Abstract: An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.

Abstract: This invention relates to a process for the preparation of plastic material for use in optical lenses comprising the steps of: a) synthesizing lead acrylate by adding lead monoxide to NaoH, which is stirred to obtain a homogenous mixture, b) adding an inhibitor to such a monomer mixture; c) adding acrylic acid drop wise to such a monomer mixture so as to avoid the formation of by products, d) heating the mixture of step (c) to a temperature of 35 to 45° C. till a white precipitate of lead acrylate is obtained, e) filtering, washing and drying the precipitate, f) subjecting lead acrylate to the step of polymerization by stepwise heating.

Abstract: A method of fabricating an electrode assembly of a sensor is described. The sensor has a field effect transistor. The electrode assembly is separated from the field effect transistor by only a conductive line. The sensor is functioned to detect different glucose concentrations. A solid layer of tin oxide is deposited on a substrate board. A ?-D-glucose oxidase and polyvinyl alcohol bearing styrylpyridinium groups are placed in 100 ?l of sulfuric acid, to form an enzyme mixture. The enzyme mixture is dropped on the solid layer of tin oxide. The enzyme mixture is dried. The enzyme mixture is exposed to a UV ray. The enzyme mixture is dried and stabilized. The enzyme mixture is immersed in a sulfuric buffer.

Abstract: A method for producing a light source bulb wherein a shielding film is formed on the outer peripheral face of a glass tube extending along a reference bulb axis, such that a coating for providing the shieiding film can be applied efficiently and precisely onto the outer peripheral face of the glass tube even though the shielding film is complicated in configuration. The method includes horizontally placing a light source bulb, vertically placing a coating discharging portion, moving a front edge face of the coating discharging portion close to the outer peripheral face of the shroud tube, and applying the coating by moving the coating discharging portion and the light source bulb relative to each other along a reference bulb axis and rotating the light source bulb upon the reference bulb axis while the coating is being discharged from the coating discharging portion.

Abstract: A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt.

Abstract: Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.

Abstract: In a method of hot-galvanizing ferrous materials, in order to improve results, there is provision, during the course of the galvanizing, for a step for the introduction of various suitable metals, preferably selected from aluminum, potassium, nickel, magnesium and manganese, which are introduced in the form of their salts.

Abstract: An improved fluxing method for the galvanization of steel, particularly batch galvanization, is disclosed. In this process, a metallic element is deposited (for example, by electroless plating) on the surface of the steel sheet or other article prior to its being dipped in the galvanization bath. Preferred metals for use in this fluxing process are tin, copper, nickel, with tin being more preferred, and mixtures of copper and tin being most preferred. This metallic film layer has a thickness between about 5 and about 50 nm. The process of the present invention provides a number of benefits when compared to conventional fluxing processes: for example, it is compatible with the inclusion of aluminum in the galvanization bath; it permits a greater time delay between the fluxing and galvanization operations; and it eliminates the formation of hydrogen chloride or other toxic fumes when the fluxed article is dipped in the molten zinc galvanization bath.

Abstract: A method of manufacturing a printed circuit board comprising a high density conductive pattern comprising at least one pad suitable for forming a solder connection with at least one surface mounted component. The method comprises the steps of forming the pattern; and forming a protective coating on the pattern suitable for soldering without solder resist adjacent the pad. The pad can adjoin land surrounding via hole, thereby increasing density of the circuit board layout. A further process for manufacturing printed circuits applies an etch resist to a conductive pattern, etches the pattern and uses the etch resist to form a protective coating on the pattern. The etch resist may be heated to cause the etch resist to form an alloy.

Abstract: Regarding filling of a paste, a temperature gradient at a paste-pressing face is managed by a heater incorporated in a filling head. Alternatively, a nonvolatile component is applied to a printing face of a base material before the paste is filled, thereby preventing a volatile component of the paste from evaporating with time. Viscosity of the paste is thus maintained. Meanwhile, a change of the quantity of the paste is coped with by changing a moving speed of the filling head or a contact angle of the filling head to the printing face, or by supporting the filling head at the side in touch with the printing face.

Abstract: A process for tinning plated wire involves first the placing of the wire in a suitable chemical flux for a period of time, the wire is then immersed for a period of time into a static solder pot having molten solder therein, the wire is then re-immersed into the chemical flux for a period of time, and finally the wire is immersed for a period of time into an ultrasonic solder pot having molten solder therein, the wire when removed from the ultrasonic pot being sufficiently tinned such that the solder has formed a suitable intermolecular bond to the plating in accordance with typical bonding criteria.

Abstract: The metal substrate (4) is coated with a coating (6) of another metal of alloy of 4-50 .mu.m thickness by deposition of a molten metal or alloy (5) through a nozzle (2), the melting temperature of this metal or alloy being lower than that of the substrate metal. This coating comports, starting from the substrate, a layer of intermetallic compound of thickness comprised between 0.5 and 4 .mu.m, within a limit not exceeding 40% of the total thickness, the remainder of the coating being formed of the initial coating metal of alloy in a proportion of 97 to 99.5% by weight.

Abstract: An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitudinal central cavity, and two spaced-apart, parallel longitudinally extending rails mounted on the top portion on opposing sides of said central cavity; a flux tank mounted in said central cavity approximate said first end to hold a liquid flux for flux-coating electronic component leads; a heated pot mounted in said central cavity approximate said second end to hold a hot molten solder bath for tinning the electronic component leads; a powered, wheeled electronic-component transport adapted to ride on said rails to carry electronic components from said first end over the flux tank to the second end over said solder pot and back again; two powered cam means mounted in said transport, rotatable to a high transport position and a low processing position, said c

Abstract: Method and apparatus which allows the component leads of pre-taped electronic components to be solder tinned to preserve the solderability and shelf life of such component leads. Pre-taped electronic components and the like are prepackaged in a reel and positioned in the apparatus such that the reel is free to rotate. Both leads of each component are secured to corresponding adjacent component leads by tape. The electronic components are moved through a plurality of processing stages such that one lead of each component is solder tinned, one of the processing stages removing the tape from the leads to enable the soldering thereof. After soldering of the leads, tape is applied thereto. The process is then repeated for the other leads of each component.

Abstract: In a case where filament-like articles (e.g. wires) are dip-coated by upwardly passing the article into a bath of molten metal through the bottom and top vertical openings of a spout containing the molten metal, the article to be coated is wrapped, before it enters the bottom inlet opening in the spout, with a blanket of protective gas at a pressure sufficient to cause the gas to penetrate into the spout simultaneously with the article, to progressively and regularly circulate around the molten metal and to steadily emerge from the upper opening of the spout still effectively shielding the freshly coated article.

Abstract: A cladding process and apparatus in which steel strip or sheet is cladded with a metal of lower melting point, e.g. lead, by maintaining a bank of constant level of the molten cladding material between a belt and the strip or sheet substrate which passes along an inclined path and is cooled to harden the molten material thereon. During the cooling process the applied material is compressed against the substrate.

Abstract: Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.195.degree. F.

Abstract: Method and means for continuously contact-coating one side only of a ferrous base metal strip with a molten coating metal. One or more roll means are provided to conduct the strip surface to be coated above the surface of a bath of the molten coating metal. The strip surface to be coated is caused to travel sufficiently close to the molten coating metal bath surface that the surface tension and wetting characteristics of the coating metal will permit the formation of a meniscus which will continuously contact and coat the strip surface. The coating is subjected to jet finishing. The strip is maintained in a protective non-oxidizing atmosphere at least until the one side thereof is coated. Alternatively, at least that side of the strip to be coated with the molten coating metal is coated with a flux which remains on the strip until contacted by the coating metal meniscus.