Abstract: Methods and apparatus for removing a dent from an automobile rim are described herein. A hammer having a hammer head containing lead, antimony and aluminum is applied to pound an automobile rim. The dent is removed from the rim without breaking the rim. Different compounds of lead for the hammer head are provided. In one embodiment the hammer weighs between 10 and 12 pounds. In another embodiment the hammer head has a cylindrical shape. The hammer head may chip away during hitting the rim.

Abstract: A method of continuously casting a lead alloy strip includes continuously supplying molten lead alloy to a tundish having a lip insert and containing a pool of molten lead alloy. The molten lead alloy is continuously supplied to the pool from a bath maintained at a temperature in the range of 575° to 750° F. The surface level of the molten alloy in the lip insert is controlled to produce a strip of desired thickness. The temperature of the lead alloy in the lip insert is controlled in a range of about 640° to 750° F. An abraded casting surface is moved upwardly through the pool for depositing the lead alloy thereon. The abraded casting surface is cooled to a temperature in the range of about 100° to 210° F. to solidify a strip of lead alloy, and the lead alloy strip is stripped from the abraded casting surface.

Abstract: A method and apparatus for continuously casting lead alloy strip on a casting surface on substantially the upper half of a rotatable casting drum from a pool of molten lead alloy at a high speed comprising imparting a coarse texture to the casting surface, providing a tundish containing a pool of the molten lead alloy at a predetermined temperature adjacent a substantially vertical upwardly-moving portion of said casting drum, the tundish having a graphite lip insert having an open front defined by a lip insert floor and opposed sidewalls cooperating with and commencing at a substantially vertical portion of the casting surface to contain said molten lead alloy in the lip insert, controlling the height of the surface level and temperature of the molten lead alloy in the lip insert, moving the casting surface upwardly through the pool of molten lead alloy by rotating said drum for depositing the lead alloy thereon, cooling the casting surface of the drum to solidify a strip of the lead alloy on substantially t

Abstract: An alloy for casting terminals for lead-acid batteries which has good corrosion resistance, produces less dross during manufacturing, has resistance to polypropylene degradation, as well as other improved features. The alloy is composed of antimony present in the range of about 2.5-4.75%; arsenic present in the range of about 0.15-0.35%; tin present in the range of about 0.2-0.6%; copper present in the range of about 0-200 ppm; sulfur present in the range of about 0-40 ppm and the balance lead. In an alternative embodiment, copper and sulfur are replaced with selenium in the range of about 40-90 ppm.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.

Abstract: Soft soldering compositions posessing equal or better melting, wetting and strength properties than conventional straight tin-lead solders but with a reduced tin content are disclosed. The compositions consist of 1-35 wt % tin, 5-30 wt % cadmium 0.05-2.5 wt % antimony, balance essentially lead with 5-30 wt % cadmium, and/or 1-15 wt % bismuth. The solder alloys are characterized by their improved properties concerning solidification temperature gap, spread percentage, wetting time and shear strength. Specific compositions are disclosed having the necessary properties to successfully replace the tradional tin-lead solders containing 30, 40 and 50 wt % tin. The high temperature performance of bonds made with these new alloys are better because of their reduced tendency of intermetallic compounds formation with the substrate due to their lower tin content.

Abstract: Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.

Abstract: A conventional solder composition of Sn--Bi--Pb which is improved so that, when soldering job at a lower temperature, adequate adhesion strength and a resilient bond is obtained by virtue of additional incorporation of 0.005 to 1% GA and/or 0.01 to 0.1% Ni. The inventive solder is useful in assembly work in the electronic industry wherein thermally weak parts are subjected to soldering.

Abstract: A lead based alloy is modified by adding thereto a surfactant consisting of about 0.01 to 0.5 weight percent tellurium, about 0.01 to 0.5 weight percent selenium, about 0.01 to 0.5 weight percent selenium plus about 0.1-0.5 weight percent antimony, and mixtures thereof. The alloy is rapidly solidified by forming a melt thereof containing the surfactant addition and quenching the melt on a moving chill surface at a quenching rate of at least about 10.sup.3 .degree. C./sec. Addition of the surfactant lowers melt surface tension and thereby promotes improved wetting.

Abstract: A solder alloy which is particularly effective for use in automotive radiator applications comprises 87.5%-96.5% lead, 3%-10% tin, 0.5%-2.0% antimony, and 0-0.5% silver. The solder has high mechanical strength, is resistant to galvanic corrosion, and is readily solderable.

Abstract: A plain bearing comprising a support and a galvanically deposited bearing alloy deposited on said support in a thickness of about 0.01 to 0.1 mm from a bath containing metallic fluoroborates. The bearing alloy is a copper-free alloy of only tin, antimony and lead and consisting essentially of 16 to 40% by weight tin, 8 to 11% by weight antimony and the balance lead. The support comprises a steel support covered with lead or tin-bronze and a nickel containing barrier layer.

Abstract: The grain size and resistance to corrosion of lead-antimony alloys containing less than 4% of antimony and 0.005 to 0.1% copper, are improved by incorporating therein from 0.001 to 0.1% of a mixture of rare earths, preferably misch metal. The alloys may also contain up to 0.5% arsenic or up to 0.8% of tin.

Abstract: Low antimony lead alloys suitable for use as grid material in maintenance-free high capacity lead acid batteries are disclosed. The alloys comprise 0.6 to 1.1 weight percent antimony, 0.06 to 0.25 weight percent arsenic, 0.1 to 0.4 weight percent tin, 0.06 to 0.11 weight percent copper, and the balance lead. A preferred alloy contains 0.8 weight percent antimony, 0.15 weight percent arsenic, 0.25 weight percent tin and 0.08 weight percent copper.