Abstract: [Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

Abstract: A nickel-coated copper foil suitable for mass production, to which YAG laser welding can be applied while reducing the electrical resistivity by forming a nickel plating layer with a thickness of 0.5 ?m or less on a surface of a copper foil by Ni plating, is provided. The nickel-coated copper foil has an overall thickness of 200 ?m or less, and includes a copper layer made of Cu or a Cu alloy, and a nickel plating layer made of Ni or a Ni alloy, covering a surface of the copper foil, having a thickness of 0.01 ?m or more and 0.5 ?m or less, and including a surface having an a* value of 0 or more and 10 or less and a b* value of 0 or more and 14 or less in an L*a*b* color system obtained by an SCI measurement method in accordance with JIS Z 8722.

Abstract: Turbomachine ring as well as a turbomachine comprising such a ring and a method for repairing such a ring, the turbomachine ring comprising an essentially cylindrical support, including a frontal surface wherein a notch is formed, one or more sectors forming an annulus configured to embody a segment of air stream, each sector comprising a hook portion protruding in the direction of the support and engaging in the notch of the support, and an anti-wear device having a U shaped portion, provided in the notch of the support and pressed at least against the radially external surface of the notch, and a tab portion, continuously extending the U shaped portion, pressed and fastened against the frontal surface of the support.

Abstract: A semiconductor device includes an insulation substrate including a circuit pattern, semiconductor chips mounted on the circuit pattern, a wire connecting between the semiconductor chips and between the semiconductor chip and the circuit pattern, and a conductive material serving as a conductor formed integrally with the wire.

Abstract: The invention relates to a method for producing a cooling device (10), which has at least one hollow body (30) made of a first material having good thermal conduction and a base body made of a second material having good thermal conduction, and a pre-product for the production of a cooling device (10) and a cooling device (10) for an electrical assembly and an electrical assembly having a cooling device of this kind.

Abstract: To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 ?m or less.

Abstract: A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.

Abstract: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a plating layer disposed on the electrode layer, and a sulfate-based secondary phase material disposed at a boundary between the plating layer and the electrode layer.

Abstract: Provided is a method for producing a non-aqueous electrolyte secondary battery. A negative electrode core of a negative electrode plate has front and back surfaces each with a surface roughness different from the other Rz. In a wound electrode body, a wound negative electrode core-exposed portion is formed at one end portion in the winding axis direction. In the wound negative electrode core-exposed portion, the surface roughness of the negative electrode core-exposed portion on the outer surface side is lower than the surface roughness on the inner surface side. A negative electrode current collector is placed on the outer surface of the wound negative electrode core-exposed portion and the negative electrode current collector is resistance-welded to the wound negative electrode core-exposed portion.

Abstract: An etched nickel plated substrate and related methods is disclosed. Specific implementations may include providing a dielectric layer, coupling a layer of copper with a first side of the dielectric layer, plating a first side of the layer of copper with a layer of nickel; forming a patterned layer on the layer of nickel, and spray etching the layer of nickel using an etchant. The method may include holding the etchant on the dielectric layer for a predetermined period of time, and while holding the etchant, etching substantially only the layer of nickel until the layer of nickel may be substantially coextensive with a perimeter of each of a plurality of traces in the layer of copper.

Abstract: Provided is a laminated body of at least one metal foil and resin layers, which is suitable for drawing. The laminated body includes at least one metal foil and at least two resin layers. The laminated body has a thickness of 25 to 500 ?m. In the laminated body, both surfaces of each metal foil are closely laminated to the resin layers, and the relationships: 60??Y?150, and 1.4??b/?Y are satisfied, in which ?Y represents a nominal stress (MPa) at a nominal strain of 5% when a tensile test according to JIS K 7127: 1999 is performed on the laminated body, and ?b represents a nominal stress (MPa) at a nominal strain at which the metal foil in the laminated body is broken when a tensile test according to JIS K 7127: 1999 is performed on the laminated body.

Abstract: A photoresist and a method of manufacturing photoresist patterns are disclosed. The photoresist includes a plurality of photosensitive units, and each photosensitive unit has magnetism.

Abstract: A titanium composite material 1 is provided that includes: an inner layer 5 consisting of a commercially pure titanium or a titanium alloy; an outer layer 3 formed on at least one surface of the inner layer 5 and having a chemical composition that is different from a chemical composition of the inner layer 5; and an intermediate layer formed between the inner layer 5 and the outer layer 3 and having a chemical composition that is different from the chemical composition of the inner layer 5. The thickness of the outer layer 3 is 2 ?m or more, and occupies no more than 40% of the overall thickness per side. The thickness of the intermediate layer is 0.5 ?m or more. Despite being inexpensive, this titanium composite material has desired characteristics.

Abstract: A printed circuit board (PCB) including an embedded electronic component is provided. The printed circuit board includes a core having a cavity, an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces, insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity, and an external circuit pattern provided on the insulating layers.

Abstract: Disclosed herein is a circuit board that includes a first insulating layer having an upper surface; a first wiring layer embedded in the first insulating layer, the first wiring layer having an upper surface exposed from the upper surface of the first insulating layer such that the upper surface of the first wiring layer is substantially coplanar with the upper surface of the first insulating layer; a semiconductor IC mounted on the upper surface of the first wiring layer with a die attach material interposed therebetween; and a second insulating layer stacked on the upper surface of the first wiring layer so as to embed the semiconductor IC, wherein a bottom surface of the die attach material is in contact with both of the upper surface of the first insulating layer and the upper surface of the first wiring layer.

Abstract: In accordance with an exemplary embodiment, a power inductor includes a body, at least two bases disposed in the body, a plurality of coil patterns disposed on at least one surface of the at least two the base, respectively, and a connection electrode disposed on an outer portion of the body and connecting the at least two coils to each other.

Abstract: An electrolytic copper foil, a current collector including the same, an electrode including the same, a secondary battery including the same and a method for manufacturing the same which can secure secondary batteries with high capacity maintenance. The electrolytic copper foil includes a first surface and a second surface opposite to the first surface, wherein each of the first and second surfaces has a peak count roughness Rpc of 10 to 100.

Abstract: A method of assessing galvanic electronic isolation of two components at a joint of the two components includes measuring a first electrical resistance at a first condition across a joint of two components and comparing the first electrical resistance to a threshold resistance. The comparison of the first electrical resistance to the threshold resistance is indicative of a degree of electrical isolation of the two components. A second electrical resistance is measured at a second condition and the second electrical resistance is compared to the first electrical resistance. The result of the comparison of the second electrical resistance to the first electrical resistance is indicative of a type of electrical connection between the two components.

Abstract: There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time. The electrodeposited copper foil has a fraction of the areas occupied by the {100} plane deviating by 18° or less from the <001> crystal orientation of 10% or more determined by analysis of the surface by electron backscatter diffraction (EBSD) and at least one surface of the electrodeposited copper foil has a glossiness Gs (20°) of 1,500 or more, determined in accordance with JIS Z 8741-1997.

Abstract: Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2?D1 is 0.30 to 3.83 ?m, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm2 at 220° C. for 2 hours.

Abstract: An oxide superconducting wire includes: a laminate which is formed by laminating a tape-shaped base, an intermediate layer, and an oxide superconducting layer; a first protective layer which is formed of Ag or an Ag alloy and is laminated on a main surface of the oxide superconducting layer of the laminate; a second protective layer which is formed of Cu or a Cu alloy, is laminated on a main surface of the first protective layer by performing film formation one or more times, and has a thickness of 0.3 ?m to 10 ?m; and a stabilization layer which is bonded to a main surface of the second protective layer with a solder layer interposed therebetween, wherein the second protective layer is formed to have a thickness of equal to or less than 2.1 ?m per film formation.

Abstract: A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 ?m.

Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.

Abstract: A method for manufacturing a clad type electromagnetic shielding material includes step as follows: a first electrically conductive metallic layer, a magnetically conductive metallic layer, a second electrically conductive metallic layer and a shock-absorbing insulation layer, which are stacked in order, are one-time continuously rolled by a clad type rolling process, so as to finish a clad plate applied to an electromagnetic shielding field, wherein the surface of the shock-absorbing insulation layer provided with a binder faces the second electrically conductive metallic layer.

Abstract: The present invention relates to reactive materials formed by thermal spray techniques. The thermally sprayed reactive materials have low porosity and high structural integrity. The reactive materials are useful for applications such as shaped charges, thermite welding, near net shaped components and the like.

Abstract: In a shield wire, a sheet shaped metal foil shield member is provided so as to envelop an inner wire part having a plurality of conductors and insulators. In the shield wire, the inner wire part is enveloped by the metal foil shield member so that the inner wire part is held and an end part of the metal foil shield member is avoided from collapsing or the end is avoided from bounding.

Abstract: A method for forming a hybrid structure is provided. The method includes applying a sealant to a first component fabricated from a first material, coupling an isolation sheet to the sealant, and coupling a second component to the isolation sheet. The isolation sheet and the second component are fabricated from a second material that is different than the first material to facilitate preventing formation of a galvanic cell within the hybrid structure.

Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Abstract: A metal foil is provided with a filler-containing resin layer that is thin and has a smooth surface as a metal foil provided with an insulating layer. The filler-containing resin layer having a thickness of 0.1 ?m to 3.0 ?M, the gloss at the surface of the filler-containing resin layer is 200 or more, and the surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 ?m×5 ?M on the filler-containing resin layer is 25 nm or less is stacked on the smooth surface of the metal foil having a gloss exceeding 400 and surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 ?m×5 ?m of 10 nm or less.

Abstract: To protect a space adjacent to a magnetic source from magnetic energy radiated by the source, a device includes one or two sheets of ferromagnetic material. Each sheet extends between the space and the source. The device further includes one or two sheets of a diamagnetic or paramagnetic electrically-conductive material, one of which extends between the sheet and the space being protected, and the other additional sheet extending between the sheet of ferromagnetic material and the magnetic source.

Abstract: Provided are a magnetic field shield sheet for a wireless charger, which blocks an effect of an alternating-current magnetic field generated when a charger function for a portable mobile terminal device is implemented in a non-contact wireless manner on a main body of the portable mobile terminal device and exhibits excellent electric power transmission efficiency, a method of manufacturing the sheet, and a receiver for the wireless charger by using the sheet.

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.

Abstract: A manufacturing method of a semiconductor device comprises releasing an oxidation source included in an interlayer dielectric film having an opening portion formed on a surface thereof and being present on the surface of the interlayer dielectric film at a first substrate temperature, forming a first layer containing Ti and N to contact with at least a part of the interlayer dielectric film at a second substrate temperature lower than the first substrate temperature, wherein a Ti content in the first layer is more than 50 at % in all components, provided that oxygen and precious metals are excluded from the all components, and forming a Cu metal layer above the first layer.

Abstract: The present invention relates to a manufacturing method for a fine grain surface copper foil with the low roughness, high peeling strength, high chemical resistance, high heat resistance, high resistance to moisture absorption and good etching properties, and applicable to all kinds of printed circuit boards. The technical characteristics are that the adhesion surface of copper foil is electroplated in an electroplating bath composed of copper sulfate, sulfuric acid, tungsten compounds to obtain a roughening treatment layer which is then treated with a electroplating copper foil method for anti-rust and thermoresistance known to the art to get a Zn alloy thermoresistant layer.

Abstract: The present invention provides a metal foil provided with an electrical resistance layer, in which peeling between the metal foil and the electrical resistance layer disposed on the metal foil can be prevented and variation in the resistivity of the resistance layer can be reduced, and a method of manufacturing the same. The present invention includes a metal foil with an electrical resistance layer including a metal foil having a surface of a ten-point mean roughness Rz, which is measured by an optical method according to 1 ?m or less and the surface being treated by irradiation with ion beams at an ion beam intensity of 0.70-2.10 sec·W/cm2 and an electrical resistance layer disposed on the surface of the metal foil.

Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.

Abstract: A cladding material for stainless steel clad steel plate, includes, by mass %, 0.03% or less carbon, 1.5% or less silicon, 2.0% or less manganese, 0.04% or less phosphorus, 0.03% or less sulfur, 22.0% to 25.0% nickel, 21.0% to 25.0% chromium, 2.0% to 5.0% molybdenum, 0.15% to 0.25% nitrogen, and the balance being iron and incidental impurities, wherein critical pitting temperature (CPT) after normalization as determined in accordance with ASTM G48-03 Method E is 45° C. or higher, and corrosion loss at a welded zone as determined by a corrosion test in accordance with NORSOK Standard M-601 is 1.0 g/m2 or less.

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1<=33f1/(F×T) wherein f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 ?g/dm2. is formed on a surface of the copper foil on which the resin layer is not laminated.

Abstract: The present invention relates to a brass-plated steel cord capable of further improving initial adhesiveness and heat-resistant adhesiveness between a coating rubber and a steel cord and also imparting excellent durability to a resulting rubber article, and more particularly to a brass-plated steel cord, wherein an outermost surface thereof contains 0.3 to 1.7 atomic % of phosphorus, 4.93 to 14 atomic % of zinc, and 0.01 to 2.0 atomic % of a metal having an ionization tendency lower than that of zinc and higher than that of copper as measured by XPS (X-ray photoelectron spectroscopy), and an amount of zinc in the outermost surface is 30 to 90 atomic % based on 100 atomic % of a total amount of zinc and copper.

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract: In accordance with various example embodiments, an apparatus includes two or more circuit nodes and a conductive material that is located between and configured to electrically couple the circuit nodes. The conductive material includes a network of elongated portions of at least one electrospun Cu-based nanostructure. Each elongated portion has an aspect ratio of at least 50,000 and a length that is greater than 100 microns, and at least one fused crossing point that joins with a fused crossing point of another of the elongated portions. The network of elongated portions is distributed and aligned in the conductive material to set a conductance level and a transparency level along the network, along at least one direction.

Abstract: A compound superconducting wire 10 includes a reinforcement portion 12 and a compound superconductor 11. In the reinforcement portion 12, an assembly of plural reinforcement elements 4 are disposed. The reinforcement elements 4 each include plural reinforcement filaments 1 disposed in a stabilizer 2, and a stabilizing layer 3 at the outer periphery thereof. The reinforcement filaments 1 each mainly contain one or more metals selected from the group consisting of Nb, Ta, V, W, Mo, Fe, and Hf, an alloy consisting of two or more metals selected from the aforementioned group, or an alloy consisting of copper and one or more metals selected from the aforementioned group.

Abstract: Provided is a hot-dip galvanized steel sheet having excellent adhesiveness at ultra-low temperatures as well as fine spangles, and a method of manufacturing the same. According to the present invention, a hot-dip galvanized steel sheet having excellent adhesiveness at ultra-low temperatures includes a base steel sheet, a composite layer formed on the base steel sheet and including transition metal, an inhibition layer formed on the composite layer and including a iron-aluminum (Fe—Al) based intermetallic compound, and a zinc (Zn)-plated layer formed on the inhibition layer, in which an average diameter of spangles in the zinc-plated layer is 150 ?m or less, and a method of manufacturing the hot-dip galvanized steel sheet is provided.

Abstract: A method of synthesis to produce a conductive film including cupronickel nanowires. Cupronickel nanowires can be synthesized from solution, homogeneously dispersed and printed to make conductive films (preferably <1,000 ?/sq) that preferably transmit greater than 60% of visible light.

Abstract: The surface of an aluminum substrate is modified to enhance the adhesion of the metal to polymeric materials. Intermediate layers, such as Zn/Sn, Co/Ni, and a Cu strike are applied before depositing a nodular Cu layer for bond enhancement. The surface treated aluminum substrate can be used in printed circuit boards, leadframes, or any electrical/electronic devices where Cu is typically used to reduce the cost and weight of the devices.

Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.

Abstract: A steel foil according to an aspect of the present invention includes a rolled steel foil; and a Ni having <111>//RD texture plated on an outermost layer of the rolled steel foil. Regarding the steel foil, a <111> pole density in an inverse pole figure of a rolling direction may be 3.0 or more and 6.0 or less.

Abstract: An electrode foil which has both the functions of a supporting base material and a reflective electrode and also has superior thermal conductivity; and an organic device using the same are provided. The electrode foil comprises a metal foil and a reflective layer provided directly on the metal foil.