Abstract: Provided are a phase transition material fluid and a proppant formed therefrom, wherein the components for preparing the phase transition material fluid comprise in percentages by mass: a supramolecular building block 10 to 60 wt %, a supramolecular functional unit 20 to 50 wt %, a dispersant 0.1 to 2 wt %, an inorganic co-builder 0.1 to 1 wt %, an initiator 0.1 to 1 wt %, the balance being a solvent. The supramolecular building block comprises a melamine-based substance and/or a triazine-based substance; the supramolecular functional unit comprises a dicyclopentadiene resin; and the dispersant includes a hydroxyl-bearing polysaccharide substance and a surfactant. After the phase transition material fluid enters the reservoir, it may form a solid substance to prop the fracture under the action of supramolecular chemistry and physics.

Abstract: A transparent electrical conductor with a transparent substrate and an electrically conductive layer on the substrate are provided. The conductive layer has a plurality of electrically conductive nanoscale additives. The additives are in electrically conductive contact with one another, in order to form the electrically conductive layer. The substrate is formed from a glass or glass-ceramic material or a composite material having a glass and/or glass-ceramic. The additives are embedded in a matrix layer at least in some regions. The matrix layer is formed by a transparent matrix material. In order to make such a transparent electrical conductor useful, particularly for application in a display, as a touch sensor, or the like for cooking surfaces, the transparent electrical conductor exhibits a temperature resistance of at least 140° C. The additives are dispersed in a matrix material, which is applied as a coating material onto the substrate in one coating step.

Abstract: Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials.

Abstract: The invention relates to a method for manufacturing boards that comprises depositing a liquid resin (22) on and/or under a plurality of electronic units for forming a plate defining a plurality of boards or board bodies. In order to do so, and in order to reduce as much as possible the residual air bubbles in the manufactured plate, the method comprises depositing the resin in the form of resin beads (26) initially having between them grooves (28) defining air discharge channels. The resin in uniformly spread using a pressing roller for one end of the plate to a second opposite end of the plate.

Abstract: Provided is a method of manufacturing a conductive metal thin film, the method including: a) heating and stirring a first solution containing a metal precursor, acid, amine, and a reducing agent to synthesize metal nano-particles on which formation of a surface oxide film is suppressed; b) dispersing the metal nano-particles synthesize in step a) in a non-aqueous solvent to prepare a conductive ink composition; c) applying the conductive ink composition onto an insulating substrate; and d) heat-treating the insulating substrate applied with the ink composition to form a conductive metal thin film. With the method of manufacturing a conductive metal thin film according to the present invention, large area conductive thin film may be manufactured as compared with the existing conductive ink composition based on noble metal nano-particles. In addition, the conductive metal thin film having excellent conductivity may be manufactured by suppressing a surface oxide film from being formed.

Abstract: A method of manufacturing an integrated metal oxide gas sensor is described including the steps of depositing a composition with metal oxide particles or precursors thereof at the desired location on a substrate including electronic components followed by a step of heating the substrate whereby the heating step is designed such that it creates a local temperature difference between the location of the deposited composition and the location of more temperature sensitive parts of the sensor such as the electronic components and is interrupted before the temperature of the substrate at the location of the electronic components reaches a threshold above which the more sensitive parts can be damaged.

Abstract: Nanoparticle inks and powders are sintered using an applied mechanical energy, such as uniaxial pressure, hydrostatic pressure, and ultrasonic energy, which may also include applying a sheer force to the inks or powders in order to make the resultant film or line conductive.

Abstract: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.

Abstract: The invention provides an electroconductive paste comprising 50-90 wt. % of copper particle, 0.5-10 wt. % of a glass frit, 0.1-5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5-20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided.

Abstract: An electroconductive stack body having on at least one side surface of a substrate an electroconductive layer that has a network structure that is made by a linear structural body, wherein, regarding an opening portion that satisfies Expression (1) in an opening area of an opening portion that is formed by the network structure, average value A of the opening area is less than or equal to 20 ?m2 and variation deviation ? of the opening area defined by Expression (2) is less than or equal to 26 ?m2: X<Xmax×0.9??Expression (1) wherein in the expression, X represents each opening area, and Xmax represents the maximum value of each opening area; and ?={?(X?A)2)/N}0.

Abstract: Thick film conductive inks for electronic devices, methods for making electronic devices using thick film conductive inks, and electronic devices fabricated by such methods are provided herein. In one example, a thick film conductive ink includes an organic portion and an inorganic portion. The inorganic portion is dispersed in the organic portion to define a paste. The inorganic portion includes metallic copper powder, cupric oxide, and elemental boron. The thick film conductive ink includes substantially no glass.

Abstract: The disclosure provides a preparation method for copper oxide nanowires including following steps: step 01, a conductive layer as an electrode is prepared on a clean substrate, or a clean substrate with a conductive layer is provided directly. Step 02, copper powder is weighed up, and the copper powder is homogeneously mixed with organic carrier. Step 03, mixture prepared in step 02 is printed onto the clean substrate with a conductive layer. Step 04, the substrate after being processed by step 03 is sintered under atmosphere having oxygen, and finally cooled to obtain copper oxide nanowires. Adhesion between the copper oxide nanowires prepared in the present disclosure and the substrate is excellent, the copper oxide nanowires may substantially prepared uniformly in large area and under low temperature, technology flow of coating is decreased, a cost of manufacture is decreased, such that a promising method for bottleneck of commercialization process of the field emission device is provided.

Abstract: The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Abstract: The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate.

Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

Abstract: A method of manufacturing a submillimetric electroconductive grid coated with an overgrid on a substrate includes: the production of a mask having submillimetric openings by the deposition of a solution of colloidal polymeric nanoparticles that are stabilized and dispersed in a solvent, the polymeric particles having a glass transition temperature Tg and the drying of the masking layer at a temperature below the Tg until the mask, with straight edges, is obtained, the formation of the electroconductive grid by a deposition of electroconductive material, referred to as grid material, a heat treatment of the masking layer with the grid material at a temperature greater than or equal to 0.

Abstract: The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.

Abstract: A silicon nitride substrate including a phase encompassed of silicon nitride particles, and intergranular phase formed from a sintering aid, wherein a separation layer is formed on the surface of a molded body including silicon nitride powder, sintering aid powder, and organic binder, by using a boron nitride paste containing boron nitride powder, organic binder, and organic solvent; the separation layer and molded body are heated; the organic binder is removed from the separation layer and molded body; subsequently molded bodies stacked with a separation layer therebetween, are sintered. Boron nitride paste contains 0.01 to 0.50% by oxygen mass and 0.001 to 0.5% by carbon mass, and c/a is within range of 0.02 to 10.00, where c is oxygen content in the powder of the boron nitride paste, and a carbon content in the degreased separation layer, which includes 0.2 to 3.5 mg/cm2 of hexagonal boron nitride powder.

Abstract: The invention relates to a process for preparing a formulation comprising an organic semiconductor (OSC) and one or more organic solvents, to novel formulations obtained by this process, to their use as coating or printing inks for the preparation of organic electronic (OE) devices, especially organic field effect transistors (OFET) and organic photovoltaic (OPV) cells, to a process for preparing OE devices using the novel formulations, and to OE devices prepared from such a process or from the novel formulations.

Abstract: A method for manufacturing a solar cell electrode, comprising the steps of: (a) applying a conductive paste for bus electrode to a wafer in order to form a bus electrode pattern; (b) depositing onto the wafer a photocurable conductive paste for finger electrode from a discharge slot of a dispenser nozzle to thereby form an uncured finger electrode pattern on the wafer, wherein the nozzle moves parallel to the wafer; and (c) curing the uncured finger electrode pattern by exposing the uncured finger electrode pattern to UV light either after forming the uncured finger electrode pattern on the wafer in the step (b), or concurrent with the step (b).

Abstract: The described embodiments relate generally to the singulation of circuits and more particularly to a method of cutting of a polymer substrate that is overlaid with a conductive element and a passivation layer. In one embodiment, the passivation layer is applied selectively to the polymer substrate in an area covering the conductive element and extending at least a first distance past an outer edge of the conductive element. Then, a cutting operation is performed along a cutting path located a second distance from an outer edge of the passivation layer. The second distance is a minimum distance between the edge of the passivation layer and the cutting path that prevents a load applied at the second distance from causing a stress crack in the passivation layer.

Abstract: The present invention can easily provide a method of manufacturing a pattern electrode with excellent electroconductivity and excellent transparency and a pattern electrode manufactured according to the method. The method of manufacturing a pattern electrode is characterized in that it comprises the steps of forming on a substrate an electroconductive layer containing metal nanowires, and carrying out pattern printing on the electroconductive layer employing a metal nanowire removing solution, followed by washing with water.

Abstract: A liquid composition for forming an activator-containing layer on a substrate, for activating a chemical reaction to produce a solid layer on the substrate, comprises activator, surfactant and solvent and/or binder. The liquid composition is deposited on a surface of a substrate, desirably by inkjet printing. The layer is used to activate a chemical reaction to produce a solid layer on the substrate surface, e.g. a layer of conductive metal. The surfactant in the liquid composition has beneficial effects on the behavior of the liquid composition when applied to certain substrates.

Abstract: For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.

Abstract: A liquid processing apparatus processes an object to be processed W including a body part Wi and a plurality of projecting-shape parts Wm disposed on the body part Wi, with an inorganic film and a different film being laminated to each other. The liquid processing apparatus comprises: a support part 50 configured to support the body part Wi; a hydrophobic-liquid supply mechanism 30 configured to supply a hydrophobic liquid to the object to be processed W; and a rinse-liquid supply part 22 configured to supply a rinse liquid to the object to be processed W to which the hydrophobic liquid has been supplied. The hydrophobic-liquid supply mechanism 30 includes: a first hydrophobic-liquid supply part 32 configured to supply a first hydrophobic liquid for making hydrophobic the inorganic film; and a second hydrophobic-liquid supply part 37 configured to supply a second hydrophobic liquid for making hydrophobic the different film.

Abstract: A composition includes a boron-containing hydrogen silsesquioxane polymer having a structure that includes: silicon-oxygen-silicon units, and oxygen-boron-oxygen linkages in which the boron is trivalent, wherein two silicon-oxygen-silicon units are covalently bound by an oxygen-boron-oxygen linkage therebetween.

Abstract: The present teachings provide a composition that includes fluoroelastomer particles, core-shell particles wherein the core is a conductive particle and the shell is a fluoroplastic, and a solvent. A surface layer formed from the coating composition is provided.

Abstract: One embodiment of the present invention is a method of fabricating an integrated circuit. The method includes providing a substrate having a metal and dielectric damascene metallization layer and depositing substantially on the metal a cap. After deposition of the cap, the substrate is cleaned with a solution comprising an amine to provide a pH for the cleaning solution of 7 to about 13. Another embodiment of the presented invention is a method of cleaning substrates. Still another embodiment of the present invention is a formulation for a cleaning solution.

Abstract: A method of forming a high resolution feature on a substrate, the method includes, depositing a liquid composition comprising a substance and a solvent onto the substrate to form deposited features, heating the deposited features to a heating temperature during or after the depositing to form an intermediate feature having a central region and an edge region, applying an adhesive substance to at least a portion of a surface of the intermediate feature, and removing the adhesive substance together with at least a portion of the central region of the intermediate feature to form the high resolution feature on the substrate.

Abstract: A method of forming a passivation layer comprising silicon nitride on features of a substrate is described. In a first stage of the deposition method, a dielectric deposition gas, comprising a silicon-containing gas and a nitrogen-containing gas, is introduced into the process zone and energized to deposit a silicon nitride layer. In a second stage, a treatment gas, having a different composition than that of the dielectric deposition gas, is introduced into the process zone and energized to treat the silicon nitride layer. The first and second stages can be performed a plurality of times.

Abstract: A low-temperature sintered conductive metal ink and a method for preparing the same are provided. To be specific, the preparation method includes the following steps of: preparing the conductive film or pattern by printing a conductive metal ink including metal nanocolloids, metal salts, and polymers reacted with the metal salts and preparing the metal nanocolloids (step 1); preparing a mixture by mixing the metal salts and polymers (step 2); preparing the metal ink by stirring the metal nanocolloids and the metal salt/polymer mixture prepared at steps 1 and 2 (step 3); printing the metal ink prepared at step 3 (step 4); and drying and thermally treating a product printed at step 4 (step 5).

Abstract: A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink.

Abstract: Water-soluble electrically conductive polymers and a composition comprising such polymers are provided. Also, an electrically conductive layer or film formed from the composition, and articles comprising the electrically conductive layer or film are provided. The electrically conductive polymers according to the present disclosure have one or more hydrophilic side chains. Hydrophilic side chains are covalently bonded to the conductive polymers, which allow the polymer to be stable at high temperature. Thus, the stability of electrical conductivity is prolonged. Depending on the concentration of hydrophilic side chains, the conductivity may be changed. The hydrophilic side chains provide a successful way to fabricate a ductile film exhibiting tunable conductivity. Furthermore, high levels of surface-resistance uniformity can be achieved in the field of coating technology that uses eco-friendly water-based solvents to uniformly and quickly coat the conductive polymer on to plastic film surfaces.

Abstract: An interface is formed by pressing a first surface and a second surface together, with a particle-loaded thermal interface material (TIM) in between. By applying the thermal interface material to controlled locations on the first surface in controlled amounts, final layer thickness at a given squeezing pressure, and time required to squeeze, are minimized. The locations and amounts are controlled such that small islands of TIM merge only just before final layer thickness is achieved. Better TIM thermal performance and quicker manufacturing result.

Abstract: Provided is a method of producing a two-layered copper-clad laminate with improved folding endurance, wherein the two-layered copper-clad laminate retains folding endurance of 150 times or more measured with a folding endurance test based on JIS C6471 by subjecting the laminate in which a copper layer is formed on a polyimide film through sputtering and plate processing to heat treatment at a temperature of 100° C. or more but not exceeding 175° C. Specifically, provided are a method of producing a two-layered copper-clad laminate (two-layered CCL material) in which a copper layer is formed on a polyimide film through sputtering and plate processing, wherein the rupture of the outer lead part of a circuit can be prevented due to the improvement in folding endurance; and a two-layered copper-clad laminate obtained from the foregoing method.

Abstract: A method and apparatus for applying an electric field to a photovoltaic element. In one embodiment, the apparatus comprises at least one photovoltaic (PV) cell having a P-N junction; and a voltage supply for (i) converting a first voltage to an e-field voltage, the first voltage generated local to the at least one PV cell, and (ii) coupling the e-field voltage to the at least one PV cell to create an electric field extending across the P-N junction.

Abstract: Disclosed herein is a method of fabricating a transparent conductive film, including preparing a carbon nanotube composite composition by blending a carbon nanotube in a solvent; coating the carbon nanotube composite composition on a base substrate to form a carbon nanotube composite film, and acid-treating the carbon nanotube composite film by dipping the carbon nanotube composite film in an acid solution, followed by washing the carbon nanotube composite film with distilled water and drying the washed carbon nanotube composite film to form a transparent electrode on the base substrate. The transparent conductive film can have excellent conductivity, transparency and bending properties following acid treatment, so that it can be used in touch screens and transparent electrodes of foldable flat panel displays. Further, the carbon nanotube composite conductive film can have improved conductivity while maintaining transparency after acid treatment.

Abstract: A clearance filling PCB includes pin contact units on a surface of the external layer of the PCB and clearance filling units formed by molding a clearance between the pin contact units and polishing an insulating layer so that the height of the insulating layer becomes equal to the height of the pin contact units in order to prevent the sliding of a fine pitch circuit with a pin and induce accurate contact between the fine pitch circuit and the pin, and a method of manufacturing the same. The height of the insulating layer is made equal to the height of the pin contact units by molding the clearance between the pin contact units on the surface of the external layer of the PCB, and the sliding of a fine pitch circuit, requiring contacts, with a pin can be prevented.

Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.

Abstract: An opening in a substrate is formed, e.g., using optical lithography, with the opening having sidewalls whose cross section is given by segments that are contoured and convex. The cross section of the opening may be given by overlapping circular regions, for example. The sidewalls adjoin at various points, where they define protrusions. A layer of polymer including a block copolymer is applied over the opening and the substrate, and allowed to self-assemble. Discrete, segregated domains form in the opening, which are removed to form holes, which can be transferred into the underlying substrate. The positions of these domains and their corresponding holes are directed to predetermined positions by the sidewalls and their associated protrusions. The distances separating these holes may be greater or less than what they would be if the block copolymer (and any additives) were to self-assemble in the absence of any sidewalls.

Abstract: The use of at least one diazonium salt bearing an initiator function, for forming an undercoat obtained by grafting a graft derived from the diazonium salt and bearing an initiator function at the surface of a conductive or semiconductive material on the undercoat, and for forming on the undercoat a polymeric layer obtained by polymerization, in particular free radical polymerization, in situ of at least one monomer, initiated from the initiator function.

Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed, which comprises providing a substrate with a conductive layer formed on the surface of a substrate, conditioning the surface of the substrate, immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioned surface of the substrate, and thermally treating the polymer-protected electrochemical catalyst layer at a temperature approximately below 300° C.

Abstract: The invention relates to a method of depositing a layer of material onto the surface of an object, of the type comprising the deposition of a layer of solution of said material in a first liquid followed by the evaporation of the first liquid to form the layer of material. According to the invention, the method comprises the formation of a layer of a second liquid interposed between the object and the layer of solution, the second liquid being immiscible with the first liquid, of density greater than that of the first liquid and with an evaporating temperature higher than that of the first liquid.

Abstract: A method for manufacturing an electrical contact pad, including a pad mounting and at least one contact layer, and a method for manufacturing an electrical contact, including a contact mounting and at least one contact layer are described. The methods include a step of depositing, via cold gas dynamic spraying, a first powder onto the pad or contact mounting so as to form the contact layer, the first powder containing at least particles including grains made of at least one refractive material, the grains being built into a matrix made of conductive metal selected from among silver or copper. The pads and the electrical contacts obtained in the respective manufacturing methods are also described.

Abstract: The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.

Abstract: A polymer for gap-filling in a semiconductor device, the polymer being prepared by polycondensation of hydrolysates of the compound represented by Formula 1, the compound represented by Formula 2, and one or more compounds represented by Formulae 3 and 4: [RO]3Si—[CH2]n—Si[OR]3??(1) wherein n is from 0 to 2 and each R is independently a C1-C6 alkyl group; [RO]3Si—[CH2]nX??(2) wherein X is a C6-C12 aryl group, n is from 0 to 2, and R is a C1-C6 alkyl group; [RO]3Si—R???(3) wherein R and R? are independently a C1-C6 alkyl group; and [RO]3Si—H??(4) wherein R is a C1-C6 alkyl group.

Abstract: The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics. The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder.

Abstract: A circuitized substrate for use in such electrical structures as information handling systems wherein the substrate includes a capacitive substrate as part thereof. The capacitive substrate includes a thin film layer of capacitive material strategically positioned on a conductive layer relative to added electrically conductive elements to in turn provide a plurality of internal capacitors within the final circuitized substrate during operation thereof. A method of making such a circuitized substrate is also provided.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Provided is a transparent flexible printed wiring board which is excellent in flexibility, heat resistance and adhesion between a transparent film and a transparent conductive film. A transparent polyimide film, whose dimension change rate in association with a baking process is not larger than ±0.2%, is prepared. ITO ink containing ITO fine particles and a binder is printed in the form of a predetermined pattern on the transparent polyimide film by an ink-jet method. The ITO ink is then baked at 230 to 300° C., thereby forming a transparent conductive film with a binder ratio of 5 to 10 wt %.