Abstract: The present invention relates to a medical Au—Pt—Pd alloy including Au, Pt, Pd, and inevitable impurities. The alloy has an alloy composition inside a polygon (A1-A2-A3-A4-A5-A6) surrounded by straight lines connected at point A1 (Au: 37.9 atom %, Pt: 0.1 atom %, and Pd: 62 atom %), point A2 (Au: 79.9 atom %, Pt: 0.1 atom %, and Pd: 20 atom %), point A3 (Au: 79.9 atom %, Pt: 20 atom %, and Pd: 0.1 atom %), point A4 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), point A5 (Au: 49 atom %, Pt: 30 atom %, and Pd: 21 atom %), and point A6 (Au: 39 atom %, Pt: 40 atom %, and Pd: 21 atom %) in a Au—Pt—Pd ternary state diagram. The metal structure of the alloy is optimized, and the metal structure is close to a single-phase structure, and has little precipitation of a Au-rich phase and a Pt-rich phase different in composition from a mother phase.

Abstract: A grey gold alloy which is nickel-free, cobalt-free, iron-free, silver-free, zirconium-free, niobium-free, chromium-free, indium-free, gallium-free and manganese-free and includes, expressed in weight percent, from 75.0 to 76.5% of Au, from 15 to 23% of Pd, from 1 to 7% of Cu, and from 0 to 5% of at least one of the alloying elements Ir, Ru, B and Re, the respective percentages of all the elements of the alloy adding up to 100%.

Abstract: A timepiece or piece of jewellery made of a nickel free and cobalt free gold alloy, the composition of which includes by weight between 75% and 77.5% gold, between 1.2 and 1.6% palladium, and between 20.1 and 23.8% copper.

Abstract: Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt % platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics.

Abstract: Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elements. Additional substitute elements are also provided, which allow for the tailoring of the physical properties of the Au-base bulk-solidifying amorphous alloys of the current invention.

Abstract: A porous catalyst layer formed from discrete particles of unsupported metal, wherein at least 80%, suitably at least 90%, of the discrete particles have a mass of from 1 to 1000 zeptograms, and wherein the catalyst layer has a metal volume fraction of less than 30% and a metal loading of less than 0.09 mg/cm2 is disclosed. The catalyst layer is suitable for use in fuel cells and other electrochemical applications.

Abstract: Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt% platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics.

Abstract: A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.

Abstract: There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

Abstract: There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities.

Abstract: A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted of gadolinium Gd only, or gadolinium Gd and at least one element selected from the group consisting of rare-earth elements other than Gd, alkaline-earth elements, silicon Si, aluminum Al, and boron B.

Abstract: An alloy is provided for dental porcelain fused to metal restorations, having a rich gold color and light oxide coating for bonding the porcelain to the cast alloy substrate. The alloy has suitable mechanical properties for the support of the porcelain and is readily polished to a bright sheen. The alloy includes from 96 to 98 weight % Au with up to 3 weight % Pt, Pd, Ru, Ir, or combinations thereof and 0 to 1.5 wt % In, Sn, Fe, Mn, Cu, B, or combinations thereof.

Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.

Abstract: The present invention provides a gold alloy thin wire for semiconductor devices, which inhibits corrosion after heating and which improves long term reliability, in portions bonded to the aluminum electrodes. The gold alloy thin wires of the present invention comprise the following group elements. (1) The gold alloy thin wire contains, as basic alloying components, 0.005 to 0.3% by weight of Mn and 0.005 to 1.0% by weight of Pd. (2) A gold alloy thin wire further contains at least one element selected from Pt, Ag and Cu in a total amount of 0.01 to 1.0% by weight in addition to the basic alloying components mentioned above. (3) A gold alloy thin wire further contains at least one element selected from Ca, Be, In and rare earth elements in a total amount of 0.0005 to 0.05% by weight in addition to the components in (1) or (2).

Abstract: Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.

Abstract: To provide a gold alloy thin wire advantageously applicable to high density packaging of semiconductor devices, in which the wire deformation upon resin molding is reduced to successfully achieve reduction in the bonding pitch and the wire diameter, a gold alloy thin wire according to the present invention consists of 0.015 to 1.0 wt % Cu, 0.0002 to 0.02 wt % Ca, and the balance consisting of Au and unavoidable impurities. Preferably, the Cu content is 0.1 to 1.0 wt % and the Ca content is 0.001 to 0.02 wt %, and more preferably, Cu and Ca are present in a weight content ratio Cu/Ca of from 40 to 800. The gold alloy thin wire further preferably contains one or more of Pt, Pd and In in a total amount of from 0.01 to 3.0 wt % and/or one or more of Y, La, and Ce in a total amount of from 0.0003 to 0.03 wt %.

Abstract: A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm.sup.2 and an elongation of 1 to 3%. The gold alloy wire has a gold purity of not less than 99.9% or further comprises 0.2 to 5.0% by weight of at least one element selected from the group consisting of Pd, Ag and Pt.

Abstract: A dental alloy is provided for use in porcelain-fused-to-metal dental restorations, which has an excellent oxide color and which can be cast and recast without deleterious effect, which comprises at least 99.5 wt. % gold, 0.1-0.25 wt. % zinc, 0.1-0.25 wt. % indium and 0-0.3 wt. % total of Rt, Pd, Rh, Ir, Re or combinations thereof.

Abstract: Gold-palladium alloys with a high gold content for dental applications should, for reasons of biocompatibility, not contain any toxically dubious components. For particularly corrosion-resistant and biocompatible Type 4 alloys, tin is needed as the only base-metal component in amounts between 0.7 and 5.8 wt % if one remains within defined limits in a palladium-tin diagram of FIG. 1, for Pt values less than 2%. Such alloys contain, in addition to gold and tin, 6 to 25 wt % palladium, 0 to 12 wt % platinum and 0 to 2 wt % of at least one of iridium, rhodium and/or ruthenium.

Abstract: A spinneret consisting essentially of an alloy consisting essentially of from 30-80 wt. % gold, 1-60 wt. % platinum, 1-50 wt. % palladium, 0.1-5 wt. % rhodium and 0-0.4 wt. % iridium and/or ruthenium, said alloy having a VICKERS hardness of from 145-340 after treatment for 5 hours at a temperature of from 500.degree.-650.degree. C.

Abstract: A dental alloy is provided which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between one and 85 percent by weight gold, between two and 65 percent by weight of a thermal expansion adjuster, between 0.25 and 34 percent by weight of a strengthener and oxide former, up to about one percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.

Abstract: A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire is further elongated in length in a range of 0.5% to 3.5% of its original length by breaking of the wire during tension testing. It has been determined that an insulated bonding fine wire exhibiting such relatively low ductility produces a loop profile maintainable in a stable condition during a bonding operation while providing reliable bonding strength.

Abstract: Bonding wire for a semiconductor device contains high purity Au or Au alloy as a base metal and 25-10000 atppm of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au, or contains high purity Au or Au alloy as a base metal and 5-500 atppm of low boiling point element II having a boiling point lower than a melting point of the base metal and insoluble in Au, or contains high purity Au or Au alloy as a base metal and 5-10000 atppm of a mixture of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au and low boiling point element II having a boiling point lower than the melting point of the base metal and insoluble in Au under the condition of (content of the low boiling point element I)/25+(content of the low boiling point element II)/5.gtoreq.1.gtoreq.(content of the low boiling point element I)/10000+(content of the low boiling point element II)/500.

Abstract: A yellow dental alloy is disclosed with high gold content for castings and ceramic veneers with an adjusted thermal expansion coefficient that does not produce any undesirable discoloration of the ceramic veneers and that is very hard. It contains 70 to 85% by weight gold, 5 to 13% by weight silver, 2 to 9% by weight platinum, 0 to 4.5% by weight palladium, 0.05 to 1% by weight iridium, rhenium, rhodium and/or ruthenium, 2 to 8% by weight copper, 0.1 to 6% by weight indium, zinc and/or germanium, and 0 to 4% by weight gallium, iron and/or tungsten.

Abstract: A hard, zinc-free gold alloy for an abutment base used with jawbone mounted dental implants is prepared containing approximately by weight 64 percent gold, 22 percent palladium, 9 percent silver, 4.5 percent platinum, and 0.5 percent iridium.

Abstract: A gold alloy for black coloring comprising gold and at least one coloring metallic element selected from the group consisting of Cu, Fe, Co, and Ti, a gold alloy for black coloring having the composition described above and further comprising at least one alloying element selected from the group consisting of Pt, Pd, Rh, Ir, Ru, Os, Ag, and Ni; a method for the production of a processed article of gold alloy possessing a black surface layer by the steps of shaping the gold alloy mentioned above, heat-treating the shaped gold alloy, and cooling; and processed article of gold alloy obtained by the method.

Abstract: A dental material of a metal composition for reinforcing the metal framework of a dental restoration comprising an aggregate combination of metal particles including a first high fusing temperature precious metal component and a second low fusing temperature component which form a porous sponge-like structure upon heat treatment.

Abstract: The method and material of the present inventioin includes a combination of a high-fusing temperature metal component and a low-fusing temperature metal component which are adapted to be heat treated at a temperature above the melting temperature of the low-fusing temperature metal component, such that a porous, sponge-like structure is formed with a total void volume of 20-80%.

Abstract: The gold wire used for the wire bonding of a semiconductor device comprises at least three kinds of elements selected from rare earth elements such as La, Ce and Pr: Be, Ca, Mg, Ag, Fe: and platinum group elements; and the balance of Au at high purity.

Abstract: A permanent magnetic alloy mainly composed of gold for making magnetic personal ornaments comprises 50 to 75 weight % gold, 12 to 40 weight % palladium and 3 to 15 weight % cobalt. The alloy is gold or white gold in color and can be plastically deformed to a desired shape. The 12, 14 and 18 Karat gold alloys have maximum energy products of 3.0, 2.2 and 0.9 MGOe, respectively.

Abstract: The present invention relates to a method for obtaining metallic alloys, to be used particularly in the field of dentistry.This method allows to accomplish a basic face-centered cubic lattice adapted to form the alloys, in which a homogeneous distribution of the atoms of the different elements is obtained, by precisely determining the number of atoms of each element forming the alloy, in close numerical relationship with the number of atoms of the other elements; it also allows the achievement of a plurality of alloys consisting of at least three among the following elements: gold, platinum, palladium, silver and copper, these alloys respecting the physico-chemical specifications necessary in the particular field of dentistry.

Abstract: A dental material of a metal composition for reinforcing the metal framework of a dental restoration comprising an aggregate combination of metal particles including a first high fusing temperature precious metal component and a second low fusing temperature component which form a porous sponge-like structure upon heat treatment.