji, Yasuhiro Nakashima, Isao Hosokawa
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Patent number: 4717436Abstract: The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. In accordance with one aspect of the present invention, at least one rare earth element, or at least one element selected from the group consisting of Mg, Ca, Ti, Zr, Hf, Li, Na, K, Rb and Cs, or the combination of at least one rare earth element and at least one elemented selected from the above-specified group is incorporated in high-purity copper as a refining component in an amount of 0.1-100 ppm on a weight basis, and the high-purity copper is subsequently refined by zone melting. The very fine wire drawn from the so refined high-purity copper has the advantage that it can be employed in high-speed ball bonding of a semiconductor chip with a minimum chance of damaging the bonding pad on the chip by the ball forming at the tip of the wire.In accordance with another aspect of the present invention, 0.Type: GrantFiled: April 9, 1987Date of Patent: January 5, 1988Assignee: Mitsubishi Kinzoku Kabushiki KaishaInventors: Naoyuki Hosoda, Masaki Morikawa, Naoki Uchiyama, Hideaki Yoshida, Toshiaki Ono
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Patent number: 4710349Abstract: A highly conductive copper-based alloy containing 0.001 percent to 0.02 percent of tellurium, 0.05 percent to 0.3 percent of one element selected from iron and chromium, and 0 percent to 0.01 percent of phosphorous with the balance being copper and incidental impurities.Type: GrantFiled: March 5, 1987Date of Patent: December 1, 1987Assignee: Sumitomo Metal & Mining Co., Ltd.Inventors: Shinsuke Yamazaki, Rikio Takeda, Iwao Uda
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Patent number: 4704253Abstract: A copper alloy for use in the manufacture of a radiator fin contains 10 to 150 ppm of tellurium and 20 to 110 ppm of phosphorus, both by weight, as well as copper and unavoidable impurities.Type: GrantFiled: January 8, 1986Date of Patent: November 3, 1987Inventors: Shinsuke Yamasaki, Hajime Izumimori
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Patent number: 4631237Abstract: A wire electrode for a spark-eroding system for erosion cutting of workpieces using intermittent electrical charges includes a core of a current-conducting material and a wire coating of a material with a lower evaporation temperature, for example zinc. The core consists of one of the following alloys according to DIN (German Industrial Standard) 17666:(a) Cu Mg 0.4;(b) Cu Fe 2P;(c) Cu Cr Zr;(d) Cu Zr.Type: GrantFiled: April 17, 1985Date of Patent: December 23, 1986Assignee: Berkenhoff GmbHInventors: Erich Dommer, Heinrich Groos
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Patent number: 4624833Abstract: A liquid metal ion source for emitting P ions, wherein a Cu alloy which contains at most 25 at. % of P and if necessary, further contains Ag, C or Si, and/or B is melted and fed to an emitter tip so as to generate an ion beam under a high electric field.Type: GrantFiled: November 26, 1984Date of Patent: November 25, 1986Assignee: Hitachi, Ltd.Inventors: Kaoru Umemura, Tohru Ishitani, Toshiyuki Aida, Hifumi Tamura
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Patent number: 4575451Abstract: A contact material for a vacuum circuit breaker consists essentially of copper as the basic component, and, as the other components, 35% by weight or below of chromium and 50% by weight or below of niobium, the total quantity of chromium and niobium in said contact material being 10% by weight and above.Type: GrantFiled: November 16, 1983Date of Patent: March 11, 1986Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Eizo Naya, Mitsuhiro Okumura
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Patent number: 4559200Abstract: A copper alloy excellent in general properties such as heat resistance, electric and heat conductivity and mechanical strength and suitable for use as materials for lead frames of electronic parts, heat exchanger fins, or the like can be obtained by optimizing the Fe and Ti contents and proportions of a Cu-Fe-Ti ternary alloy and adding thereto a suitable amount of one or more members selected from the group consisting of Mg, Sb, V Misch metal, Zr, In, Zn, Sn, Ni, Al, and P.Type: GrantFiled: August 7, 1984Date of Patent: December 17, 1985Assignee: Mitsui Mining and Smelting Company, Ltd.Inventors: Syuichi Yamasaki, Hiroshi Yamaguchi, Yousuke Taniguchi
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Patent number: 4477320Abstract: A method for the preparation of electrolytic manganese dioxide is provided employing improved cathodes, said cathodes being characterized by their reduced tendency to corrode and undergo buildup of current inhibiting scale under electrolytic conditions. The improved cathodes are fabricated from copper comprised of at least about 99.95 weight percent of copper, from about 0.001 to about 0.085 weight percent of silver and up to about 0.003 weight percent of phosphorous. The weight ratio of phosphorous to silver in said copper cathode will be no greater than about 2.0 to 1.0.Type: GrantFiled: February 27, 1984Date of Patent: October 16, 1984Assignee: Kerr-McGee Chemical CorporationInventor: Olen L. Riggs, Jr.
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Patent number: 4474614Abstract: A process for the formation of copper anodes useful in the electrorefining of copper. Molten partially refined copper is subjected to controlled cooling such that the impurities coalesce into larger agglomerations and in the resulting solid partially refined copper are found segregated at the boundaries of the copper crystals. These larger agglomerations are less susceptible to dissolution in the electrolyte and to deposition or entrainment at the cathode. The process allows the use of a less refined copper starting material to achieve a comparable final cathode copper product.Type: GrantFiled: February 14, 1983Date of Patent: October 2, 1984Assignee: Atlantic Richfield CompanyInventor: Charles Arentzen
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Patent number: 4427627Abstract: The present invention relates to a copper alloy, essentially comprising 0.10 to 0.50% by weight of cobalt, 0.04 to 0.25% by weight of phosphorus, the remainder being copper. It also relates to a process for the treatment of said alloys with a particular view to improving the electrical conductivity thereof.Type: GrantFiled: March 24, 1981Date of Patent: January 24, 1984Assignee: Comptoir Lyon-Alemand LouyotInventors: Jean-Paul Guerlet, Claude Niney
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Patent number: 4400351Abstract: An improved copper base alloy having excellent thermal resistance and electric conductivity. The alloy consists essentially of from 0.0005 to 0.01 percent boron, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities. The copper base alloy may further contain from 0.002 to 0.05 percent magnesium whereby the magnesium imparts further enhanced thermal resistance to the alloy.Type: GrantFiled: June 2, 1981Date of Patent: August 23, 1983Assignee: Mitsubishi Kinzoku Kabushiki KaishaInventors: Shinichi Komori, Yasushi Shimanuki, Isamu Suzuki