Abstract: This application describes a tool, an arrangement, and a method of manufacturing a component. The manufacturing of the component is achieved by a resin transfer from a storage chamber via a transfer line into a working chamber. Before the resin transfer, taking place, for example by a compressed air charging of the storage chamber, the storage chamber is filled with an amount of resin adjusted to the size of the component. furthermore, a semi-finished product, consisting of cut-to-size reinforcement fibers, is inserted into the working chamber that is adjusted to the form of the component to be produced. Storage chamber, transfer line, and working chamber are configured in a one-piece mould casing of the tool. The application further describes a component manufactured by the above-mentioned tool or by the above-mentioned method respectively.

Abstract: An injection compression moulding apparatus comprises two mould parts which define a mould cavity and are mounted on two relatively movable platens of an injection moulding press. An actuator is arranged in series with the platen action on at least one of the mould parts and is controlled in synchronism with the movement of the platens to enable the relative speed of the two mould parts during a mould closing phase of each article moulding cycle to be modified, the speed of relative movement of the mould parts being the vector sum of the speeds of movement and the platens and the actuator.

Abstract: A radiator core support is made by an insert injection molding method. Four core members shaped in a triangular prism are built into a quadric-prism core and inserted into a rectangular tube, an upper radiator core support member. Then, an outwardly pressing member is inserted into a longitudinal slanted hole of the core to move and contact its members to the inner surfaces of the tube. The tube is located in a mold, into which molten molding material is injected. The tube is overmolded at the tops of a hood lock stay, and right and left side support members, being integrally formed out of resin. After cooling, the method includes drawing the pressing member from the core; then the core from the mold; and the molded part is removed from the mold.

Abstract: An improved method of forming fiber-reinforced plastic shells for bathtubs utilizes a fiber mat placed on a rear surface of a plastic shell. The fiber mat is infused with a resin, and is then cured. The mat and resin are preferably received within a vacuum chamber as the resin is infused. Further, the plastic shell is preferably supported on a fluidized bed during this process. The present invention eliminates the need for detailed air handling as is now required to handle impurities in the industrial air around the process of forming the bathtub shell.

Abstract: The present invention provides a method of making modular floor tiles. The method includes adding a protective layer to a modular floor tile, which may provide surface protection, a high gloss finish, or other advantageous features. The protective layer may comprise a polymer sheet that is melded to a top surface of the modular floor tile.

Abstract: Catheter (1) for vascular access comprising a cannula (2) having at least one first lumen (21), at least one first connection tube (3), and a connection molded simultaneously on an end of the cannula (2) and on at least one part of the first connection tube (3) and manufacturing process comprising the following stages: taking a cannula (2) having at least one first lumen (21), taking one first connection tube (3), placing in a mould one end of the cannula (2) and one end of the first connection tube (3), injecting into the mould a molding material to obtain the connection (4) between the end of the first connection tube (3) and the end of the cannula placing the first lumen (21) and at least the first tube (3) in fluid communication and device for implementing the manufacturing process.

Abstract: A method is provided for manufacturing a painted plastic component such as painted air bag covers, side cladding or exterior bumpers, which includes a painted film sheet and a one-piece thermoplastic elastomeric structural carrier. A bottom contact surface of the film sheet bonds with a front contact surface of the structural carrier by diffusion between the contact surfaces thereof within a mold cavity of an injection mold separate from the mold cavity of a vacuum mold which is utilized to vacuum-mold the film sheet to form the desired painted plastic component.

Abstract: To avoid air pockets (voids), for example when embedding semiconductor devices (15) in a plastic package molding compound, process parameters in transfer and compression molding are to be contemporaneously controlled. For this purpose, the tendency for voids to form is observed on the basis of test structures in control cavities (7), which form outwardly directed continuations of the mold cavity (3) of a capillary nature.

Abstract: A resin injecting apparatus includes a resin injecting nozzle for injecting a molten resin into a cavity configured between a first resin molded part and a second resin molded part connected to the first molded part, from a through-hole configured in the second molded part, and an ejection plunger for ejecting a predetermined amount of molten resin from the resin injecting nozzle. In addition, a thermal insulating bush is attached to the resin injecting nozzle, a coolant passage is formed in the thermal insulating bush and through which a coolant is passed, and a coolant supplying unit supplies the coolant to the coolant passage.

Abstract: In at least certain embodiments, the present invention relates to a trim panel and an apparatus and method of making the same. In at least one embodiment, the trim panel comprises a first portion and a second portion with a transition portion extending therebetween with the first portion and the second portion having curved portions having radii of less than 5 mm.

Abstract: A mold for in-mold decorating that includes a stationary mold member and a movable mold member through which a decorating film can be passed. At least one of the mold members includes a cavity-forming block with molding cavity configured to receive a design pattern of the decorating film, a dieset, and engaging portions for mounting the cavity-forming block on the dieset. Clamping-force receiving portions are located around the cavity-forming block such that a clamping force is not applied to the decorating film when the mold members are joined.

Abstract: An object of the present invention is to provide a die and a method for manufacturing a core, wherein the core includes a ring-shaped supporting member 16 that is formed by a plate-like member, that is disposed inside a pneumatic tire, and that supports a pneumatic tire by allowing an inner side of a tread portion of the pneumatic tire to be brought into contact with an outer peripheral surface of the supporting member at the time of a deformation of the pneumatic tire due to a decrease of an internal pressure of the tire, and ring-shaped rubber portions that are joined respectively to both widthwise direction edge portions of the supporting member.

Abstract: Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component underneath are disclosed. The molding equipment provides one or more selectively positionable knock-out pins along the surface of the molding chamber. These pins are specially tailored such that subsequent to molding, the resulting voids are traditional or deep dimples. The molding equipment and related processes are particularly useful when forming the various layers by reaction injection molding.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: A resin infusion mold tool system for use in a vacuum assisted resin transfer molding process with a subsequent pressure bleed step. The mold tool system includes a mold assembly having an outer mold line tool connected to resin supply lines and supplying resin to the preform. A plurality of inner mold line tools form a hard interface with the inner mold line of the fiber preform and are held to within tight tolerances by an external locating fixture. Excess resin is drawn out of the fiber preform using a vacuum bag connected to vacuum lines and disposed over the inner mold line tools but not between the tools and the fiber preform. The mold assembly is placed in an autoclave, the resin supply lines are detached and the autoclave pressurized to bleed additional resin out of the preform to raise the fiber volume of the composite structure.

Abstract: One advantageous embodiment of the present invention is a reaction-injection-molded galley cart (10) for an aircraft. This cart (10) includes a body, which is configured to move along a passenger aisle of the aircraft. The body is comprised of a one-piece plastic shell (12) having a first side portion (28), a second side portion (30) spaced apart from the first side portion (28), a top side portion (24) extending between the first side portion (28) and the second side portion (30), and a bottom side portion (32) extending between the first side portion (28) and the second side portion (30). This one-piece plastic shell (12) includes at least one layer (36) of a reaction-injection-molded material.

Abstract: A molding die includes an upper die, upper-die pins arranged in the upper die to be movable up and down, springs arranged in the upper die to urge the upper-die pins downwardly, a lower die, lower-die pins arranged in the lower die to be movable up and down and springs arranged in the die to urge the pins upwardly. In molding, a hollow primary molded piece is accommodated in a cavity defined by the upper die and the lower die. Then, the piece is mounted on the pins with retained apart from a concave bottom surface of the lower die. Before closing the molding die, it is started to inject molten resin into the cavity. As a result, the molten resin enters a space between the primary molded piece and the concave bottom surface of the lower die. Even after completing to close the molding die, the injection of the molten resin is continued.

Abstract: Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block whereby the flow of the mold resin is neither perpendicular nor parallel to the side surfaces of the semiconductor chips arranged in the chip array. In this manner failures associated with the sweeping effects of the mold resin flowing past the bonding wires on the semiconductor chips may be reduced.

Abstract: A spherical bearing assembly manufacturing apparatus and its manufacturing method is disclosed. The spherical bearing that houses and supports a spherical journal is manufactured with fiber reinforced composite as a material. The spherical bearing assembly manufacturing apparatus consists of a mold, plunger, and first and second grippers. The mold has a cavity for molding fiber reinforced composite into a spherical bearing, and a first press surface for supporting fiber reinforced composite, and a first guide hole communicated with the cavity. The plunger has a second press surface for molding the fiber reinforced composite housed in the cavity into a spherical bearing, and a second guide hole formed in the center of the second press surface. In the first gripper is formed a hole in which the edge on one end of the spherical journal is housed. In the second gripper is formed a recessed portion in which the edge on the other end of the spherical journal is housed.

Abstract: An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void and a second, separate mould void; and injecting material into the first and second mould voids.

Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.

Abstract: The disclosure relates to a tool (1a, 1b, 2)for injection moulding of an opening arrangement (20) of plastic in a hole in a packing material (9), the hole defining a hole edge (8) and the tool displaying a mould cavity (7) which surrounds the hole edge (8) together with a part of a first side (9a), as well as a part of a second side (9b) of the packing material in connection with the hole edge, the mould cavity (7) displaying an inlet (10) for molten plastic and, opposing the inlet, an end gap (11) for the extension of the packaging material (9) out of the tool, the inlet (10) displaying a deflection from a first flow direction (F1) in a flow gap (5) to a second flow direction (F2) into the mould cavity (7). According to the invention, the tool (1a, 1a) displays, at said inlet (10), a throttle lip (12) which projects in a direction which substantially coincides with said first flow direction (F1).

Abstract: A tablet press (1) of the type with a rotary turret (3) for the production of tablets comprises a hopper (2) containing the pharmaceutical product in powder or granular form to be compressed; a rotary disc (4) equipped with matrices (5) designed to contain defined quantities of the pharmaceutical product fed to them by the hopper (2); reciprocating punches (8, 9) for compressing the powdered product and constituting a plurality of compressing operating stations (10); at least one set (A) f operating stations (10a) having a modified structure to inhibit operation, each modified structure station (10a) comprising barrier means (11) designed to be fitted at the matrices (5) in such a way as to prevent the passage of the product from the hopper (2) to the matrices (5), and opposing elastic means (12) designed to be coupled to, and act in conjunction with, the reciprocating punches (8, 9) and with the barrier means (11) in order to simulate the presence of powdered product.

Abstract: A molding mold and a molding method are disclosed, for molding a flange configuration in which a flange of a reel hub portion can be maintained in a predetermined configuration. Also a tape cartridge is disclosed, which can securely prevent a tape-shaped recording medium from touching at the flange while the tape cartridge is being used.

Abstract: An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater degree, mold compound not removed during a deflashing procedure does not flake off to form mold compound debris during a trimming and forming procedure. By adhering to mold compounds to a lesser degree, substantially all of the mold compound is removed during the deflashing procedure so there is no mold compound to flake off to form mold compound debris during the trimming and forming procedure. The leadframe rails may be treated by forming apertures in the rails, by increasing or decreasing the roughness of the leadframe rails, or by coating the leadframe rails with an adhesion promoting or reducing material.

Abstract: This dual use injection molding tool comprises injection molding tool with techniques for both low pressure and high pressure injection molding for injection of material into a bolster and a lifter. In the retracted, non-functional position, this tool is capable of low pressure injection molding techniques. In the extended, functional position, this tool is capable of high pressure injection molding techniques.

Abstract: The flow of resin during the molding of composite articles is controlled by forming areas of immobilized resin during the infusion of resin into the fibrous body. The immobilized resin is formed using an immobilization agent that interacts with the infused resin to form a high viscosity resin barrier that is effective in blocking the flow of non-immobilized resin. The barriers of immobilized resin are located within the fibrous body so as to control the flow of non-immobilized resin during the molding process to prevent or least reduce resin depletion and to selectively block resin flow from the mold.

Abstract: Molding apparatus for rapid transfer of molten resin or pitch in an infiltration molding process. The apparatus includes e.g. an extruder (4) for melting and conveying a resin or pitch and a mold (10) arranged so that resin or pitch is conveyed to a mold insert cavity (19) within the mold. The mold insert contains an internal protrusion such as a locating ring (25) for positioning a porous body (1, 18) within the mold insert cavity in a position that brings about unidirectional flow of the molten resin or pitch through the porous body. Also, rapid resin or pitch infiltration molding process that includes injecting a high melting point, high viscosity, molten resin or pitch into the mold to effect a unidirectional impregnation of a heated preform via a pressure gradient in the mold.

Abstract: A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner and a plurality of mold cavities. The first dummy runner connects with the top runner and the top runner extends into a space between the mold cavities. The mold cavities for accommodating the semiconductor devices are connected to the top runner. The bottom mold has a bottom runner and at least a second dummy runner. The second dummy runner connects with the bottom runner. The second dummy runner is above but separated from the first dummy runner by the package substrate.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: A multi-film junction structure includes an upper mold having a downwardly extending protrusion formed at a lower surface thereof to allow a recess to be defined in resin that is injected therearound. A first film is attached to a part of the lower surface of the upper mold and a side surface and lower surface of the protrusion, the first film having an extension extended from the lower surface of the protrusion by a predetermined length. A second film is attached to a remaining lower surface of the upper mold and an opposite side surface of the protrusion, the second film having a coupling portion located inside the extension of the first film, wherein the extension is bent upwardly. Additionally, a lower mold is provided having a recess facing the protrusion of the upper mold while being spaced apart from the protrusion, the lower mold defining an injection molding space together with the upper mold for allowing resin to be introduced and injection molded in the space.

Abstract: A method of manufacturing a charge roller utilizes a foam rubber substance where epichlorohydrin oxide rubber and an acrylonitrile butadiene rubber are mixed at a ratio of 5:95, or utilizing a crosslinking rubber substance consisting of epichlorohydrin oxide rubber and acrylonitrile butadiene rubber having a polar low molecular polymeric characteristic, thus allowing the charge roller to maintain a low volume resistivity of 107 ?cm to 108 ?cm. As a result, the surface of a photosensitive drum can be charged by a minimum charging voltage, to thereby significantly reduce an amount of ozone. A method of manufacturing a charge roller employs peroxide as a cross linking agent for rapidly cross-linking molecular chains between an epichlorohydrin oxide rubber and acrylonitrile butadiene rubber forming a main composition of a foam rubber substance.

Abstract: A golf ball manufacturing apparatus comprises a mold including a cavity for forming a golf ball, an injection molding machine for supplying a molten resin to the mold, a supply portion for supplying a resin pellet to the injection molding machine, and a crushing machine for crushing a residue discharged from the mold, thereby fabricating a regenerating pellet. The supply portion includes a main cylinder (11), a cylinder (13) for a regenerating pellet and a cylinder (15) for a virgin pellet which branch upward. An inclination angle (u) to a vertical line of the cylinder (13) is equal to or smaller than 20 degrees. An inclination angle (f3) to a vertical line of the cylinder (15) is 30 to 60 degrees. The crushing machine is coupled to the cylinder (13), and the regenerating pellet is transferred to the main cylinder (11) through the cylinder (13).

Abstract: Systems, methods and apparatuses for manufacturing dosage forms, and to dosage forms made using such systems, methods and apparatuses are provided. Novel compression, injection molding, and thermal setting molding modules are disclosed. One or more of such modules may be linked, preferably via a transfer device, into an overall system for making dosage forms. The injection molding module having at least one mold shell with an interior surface capable of producing non-uniform coatings over compressed cores or molded inserts contained therein.

Abstract: The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising: at least two mould parts displaceable relative to each other, at least one of which is provided with a recess, and feed means for encapsulating material, wherein at least one of the mould parts is provided with a runner which connects on one side to a wall of a mould part co-defining a mould cavity and connects on the other side to a side of the mould part remote from the mould cavity. The invention also relates to an encapsulating device of which such a mould forms parts, and to a method for encapsulating electronic components mounted on a carrier.

Abstract: A device for impregnating an insulation of a winding bar of an electric machine includes a container accommodating the winding rod and connected to a tank containing an impregnation agent. The container, which remains open during the impregnation process, is surrounded by an evacuation container to create a negative pressure within the container. To achieve a more rapid penetration of the impregnation agent and to simplify the overall process, a vacuum-tight sleeve acts as the container, the sleeve being encompassed by a pressure-resistant sleeve, and a conduit of an assembly that generates a vacuum leads into the interior of the sleeve. The impregnation agent is supplied with a pressure that is lower than the prevailing pressure in the pressure-resistant sleeve. The container can be a multi-part tool defining an interior for surrounding and accommodating the winding bar in a positive fit at least during an evacuation and impregnation process.

Abstract: A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.

Abstract: Apparatus for forming a plastic attachment on an article includes clamping mechanisms which position the article and form a mold surrounding the appropriate section of the article. During the process of molding the plastic attachment, the article may be moved through the mold to facilitate forming the attachment along a length of the article. The apparatus is illustrated by an annular mold for forming mating plastic couplings around the ends of tubes such as corrugated and smooth-walled metal pipes.

Abstract: A resin transfer molding (RTM) process is disclosed for rapidly filling a fibrous preform and/or a rigid, porous body with high viscosity resin or pitch. The process is suitable for impregnated multiple porous bodies stacked in a single mold. The process uses a fibrous preform or rigid porous body which is placed into a mold matching the desired part geometry. A resin is injected into the mold at temperature and pressure. After cooling, the infiltrated component is removed from the mold. The mold is constructed from two halves fitted to form at least one mold cavity. A gate fitted with a nozzle is set into one of the mold halves, and a valve admits resin or pitch into the gate area. Venting or vacuum can be applied to the mold. The mold is held in a hydraulic press and an extruder, optionally fitted with an accumulator, supplies molten resin or pitch to the mold.

Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

Abstract: An injection casting system for encapsulating semiconductor products and method of use includes a mold unit having a cavity, a substrate material placed against the cavity, the cavity being filled by a liquid dispenser in contact with the bottom of the cavity and a running channel at the bottom of the cavity to receive the liquid dispenser for even dispersion of epoxy in the cavity from the bottom of the cavity upward to the top of the cavity.

Abstract: The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a molding die; a cavity plate having a cavity hole, which defines a shape and thickness of a resin mold section of the work; a mechanism for repeatedly carrying the cavity plate into and out from the press section; and a mechanism for positioning the cavity plate onto the molding die.

Abstract: A method and molding tool for the molding of both one- or multi-component parts preferably comprising plastic material which may be integrated together with parts of another material, such as steel and copper, where the turnable middle section during the molding process is supplied with material on at least one of the surfaces thereof, that in contrast to the normal procedures are not at a right angle to the closing direction between the stationary mold part and the movable mold part of the tool. This can be realized by molding a part or a piece of a part and/or by molding around a special part for the in-molding on at least one of these surfaces of the turnable middle section. This molding and/or insertion can take place while the tool is closed and can be performed on several surfaces at the same time in order to save cycle time.

Abstract: A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

Abstract: A system for controlling the deposit of liquid, gaseous, and/or particulate solid substances from a staging medium and method of making same is provided. The system comprises a distribution medium for receiving substances, and a containment layer adjacent to the substance distribution medium. The containment layer substantially prevents substance from entering the deposit area until the distribution medium is substantially filled with substance, thereby helping to prevent uneven deposits of the substance.

Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.

Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.

Abstract: An injection moulding process for making a toothbrush involving a stack mould assembly of at least three mould blocks (1, 2, 3, 4) arranged for use along a longitudinal stack axis (A—A), with two end mould blocks (3, 4), and an intermediate mould block (1, 2), with part mould cavities (11A, 21, 31, 41, 51) in the blocks. Plastic toothbrush skeletons are made in a cavity (11A, 21, 31) between the intermediate block (1, 2) and one end block (3), then elastomer parts are made in a cavity (41, 51) between the intermediate block (1, 2) and the other end block (4). Preferably the intermediate block (1) rotates so its part cavity (11A) faces the other end block (4). Stack mould assemblies (1, 2, 3, 4) for this process are provided. The assembly (1, 2, 3, 4) provides a compact mould with high output.

Abstract: A manufacturing device for a synthetic resin hollow molded body molds a first split assembly member, a second split assembly member, and a third split assembly member by a first injection, and joints each of contact portions of the three members with a corresponding contact portion by a second injection. The manufacturing device includes an ejecting mechanism which moves the second split assembly member in a die opening/closing direction, a rotating mechanism which rotates the third split assembly member around a shaft center in the die opening/closing direction, and a sliding mechanism which slides the second split assembly member and the third split assembly member in a direction perpendicular to the die opening/closing direction.