Abstract: A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used internal and external combustion engines The catalyst is a base metal alloy catalyst including tin antimony, lead and mercury. The catalyst operates at ambient temperatures and atmospheric pressure and in the presence of a small but effective quantity of water. The method of treating the fuel with the catalyst may be employed at any point after refining of the fuel and prior to combustion thereof.

Abstract: The quaternary Zintl material (Et.sub.4 N).sub.4 ?Au(Ag.sub.1-x Au.sub.x).sub.2 Sn.sub.2 Te.sub.9 ! that contains 1-D semiconducting chains composed of four metallic elements is prepared by treating ethylenediamine extracts of a pentanary K--Au--Ag--Sn--Te alloy with Et.sub.4 NI.

Abstract: According to the present invention, an article of manufacture is provided having at least one region which includes a lead-free solder composition. The lead-free solder composition comprises an alloy of at least 50 wt. % tin and 7-30 wt. % zinc. An effective amount of silver is added to increase the ductility of the resultant alloy at least 25% over the ductility of the binary eutectic tin-zinc alloy. In a further embodiment, the present invention provides alloys useful in articles comprising lead-free solder compositions. The alloys include at least (8.0+y) wt. % zinc, 0.25 y to 0.5 y wt. % silver and at least 50 wt. % tin where y is from 0.2 to 22.

Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.

Abstract: A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used in internal and external combustion engines. The catalyst is a base metal alloy catalyst including tin, antimony, lead and mercury. The catalyst operates at ambient temperatures and atmospheric pressure. The method of treating the fuel with the catalyst may be employed at any point after refining of the fuel and prior to combustion thereof.

Abstract: A hydrogen storage alloy preferably used for electrodes in alkaline rechargeable battery is of the general formula: Zr.sub.1.2-a Ti.sub.a Mn.sub.v Al.sub.w Ni.sub.x M.sub.y Cr.sub.z wherein M represents at least one element selected from the group consisting of Si, Zn, Sn, Fe, Mo, Cu and Co; and wherein 0.1.ltoreq.a<1.2, 0.4.ltoreq.v.ltoreq.1.2, 0<w.ltoreq.0.3, 0.8.ltoreq.x.ltoreq.1.6, 0.ltoreq.y.ltoreq.0.2, 0.ltoreq.z.ltoreq.0.3, and 1.7.ltoreq.(v+w+x+y+z).ltoreq.2.7. The alloy has at least one of a C14-type Laves phase of a crystal structure similar to that of MgZn.sub.2 and a C15-type Laves phase of a crystal structure similar to that of MgCu.sub.2 as a main alloy phase.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: A dental alloy is provided which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between one and 85 percent by weight gold, between two and 65 percent by weight of a thermal expansion adjuster, between 0.25 and 34 percent by weight of a strengthener and oxide former, up to about one percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.

Abstract: The catalyst is provided for improving the performance of hydrocarbon fuels used in internal combustion engines. The catalyst is a based metal alloy catalyst including tin, antimony, lead, mercury and thallium in the following proportions by weight percent:Sb 18-20Pb 4.5-5.5Hg 12-14Tl 0.1-0.5and the balance consisting essentially of Sn. The catalyst operates at ambient temperatures and atmospheric pressure. The catalyst is intended to pretreat fuel before combustion and may be disposed in the fuel tank, fuel line or return fuel line.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: An alloy composition comprising effective amounts of bismuth, indium, lead, tin, and gallium, which is especially suited for lens blocking.

Abstract: White solder alloys for dental and jewelry parts, with working temperatures around 1000.degree. C., contain 38 to 70% by weight gold, 6 to 20% by weight palladium, 8 to 40% by weight silver, 1 to 6% by weight iron and/or cobalt, 0 to 10% by weight copper, 0-5% each by weight indium, zinc and tin, 0 to 4% each by weight gallium and germanium, ruthenium and/or rhenium. The sum of the contents of tin, zinc, indium, gallium and germanium can be between 1 and 5% by weight.

Abstract: A dental alloy having, upon amalgamation, a desirable combination of physical properties and both a desirable condense time and carve time. The alloy contains from 48.75 to 50.75% silver, 20.25 to 21.75% copper, 28.25 to 29.25% tin, 0.05 to 0.8% palladium and up to 2.7% of elements selected from the group consisting of zinc, indium, manganese, cadmium, aluminum, gallium, ruthenium and mercury.

Abstract: The invention relates to a novel palladium-based alloy.This palladium-based alloy comprises tin in an amount, preferably of 5 to 20% by weight, which is sufficient to impart an acceptable resistance to corrosion by molten glass, preferably being essentially equivalent to that of platinum-rhodium 10% alloys.An alloy of this type can be used in the glass industry for making components which come into contact with molten glass, which preferably essentially contains no oxides less stable than tin oxide, such as lead oxide, because it has an excellent resistance to corrosion by molten glass and is much less expensive than the platinum-rhodium 10% alloy normally used. Moreover, by the addition of at least one element selected from platinum (0-50% by weight), rhodium (0-20% by weight), iridium (0-20% by weight) and ruthenium 0-20% by weight), the mechanical strength at high temperature, especially the creep strength, is significantly improved.

Abstract: The invention relates to a novel palladium-based alloy.This palladium-based alloy comprises at least one additional element selected from indium, bismuth, silver and copper, in an amount sufficient to impart an acceptable resistance to corrosion by molten glass, preferably being essentially equivalent to that of platinum-rhodium 10% alloys.An alloy of this type can be used in the glass industry for making components which come into contact with molten glass, which preferably essentially contains no oxides less stable than the oxide of the additional element, such as lead oxide, because is has an excellent resistance to corrosion by molten glass and is less expensive than the platinum-rhodium 10% alloy normally used. Moreover, by the addition of at least one element selected from platinum (0-50% by weight), rhodium (0-20% by weight), iridium (0-20% by weight), ruthenium (0-20% by weight) and tin (0-20%), the mechanical strength at high temperature, especially the creep strength, is significantly improved.

Abstract: A silver alloy composition exhibiting the desirable properties of reduced fire scale, reduced porosity, reduced grain size and reduced oxide formation when heated, consists essentially of the following parts by weight: about 89-93.5% silver, about 0.02-2% silicon, about 0.001-2% boron, about 0.5-5% zinc, about 0.5-6% copper, about 0.25-6% tin, and about 0.01-1.25% indium. A master alloy composition adapted to be alloyed with silver, consisting essentially of the following parts by weight: about 5-35% zinc, about 5-80% tin, about 5-35% copper, about 0.05-14% silicon, about 0.01-1.25% indium, and about 0.05-17% boron.

Abstract: Tin-based alloys that include micro-additions of certain elements avoid the discoloration that otherwise afflict those alloys when they are melted. The discoloration, which results from tin oxidation, correlates with poor performance of the alloys in filler metal applications. A preferred method of preparing the alloys of the invention is by rapid solidification from the melt.

Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

Abstract: Soft soldering compositions posessing equal or better melting, wetting and strength properties than conventional straight tin-lead solders but with a reduced tin content are disclosed. The compositions consist of 1-35 wt % tin, 5-30 wt % cadmium 0.05-2.5 wt % antimony, balance essentially lead with 5-30 wt % cadmium, and/or 1-15 wt % bismuth. The solder alloys are characterized by their improved properties concerning solidification temperature gap, spread percentage, wetting time and shear strength. Specific compositions are disclosed having the necessary properties to successfully replace the tradional tin-lead solders containing 30, 40 and 50 wt % tin. The high temperature performance of bonds made with these new alloys are better because of their reduced tendency of intermetallic compounds formation with the substrate due to their lower tin content.

Abstract: There is disclosed an antimony, tin and indium alloy which contains an additional element. The additional element is selected from the group consisting of titanium, aluminum, magnesium, manganese, silver, bismuth, germanium, lead, tellurium, gold, zinc, copper, palladium, nickel, iron, cobalt, and cadmium. The additional element substantially reduces arcing during the sputtering process used to make optical recording layers from the alloy.

Abstract: A method and an apparatus for the manufacture of non-allergy creating objects, especially objects of metal for direct contact with the skin of a human body, for instance jewelery, watches, glasses etc. whereby completely pure metals, especially precious metals like gold, silver, platinum, palladium, rodium etc. are alloyed with optimum pure zinc, copper, aluminum, nickel or chrome, and whereby any and all treatments both in hot and cold stage are made without access of air and without any contact with extraneous substances like salts or acids. Preferably all melting and heating is made under a protective gas.

Abstract: Low density, high temperature and aluminum-rich intermetallic alloys displaying excellent elevated temperature properties, including oxidation resistance, are disclosed. Based on the aluminum/titanium system, specifically modifications of Al.sub.3 Ti compositions, useful alloys are derived from changes in crystal structure and properties effected by selected-site substitution alloying with manganese, or chromium, and, where used, vanadium, or equivalent alloying elements.

Abstract: Disclosed is a wear-resistant intermetallic compound alloy having superior machineability which consists essentially of: 45-60% of either Ni or Co or both with cobalt content of at least 5%, at least one of 0.1-2% of Hf and 0.05-2% of Re, 0-2% of at least one element selected from the group consisting of Si, P, Cu, Zn, Ga, Ge, Cd, In, Sn, Sb, Pb and Bi, 0-2% of C, and 0-5% of at least one element selected from the group consisting of Zr, Fe, V, Nb, Ta, Cr, Mo, W and Mn, the balance being Ti and incidental impurities, the percent being atomic percent.

Abstract: Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.

Abstract: The present invention relates to a dental amalgam alloy comprising by weight, as alloying ingredients, from about 30 to 70% silver, from about 20 to 35% tin, from about 10 to 30% cooper, from 0 to about 5% indium, from 0 to about 1% zinc and from about 0.01 to 2% of a Group VIII metal selected from the group consisting of platinum, rhodium, iridium and ruthenium.

Abstract: A conventional solder composition of Sn--Bi--Pb which is improved so that, when soldering job at a lower temperature, adequate adhesion strength and a resilient bond is obtained by virtue of additional incorporation of 0.005 to 1% GA and/or 0.01 to 0.1% Ni. The inventive solder is useful in assembly work in the electronic industry wherein thermally weak parts are subjected to soldering.

Abstract: A yellow dental alloy containing a colored intermetallic compound of palladium and indium as 15-85% by weight of the alloy and at least 10% by weight of silver and as desired gold 0-30%, copper 0-45% and silver 10-50%. This alloy exhibits a pale yellow gold color which it derives from the interaction of two white colored metals--palladium and indium. Various alloying additions are specified to improve castability, ductility, strength, hardness, tarnish and corrosion resistance.

Abstract: A hydrogen-producing material comprises an aluminum alloy consisting essentially of 5 to 50% of tin and the balance being aluminum and inevitable impurities. The material may comprise a deposit composed of flat fine particles of the aluminum alloy, for example, a spray deposit formed on a base by thermal spraying with a wire of an aluminum alloy consisting essentially of 5 to 50% of tin and the balance being aluminum and inevitable impurities.

Abstract: The present disclosure relates to a dental amalgam alloy comprising by weight, as alloying ingredients, from about 30 to 70% silver, from about 20 to 35% tin, from about 10 to 30% copper, from 0 to about 5% indium, from 0 to about 1% zinc and from about 0.01 to 2% of a Group VIII metal selected from the group consisting of platinum, rhodium, iridium and ruthenium.

Abstract: A new alloy containing aluminum, chromium, copper, magnesium, manganese, zinc, titanium dioxide, and cast red brass is disclosed.

Abstract: An alloy for brazing ceramic to a ceramic or a metal consists essentially of 35 to 95% tin, 0.5 to 70% silver, 0.5 to 20% copper, 0.1 to 4% titanium and/or vanadium and/or zirconium, 0 to 5% nickel, 0 to 2% chromium, all percentages by weight.

Abstract: Titanium-silver alloys containing specified amounts of silver and titanium and controlled amounts of copper, aluminum and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials. These alloys also may contain controlled amounts of tin, palladium, indium and mixtures thereof.

Abstract: A method for transferring current which uses a fusible alloy comprising f about 25.0 to about 48.0 weight percent bismuth, from about 0.8 to about 11.5 weight percent cadmium, from about 18.0 to about 53.5 weight percent indium, from 0.0 to about 24.0 weight percent lead, and from about 9.0 to about 17.0 weight percent tin.

Abstract: There are described noble metal alloys for dental purposes, especially for firing on dental porcelain which are low melting, do not discolor the porcelain, are repeatedly castable, and making possible brazing joints. These alloys containing 20 to 65% gold, 25 to 65% palladium, 0 to 7% gallium, 0.2 to 11% indium and/or tin, 0 to 2% copper, 0.05 to 1% ruthenium, iridium and/or rhenium, 0 to 1% vanadium, 0 to 1% iron and additionally 0.5 to 15% cobalt, with the proviso that the content of base metals must exceed 5%.

Abstract: Low gold dental alloys, especially for firing on dental porcelains, should be easily worked, result in no discolorations and bubble formation in the firing, and have a physiologically replaceable hardness and a low melting interval. These properties are shown by alloys having 20 to 35 wt. % gold and 45 to 65 wt. % palladium if they also contain(a) 6 to 15 wt. % copper and 0 to 10 wt. % nickel,(b) 0 to 12 wt. % indium, 0 to 12 wt. % tin, and 0 to 4 wt. % gallium, with the proviso that the sum of the content of indium and tin added to two and one-half times the gallium content must give a value between 5 and 15 wt. %,(c) 0.1 to 1 wt. % iridium and/or rhenium and/or ruthenium, and(d) optionally 0 to 1 wt. % aluminum, 0 to 1 wt. % tantalum, 0 to 1 wt. % titanium and/or 0 to 5 wt. % silver.

Abstract: A silverless low gold dental alloy contains, by weight, 10-40% gold; 3-8% gallium; 0.5-10% indium and/or tin; 0.1 to 1.5% ruthenium, or iridium, or rhenium; balance palladium. The alloy is non-staining and bondable to and compatible with porcelain.

Abstract: This invention provides a thermal fatigue resistant, low-melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.

Abstract: Conventional or non-conventional dental amalgam alloys in the form of lathe-cut, spherical shaped or irregular shaped particles of silver, tin, copper and zinc are improved by adding to the alloys at least one compound selected from Cu.sub.6 Sn.sub.5, Cu.sub.3 Sn or a mixture thereof. The resulting dental alloy mixture is low in silver, is corrosion resistant, and is used as a filling for dental cavities after amalgamation with mercury.

Abstract: The present invention relates to low in silver particulate dental amalgam alloys comprising by weight from about 46 to 48% silver, about 23 to 33% tin, about 20 to 28% copper and about 0.5 to 5% indium.The dental amalgam alloys of the present invention have been found to be particularly efficacious when incorporated in blends with high silver particulate dental amalgam alloys, said high silver alloys being used in amounts between about 30% and 70% of the total alloy blend.

Abstract: A composition is provided consisting essentially of from about 50% to about 99% by weight of a silver-copper based brazing alloy and as an additive, from about 1% to about 50% to the composition, of a metal or metal alloy having essentially the same density as the brazing alloy and being essentially insoluble in the brazing alloy. The additives are selected from (a) molybdenum, (b) mixtures of molybdenum and at least one metal selected from the group consisting of cobalt, iron and tungsten and (c) mixtures of tungsen and at least one metal selected from iron and cobalt.

Abstract: A method for soldering aluminum or aluminum alloys is disclosed, together with an alloy useful in the method. The method includes heating, for example by using a torch, at least one aluminum piece to a temperature within the range of 90-150 degrees celsius, cleaning at least one heated surface thereof, for example by wire brushing, further heating the cleaned piece to a temperature within the range of 350-490 degrees celsius, and applying, for example by rub soldering, to the cleaned and further-heated piece a quantity sufficient to enable subsequent soldering, as required, of a tin/lead/zinc alloy consisting essentially of, by weight, from 1.7 to 2.2 percent aluminum, from 0.01 to 0.02 percent magnesium, from 45.9 to 50.4 percent zinc, from 14.2 to 34 percent tin, and from 16.6 to 36.7 percent lead.

Abstract: A bismuth-lead alloy containing lesser amounts of tin, antimony and zinc has been developed for use as a fusible metal, and particularly as a jewel metal alloy. The alloy meets the standards set by presently available jewel metals, has a lower melting temperature, better casting properties, and is less expensive than currently used alloys.