Abstract: Disclosed are a composite material having an anti-wear property and a process for producing the same. The composite material includes a matrix of a low melting point Sn alloy having a melting point of from 80.degree. to 280.degree. C., and metallic dispersing particles dispersed in the matrix in an amount of from 10 to 50% by volume. When the composite material is utilized to make a rough mold for preparing a prototype, it sharply improves the anti-wear property of the rough mold, and it can be refused for a plurality of times without adversely affecting the sharply improved anti-wear property. The composite material provides the advantageous effect best when the metallic dispersing particles are Fe-C alloy dispersing particles and/or Fe-W-C alloy dispersing particles which were subjected to a surface treatment including an Sn or Ni electroplating followed by a ZnCl.sub.2 .multidot.NH.sub.4 Cl flux depositing.

Abstract: A lead-free solder pursuant to the invention consists essentially of, in weight %, about 0.75% to about 2% antimony, about 0.05% to about 0.6% copper, about 0.05% to about 0.6% silver, about 0.05% to about 0.6% nickel and balance essentially tin. An even more preferred solder consists essentially of, in weight %, about 0.8% to about 1.8% antimony, about 0.05% to about 0.15% copper, about 0.05% to about 0.15% silver, about 0.05% to about 0.15% nickel and balance essentially tin.

Abstract: Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133.degree.-167.degree. C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.

Abstract: A high-strength Pb-free solder alloy, based on the Sn--Ag--Zn system, is disclosed. The Pb-free solder alloy contains, in weight percent, 0.2-0.6% Zn, 1-6% Ag, one or both 0.2-0.6% In and 0.2-0.6% Bi, and the balance Sn. The addition of Zn significantly improves the mechanical strength and creep resistance of e.g., Sn--3.5% Ag eutectic solder while maintaining substantially the same level of ductility. The increase in strength is as much as 48% over that of the Sn--3.5% Ag alloy. This strengthening from the Zn additions is attributed to a uniform solidification structure and a substantial refinement of the precipitates in the alloy. Essentially all of the added Zn resides in the more corrosion-resistant, Ag-based, intermetallic precipitates, leaving the Sn-rich matrix primarily free of Zn in solid solution.

Abstract: Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.

Abstract: A lead-free solder alloy comprises 0.8 to 5.0% inclusive by weight of Ag, not less than 0.1% by weight of In, not less than 0.1% by weight of Bi, the total amount of In and Bi being not more than 17% by weight and the balance of Sn and inevitable impurities. The other lead-free solder alloy further contains 0.1 to 10% by weight of Sb. These solder alloys have low melting point and narrow melting range, and furthermore, they show excellent wettability and mechanical characteristics.

Abstract: The present invention provides a solder alloy having from about 80-81% tin, from about 2-4% silver, from about 5-6% indium, and from about 10-12% bismuth by weight, and microelectric circuits soldered by this alloy.

Abstract: The invention relates to a plain bearing alloy on a tin basis with antimony and copper, the alloy consisting of 6 to 15% by weight of antimony, 3 to 10% by weight of copper, 0.05 to 1% by weight of silver and 0.1 to 2% by weight of zinc, the remainder being tin.

Abstract: A lead-free solder consisting of 1 to 4 wt % of Ag, at least one of Bi and In in respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and that the value of expression (2), B, is equal to or less than 6.90, and Sn for the balance:A=[Ag wt %]+1.23 [Bi wt %]+0.52 [In wt %] (1)B=[Ag wt %]+1.19 [Bi wt %]+0.50 [In wt %] (2)This solder has a tensile strength and an elongation as high as those of conventional Pb--Sn solder without containing neither lead nor cadmium, which can cause environmental contamination.

Abstract: Disclosed are a composite material having an anti-wear property and a process for producing the same. The composite material includes a matrix of a low melting point Sn alloy having a melting point of from 80.degree. to 280.degree. C., and metallic dispersing particles dispersed in the matrix in an amount of from 10 to 50% by volume. When the composite material is utilized to make a rough mold for preparing a prototype, it sharply improves the anti-wear property of the rough mold, and it can be re-used for a plurality of times without adversely affecting the sharply improved anti-wear property. The composite material provides the advantageous effect best when the metallic dispersing particles are Fe--C alloy dispersing particles and/or Fe--W--C alloy dispersing particles which were subjected to a surface treatment including an Sn or Ni electroplating followed by a ZnCl.sub.2.NH.sub.4 Cl flux depositing.

Abstract: We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising at least 40% by weight Bi, between 40% and 60% Sn, and between 0.05 and 1% Ag is effective to increase the total elongation of the solder by at least 20% under the same processing conditions. Moreover the solder is free of undesirable Ag-containing phases with a melting point in excess of the 183.degree. C. melting point of the Pb--Sn binary eutectic alloy. In a preferred embodiment, the composition comprises 54.75% Bi, 45% Sn, and 0.25 % Ag.

Abstract: Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183.degree. C..+-.10.degree. C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The novel compositions also can possess superior mechanical properties, compared to the 40/60 Pb-Sn composition, and readily wets copper. Bi and/or Sb may be added to the Sn-In-Zn base to reduce the tendency for the formation of lower temperature phases.

Abstract: A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniformly distributed and resist degradation on long-term aging. When added to commercial bulk or paste solders, the intermetallic particles reduce the lead content of solder joints by consuming volume in lead-tin solder, and improve the mechanical properties of the solder by inhibiting localized shear deformation and interfering with crack growth.

Abstract: The invention relates to a bullet based on an Sn alloy, wherein the Sn alloy comprises Cu, Sb, Bi and/or Zn as an alloying element, wherein the Sn alloy preferably contains 0.2-10% by weight Cu, preferably 0.2-6% by weight Cu, or 0.2-10% by weight Cu and 0.5-20% by weight Sb, preferably 0.2-5% by weight Cu and 0.5-10% by weight Sb, or 1-15% by weight Sb, preferably 1-10% by weight Sb, or 0.5-30% by weight Bi, preferably 5-20% by weight Bi, or 0.005-10% by weight Zn, preferably 0.01-1% by weight Zn. The invention further relates to the use of an Sn alloy for manufacturing a bullet.

Abstract: A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.

Abstract: A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<x<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).

Abstract: A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0% to about 10.5% by weight bismuth.

Abstract: A non-toxic alloy for soldering electronic components comprising 80% Sn, 5-14.5% In, 4.5-14.5% Bi and 0.5% Ag. The disclosed alloy has a fine microstructure. Particles of intermetallic compounds are finely dispersed throughout the matrix, thereby inhibiting grain growth. Accordingly, the alloy does not significantly coarsen after thermal aging.

Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90.3-99.2% tin, 0.5-3.5% silver, 0.1-2.8% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-216.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.

Abstract: A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.

Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1.5-3.5% silver, 0.2-2.0% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-215.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.

Abstract: Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.

Abstract: Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.

Abstract: A gold bump contact on an electronic component is solder bonded to a bond pad of a printed circuit board or the like utilizing a solder composed of tin-bismuth alloy. The solder is applied to the bond pad as an electroplate or a paste, after which the gold bump is superposed onto the bond pad. The assembly is heated to a first temperature to melt the solder and thereafter maintained at a temperature less than 150.degree. C. to permit the molten solder to wet the gold surface, after which the assembly is cooled to solidify the solder and complete the connection. Wetting at the relatively low temperature retards dissolution of the gold and thereby reduces formation of unwanted gold tin intermetallic compounds that tend to decrease mechanical properties of the connection.

Abstract: A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

Abstract: Heavy metal solders having exceptional ability to wet non-metals, especially glass, are produced by the incorporation of small amounts of the light reactive metals lithium, sodium, potassium, rubidium, cesium, calcium, or magnesium into the heavy metal solder compositions. These heavy metal solder compositions consist essentially of alloys contained within the heavy metal system Pb-Sn-In-Bi-Cd-Sb-Hg-Ga-Ag-Au or within subsystems thereof wherein each heavy metal element present in the system or subsystem can potentially constitute nearly the whole of the total depending upon the specific composition chosen. In cases where a low melting point is desired the resultant solder will in general have the formula:A.sub.a B.sub.bwherein A is at least three metals selected from the group consisting ofPb, Sn, In, Bi, Cd, Sb, Hg, Ga, Ag, and Au;and B is at least one metal selected from the group consisting ofLi, Na, K, Rb, Cs, and Ca, and Mg; andwhereinb ranges from about 0.0001 to about 0.1; anda ranges from about 0.

Abstract: An electroplating bath, cell and method for the electrodeposition of a wide range of tin-bismuth alloys onto a conductive substrate comprises tin and bismuth ion in aqueous solution, and an alkyl sulfonic or polysulfonic acid or salt as the electrolyte. The sulfonic component is present in amounts sufficient to maintain the bismuth in solution.In the operation of the method of the invention, electroplated tin-bismuth eutectic alloys of controlled composition are obtained. The alloys of tin and bismuth contain amounts of both metals such that the plated alloy has a melting point substantially lower than that of either metal alone, and a melting point lower than that of a tin-lead alloy.

Abstract: Tin-based alloys that include micro-additions of certain elements avoid the discoloration that otherwise afflict those alloys when they are melted. The discoloration, which results from tin oxidation, correlates with poor performance of the alloys in filler metal applications. A preferred method of preparing the alloys of the invention is by rapid solidification from the melt.

Abstract: In summary of this disclosure, the present invention provides novel metal matrix fibrous composites which can be used as a fusible core in molding plastics. Modifications are possible within the scope of this invention.

Abstract: A lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% by weight antimony, approximately 1% to 4.5% by weight bismuth, and approximately 0.1% to 0.5% by weight silver.

Abstract: A low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.5-2.0% silver and 90.0-98.5% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.