Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: A Pb-based overlay alloy of a plain bearing contains 3%-20% of In and more than 0.5% to 9% of Sb, and, preferably 0.1%-5% of Ag, Cu, Ni, and/or Mn, and exhibits improved properties at a high temperature and corrosive condition of deteriorated lubricating oil.

Abstract: A superconductive Pb-Bi-(Te or Sb) system trinal alloy continuous filament with a high superconducting transition temperature of at least 9.0.degree. K. and high tenacity and ductility is provided. The filament according to the invention can be efficiently manufactured in one stage with high stability and productivity, by utilizing the so-called Taylor process for producing metallic filament.

Abstract: A process is provided for increasing the strength of antimony-lead alloys by specially treating an alloy which contains an effective amount of arsenic in the alloy, the process comprising working the alloy, rapidly heat treating the alloy, which includes quenching, for a period of time sufficient to activiate a strengthening mechanism in the alloy. The process is especially useful for the manufacture of battery grids on a continuous production line.

Abstract: The disclosed invention includes improved devices and materials for thermoelectric conversion, particularly for operation at temperatures of 300.degree. C. and below. Disordered p-type semiconductor elements incorporate compound adjuvants of silver and lead to achieve enhanced "figure of merit" values and corresponding increased efficiencies of thermoelectric conversion. Similar results are obtained with disordered n-type elements by employing lowered selenium contents, preferably in combination with cuprous bromide.Improved conversion devices include powder pressed elements from one or both of these materials.

Abstract: A side terminal lead alloy is provided which is a composition of lead, 3 wt-% antimony and 10 wt-% brass. The alloy is capable of use in conjunction with resistance welding techniques. The terminal created thereby exhibits sufficient structural integrity to permit a mechanical connection to be made directly thereto without any additional threaded inserts and exhibits sufficient electrical current conductivity to permit direct electrical connection thereto.

Abstract: An indium-antimony complex crystalline semiconductor consisting essentially of crystals of an indium-antimony compound and crystals of indium alone is disclosed. The atomic ratio of the total indium content to the antimony content in the semiconductor is in the range of from 1.1/1 to 1.7/1. A process for producing such semiconductor is also disclosed. In the process, the vapors of indium and antimony are deposited on a substrate in such a manner that the arrival rate ratio of indium to antimony is controlled to be within the range of from 1.1/1 to 1.7/1.

Abstract: The grain size and resistance to corrosion of lead-antimony alloys containing less than 4% of antimony and 0.005 to 0.1% copper, are improved by incorporating therein from 0.001 to 0.1% of a mixture of rare earths, preferably misch metal. The alloys may also contain up to 0.5% arsenic or up to 0.8% of tin.

Abstract: A process for metal-enrichment of lead bullion, wherein an alkali metal-desired metal intermetallic, such as sodium-antimony intermetallic, is added as a refining dross to the bullion and the desired metal is stripped from the dross and recovered as an enriched bullion. The process includes the steps of heating the lead bullion, in which the desired metal is to be recovered, to a temperature between 650.degree. F. and 900.degree. F.; agitating the molten bullion; adding said alkali metal-desired metal intermetallic to said bullion; mixing said intermetallic into said bullion; adding a stripping reagent for stripping said desired metal from said intermetallic; forming a desired metal-enriched lead bullion and a residue dross substantially void of said desired metal; and separating said enriched bullion from said residue dross. The process may also require a cleansing step to cleanse said enriched lead bullion of any said alkali metal in solution.

Abstract: A side terminal lead alloy is provided which is a composition of lead, 3 wt-% antimony and 10 wt-% brass. The alloy is capable of use in conjunction with resistance welding techniques. The terminal created thereby exhibits sufficient structural integrity to permit a mechanical connection to be made directly thereto without any additional threaded inserts and exhibits sufficient electrical current conductivity to permit direct electrical connection thereto.

Abstract: Low antimony lead alloys suitable for use as grid material in maintenance-free high capacity lead acid batteries are disclosed. The alloys comprise 0.6 to 1.1 weight percent antimony, 0.06 to 0.25 weight percent arsenic, 0.1 to 0.4 weight percent tin, 0.06 to 0.11 weight percent copper, and the balance lead. A preferred alloy contains 0.8 weight percent antimony, 0.15 weight percent arsenic, 0.25 weight percent tin and 0.08 weight percent copper.