Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.

Abstract: A process for making an encapsulation structure comprising the following steps: 1) make at least one portion of material capable of releasing at least one gas when said material is heated, the portion of material communicating with the inside of a hermetically closed cavity of the encapsulation structure, 2) heat all or part of said portion of material such that at least part of the gas is released from said portion of material in the cavity, and in which said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements being released from said portion of material in gaseous form when said material is heated.

Abstract: An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.

Abstract: Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.

Abstract: The presently disclosed subject matter is directed to method for forming an encapsulant and coating electronic components such as those utilized in AMR technology with the encapsulant. The encapsulant comprises a wax, a tackifier, a polymer, a plasticizer, a thixotropic agent, and an antioxidant and is designed to protect electronic components from harsh environments such as those where high levels of humidity or corrosive liquids may be present. For example, the encapsulant exhibits minimal percent weight gain due to moisture vapor when subjected to temperatures ranging from about ?40° C. to about 70° C. and relative humidities ranging from 0% to 85% over a period of 200 days.

Abstract: There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200° C. or less and a liquid resin that is in a liquid state at 10 to 50° C. at a ratio (solid resin/liquid resin) of 0.

Abstract: An electronic device comprises a substrate (120), at least one electronic component (171, 172, 173) arranged on the substrate, and an encapsulation (140) covering the at least one electronic component (171, 172, 173). An electromagnetic protective layer (130) covers a surface (143) of the encapsulation (140) that faces away from the substrate (120), and the side faces (121, 141; 122, 142) directed transversely with respect to the surface (143). In particular, a thermal and/or electrical coupling (134, 162, 163, 164, 165, 166) couples the electromagnetic protective layer (130) thermally and/or electrically to a region (168) of the electronic device (111, 112) that is enclosed by the encapsulation. For production purposes, the device is singulated from a panel and the electromagnetic protective layer (130) is subsequently applied.

Abstract: A method and apparatus for applying an electric field to a photovoltaic element. In one embodiment, the apparatus comprises at least one photovoltaic (PV) cell having a P-N junction; and a voltage supply for (i) converting a first voltage to an e-field voltage, the first voltage generated local to the at least one PV cell, and (ii) coupling the e-field voltage to the at least one PV cell to create an electric field extending across the P-N junction.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: The present invention provides a method for forming a shielding layer on a sensor board. The sensor board includes an antenna array element. The sensor board is integrated into an electronic system. The method includes using a physical vapor deposition process to form the shielding layer on the sensor board to shield the sensor board from an electromagnetic signal generated by the electronic system, wherein the shielding layer and the antenna array element are respectively formed on two opposite surfaces of the sensor board.

Abstract: The present invention provides an electromagnetic wave shielding material that has high electromagnetic wave shielding effects, excellent transparency, and excellent see-through property, and a simple and inexpensive production process for the electromagnetic wave shielding material. Specifically, the present invention provides a process for producing an electromagnetic wave shielding material, the process comprising screen-printing in a geometric pattern a conductive paste containing a particulate silver oxide, a tertiary fatty acid silver salt, and a solvent, onto a transparent porous layer surface of a transparent resin substrate having a transparent porous layer containing as a main component at least one member selected from the group consisting of oxide ceramics, non-oxide ceramics, and metals; and performing heat treatment to form a conductive region with a geometric pattern on the transparent porous layer surface; and an electromagnetic wave shielding material produced by the production process.

Abstract: The present invention discloses methods, materials and devices for facilitating electromagnetic/radiofrequency interference (EMI/RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and/or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and/or electrically conductive (or thermally conductive and/or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or/and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component.

Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating positioned on an electrical system having circuit components mounted thereon, the dielectric coating shaped to conform to a surface of the electrical system and having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the conductive coating and the contact pads. The dielectric coating and the conductive coating have a plurality of overlapping pathway openings formed therethrough to isolate a respective shielding area of the conformal structure over desired circuit components or groups of circuit components.

Abstract: A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules including a plurality of electronic components is batch-sealed with a resin. A cut section is formed from a top surface of the sealed resin to a position that reaches a grounding electrode arranged in the substrate at a boundary section of the electronic component module so as to expose the grounding electrode. A conductive paste is applied on side surfaces and the top surface. Then, a conductive thin film is formed by spin coating, and the electronic component module is cut.

Abstract: Use of the barrier property effect of nanomaterials to improve the electrical insulation resistance, corrosion protection and bond strength properties of electromagnetic devices. The beneficial effects are realized with nanomaterial loadings of 1-20%, and preferably between 1-5%, parts by weight of coating resins. Nanomaterials include, but are not limited to, silica, alumina, zirconia, and antimony pentoxide, which are dispersed either directly into a coating, or pre-dispersed in a carrier appropriate to the solvent of the resin system. Resulting formulations benefit from the fact anti-settling agents need not be incorporated into the resin to keep the inorganic material suspended. Also, the rheology of the resin system is not significantly altered which would otherwise affect processing of the resins for their intended applications.

Abstract: A gaming apparatus comprising a housing, a transparent panel with a first and second surface, and a conductive coating disposed proximate to the second surface, wherein the coating has a high visible light transmittance and a low electrical surface resistance. The gaming apparatus also comprises a grounded metallic strip coupled to the coating and located at a perimeter of the coating, a value input device, and a mechanically rotatable reel that is disposed in the housing so that the mechanically rotatable reel is visible to a player of the gaming apparatus through the transparent panel and the coating. Also included is a controller that comprises a processor and a memory coupled to the processor. The controller is programmed to allow a person to make a wager and to determine a value payout associated with an outcome of a game incorporating the mechanically rotatable reel.

Abstract: Silsesquioxane resins useful in forming the antireflective coating having the formula (PhSiO(3-x)/2(OH)x)mHSiO(3-x)/2(OH)x)n(MeSiO(3-x)/2(OH)x)p(RSiO(3-x)/2(OH)x)q where Ph is a phenyl group, Me is a methyl group, R is selected from ester groups and polyether groups, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, q has a value of 0.01 to 0.30 and m+n+p+q?1.

Abstract: A filter for a display device and a method for fabricating the filter are provided. The filter includes a base including a transparent polymer resin and a color compensation colorant mixed in the transparent polymer resin, an external light blocking pattern formed at the base, and an electromagnetic wave blocking layer formed on the base.

Abstract: A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.

Abstract: Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically sealing protective layer is impermeable to gas, liquid, and electromagnetic waves, temperature-resistant, electrically insulating, and process-resistant.

Abstract: An electromagnetic wave shielding filter that has low electric conductivity, high visible light transmittance and good durability, a method of manufacturing the electromagnetic wave shielding filter, and a PDP apparatus including the electromagnetic wave shielding filter. The electromagnetic wave shielding filter includes a laminate structure including multiple stacks each consisting of a niobium oxide layer, a first protective layer having a ZnO as a main component, and a metal layer sequentially laminated in that order, the multiple stacks formed by repeatedly laminating the respective layers at least three times, and a niobium oxide layer formed on the laminate structure.

Abstract: A method and system for fabricating an integral electromagnetic radiation shield for an electronics package is disclosed. Various embodiments include exposing a portion of at least one ground contact feature in an electronic package by removing a portion of the electronic package above the at least one ground contact feature to form at least one trench above the at least one ground contact feature; depositing electromagnetic radiation shield material in the at least one trench to substantially fill the at least one trench with a trench deposit; and depositing additional electromagnetic radiation shield material over a substantial portion of the electronic package, wherein the electromagnetic radiation shield material in the trench and over the substantial portion of the electronic package form an integral electromagnetic radiation shield which is electrically connected to the at least one ground contact feature.

Abstract: A circuit board and process thereof are provided. The circuit board includes a dielectric layer, an active circuit, and two shielding circuits. The dielectric layer has an active surface. The active circuit is disposed on the active surface, and the shielding circuits are respectively disposed on two sides of the active circuit. The height of the shielding circuits is larger than the height of the active circuit.

Abstract: A method for producing an electromagnetic-wave-shielding light-transmitting window member comprising a transparent substrate and a conductive pattern formed by electroless plating on a surface of the transparent substrate. In the method, an ultraviolet-curable resin paste containing an electroless plating catalyst is applied to a surface of a transparent substrate, and the resulting printed pattern is cured by irradiation of ultraviolet light to form a resin pattern. Subsequently, a plating layer is deposited on the resin pattern by electroless plating treatment to form a conductive pattern. The ultraviolet-curable resin paste is selected from a group of sublimable resists and phthalocyanine-based sublimable materials and contains a volatile substance that is volatized by heating or irradiation. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.

Abstract: To manufacture an electromagnetic-wave shielding and light transmitting plate having a conductive pattern of which line width is narrow and open area ratio is high, a negative pattern 2 composed of dots is printed on a transparent film 1 having a high affinity for a plated layer of a conductive material by using a transparent resin having a low affinity for the plated layer and a backside coating layer 3 is formed by printing a transparent resin on the entire back surface of the transparent film 1. Then, a conductive material layer is formed by electroless plating to cover the film exposed surface not covered by the negative pattern 2 of the film 1, thereby forming the conductive pattern 4. After that, the blackening treatment is conducted, thereby obtaining the electromagnetic-wave shielding and light transmitting plate.

Abstract: A shielding structure for electronic components includes a circuit board, at least one electronic module disposed on the circuit board and electrically connected thereto, at least one first covering layer, at least one shielding layer, and one second covering layer. Each first covering layer covers one electronic module and each first covering layer is covered by the shielding layer. The second covering layer covers the shielding layers. In the above-mentioned structure, the shielding layer is formed by coating or printing on the first covering layer in order to shield the electromagnetic radiation emitted by the function module. The time and the costs required for the manufacture of the above invention are reduced compared to the prior art.

Abstract: A light-transmitting electromagnetic wave shielding film which is a conductive silver thin film with a metallic silver portion formed on a support in a meshy state, wherein the metallic silver portion formed in the meshy state has a line width of 18 ?m or less, an opening rate of 85% or more, an Ag content of 80 to 100% by mass and a surface resistance value of 5 ?/sq or less. This light-transmitting electromagnetic wave shielding film has characteristic features that it has a high electromagnetic wave shielding property and a high transparency at the same time and the meshy portion is black.

Abstract: A pressure sensitive adhesive for sticking together an electromagnetic wave-shielding film and an optically functional film, wherein a storage elastic modulus at 70° C. is 7.00×104 Pa or more; and a display panel filter element comprising (1) an electromagnetic wave-shielding film, the film being a laminate of a transparent substrate film, an adhesive for a metal foil, which is applied on one surface of the transparent substrate film, and a metal foil mesh formed on the adhesive for a metal foil, (2) a layer of the pressure sensitive adhesive according to (1), which is applied so as to cover the metal foil mesh of the electromagnetic wave-shielding film, and (3) an optically functional film provided on the pressure sensitive adhesive, are provided. The pressure sensitive adhesive exhibits a sufficient adhesive strength, can be filled into the inside of the pores of the metal foil mesh, and does not generate bubbles in a heating treatment.

Abstract: Disclosed herein is a method for forming a metal pattern by using metal nanocrystals. The method comprises the steps of: (i) coating a photosensitive compound having a substituent, which is converted into a free carboxyl group by light exposure, on a substrate to form a photosensitive film; (ii) selectively exposing the photosensitive film to light in the presence of a photoacid generator to form a latent pattern for crystal growth having a free carboxyl group; and (iii) treating the latent pattern for crystal growth with a nanometallic solution in which metal nanocrystals can be formed to grow the metal nanocrystals on the latent pattern. According to the method, a metal wiring pattern can be formed in a cost-effective and relatively simple manner. Further, the metal pattern formed by the method can be useful in the manufacture of an electromagnetic interference filter for flat panel display devices or an electrode, and can thus be applied to devices, e.g.

Abstract: A flexible circuit incorporating an electrostatic discharge limiting feature, comprising a dielectric substrate selected from polyimide or liquid crystal polymer film having at least one conductive trace coated on at least one surface of the substrate wherein the discharge limiting feature includes a thin conductive polymer coating selectively applied over a at least a portion of the non-critical region of the circuit, said feature reducing the surface resistivity of the circuit to about 104 ohms to about 108 ohms and having tribocharging of less than about 50 V.