Width Or Thickness Variation Or Marginal Cuts Repeating Longitudinally Patents (Class 428/573)
  • Patent number: 6880243
    Abstract: A printed circuit board stiffener is provided comprising a generally U-shaped elongated horizontal assembly having a substantially horizontal surface, an elongated vertical member extending downward from and rigidly coupled to one of the elongated horizontal assembly members opposite the assembly's curved edge and having a plurality of legs extending from the elongated vertical member, each such leg further comprising a flange extending substantially perpendicular to its respective plurality of legs in a direction toward the elongated horizontal assembly's curved edge. Each of said flanges are suitable for attachment to a surface of a circuit board. Further, such stiffener is capable of being moved, oriented, placed and mechanically bonded to the printed circuit board using existing SMT robotic assemblies.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: April 19, 2005
    Assignee: Sanmina-SCI Corporation
    Inventor: John A. Ireland
  • Patent number: 6824887
    Abstract: A structure for encapsulating and protecting fiber insulation material as well as other materials in multicompartment devices in order to provide unitized material which can be applied to any surface desired for insulation or other purposes. A first sheet of material is formed with pockets or depressions in the sheet which are adapted for receiving the material desired to be unitized and a second sheet placed over the first sheet, and the two sheets are attached together in the areas between the pockets or depressions thus encapsulating the material in the pockets. The material is unitized by placing the material in individual sealed metal foil containers or compartments, then the individual containers of unitized material are attached in matrix form to a continuous sheet, such as positioning the containers in openings in the continuous sheet. The product can be applied to any surface desired for insulation or other purposes. Preferably a multilayer metal foil material is employed in the structures.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: November 30, 2004
    Assignee: ATD Corporation
    Inventor: G. William Ragland
  • Patent number: 6752308
    Abstract: A titanium alloy strip which has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the titanium alloy strip allows for the possibility of removing the laser device from the substrate without destroying the laser device.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: June 22, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Maheshchandra Mistry, Christopher Main
  • Patent number: 6733899
    Abstract: There are provided a step of forming a structure in which a first concave portion is formed in a predetermined portion on one surface of a metal plate and also a convex portion that protrudes from other surface of the metal plate is formed by formation of the first concave portion and a second concave portion is formed in a predetermined portion on an outside of a peripheral portion of the convex portion, by shaping the metal plate by means of stamping using a die, and a step of cutting the convex portion formed on the other surface of the metal plate.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: May 11, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Sumio Uehara, Yoshihisa Nagamine, Toshifumi Iizuka
  • Publication number: 20040086739
    Abstract: Disclosed is a film carrier tape for mounting electronic part comprising an insulating film and a wiring pattern which is made of a conductive metal and is provided on the surface of the insulating film, wherein an undercoating layer containing nickel as a main constituent is formed on at least a part of the surface of the wiring pattern made of a conductive metal, an intermediate layer containing palladium as a main constituent is formed on the surface of the undercoating layer, a surface layer containing gold as a main constituent is formed on the surface of the intermediate layer, and the average thickness of the intermediate layer containing palladium as a main constituent is not more than 0.04 &mgr;m. According to the present invention, a film carrier tape for mounting electronic part, in which the wire bonding strength to the bonding pad (connecting terminal) and the peel strength of the solder ball to the ball pad are high and the variability range of these strengths is small, is provided.
    Type: Application
    Filed: June 20, 2003
    Publication date: May 6, 2004
    Inventors: Yasunori Matsumura, Hideaki Makita
  • Patent number: 6727006
    Abstract: A method of production and/or processing of contact elements for electrical plug connectors is provided. The contact elements are fixed to a transport strip during the production and/or processing process. This transport strip is reduced in its material thickness after at least a portion of the production and/or processing process by deformation between the fixed positions of adjacent contact elements on the strip, so that the spacing between the fixed positions of adjacent contact elements is increased.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: April 27, 2004
    Assignee: Kramski GmbH
    Inventor: Wiestaw Kramski
  • Publication number: 20030170481
    Abstract: A method of production and/or processing of contact elements for electrical plug connectors is provided. The contact elements are fixed to a transport strip during the production and/or processing process. This transport strip is reduced in its material thickness after at least a portion of the production and/or processing process by deformation between the fixed positions of adjacent contact elements on the strip, so that the spacing between the fixed positions of adjacent contact elements is increased.
    Type: Application
    Filed: March 6, 2003
    Publication date: September 11, 2003
    Applicant: Kramski GmbH
    Inventor: Wiestaw Kramski
  • Publication number: 20030170480
    Abstract: The present invention discloses gradients and methods of forming gradients. The gradients can form a component of a molecular machine, such as those disclosed herein. The molecular machines of the present invention can perform a range of tasks including nanoparticle heterostructure assembly, derivatization of a nanoparticle and synthesis of biomolecules, to name just a few applications.
    Type: Application
    Filed: January 16, 2003
    Publication date: September 11, 2003
    Applicant: North Carolina State University
    Inventors: Christopher B. Gorman, Daniel L. Feldheim, Ryan R. Fuierer
  • Patent number: 6607841
    Abstract: An improved silicon steel sheet has two lateral ends each having a side edge narrower than the width of the silicon sheet. The side edge has two end points linking respectively to two lateral sides of the silicon steel sheet to form two symmetrical slant edges for reducing tension area of the silicon steel sheet at the side edge. The slant edges and the side edges form two solder zones to anchor the silicon steel sheet for soldering at the initial winding stage and after the winding is completed.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: August 19, 2003
    Inventor: Albert Chow
  • Patent number: 6503639
    Abstract: A press-formed product which is characterized by having a large number of linear concave portions 11 in the region (such as the side wall 31 of the press-formed product 30) which has undergone bending or bending-unbending deformation during press-forming, said linear concave portions satisfying the following requirements. D/P≦0.03×t/1.2 and 0.02t<D≦0.5t where, P (mm) is an interval between the linear concave portions 11, D (mm) is a depth of the linear concave portions, and t (mm) is a wall thickness of the press-formed product. A method of producing a press-formed product, said method being characterized by using a die having linear projections on its forming surface in such a way that the edges of said linear projections cut into the blank in the region which has undergone bending or bending-unbending deformation during press-forming, thereby correcting warpage at the same time of press-forming.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: January 7, 2003
    Assignee: Kobe Steel, Ltd.
    Inventors: Jiro Iwaya, Koichi Kani, Toshiaki Funabiki
  • Patent number: 6447928
    Abstract: A core metal insert for use in a sealing assembly is disclosed. The core metal insert is manufactured by a process which includes the step of cutting a plurality of left lateral outermost inboard slits and a plurality of right lateral outermost inboard slits in a metal blank so as to create a slitted metal blank.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: September 10, 2002
    Assignee: The Gem City Engineering Company
    Inventor: Terry Robert Suitts
  • Patent number: 6426152
    Abstract: Castings for gas turbine parts exposed on one side to a high-temperature fluid medium have cast-in bumps on an opposite cooling surface side to enhance heat transfer. Areas on the cooling surface having defectively cast bumps, i.e., missing or partially formed bumps during casting, are coated with a braze alloy and cooling enhancement material to salvage the part.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: July 30, 2002
    Assignee: General Electric Company
    Inventors: Robert Alan Johnson, Jon Conrad Schaeffer, Ching-Pang Lee, Nesim Abuaf, Wayne Charles Hasz
  • Patent number: 6426154
    Abstract: The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to the ceramic substrate through a brazing material layer; wherein the brazing material layer is composed of Al—Si group brazing material and an amount of Si contained in the brazing material is 7 wt % or less. In addition, it is preferable to form a thinned portion, holes, or grooves to outer peripheral portion of the metal circuit plate. According to the above structure of the present invention, there can be provided a ceramic circuit board having both high bonding strength and high heat-cycle resistance, and capable of increasing an operating reliability as electronic device.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: July 30, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Naba, Hiroshi Komorita, Noritaka Nakayama, Kiyoshi Iyogi
  • Patent number: 6401292
    Abstract: The invention relates to a wiper blade with a wiper head (1), wiper lip (2) and a connecting tilting bar. It is distinguished in that the wiper head (1) and the wiper lip (5) consist of at least one elastomer, and the connecting tilting bar is an elastic, resilient metal strip (4).
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: June 11, 2002
    Assignee: Robert Bosch GmbH
    Inventor: Wolfgang Leutsch
  • Patent number: 6337142
    Abstract: A hollow elongate element of elastic material for transmitting forces in which the walling comprises openings which reduce the bending resistance moment and are arranged such that the torsion resistance moment of the element essentially remains.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: January 8, 2002
    Assignee: Stryker Trauma GmbH
    Inventors: Hans E. Harder, Harm-Iven Jensen, Andreas W. Speitling
  • Publication number: 20010024732
    Abstract: A core metal insert for use in a sealing assembly is disclosed. The core metal insert is manufactured by a process which includes the step of cutting a plurality of left lateral outermost inboard slits and a plurality of right lateral outermost inboard slits in a metal blank so as to create a slitted metal blank.
    Type: Application
    Filed: March 26, 2001
    Publication date: September 27, 2001
    Inventor: Terry Robert Suitts
  • Publication number: 20010008704
    Abstract: A hollow elongate element of elastic material for transmitting forces in which the walling comprises openings which reduce the bending resistance moment and are arranged such that the torsion resistance moment of the element essentially remains.
    Type: Application
    Filed: June 22, 1998
    Publication date: July 19, 2001
    Inventors: HANS ERICH HARDER, HARM-IVEN JENSEN, ANDREAS WERNER SPEITLING
  • Patent number: 6260265
    Abstract: A rigid bar of material is fastened to a circuit board to increase its stiffness. The bar is preferably a high modulus plastic such as liquid crystal polymer. Flexible fingers which surround a central opening are formed integrally with the bar and pop into throughbores in the circuit board. Each finger has at least one arcuate protrusion and, preferably several, which can engage the bottom of the circuit board. A rigid pin which may be made of steel is slid into the central opening and has an interference fit therewith to hold it in place to prevent flexible fingers from moving inwardly so the stiffener is held fast to the circuit board. In one embodiment, the stiffener has an I-beam cross section and arches enhancing the resistance to bending.
    Type: Grant
    Filed: April 19, 2000
    Date of Patent: July 17, 2001
    Assignee: Power Distribution Products
    Inventors: Charles D. Kownacki, Paul M. Deters
  • Patent number: 6254999
    Abstract: A plated product is provided which comprises a material of which the surface has many recesses, each having an opening of 5˜100 &mgr;m and a depth of 0.2 d˜d (d: the size of the opening of a recess, &mgr;m) and having an anchor portion. Further, a plurality of grooves are provided on the surface of the material. The width of the opening of each groove and the depth of each groove have specified values. The groove can be provided at each of both edges of its opening with a ridge portion. The angle of said groove to the surface of the material is within a range of specified values. A part of the thin film of metal enters the anchor portions of the recesses or grooves, so that the plated metal produced by this invention has a superior technical effect in that the thin film of metal hardly peels off the surface of the material.
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: July 3, 2001
    Assignee: Sintokogio, Ltd.
    Inventors: Kunio Ota, Hitoshi Rokutanda, Hiroaki Suzuki, Shinobu Kato, Seietsu Abe
  • Patent number: 6170378
    Abstract: A method and apparatus for defeating high-velocity projectiles. A plurality of disks of equal size and having a thickness greater than 0.100″ are milled in a plurality of places. Each milled place having a radius of curvature approximately equal to the radius of curvature of the disk. The disks are then laid out in an imbricated pattern row by row such that each disk in a row is in substantially a straight line with the other disks in the row and overlaps a milled place of a disk in a row above its row and has its milled place overlapped by a disk in the row below its row. The imbricated pattern is then adhered to a flexible, high tensile strength substrate and overlaid by a second high tensile strength layer such that the imbricated pattern is enveloped between the substrate and the second layer. The envelope is then coupled to a soft body armor backing.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: January 9, 2001
    Inventors: Murray L. Neal, Allan D. Bain
  • Patent number: 6114049
    Abstract: A stent and a method for fabricating the stent are disclosed. The stent has an originally flat pattern and connection points where the sides of the flat pattern are joined. The method includes the steps of a) cutting a stent pattern into a flat piece of metal thereby to produce a metal pattern, b) deforming the metal pattern so as to cause two opposing sides to meet, and c) joining the two opposing sides at least at one point. Substantially no portion of the stent projects into the lumen of the stent when the stent is expanded against the internal wall of a blood vessel.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: September 5, 2000
    Assignee: Medinol Ltd.
    Inventor: Jacob Richter
  • Patent number: 6051613
    Abstract: A pharmaceutical composition containing an extract from inflammatory tissue inoculated with vaccinia virus may be used to suppress the death of cells caused by endotoxin, and suppress excessive production of nitrogen monoxide induced by endotoxin. The extract may also be used to relieve hypotension induced by endotoxin. In sepsis and other serious bacterial infectious diseases, endotoxin (an intracellular toxin) is produced and a shock symptom is induced by its action. The extract, having an excellent inhibitory action toward endotoxin-induced toxicity, is quite useful for the treatment or the prevention of endotoxin-induced shock symptoms, sepsis and various symptoms accompanied thereby. In addition, the extract has an inhibitory action towards abnormal nitrogen monoxide production during the diseased state and, therefore, it is also useful as a therapeutic and preventive agent for diseases wherein an excessive nitrogen monoxide production occurs, such as acute hypotension.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: April 18, 2000
    Assignee: Nippon Zoki Pharmaceutical Co., Ltd.
    Inventors: Kousaku Ohno, Jin-emon Konishi, Seishi Suehiro
  • Patent number: 6048616
    Abstract: Doped encapsulated semiconductor nanoparticles of a size (<100 .ANG.) which exhibit quantum effects. The nanoparticles are precipitated and coated with a surfactant by precipitation in an organometallic reaction. The luminescence of the particles may be increased by a further UV curing step.
    Type: Grant
    Filed: October 4, 1994
    Date of Patent: April 11, 2000
    Assignee: Philips Electronics N.A. Corp.
    Inventors: Dennis Gallagher, Rameshwar Bhargava, Jacqueline Racz
  • Patent number: 5851685
    Abstract: An easy open can end having an improved rivet structure integrally formed thereon for the attachment of a pull tab, a method of further forming a can end to incorporate the improved rivet, and tooling for accomplishing the method. The further formation of the can end includes the steps of bubble formation, first button formation, and final rivet formation.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: December 22, 1998
    Assignee: Aluminum Company of America
    Inventor: Carl McEldowney
  • Patent number: 5789066
    Abstract: Method of producing metal sheets or strips by cold reduction rolling of a metal sheet or strip with at least one pair of work rolls, at least one of which being a textured work roll in order to transfer the surface pattern of the textured work roll to the surface of said sheet or strip, characterized in that said pattern of the textured work roll consists in a bidimensional deterministic pattern of spots wherein each spot has the form of a crater with a rim around it.
    Type: Grant
    Filed: March 4, 1996
    Date of Patent: August 4, 1998
    Assignee: Sidmar N.V.
    Inventors: Carl De Mare, Damien De Soete, Yves Gadeyne
  • Patent number: 5788110
    Abstract: A highly effective barrier for protecting objects against focused beams of radiant energy. The invention has special applicability in a combat environment for protecting military equipment against destruction by laser weapons, or for thwarting detection of such equipment by reflected radar waves. The barrier comprises a layer of slitted and expanded metal foil, made from a non-ferrous metal having an absorptivity less than 3% and a thermal conductivity above 100 W/m/K, interposed between the radiant energy beam and the object to be protected. The barrier layer may be multiple sheets of the slitted and expanded metal foil, or a contained layer of nested ellipsoids formed from the expanded metal sheets.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: August 4, 1998
    Inventor: Shaikh Ghaleb Mohammad Yassin Alhamad
  • Patent number: 5783312
    Abstract: A continuous strip of sheet metal is progressively lanced and then expanded by coining rolls to form an expanded ladder-like reinforcing strip. The strip has laterally extending parallel spaced bars integrally connected on one side by a coined solid spline and on the other side by a coined spline lanced to form slits at longitudinally spaced intervals. The strip is roll-formed into a U-shaped channel which is fed into an extruder head for reinforcing an extruded resilient weatherstrip having a tubular portion projecting from the embedded continuous solid spline and a retaining wall portion reinforced with the embedded lanced spline.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: July 21, 1998
    Assignee: The Gem City Engineering Co.
    Inventors: Kerry L. Laughman, Terry R. Suitts, Daniel J. Davis, Robert W. Davis
  • Patent number: 5756167
    Abstract: A method of producing an elongated member having a main body portion and terminal portions extending form ends thereof includes bending an elongated strip between circumferential faces of first forming rolls and second forming rolls having parallel central rotational axes. The circumferential faces of the first forming rolls include annular main body portion bending sections that form the main body portion in the strip and adjacent transition portion bending sections that form adjacent transition portions in the strip, thereby forming an intermediate stage elongated member. The transition portions have a cross-section that changes continuously from the annular cross-section of the main body portion to a different cross-section of the terminal portions.
    Type: Grant
    Filed: February 26, 1996
    Date of Patent: May 26, 1998
    Assignee: Hashimoto Forming Industry Co., Ltd.
    Inventors: Tatsuya Tamura, Toshio Ohkura, Yuko Kano
  • Patent number: 5521028
    Abstract: Metallization by deposit under vacuum of metal on a face of a support film of synthetic resin at a thickness of 0.005 to 0.1 micron, followed by the electrochemical deposit of an additional metallic layer, whose thickness is between 0.1 and 4 microns. A coating of an electrode of a generator is then applied on the surface of the collector thus prepared. The assembly is characterized by the adhesion of its components and its facility of mechanized handling during the steps of assembling the complete generator.
    Type: Grant
    Filed: April 7, 1995
    Date of Patent: May 28, 1996
    Assignee: Hydro-Quebec
    Inventors: Michel Gauthier, Guy St-Amant, Guy Vassort
  • Patent number: 5419965
    Abstract: There is disclosed a reinforcing element for reinforcing a solidified fluid mass such as concrete or refractory comprising an elongate shank having a slot extending along at least a portion of the length of the shank. The slot increases the surface area of the shank and increases the aspect ratio of the element to more firmly bond the element in the mass. Anchoring portions are provided at the ends of the shank and have a width greater than the diameter of the shank.
    Type: Grant
    Filed: March 8, 1994
    Date of Patent: May 30, 1995
    Assignee: Domecrete Ltd.
    Inventor: C. Geoffrey Hampson
  • Patent number: 5415948
    Abstract: Self-protecting current collector, with lateral collection an insulating plastic support film having a thickness between about 1 and 30 microns, and a conductive metallic coating, of a thickness lower than about 10 microns, adhering to at least one face of the insulating support film, compatible with the corresponding material of the electrode of the generator, and wherein its conductive surface is divided into a plurality of adjacent distinct areas, each area being electrically insulated by means of non-conductive borders except for at least one conductive bridge of small cross-section connected to a lateral common conductive margin enabling a lateral collection of the entire distinct areas; the nature and electrical resistance of the conductive bridges enabling on the one hand, passage of currents corresponding to maximum currents provided for each of the individual collection areas of the generator to be produced, and limiting on the other hand, in case of an accidental short-circuit inside an area, the ma
    Type: Grant
    Filed: September 17, 1992
    Date of Patent: May 16, 1995
    Assignee: Hydro-Quebec
    Inventors: Michel Gauthier, Guy St-Amant, Yves Choquette, Real Boissonneault
  • Patent number: 5378545
    Abstract: A removable stiffener, which is made of titanium so that it will not be wetted by solder, consists of a thick, straight center member with wedge-shaped feet evenly spaced along its length. A latching pin is included on one end. The stiffener also includes flanges made of thinner stock, running the length of the stiffener on both sides. These flanges strengthen the center member and hold it perpendicular to the card on which the stiffener is installed. The stiffener requires a one-half inch wide channel on the card and a special pattern of slots. To install the stiffener, the feet are inserted part-way into the slots with the latching pin of the stiffener oriented near the latching slot of the card. The card is then bent gently away from the stiffener while the stiffener is being pushed forward so that the latching pin and the latching slot align and engage. When the card springs back the stiffener is latched in place.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: January 3, 1995
    Assignee: AG Communication Systems Corporation
    Inventor: Orest B. Akulow
  • Patent number: 5302466
    Abstract: A continuous strip of sheet metal is progressively sheared with longitudinally spaced and laterally extending slits to form opposing U-shaped tabs having corresponding edge portions and successively connected by corresponding center portions of the strip. In one embodiment, the sheared strip is fed between first and second overlapping sets of power driven pinch rollers which progressively grip the edge and center portions, respectively, and the second set of pinch wheels is longitudinally offset and driven at a higher peripheral speed to produce precisely uniform expansion of the strip by deforming the U-shaped tabs into V-shaped tabs. A hot melt adhesively impregnated flexible filament is progressively attached to the expanded center portions of the strip while the strip is heated to form a continuous center connection. In another embodiment, the strip of opposing U-shaped tabs is expanded into opposing V-shaped tabs by coining or thinning a connecting center portion of the strip.
    Type: Grant
    Filed: February 11, 1993
    Date of Patent: April 12, 1994
    Assignee: The Gem City Engineering Co.
    Inventors: Robert W. Davis, Thomas H. Harney
  • Patent number: 5221585
    Abstract: Two sheet metal panels are joined together to form a closed box section structure. The two panels are individually stamped from a blank and each has a flange along one edge and a toothed edge of alternating notches and tabs along the opposite edge. The two panels are assembled in box section forming relationship with the flanges of the two panels abutting with one another and the toothed edges abutting with one another with the tabs of the one panel interdigitating with the tabs of the other panel. Clamps are applied to the panels and urge the interdigitating tabs into tight fitting relationship. Then the panels are welded together at the interdigitating tabs and also at the abutting flanges to form the closed box section structure.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: June 22, 1993
    Assignee: General Motors Corporation
    Inventors: Alfred L. Kresse, Jr., Gregory L. Nagel
  • Patent number: 5139883
    Abstract: Gold, copper, silver, palladium or aluminum and their alloys, but preferably gold or gold alloy, which may be in the form of a wire, has deposited thereon or contained within the wire, a material such as metals or metal alloys which diffuse into the gold or into the other listed metals. With the passage of time and exposure to temperature the deposited metal or metal alloy continues to diffuse into the gold forming intermetallics with the gold and thereby causing the resistivity of the gold to increase and causing the gold to become progressively more brittle until such time as the gold wire ruptures at a stress point. At a given temperature, the elapsed time until rupture takes place depends upon the metal or metal alloys deposited on or contained within the gold. Lead, indium, gallium, tin, bismuth and aluminum and the alloys of these metals diffuse into and form intermetallics with the gold.
    Type: Grant
    Filed: May 9, 1989
    Date of Patent: August 18, 1992
    Inventors: Grigory Raykhtsaum, Dwarika P. Agarwal, James R. Valentine, David J. Kinneberg
  • Patent number: 5071712
    Abstract: A four quadrant leadframe, base and window assembly and assembly method therefor are disclosed which are suited for fabrication of leaded integrated circuit (IC) chip carriers having electrical contacts on all four sides of the package, lead spacing as small as 0.020 inch, and lead counts exceeding 164 total leads.
    Type: Grant
    Filed: April 25, 1990
    Date of Patent: December 10, 1991
    Assignee: Diacon, Inc.
    Inventor: Tom J. Frampton
  • Patent number: 5023700
    Abstract: A patterned structure including a plurality of patterned sheet members which have respective configurations and which are partially superposed on each other and which cooperate with each other to define a plurality of voids. At least one of the sheet members includes a thin-walled portion whose thickness is smaller than a thickness of the other portion. The thin-walled portion is formed by etching the appropriate sheet member or members. The thin-walled portion of one sheet member engages the corresponding thin-walled portion or the other portion of the other sheet member or members.
    Type: Grant
    Filed: June 16, 1989
    Date of Patent: June 11, 1991
    Assignees: NGK Insulators, Ltd., Toppan Printing Co., Ltd.
    Inventors: Yukihisa Takeuchi, Tetsuo Watanabe, Azuma Yamamoto, Kazuo Shirakawa, Takao Segawa
  • Patent number: 5001017
    Abstract: The invention is directed to an expandable metal product for use in extinguishing surface fires. Rolled, unexpanded continuous sheets of magnesium alloy foil are transported to the site of a fire and stretched over the surface of the fire to extinguish it. This invention also is directed to using the expanded product in the form of an ellipsoid to promote nestling in fuel containers.
    Type: Grant
    Filed: October 5, 1989
    Date of Patent: March 19, 1991
    Inventors: Shaikh G. M. Y. Alhamad, Sami I. Altikan
  • Patent number: 4988577
    Abstract: A stiffener for a printed circuit board which comprises an elongated metallic electrically conductive bar. Extending from the bar are a plurality of spaced apart pins with these pins being in longitudinal alignment. Each pin is constructed to facilitate physical deformation such as by including a through opening within the body of the pin or with the pin including notched-out areas in the side walls of the pin. Upon the pin incurring a sufficiently powerful striking force, the pin will deform and expand laterally.
    Type: Grant
    Filed: June 8, 1989
    Date of Patent: January 29, 1991
    Assignee: Bussco Engineering, Inc.
    Inventor: John A. Jamieson
  • Patent number: 4960649
    Abstract: A concrete reinforcing metal fiber capable of being easily and uniformly dispersed in concrete. The metal fiber integrally includes a longitudinal strength body which bears tensile force that works thereon, and two rows of intermittent fins extending on the opposite sides of the strength body. The flatness ratio, namely, the ratio of the maximum width of the metal fiber to the maximum thickness of the same, of the metal fiber is in the range of 2.5 to 6.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: October 2, 1990
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Susumu Takata, Mamoru Murahashi
  • Patent number: 4900636
    Abstract: There is disclosed a metal plate laminated body. When a portion encircled by inner and outer closed curves is embossed, a projection is protruded from a lower surface of a metal plate. Since a width of protrusion is slightly larger than that of a recess, when press-fitting the projection into the recess of the contiguous metal plate, an outer peripheral surface of the projection which is formed along the outer closed curve is brought into press-contact with an outer peripheral surface of the recess; and an inner peripheral surface of the projection which is formed along the inner closed curve similarly comes in press-contact with an inner peripheral surface of the recess. These inner and outer peripheral surfaces cooperate to become effective contactual surfaces, and the contiguous metal plates are joined to each other.
    Type: Grant
    Filed: June 20, 1988
    Date of Patent: February 13, 1990
    Assignee: Nippondenso Co., Ltd.
    Inventors: Syoishi Takenouchi, Kazuhiro Morita, Shinichi Ezaka, Yoshitaka Kuroda
  • Patent number: 4849857
    Abstract: The present invention is directed to an interconnect tape for TAB and electronic packages made from the tape. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heatsink. The tape leads, the heat dissipating pad and the support members for the heat dissipating pad are all formed from the same electrically conductive strip.
    Type: Grant
    Filed: October 5, 1987
    Date of Patent: July 18, 1989
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Scott V. Voss
  • Patent number: 4827376
    Abstract: The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.
    Type: Grant
    Filed: December 18, 1987
    Date of Patent: May 2, 1989
    Assignee: Olin Corporation
    Inventor: Scott V. Voss
  • Patent number: 4743956
    Abstract: A method of forming leadframes for use in manufacturing semiconductor chips starts with fabricating a plurality of leadframes by metal stamping or etching leadframe patterns into a flat ribbon of conductive material. The leadframe patterns include a plurality of outwardly radiating leads, inner radiating leads, and a central perimeter for interconnecting the outwardly and inner radiating leads. The outwardly radiating leads are arranged in groups, each of which are directed along planar perpedicular coordinates. The inner radiating leads have 180 degrees turns in the plane of the leadframe. The inner radiating leads are then successively bent at an acute angle and parallel to the plane of said leadframe so that the inner radiating leads are offset from the plane of the leadframe. The bending is performed in such a manner that each of the leads are formed with a stable spring force for effective bonding to corresponding semiconductor chip pads.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: May 10, 1988
    Assignee: Thomson Components-Moster Corporation
    Inventors: Michael A. Olla, Linn C. Garrison, Robert H. Bond, Harold Trammell
  • Patent number: 4721992
    Abstract: In an assembly tape to be used in the tape automated bonding of semiconductor devices a single layer or two or three layer tape is described. The arrays of finger patterns created in the tape are isolated by forming transverse slots across the tape. These slots act to mechanically isolate adjacent finger patterns and improve tape flexibility. When the tape is passed under the guide shoe in an inner lead bonding machine the metal fingers will not be distorted as the tape flexes. After the semiconductor device is bonded to the tape the increased tape stiffness does not cause the tape to be deflected from its desired location with respect to the guide shoe. The slots desirably span the space between tape locator holes. If desired, the slots can be extended on the finger side of the tape to span the locator holes to form slot extension regions of reduced tape thickness. Alternatively, a slot can be formed from a plurality of shorter slots that in the aggregate perform the same function.
    Type: Grant
    Filed: June 26, 1986
    Date of Patent: January 26, 1988
    Assignee: National Semiconductor Corporation
    Inventors: Ali Emamjomeh, Richard Pice
  • Patent number: 4710062
    Abstract: A rolled metal strip for use in stabilized earth structures has at periodic intervals along its length thickened reinforcement regions formed during the rolling operation. The strip is cut into required lengths such that each strip length has an end reinforced region through which an aperture is then formed to receive a bolt passing through a bracket of a facing. The strip may include transverse ribs at intervals on both faces of the strip to assist engagement with the surrounding soil.
    Type: Grant
    Filed: July 3, 1986
    Date of Patent: December 1, 1987
    Assignee: Henri Vidal
    Inventors: Henri Vidal, Daniel Weinreb
  • Patent number: 4701363
    Abstract: A process for step etching a metal tape adapted for use in tape automated bonding comprises forming an etch resist pattern on the tape having a first portion defining a pattern of leads and a second portion within the first portion defining steps in the leads. The metal tape is etched in the regions not covered by the resist at a desired rate and etched in the regions for forming the step at a reduced rate as compared to the desired rate, thereby forming the tape having a plurality of leads corresponding to the resist pattern with each of the leads having a step therein generated by the second portion of the resist pattern. The metal tape formed by the process has a unique structure wherein the web between bumps formed at the end of the leads and the remainder of the leads has a unique channel beam cross section for stiffening the web which is relatively thin as compared to the leads or the bump.
    Type: Grant
    Filed: January 27, 1986
    Date of Patent: October 20, 1987
    Assignee: Olin Corporation
    Inventor: Larry J. Barber
  • Patent number: 4597146
    Abstract: An improved method of making lead or tin based alloy badges or emblems having brilliantly colored closely spaced cloisonned areas into which the desired colors can be introduced. The cloisonned areas separate the differently colored sections from each other by the formation of slight ridges or low fences into which the differently colored paints can be introduced. After the differently colored paints or other colorings have been introduced into the cloisonned areas and dried, the badge or emblem is polished to expose the ridges or fences separating the cloisonned areas and any other raised areas which it is desired to emphasize. The badge or emblem is then plated with an appropriate plating to cover the raised cloisonned areas and any other raised areas which it is desired to highlight. The resulting badges or emblems have clearly defined brilliantly colored sections and embody remarkable detailed structures.
    Type: Grant
    Filed: January 30, 1984
    Date of Patent: July 1, 1986
    Inventor: Leo H. Larin
  • Patent number: 4456500
    Abstract: In a method of making a polishing element a photoresist film 2 is first deposited on a surface of metal stock 1. A photomask 3 is then used to selectively cover portions of the deposited photoresist film 2. Thereafter, portions of the photoresist film 2 which are not covered by the photomask 3 are removed in order to leave exposed patterned portions 5 of the metal stock surface. Gulf-shaped recesses 6 are then etched into the exposed portions of the metal stock surface. The formation of gulf-shaped recesses 6 results from the application of a etchant while the metal stock 1 and the etchant are in physical motion relative to one another. After etching, remaining portions of the photoresist film 2 are removed from the metal stock. A polishing element 10 comprising cutting teeth 11 having acute cutting action angles results.
    Type: Grant
    Filed: July 28, 1982
    Date of Patent: June 26, 1984
    Assignee: Nippon Tenshashi Kabushiki Kaisha
    Inventor: Sachiko Ibata
  • Patent number: 4404264
    Abstract: An improved method and apparatus for the production of multi-gauge strip is disclosed wherein the multi-gauge strip comprises a first strip of metal having a first thickness and extending longitudinally for a given length. A second strip of metal has a second thickness, is narrower in width than the first strip, and coextends longitudinally with the first strip of metal. The first and second strips of metal are intimately bonded in direct metal-to-metal contact without the use of a welding or brazing material. The multi-gauge strip has a first portion extending the given length with a third thickness substantially equal to the sum of the first and second thicknesses and a second portion of substantially constant width extending the given length having a fourth thickness substantially equal to the first thickness.
    Type: Grant
    Filed: January 26, 1981
    Date of Patent: September 13, 1983
    Assignee: Olin Corporation
    Inventors: Robert N. Tatum, Robert W. Hofer, S. Paul Zarlingo