Abstract: A flexible printed circuit board according to an aspect is a flexible printed circuit board including a base film and a wiring layer disposed on at least one surface of the base film and having a plurality of wiring lines. The wiring lines have an average line width of 30 ?m or less and an average spacing of 30 ?m or less. The wiring lines have a copper-based plating layer. The copper-based plating layer has an electrical resistivity of more than 1.68×10?8 ?·m.

Abstract: A method for a lithography exposure process is provided. The method includes irradiating a target droplet with a laser beam to create an extreme ultraviolet (EUV) light. The method further includes reflecting the EUV light with a collector. The method also includes discharging a cleaning gas over the collector through a gas distributor positioned next to the collector. A portion of the cleaning gas is converted to free radicals before the cleaning gas leaves the gas distributor, and the free radicals are discharged over the collector along with the cleaning gas.

Abstract: A screen printing device has a screen printing stencil. At least two doctor blade systems, each acting on the screen printing stencil are provided. The at least two doctor blade systems are arranged to each apply printing ink to an object to be printed in the same printing process. Each of the doctor blade systems has at least one doctor blade. Each of the doctor blades is arranged to sweep over the screen printing stencil. Each of the doctor blade systems is individually controlled by a control unit. The at least one doctor blade of each of the doctor blade systems is moved by a robot. At least respective two-dimensional motion paths of the doctor blades of each doctor blade system are each freely programmed and are established by control of the robot.

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

Abstract: A method of depositing a lateral pattern of a deposition material onto a substrate. The method comprises fabricating a laterally patterned deposition surface on the substrate having one or more deposition regions and one or more non-deposition regions. The method comprises depositing deposition material onto the deposition regions of the deposition surface to form a deposition structure comprising deposited regions and non-deposited regions. Depositing deposition material comprises dissolving the deposition material in a solvent to form a solution, introducing the deposition surface into fluid contact with the solution, varying a temperature of the solution, varying a pressure of the solution; and selectively heating the deposition regions to temperatures greater than the temperature of the solution to cause the deposition material to precipitate from the solution and deposit onto the deposition regions.

Abstract: A dispensing system receives liquid material and process air. The dispensing system includes a manifold body having a liquid material passage and a process air passage. The dispensing system includes a heating member received in the manifold body. The heating member has an upper portion, a lower portion, an outer surface, and a groove in the outer surface. The groove may extend between the upper portion and the lower portion and form at least a portion of the process air passage. The dispensing system may further include a nozzle configured to dispense the liquid material. The heating member may be configured to heat the process air as the process air passes through the groove and heat the liquid material through contact of the outer surface of the heating member with the manifold body.

Abstract: A nanoparticle composition comprising a plurality of stabilized metal-containing nanoparticles comprising silver and/or a silver alloy composite. The stabilized metal-containing nanoparticles are prepared by a method comprising reacting a silver compound with a reducing agent comprising a hydrazine compound by incrementally adding the silver compound to a first mixture comprising the reducing agent, a stabilizer and a solvent. The stabilizer comprises a mixture of a first organoamine and a second organoamine, an alkyl moiety of the first organoamine having a longer carbon chain length than the alkyl moiety of the second organoamine. The first organoamine is selected from the group consisting of decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine and mixtures thereof. The second organoamine is selected from group consisting of butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine and mixtures thereof.

Abstract: An organic lighting-emitting diode (OLED) display panel, a backplane attaching method and a backplane attaching device are provided. The OLED display panel includes: a flexible substrate, and a thin film transistor layer and a light-emitting layer prepared on the flexible substrate. The flexible substrate includes a first flexible substrate layer, a fixing layer and a second flexible substrate layer sequentially stacked one another. The fixing layer includes an organic film layer and magnetic particles embedded in the organic film layer. The magnetic particles are located in an internal of the flexible substrate.

Abstract: An object of the invention is to provide a conductive film that can prevent an operation error caused by ion migration and is suitable for, for example, a projected capacitive touch panel, a method for manufacturing the conductive film, and a touch panel using the conductive film. In the conductive film, a resin layer is laminated on a surface of a substrate. A mesh-shaped groove portion is formed in a surface of the resin layer. A thin metal wire is provided in the groove portion to form an electrode pattern. When a value indicating ion migration characteristics of the electrode pattern in a longitudinal direction is ML and a value indicating ion migration characteristics of the electrode pattern in a lateral direction is MS, a migration ratio obtained by dividing the larger of the two values ML and MS by the smaller value is in the range of 1.0 to 1.4.

Abstract: An integrated circuit (IC) device includes a die having an integrated passive device (IPD) layer. The integrated circuit device also includes a substrate supporting the die, a molding compound surrounding the die. The integrated circuit device further includes a backside conductive layer on a surface of the die that is distal from the IPD layer. The integrated circuit device also includes vias coupling the backside conductive layer to a ground plane through the molding compound.

Abstract: A device for manufacture including a deposition mask includes a clamper for fixing an end of a divided mask sheet and having a pin hole, a clamping pin in the clamper for being inserted into the pin hole, and an elevator for elevating the clamping pin.

Abstract: A device for manufacture including a deposition mask includes a clamper for fixing an end of a divided mask sheet and having a pin hole, a clamping pin in the clamper for being inserted into the pin hole, and an elevator for elevating the clamping pin.

Abstract: The invention relates to a method for the electrochemical measurement of an analyte concentration in vivo, comprising a fuel cell with which the analyte to be measured is reacted catalytically with an enzyme contained in an enzyme layer and which supplies an electrical voltage, dependent on the analyte concentration to be measured, beween an anode and a cathode, which voltage is measured. In the catalytic reaction of the analyte to be measured in the enzyme layer, a product is generated which, as fuel of the fuel cell, oxidizes on the anode and is reduced on the cathode. The invention further relates to a fuel cell for such a method.

Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.

Abstract: A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others.

Abstract: This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.

Abstract: An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

Abstract: A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion. A sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.

Abstract: The present invention relates to an adhesive substrate for forming a conductive pattern, which includes an adhesive substrate, and a precursor pattern of a conductive pattern, or a conductive pattern, provided on one side of the adhesive substrate, a method for preparing a conductive pattern using the adhesive substrate, a conductive pattern prepared using the adhesive substrate, and an electronic device including the conductive pattern.

Abstract: A method of forming an article is provided. The method can include providing a substrate comprising a surface. The method can further include forming a solvent soluble layer on or over the surface of the substrate in a pattern, the pattern defining one or more first portions of the surface that are overlaid by the solvent soluble layer, and one or more second portions of the surface that are free of the solvent soluble layer. The method can further include forming a second layer on or over at least one of the first portions and at least one of the second portions, wherein the step of forming the second layer includes buffing an exfoliatable material on or over at least one of the first portions and at least one of the second portions. The method can further include removing the solvent soluble layer by applying a solvent to the substrate.

Abstract: The invention relates to an electrically conductive system comprising a substrate and at least one conductive track adhered onto the substrate, wherein the substrate is composed of at least a polyamide and the conductive track is made out of an electrically conductive material and wherein the conductive track is adhered to the substrate by an jet printing technique followed by sintering. The invention further relates to a process for the production of an electrically conductive system and to its uses.

Abstract: A transparent electrical conductor with a transparent substrate and an electrically conductive layer on the substrate are provided. The conductive layer has a plurality of electrically conductive nanoscale additives. The additives are in electrically conductive contact with one another, in order to form the electrically conductive layer. The substrate is formed from a glass or glass-ceramic material or a composite material having a glass and/or glass-ceramic. The additives are embedded in a matrix layer at least in some regions. The matrix layer is formed by a transparent matrix material. In order to make such a transparent electrical conductor useful, particularly for application in a display, as a touch sensor, or the like for cooking surfaces, the transparent electrical conductor exhibits a temperature resistance of at least 140° C. The additives are dispersed in a matrix material, which is applied as a coating material onto the substrate in one coating step.

Abstract: Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials.

Abstract: A circuit board upon which to mount an integrated circuit chip may include a first interconnect zone on the surface of the circuit board having first contacts with a first pitch, and a second interconnect zone, surrounding the first zone, having second contacts or traces with a second pitch that is smaller than the first pitch. The first contacts may have a design rule (DR) for direct chip attachment (DCA) to an integrated circuit chip. The first contacts may be formed by bonding a sacrificial substrate having the first contacts to a surface of the board; or by laser scribing trenches where the conductor will be plated to create the first contacts. Such a board allows DCA of smaller footprint processor chips for devices, such as tablet computers, cell phones, smart phones, and value phone devices.

Abstract: The invention relates to a method for manufacturing boards that comprises depositing a liquid resin (22) on and/or under a plurality of electronic units for forming a plate defining a plurality of boards or board bodies. In order to do so, and in order to reduce as much as possible the residual air bubbles in the manufactured plate, the method comprises depositing the resin in the form of resin beads (26) initially having between them grooves (28) defining air discharge channels. The resin in uniformly spread using a pressing roller for one end of the plate to a second opposite end of the plate.

Abstract: A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.

Abstract: A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of ?50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.

Abstract: A silver conductive film is formed on a substrate in a continuous roll-to-roll system by applying a fine silver particle dispersing solution, which contains 30 to 70 wt % of fine silver particles dispersed in a water based dispersing medium, to a halide, such as a chlorine compound, which is applied to the substrate, by flexographic printing, and thereafter, heating the substrate at 60 to 200° C. for 0.1 to 5 seconds in an infrared (IR) heating open, which is installed on the printing path, to carry out calcination.

Abstract: A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10?6 ohm·meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film.

Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.

Abstract: There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.

Abstract: A circuit board is described. The circuit board comprises a substrate (4), a set of contact pads (6) supported on the substrate and a plurality of discrete adhesive conductive regions disposed on the contact pads and the substrate such that at some adhesive conductive regions are disposed on and between two contact pads.

Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

Abstract: A system and method for “pixelating” a three-dimensional circuit structure into a three-dimensional matrix of cubes that are located with respect to a coordinate system. The design step is typically performed on a conventional computer using computer aided design software that pixelates the proposed circuit structure into an array of uniformly sized cube. The fabrication process involves adding and subtracting bulk materials from the individual cubic positions within the pixelated representation of the circuit structure. Various existing and new techniques can be used to add or subtract bulk materials as the cubic positions within the matrix to construct the circuit structure.

Abstract: Provided are a method and device for marking an article for security, tracking or authentication. The method includes depositing a solution comprising a nucleic acid marker onto at least a portion of the article. The nucleic acid marker may be activated, for example, by adding a functional group to the nucleic acid marker. The activation of the nucleic acid marker may be performed by exposure to alkaline conditions. The method is well suited for marking fibers and textiles, as well as many other items.

Abstract: Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than those for conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a substrate (1) and a conductive pattern (5) provided on the substrate (1), wherein the conductive pattern (5), except on a surface and in a vicinity thereof on a side opposite to the substrate side, entirely has a structure comprising a binder (2) and fine aluminum grains (3) dispersed therein, and on the surface and in the vicinity a surface metal aluminum layer (4) is formed in which the fine aluminum grains (3) are spread with a roller to form a conductive junction connecting the fine aluminum grains to each other.

Abstract: Disclosed is an electronic device comprising a glass, glass ceramic, or ceramic sheet having a thickness less than about 0.4 mm and wherein a minimum strength of the inorganic substrate is greater than about 500 MPa. Also disclosed is a method of making an electronic device including drawing a viscous inorganic material to form an inorganic ribbon having opposing as-formed edges along a length of the ribbon, separating the ribbon to form a substrate sheet of inorganic material comprising two as-formed edges and forming a device element on the inorganic substrate.

Abstract: A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of inorganic nanowires. The plurality of inorganic nanowires is embedded throughout at least a region of the layer of cross-linked polymer. The region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film. The composite conductive film has a pencil test hardness in a range of 2H to 9H.

Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

Abstract: A method of forming a printed pattern on a substrate includes printing a pattern onto the substrate with a conductive ink including a conductive material, a thermoplastic binder and a solvent, curing the printed pattern, and fusing the printed pattern by feeding the printed pattern through a fusing system operated at a temperature of about 20° C. to about 130° C. above the glass transition temperature of the thermoplastic binder and at least 120° C. at a minimum, a pressure of from about 50 psi to about 1500 psi, and a feed rate through the fusing system of about 1 m/min to about 100 m/min. The method may be done continuously. The method improves the sheet resistivity of the printed ink.

Abstract: Nanoparticle inks and powders are sintered using an applied mechanical energy, such as uniaxial pressure, hydrostatic pressure, and ultrasonic energy, which may also include applying a sheer force to the inks or powders in order to make the resultant film or line conductive.

Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and including a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and are set off from the second mounting pads toward the semiconductor element.

Abstract: A metal precursor powder, a method of manufacturing a conductive metal layer or pattern, and an electronic device including the same, are provided, and in the metal precursor powder, the Gibbs free energy change of hydrogen removal at a temperature range of ?25° C. to 25° C. is ?100 kJ/mol to 300 kJ/mol.

Abstract: With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region. This allows for easier formation of the circuit pattern.

Abstract: A method for producing a laminated ceramic electronic component includes the steps of preparing ceramic green sheets, transferring an inner conductor pattern layer and a lead conductor pattern layer formed on a support on the ceramic green sheets to form the inner conductor and the lead conductor on the ceramic green sheets, laminating the ceramic green sheets to cover the inner conductor and the lead conductor, and firing the ceramic laminated product. In the step of forming the inner conductor and the lead conductor, the inner conductor pattern layer is transferred onto the ceramic green sheet a plurality of times so as to overlap each other, thereby forming the inner conductor, and the lead conductor pattern layer is transferred onto the ceramic green sheet, wherein the number of times of the transferring is less than the number of times of the transferring of the inner conductor pattern layer.

Abstract: An electronic component module includes a wiring board on which at least one electronic component is mounted, an outer layer portion that is made of prepreg and covers the wiring board so that all of the at least one mounted electronic component is not exposed, and a terminal portion that is exposed from the outer layer portion to the outside and is configured to electrically connected to a mating connection member.

Abstract: A method of manufacturing an electronic circuit with an integrally formed capability of providing information indicative of a value of a current flowing in the electronic circuit, wherein the method comprises forming an electrically conductive wiring structure on a substrate, configuring a first section of the wiring structure for contributing to a predefined use function of the electronic circuit, and configuring a second section of the wiring structure for providing information indicative of the value of the current flowing in the electronic circuit upon applying a stimulus signal to the second section, wherein at least a part of the configuring of the first section and the configuring of the second section is performed simultaneously.

Abstract: Wetting and print transfer from a printing patterned transfer surface is enhanced by applying an ultraviolet radiation responsive material to the patterned transfer surface. Ultraviolet activation of the ultraviolet responsive coating is performed during a transfer of printing material to a substrate. The technique increases precision of the printing process and is useful for transfer of printing material to a substrate in order to establish printed circuit components such as circuit traces and printed circuit elements on the substrate. In a particular configuration the ultraviolet radiation responsive material can be made of azobenzene material or free radical initiators.

Abstract: A conductive element includes a base having a first wavy surface, a second wavy surface, and a third wavy surface, a first layer provided on the first wavy surface, and a second layer provided on the second wavy surface. The first layer has a multilayer structure including two or more stacked sublayers, the second layer has a single-layer or multilayer structure including part of the sublayers constituting the first layer, and the first and second layers form a conductive pattern portion. The first, second, and third wavy surfaces satisfy the following relationship: 0?(Am1/?m1)<(Am2/?m2)<(Am3/?m3)?1.8 (Am1: mean amplitude of first wavy surface, Am2: mean amplitude of second wavy surface, Am3: mean amplitude of third wavy surface, ?m1: mean wavelength of first wavy surface, ?m2: mean wavelength of second wavy surface, ?m3: mean wavelength of third wavy surface).