Platinum Containing Patents (Class 420/510)
  • Patent number: 11268174
    Abstract: This invention provides a jewelry alloy which improves mechanical properties of AuIn2 while preserving its attractive blue hue. In one embodiment, said mechanical properties comprises fracture toughness and hardness. In one embodiment, said jewelry alloy consist essentially of 43.0 to 49.0 wt % Au; 51.0 to 57.0 wt % In; 0.001 to 1.0 wt % of one or more elements selected from the group consisting of Fe and Ge; and 0.001 to 1.0 wt % of one or more elements selected from the group consisting of Rh, Ir and Ru.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 8, 2022
    Assignee: CHOW SANG SANG JEWELLERY COMPANY LIMITED
    Inventors: Wai Kei Cheung, Shuk Kwan Mak, Mei Tsz Macy WONG
  • Publication number: 20150125338
    Abstract: Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase.
    Type: Application
    Filed: March 12, 2012
    Publication date: May 7, 2015
    Inventors: Heather Murdoch, Christopher A. Schuh
  • Patent number: 8685878
    Abstract: A multimetallic nanoscale catalyst having a core portion enveloped by a shell portion and exhibiting high catalytic activity and improved catalytic durability. In various embodiments, the core/shell nanoparticles comprise a gold particle coated with a catalytically active platinum bimetallic material. The shape of the nanoparticles is substantially defined by the particle shape of the core portion. The nanoparticles may be dispersed on a high surface area substrate for use as a catalyst and is characterized by no significant loss in surface area and specific activity following extended potential cycling.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: April 1, 2014
    Assignee: UChicago Argonne, LLC
    Inventors: Vojislav Stamenkovic, Nenad M. Markovic, Chao Wang, Hideo Daimon, Shouheng Sun
  • Publication number: 20130259736
    Abstract: Gold alloys are provided that offer therapeutic benefits to a biological organism by enhancing thermoregulation, metabolism, and improving blood circulation. In addition to the therapeutic benefits, the alloys retain their metallurgical properties, thereby allowing the alloys to be utilized with conventional lost-wax casting techniques as both jewelry items and therapeutic instruments. The alloys contain 88% to 95% gold, 2% to 10% platinum, 0.1% to 0.9% silver, 0.01% to 1.5% rhodium, and 0.01% to 1.5% iron.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 3, 2013
    Inventor: Victor Dyment
  • Patent number: 8524150
    Abstract: A dental alloy with a high gold content that is devoid of palladium and copper. To achieve high mechanical stability, the dental alloy contains between 75 and 95 wt. % Au, between 5 and 20 wt. % Pt, between 0.5 and 3.5 wt. % Zn and/or Sn and/or In, between 0.1 and 0.8 wt. % of an element of a group I, in addition to a single particle refiner of a group II. The weight fraction of the element of group I is between 2 and 6 times that of the single particle refiner of group II, and one element of group I is represented by Nb or Ta or Ti or V and the particle refiner of group II is represented by Ir or Rh.
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: September 3, 2013
    Assignee: Degudent GmbH
    Inventors: Jochen Bauer, Lothar Volkl, Doris Hathaway, Angela Klaus, Martin Schuster, Rudi Steinke
  • Patent number: 8501087
    Abstract: Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elements. Additional substitute elements are also provided, which allow for the tailoring of the physical properties of the Au-base bulk-solidifying amorphous alloys of the current invention.
    Type: Grant
    Filed: October 17, 2005
    Date of Patent: August 6, 2013
    Assignee: Crucible Intellectual Property, LLC
    Inventors: Jan Schroers, Atakan Peker
  • Patent number: 8367266
    Abstract: A porous catalyst layer formed from discrete particles of unsupported metal, wherein at least 80%, suitably at least 90%, of the discrete particles have a mass of from 1 to 1000 zeptograms, and wherein the catalyst layer has a metal volume fraction of less than 30% and a metal loading of less than 0.09 mg/cm2 is disclosed. The catalyst layer is suitable for use in fuel cells and other electrochemical applications.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: February 5, 2013
    Assignee: Johnson Matthey Fuel Cells Limited
    Inventors: Ian Roy Harkness, Jonathan David Brereton Sharman, Edward Anthony Wright
  • Patent number: 8178463
    Abstract: A multimetallic nanoscale catalyst having a sore portion enveloped by a shell portion and exhibiting high catalytic activity and improved catalytic durability. In various embodiments, the core/shell nanoparticles comprise a gold particle coated with a catalytically active platinum bimetallic material. The shape of the nanoparticles is substantially defined by the particle shape of the core portion. The nanoparticles may be dispersed on a high surface area substrate for use as a catalyst and is characterized by no significant loss in surface area and specific activity following extended potential cycling.
    Type: Grant
    Filed: April 5, 2010
    Date of Patent: May 15, 2012
    Assignee: UChicago Argonne, LLC
    Inventors: Vojislav Stamenkovic, Nenad M. Markovic, Chao Wang, Hideo Daimon, Shouheng Sun
  • Publication number: 20120039744
    Abstract: Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt% platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics.
    Type: Application
    Filed: March 17, 2011
    Publication date: February 16, 2012
    Inventors: Peter Hale, Edward F. Smith, III, Arthur S. Klein
  • Publication number: 20120035632
    Abstract: Provided is alloy for medical use and a medical device that is novel and useful. The alloy for medical use according to, for example, an embodiment of the present invention is mainly composed of three kinds of elements of gold (Au), platinum (Pt), and niobium (Nb). A total content of the three kinds of elements can be no smaller than 99% by weight, in which a platinum content can be no smaller than 5% by weight and no greater than 50% by weight and a niobium content can be no smaller than 3% by weight and no greater than 15% by weight. By adjusting the content ratio of the three elements, for example, it is possible to reduce or prevent artifacts in an MRI. Non-magnetization is also possible.
    Type: Application
    Filed: January 22, 2010
    Publication date: February 9, 2012
    Applicant: The University of Tokushima
    Inventors: Kenichi Hamada, Eiichi Honda, Kenzo Asaoka, Midori Yoshida
  • Patent number: 7959855
    Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: June 14, 2011
    Inventor: Heru Budihartono
  • Patent number: 7901835
    Abstract: A platinum alloy catalyst can be used as a fuel cell catalyst. The platinum alloy is a PtAuX alloy wherein X is one or more metals chosen from the group consisting of transition metals, and wherein the alloy contains 40-97% Pt, 1-40% Au and 2-20% X. Electrodes, catalysed membranes and membrane electrode assemblies comprising the catalyst are also disclosed.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: March 8, 2011
    Assignee: Johnson Matthey Public Limited Company
    Inventors: Brian Elliott Hayden, Christopher Edward Lee, Claire Mormiche, David Thompsett
  • Publication number: 20110042210
    Abstract: The invention relates to a method of manufacturing metal nanoparticles by using metal seed and metal nanoparticles including such metal seed. It is to provide the Au nanoparticles prepared by a method comprising: preparing a solution by adding a monosurfactant into a non-aqueous solvent; heating the solution; preparing a platinum seed solution by adding platinum salt chosen form platinum, palladium, iridium into the heated solution; and adding gold salt in the platinum seed solution.
    Type: Application
    Filed: December 30, 2009
    Publication date: February 24, 2011
    Inventors: Sung Koo KANG, Hyunjoon Song, Daeha Seo, Jongwook Jung, Garam Park, Donghoon Kim, KwiJong Lee
  • Patent number: 7857189
    Abstract: There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: December 28, 2010
    Assignee: Tanaka Denshi Kogyo K.K.
    Inventors: Kazunari Maki, Yuji Nakata
  • Publication number: 20090232695
    Abstract: There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities.
    Type: Application
    Filed: June 8, 2006
    Publication date: September 17, 2009
    Inventors: Kazunari Maki, Yuji Nakata
  • Publication number: 20080152535
    Abstract: A dental alloy with a high gold content that is devoid of palladium and copper. To achieve high mechanical stability, the dental alloy contains between 75 and 95 wt. % Au, between 5 and 20 wt. % Pt, between 0.5 and 3.5 wt. % Zn and/or Sn and/or In, between 0.1 and 0.8 wt. % of an element of a group I, in addition to a single particle refiner of a group II. The weight fraction of the element of group I is between 2 and 6 times that of the single particle refiner of group II, and one element of group I is represented by Nb or Ta or Ti or V and the particle refiner of group II is represented by Ir or Rh.
    Type: Application
    Filed: October 13, 2005
    Publication date: June 26, 2008
    Applicant: Degudent GmbH
    Inventors: Jochen Bauer, Lothar Volkl, Doris Hathaway, Angela Klaus, Martin Schuster, Rudi Steinke
  • Patent number: 7311876
    Abstract: Timepiece or jewelry part manufactured in an alloy containing at least 75% gold by weight, from 21% to 23% copper by weight, and from 1% to 4% platinum by weight.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: December 25, 2007
    Assignee: Rolex S.A.
    Inventors: Jacques Baur, Frédéric Oulevey, Michèle Saudan, Denis Vincent
  • Patent number: 7208439
    Abstract: A method is featured for fabricating Carbon-supported AuPt nanoparticle catalysts for fuel cells, and particularly fuel cells using methanol as the fuel. The method prepares AuPt-based fuel cell catalysts having a wide range of controllable Au:Pt ratios. The AuPt catalysis are supportable on both carbon black (C) and C/TiO2 support materials. These materials demonstrate electro-catalytic activity towards CO and methanol oxidation, and O2 reduction. The same catalyst material is useful in constructing both anodes and cathodes, and demonstrates bifunctional activity.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: April 24, 2007
    Assignee: The Research Foundation of State University of New York
    Inventors: Chuan-Jian Zhong, Jin Luo, Mathew M. Maye, Nancy N. Kariuki
  • Patent number: 6913656
    Abstract: An alloy is provided for dental porcelain fused to metal restorations, having a rich gold color and light oxide coating for bonding the porcelain to the cast alloy substrate. The alloy has suitable mechanical properties for the support of the porcelain and is readily polished to a bright sheen. The alloy includes from 96 to 98 weight % Au with up to 3 weight % Pt, Pd, Ru, Ir, or combinations thereof and 0 to 1.5 wt % In, Sn, Fe, Mn, Cu, B, or combinations thereof.
    Type: Grant
    Filed: August 11, 2003
    Date of Patent: July 5, 2005
    Assignee: Ivoclar Vivadent, Inc.
    Inventors: Dasgupta Tridib, Clyde Ingersoll
  • Patent number: 6913657
    Abstract: A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted of gadolinium Gd only, or gadolinium Gd and at least one element selected from the group consisting of rare-earth elements other than Gd, alkaline-earth elements, silicon Si, aluminum Al, and boron B.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: July 5, 2005
    Inventor: Kazuo Ogasa
  • Publication number: 20020141895
    Abstract: A dental alloy comprises 50-55% by weight gold, 10-20% by weight platinum, 0-10% by weight silver, 15-35% by weight nickel, 0-10% by weight indium, 0-10% by weight tin; and 0.1% by weight grain refiner. The dental alloy may be made by mixing preselected quantities of gold, platinum, nickel and a grain refiner, subjecting the mixture to a heating process until all the metals are brought to a molten state, and thereafter allowing the metals in the molten state to cool and cure in a mold.
    Type: Application
    Filed: July 2, 2001
    Publication date: October 3, 2002
    Inventor: Edward J. Harms
  • Patent number: 6242106
    Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: June 5, 2001
    Assignee: W. C. Hereaeus GmbH & Co. KG
    Inventors: Günter Herklotz, Lutz Schräpler, Christoph Simons, Jürgen Reuel, Y. C. Cho
  • Patent number: 6103025
    Abstract: Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: August 15, 2000
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Gunther Herklotz, Jurgen Reuel, Lutz Schrapler, Christoph Simons
  • Patent number: 6080492
    Abstract: To provide a gold alloy thin wire advantageously applicable to high density packaging of semiconductor devices, in which the wire deformation upon resin molding is reduced to successfully achieve reduction in the bonding pitch and the wire diameter, a gold alloy thin wire according to the present invention consists of 0.015 to 1.0 wt % Cu, 0.0002 to 0.02 wt % Ca, and the balance consisting of Au and unavoidable impurities. Preferably, the Cu content is 0.1 to 1.0 wt % and the Ca content is 0.001 to 0.02 wt %, and more preferably, Cu and Ca are present in a weight content ratio Cu/Ca of from 40 to 800. The gold alloy thin wire further preferably contains one or more of Pt, Pd and In in a total amount of from 0.01 to 3.0 wt % and/or one or more of Y, La, and Ce in a total amount of from 0.0003 to 0.03 wt %.
    Type: Grant
    Filed: July 16, 1997
    Date of Patent: June 27, 2000
    Assignee: Nippon Steel Corporation
    Inventors: Tomohiro Uno, Kohei Tatsumi
  • Patent number: 5945065
    Abstract: A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm.sup.2 and an elongation of 1 to 3%. The gold alloy wire has a gold purity of not less than 99.9% or further comprises 0.2 to 5.0% by weight of at least one element selected from the group consisting of Pd, Ag and Pt.
    Type: Grant
    Filed: July 28, 1997
    Date of Patent: August 31, 1999
    Assignee: Tanaka Denshi Kogyo
    Inventors: Teruo Kikuchi, Mitsuyoshi Ishii
  • Patent number: 5922276
    Abstract: A dental alloy is provided for use in porcelain-fused-to-metal dental restorations, which has an excellent oxide color and which can be cast and recast without deleterious effect, which comprises at least 99.5 wt. % gold, 0.1-0.25 wt. % zinc, 0.1-0.25 wt. % indium and 0-0.3 wt. % total of Rt, Pd, Rh, Ir, Re or combinations thereof.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: July 13, 1999
    Assignee: The Argen Corporation
    Inventor: Paul J. Cascone
  • Patent number: 5876862
    Abstract: Sliding contacts comprising alloys such as Pd/Cu/Ag, Pt/Cu/Ag, Pd/Cu/Ag/Ni, Pt/Cu/Ag/Ni, Ag/Pd/Cu,Au, Ag/Pt/Cu/Au and two-layered composites comprising a surface layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy. Also, three-layered composites comprising a surface layer of one of the foregoing alloys, an intermediate layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy as well as direct current motors comprising commutators comprising a three-layered composite.
    Type: Grant
    Filed: May 6, 1997
    Date of Patent: March 2, 1999
    Assignees: Mabuchi Motor Co., Ltd., Tanaka Kikinzoku Kogyo K.K.
    Inventors: Isao Shibuya, Toshiya Yamamoto, Takao Asada, Tetsuya Nakamura
  • Patent number: 5853661
    Abstract: A high gold content dental alloy comprises, on a weight basis, 91 to 99.4% of gold, 0.5 to 3% of at least one metal selected from titanium and tantalum, up to 5% of silver, 0.05 to 1% of iridium and/or tungsten, and up to 1% at least one element selected from the group comprising rhodium, ruthenium, platinum, osmium, iron, molybdenum, niobium and rhenium.
    Type: Grant
    Filed: December 24, 1996
    Date of Patent: December 29, 1998
    Assignee: Cendres ET Metaux SA
    Inventor: Jens Fischer
  • Patent number: 5702814
    Abstract: According to the present invention provided is a gold wire for IC chip bonding which wire is unlikely to be broken after thermosonic wire bonding at an increased ultrasonic output, subsequent reverse deformation involving severe bonding and deformation of a ball neck portion and formation of a loop. The bonding gold wire essentially consists of 0.0001-0.005 wt % of Pt, 0.0001-0.005 wt % of Ag, 0.0005-0.005 wt % of Mg and 0.00005-0.005 wt % of Eu; with the balance being Au, said Au having less than 0.001% by weight of incidental impurity.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: December 30, 1997
    Assignee: Tanaka Denshi Kogyo Kabushiki Kaisha
    Inventors: Shinichi Hanada, Koichiro Mukoyama
  • Patent number: 5491034
    Abstract: This invention relates to a bonding wire (3) for connecting electrodes of a semiconductor element to outer leads (2). The bonding wire (3) consists of Cu of not less than 1 wt % but less than 5 wt %, and the balance Au and incidental impurities. The bonding wire is superior in rupture strength and bonding strength. Even if the diameter is thinned to about 10 .mu.m, high reliability may be insured for connection.
    Type: Grant
    Filed: November 18, 1994
    Date of Patent: February 13, 1996
    Assignee: Nippon Steel Corporation
    Inventors: Yasuhide Ohno, Yoshio Ohzeki
  • Patent number: 5462437
    Abstract: A dental alloy is provided which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between one and 85 percent by weight gold, between two and 65 percent by weight of a thermal expansion adjuster, between 0.25 and 34 percent by weight of a strengthener and oxide former, up to about one percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.
    Type: Grant
    Filed: November 10, 1993
    Date of Patent: October 31, 1995
    Assignee: Jeneric/Pentron Incorporated
    Inventors: Arun Prasad, Martin Schulman
  • Patent number: 5423680
    Abstract: A dental alloy is provided which is free of palladium, gallium and copper and which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between about 40 and 80 percent by weight gold, between 5 and 50 percent by weight of thermal expansion adjuster, between two and 15 percent by weight strengthener and oxide former, up to about 1.5 percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.
    Type: Grant
    Filed: November 10, 1993
    Date of Patent: June 13, 1995
    Assignee: Jeneric/Pentron, Incorporated
    Inventor: Arun Prasad
  • Patent number: 5298219
    Abstract: Bonding wire for a semiconductor device contains high purity Au or Au alloy as a base metal and 25-10000 atppm of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au, or contains high purity Au or Au alloy as a base metal and 5-500 atppm of low boiling point element II having a boiling point lower than a melting point of the base metal and insoluble in Au, or contains high purity Au or Au alloy as a base metal and 5-10000 atppm of a mixture of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au and low boiling point element II having a boiling point lower than the melting point of the base metal and insoluble in Au under the condition of (content of the low boiling point element I)/25+(content of the low boiling point element II)/5.gtoreq.1.gtoreq.(content of the low boiling point element I)/10000+(content of the low boiling point element II)/500.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: March 29, 1994
    Assignee: Tanaka Denshi Kogyo Kabushiki Kaisha
    Inventors: Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Takeshi Kujiraoka, Kensei Murakami
  • Patent number: 5221207
    Abstract: A yellow dental alloy is disclosed with high gold content for castings and ceramic veneers with an adjusted thermal expansion coefficient that does not produce any undesirable discoloration of the ceramic veneers and that is very hard. It contains 70 to 85% by weight gold, 5 to 13% by weight silver, 2 to 9% by weight platinum, 0 to 4.5% by weight palladium, 0.05 to 1% by weight iridium, rhenium, rhodium and/or ruthenium, 2 to 8% by weight copper, 0.1 to 6% by weight indium, zinc and/or germanium, and 0 to 4% by weight gallium, iron and/or tungsten.
    Type: Grant
    Filed: October 2, 1991
    Date of Patent: June 22, 1993
    Assignee: Degussa Aktiengesellschaft
    Inventors: Gernot Schoeck, Bernd Kempf, Werner Groll
  • Patent number: 5139739
    Abstract: A gold alloy for black coloring comprising gold and at least one coloring metallic element selected from the group consisting of Cu, Fe, Co, and Ti, a gold alloy for black coloring having the composition described above and further comprising at least one alloying element selected from the group consisting of Pt, Pd, Rh, Ir, Ru, Os, Ag, and Ni; a method for the production of a processed article of gold alloy possessing a black surface layer by the steps of shaping the gold alloy mentioned above, heat-treating the shaped gold alloy, and cooling; and processed article of gold alloy obtained by the method.
    Type: Grant
    Filed: April 9, 1991
    Date of Patent: August 18, 1992
    Assignees: Agency of Industrial Science and Technology, Ministry of International Trade and Industry, Seki Company
    Inventors: Takeshi Takayanagi, Noboru Morita, Chusei Seki
  • Patent number: 4997723
    Abstract: A metal foil is provided for use in a metal-porcelain dental restoration, which metal foil provides improved color qualities to the finished restoration and improved bonding of the metal to the porcelain. The metal foil is made of an alloy comprising a major amount of gold, an amount of platinum or palladium, and an amount of a non-precious metal. An improved dental veneer and dental bridge can also be made using the metal foil of the invention.
    Type: Grant
    Filed: February 14, 1990
    Date of Patent: March 5, 1991
    Assignee: Tanaka Dental Enterprises
    Inventor: Asami Tanaka
  • Patent number: 4938923
    Abstract: The gold wire used for the wire bonding of a semiconductor device comprises at least three kinds of elements selected from rare earth elements such as La, Ce and Pr: Be, Ca, Mg, Ag, Fe: and platinum group elements; and the balance of Au at high purity.
    Type: Grant
    Filed: October 31, 1989
    Date of Patent: July 3, 1990
    Inventors: Takeshi Kujiraoka, Koichiro Mukoyama, Hiromi Yamamoto, Kenichi Kurihara
  • Patent number: 4853048
    Abstract: A permanent magnetic alloy mainly composed of gold for making magnetic personal ornaments comprises 50 to 75 weight % gold, 12 to 40 weight % palladium and 3 to 15 weight % cobalt. The alloy is gold or white gold in color and can be plastically deformed to a desired shape. The 12, 14 and 18 Karat gold alloys have maximum energy products of 3.0, 2.2 and 0.9 MGOe, respectively.
    Type: Grant
    Filed: January 29, 1988
    Date of Patent: August 1, 1989
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Shotaro Shimizu, Yosuke Sakakibara
  • Patent number: 4522783
    Abstract: The present invention relates to a method for obtaining metallic alloys, to be used particularly in the field of dentistry.This method allows to accomplish a basic face-centered cubic lattice adapted to form the alloys, in which a homogeneous distribution of the atoms of the different elements is obtained, by precisely determining the number of atoms of each element forming the alloy, in close numerical relationship with the number of atoms of the other elements; it also allows the achievement of a plurality of alloys consisting of at least three among the following elements: gold, platinum, palladium, silver and copper, these alloys respecting the physico-chemical specifications necessary in the particular field of dentistry.
    Type: Grant
    Filed: May 11, 1983
    Date of Patent: June 11, 1985
    Inventor: Gian F. Menicucci