Abstract: Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.

Abstract: In certain embodiments, device inspection or repair may be facilitated via signal-based determinations. In some embodiments, one or more flaws may be detected on a portion of a device via an optical sensor. Based on the detection, a physical structure may be caused to physically interact with the portion of the user device. Information indicating signals from the physical interaction may be obtained. Based on the signal information, a determination of whether a repair process should be performed on the device may be effectuated. The device may be assigned to be repaired via the repair process based on the determination indicating that the repair process should be performed on the device. In some embodiments, the signal information may be provided to a prediction model to determine whether the repair process should be performed on the device.

Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

Abstract: The invention provides a metal alloy fuel catalyst for decontaminating a hydrocarbon fuel, including diesel and bio-diesel fuel, of a bacterial contamination and for improving fuel combustion. The metal alloy fuel catalysts preferably includes about 70% Sn, about 22% Sb, about 4% Bi, and about 4% Pb, although other formulations are possible. The fuel catalyst can take the form of an in-line component in a fuel system or be coated within a fuel storage container.

Abstract: In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a ?? phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special coating is provided on the die bonding plane of the semiconductor element. The brazing filler metal of the present invention comprises 5 to 20 weight % of Sb and 0.01 to 5 weight % of Te, with the balance being Sn and incidental impurities, or a brazing filler metal comprises 5 to 20 weight % of Sb, 0.01 to 5 weight % of Te, 0.001 to 0.5 weight % of P, with the balance being Sn and incidental impurities.

Abstract: Provided is high purity tin or tin alloy wherein the respective contents of U and Th are 5 ppb or less, the respective contents of Pb and Bi are 1 ppm or less, and the purity is 5N or higher (provided that this excludes the gas components of O, C, N, H, S and P). This high purity tin or tin alloy is characterized in that the ? ray count of high purity tin having a cast structure is 0.001 cph/cm2 or less. Since recent semiconductor devices are densified and are of large capacity, there is considerable risk of a soft error occurring due to the influence of the ? ray from materials in the vicinity of the semiconductor chip. In particular, there are strong demands for purifying the soldering material or tin to be used in the vicinity of semiconductor devices, as well as for materials with fewer ? rays. Thus, the present invention aims to provide high purity tin or tin alloy and the manufacturing method of such high purity tin by reducing the ? dose of tin so as to be adaptable as the foregoing material.

Abstract: A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60–64 mass % of Sn, 0.002–0.01 mass % of P, 0.04–0.3 mass % of Cu, and a remainder of Pb. The solder is particularly suitable for forming a solder bump on a Cu electrode which has been coated with Ni by electroless plating.

Abstract: A low-pressure mercury vapor discharge lamp is provided with a discharge vessel (10) enclosing a discharge space (11) containing a filling of mercury and a rare gas, an amalgam (63) which communicates with the discharge space (11), and means for maintaining an electric discharge in the discharge vessel (10). The amalgam (63) comprises a Bi:Sn content in the range of 80:20≦Bi:Sn≦20:80, a Pb content in the range of 0.7<Pb≦12 at % and a Hg content in the range of 0.05≦Hg≦2 at %. For compact fluorescent discharge lamps, the amalgam (63) preferably comprises 70:30≦Bi:Sn≦30:70, 1≦Pb≦10 at % and 0.25≦Hg≦1.2 at %. For electrodeless low-pressure mercury vapor discharge lamps, the amalgam preferably comprises 70:30≦Bi:Sn≦30:70, 1≦Pb≦10 at % and 0.05≦Hg≦0.5 at %.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: A solder alloy includes tin (Sn) of 50-80 wt %, antimony (Sb) of 0.05-10 wt %, silver (Ag) of 0.0001-5 wt %, phosphorus (P) of 0.0001-0.5 wt %, unavoidable impurities, and lead for the remaining wt %. Numerical limitation to the content amount of the respective elements and the rest effects the solder alloy to have an improved fatigue-proof characteristic for a soldering area.

Abstract: Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154.degree.-162.degree. C. The solder compositions have microstructure similarly to Sn/Pb eutectic microstructure which makes them have excellent properties like higher yield strength and better creep resistance providing long term reliability to solder joints.

Abstract: A fuel treatment device treats fuel prior to combustion in order to improve combustion efficiency and reduce exhaust emissions in hydrocarbon fuel burning systems. The fuel treatment device includes at least one element comprising tin, antimony, lead and mercury that is brought in contact with fuel to be treated. The element comprises the following percentages by weight: 60-80% tin; 15-30% antimony; 2-7% lead; and 3-12% mercury. In a further preferred embodiment, the element comprises the following percentages by weight: 70-75% tin; 15-30% antimony; 2-7% lead; and 3-12% mercury. In a still further preferred embodiment, the element comprises an alloy including approximately 75% wt tin, 21% wt antimony and 4% wt lead, wherein 0.5 kg of mercury and 0.020 kg platinum is added to 5.0 kg of the alloy. The fuel is treated as it comes into contact with the element.

Abstract: A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used internal and external combustion engines The catalyst is a base metal alloy catalyst including tin antimony, lead and mercury. The catalyst operates at ambient temperatures and atmospheric pressure and in the presence of a small but effective quantity of water. The method of treating the fuel with the catalyst may be employed at any point after refining of the fuel and prior to combustion thereof.

Abstract: A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

Abstract: A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used in internal and external combustion engines. The catalyst is a base metal alloy catalyst including tin, antimony, lead and mercury. The catalyst operates at ambient temperatures and atmospheric pressure. The method of treating the fuel with the catalyst may be employed at any point after refining of the fuel and prior to combustion thereof.

Abstract: Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183.degree. C..+-.10.degree. C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The novel compositions also can possess superior mechanical properties, compared to the 40/60 Pb-Sn composition, and readily wets copper. Bi and/or Sb may be added to the Sn-In-Zn base to reduce the tendency for the formation of lower temperature phases.

Abstract: The invention is a solder alloy which can alleviate the fatigue rupture which occurs at a soldered joint due to a heat cycle. The solder alloy also shows effective use of the addition of Cu. This solder alloy comprises 57 to 65% Sn, 0.1 to 0.5% Sb, 0.002 to 0.05% Te and the balance being lead, wherein all percentages are by weight. The solder alloy of the present invention also supplements the base composition with 0.001 to 0.05% by weight Ga and/or 0.1 to 0.3% by weight Cu.

Abstract: Various metal coatings have been used for many years to inhibit oxidation of metals exposed to the natural elements of the atmosphere over a period of time. Terne alloy coatings which normally contain about 20% tin and about 80% lead are some of the most popular metal coating treatments to resist corrosion. The special formulation of the present invention reformulates the terne coating to constitute a tin and lead based coating where tin constitutes at least 90% of the terne and lead amounts to less than 0.1% and preferably less than 0.05% of the terne. The low lead terne coating may also include antimony and bismuth to provide strength and hardness to the low lead terne formulation having corrosion resistive qualities similar to that of standard terne coating formulations.

Abstract: A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.

Abstract: A repair coating for superalloy articles, such as gas turbine engine components, includes a volatile organic carrier or water-based carrier, a fluxing agent, a thickening agent, balance a filler mix. The filler mix consists of at least two distinct particulate components. The mix includes a first particulate component having a composition which approximates that of the article being repaired. The mix also includes a second particulate component having a composition approximating that of the article and a melting point depressant, such as boron. This melting point depressant is substantially in excess of that in the article and sufficient to provide melting of a portion of the mix at a processing temperature below the melting temperature of the article. The above filler mix is blended with the other constituents to form the repair coating which is applied to an article.

Abstract: An enhanced bonding design utilizing tin and copper to create tin alloy solders for use in the manufacturing of heat exchangers and other soldering applications. The tin alloy solders contain as primary constituent metals 3.0-15.0 wt. % copper and 79.0-97.0 wt. % tin, and containing as optional constituent metals 0.0-4.0 wt. % silver, 0.0-1.0 wt. % selenium and 0.0-1.0 wt. % bismuth. These solder alloys have lower toxicity levels and better corrosion resistance than the lead based alloy solders commonly employed. Also, because the application temperature range for these solder alloys is below the temperature where dezincification of copper/zinc base metal alloys occurs, joints on copper/zinc base metals subjected to cyclic loads are stronger when constructed using these tin alloy solders than when constructed of lead based alloy solders.

Abstract: The catalyst is provided for improving the performance of hydrocarbon fuels used in internal combustion engines. The catalyst is a based metal alloy catalyst including tin, antimony, lead, mercury and thallium in the following proportions by weight percent:Sb 18-20Pb 4.5-5.5Hg 12-14Tl 0.1-0.5and the balance consisting essentially of Sn. The catalyst operates at ambient temperatures and atmospheric pressure. The catalyst is intended to pretreat fuel before combustion and may be disposed in the fuel tank, fuel line or return fuel line.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: A solder paste is composed of a vehicle (or flux) system and a mixture of at least two solder powders. One component of this mixture is a eutectic or near-eutectic Sn/Pb alloy powder, while the other component comprises powders selected from at least one elemental metal powder or at least one solder alloy powder or at least one elemental metal powder and at least one solder alloy powder. Said other component is a powder or combination of powders each of which has a liquidus temperature which is lower by at least 5 degrees Centigrade (.degree.C.) than the solidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder or a solidus temperature which is higher by at least 5.degree. C. than the liquidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder. The eutectic or near-eutectic Sn/Pb powder makes up from 5 to 95 weight percent of the total powder mixture. Alternatively, not all powders which comprise the second component need to obey this rule so long as at least 30% by wt.

Abstract: A copper metal roofing system coated with a highly corrosive resistant material is disclosed which can be used to collect potable water. The copper roofing system is highly malleable allowing on site formation of the copper roofing materials into a variety of simple and complex shapes. The highly corrosion resistant coating is a metal alloy consisting of at least 90 weight percent tin and not more than 1.0 weight percent lead.

Abstract: Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.

Abstract: Various metal coatings have been used for many years to inhibit oxidation of metals exposed to the natural elements of the atmosphere over a period of time. Terne alloy coatings which normally contain about 20% tin and about 80% lead are some of the most popular metal coating treatments to resist corrosion. The special formulation of the present invention reformulates the terne coating to constitute a tin and lead based coating where tin constitutes at least 90% of the terne and lead amounts to less than 0.1% and preferably less than 0.05% of the terne. The low lead terne coating may also include antimony and bismuth to provide strength and hardness to the low lead terne formulation having corrosion resistive qualities similar to that of standard terne coating formulations.

Abstract: The fatigue resistance of lead-tin eutectic solder is increased by doping the solder with about 0.1 to 0.8 weight % of a dopant selected from cadmium, indium antimony and mixtures thereof. The doped eutectic solder exhibits increased resistance to thermally or mechanically induced cyclic stress and strain. As a result, the fatigue resistance of the solder joint is increased. Combination of dopants, such as indium and cadmium, in combined amounts of less than 0.5 weight % are especially effective in increasing the fatigue resistance of the lead-tin eutectic solder.

Abstract: A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The second powder is formed of a tin alloy containing indium or bismuth and having a melting temperature less than the first powder. During soldering, the second powder melts during the early stages of the heating cycle to initiate wetting of the faying surfaces and promote dissolution of the first powder, thereby reducing the time and temperature required to form the solder connection.

Abstract: Heavy metal solders having exceptional ability to wet non-metals, especially glass, are produced by the incorporation of small amounts of the light reactive metals lithium, sodium, potassium, rubidium, cesium, calcium, or magnesium into the heavy metal solder compositions. These heavy metal solder compositions consist essentially of alloys contained within the heavy metal system Pb-Sn-In-Bi-Cd-Sb-Hg-Ga-Ag-Au or within subsystems thereof wherein each heavy metal element present in the system or subsystem can potentially constitute nearly the whole of the total depending upon the specific composition chosen. In cases where a low melting point is desired the resultant solder will in general have the formula:A.sub.a B.sub.bwherein A is at least three metals selected from the group consisting ofPb, Sn, In, Bi, Cd, Sb, Hg, Ga, Ag, and Au;and B is at least one metal selected from the group consisting ofLi, Na, K, Rb, Cs, and Ca, and Mg; andwhereinb ranges from about 0.0001 to about 0.1; anda ranges from about 0.

Abstract: In summary of this disclosure, the present invention provides novel metal matrix fibrous composites which can be used as a fusible core in molding plastics. Modifications are possible within the scope of this invention.

Abstract: A solder composition for use in high-speed hand-soldering of art work or other artifacts consisting essentially of from about 51% to about 56% by weight tin, from about a trace to about 1.0% by weight antimony, and the balance being substantially lead.

Abstract: Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.