Abstract: A metallurgical product, such as brazing sheet, comprises a core, on at least one side of the core an interlayer bonded to the core and a cladding bonded to the interlayer. The core and the interlayer are a compositely cast material having at their mutual interface a bond formed in a casting process by their simultaneous solidification from contacting melts of their respective materials. This provides a simple process, with good adhesion. The cladding is applied subsequently and the composite material is rolled into a sheet or plate product.

Abstract: Metallic surfaces are prepared to receive ceramic coatings. An abrasion process of progressively declining intensity removes a portion of the metallic surface. Ceramic coating applied to surfaces so prepared display improved lives at elevated temperatures.

Abstract: A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 &mgr;m. There is also presented a method for manufacturing such a composite copper foil.

Abstract: A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

Abstract: A sliding bearing being improved in resistance to seizure under a high bearing pressure condition, the bearing having a lining of a copper alloy in which Ag and Sn are preset as additive metals in solid solution state and form a hexagonal compound or an eutectic between themselves or with Cu The improved bearing has a back metal having, adhered thereon, a copper alloy wherein 0.1 to 2 wt. % of Ag and 1 to 10 wt. % of Sn are present as essential metal components and the residue is composed essentially of Cu, and a surface obtained by covering a roughened surface, which is positioned on the opposite side to said back metal of copper alloy and has a roughness (R z) of about 0.5 to about 10% mgr m with an overlay of a thermosetting resin, such as a polyimide resin, a polyamideimide resin, an epoxy resin and a phenol resin, containing MoS 2 in an amount of 55 to 90 wt %.

Abstract: In aluminum alloy which is required to have good sliding characteristics, excellent sliding characteristics are achieved by carrying out granulation while avoiding the formation of flakes from Si particles through thermally spraying an aluminum alloy containing Si in an amount of 12 to 60 % The aluminum alloy may contain 0.1 to 30% of Sn, in addition to Si.

Abstract: A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.

Abstract: A method for improving corrosion resistance while maximizing magnetic performance of a magnetic disk employed in data storage applications. The invention includes providing a substrate and forming a first layer above the substrate, the first layer having a first degree of abrasion resistance. The invention includes forming a second layer such as a Ni-containing layer above the first layer, the Ni-containing layer having a second degree of abrasion resistance lower than the first degree of abrasion resistance. The invention further includes forming grooves in the Ni-containing layer.

Abstract: The present invention relates to a process for producing a substrate for a photosensitive drum, comprising machining a cylindrical stock tube by a turning tool to form a cylindrical substrate having a surface roughness of 0.5 to 5 &mgr;m and being provided on the surface thereof with the streaks extending in the approximately circumferential direction thereof, said turning tool being constituted by monocrystalline diamond and having a cutting edge provided with a saw-like portion along an effective cutting length thereof, and a substrate which is suitable for the production of a photosensitive drum being free from the occurrence of interference fringes and has fine streaks uniformly formed on the surface thereof by machining without burrs, and the substrate capable of producing a higher-quality photosensitive drum.

Abstract: A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 &mgr;m; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 &mgr;m. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared.

Abstract: The present invention provides a cast iron component for enveloped casting which is characterized by that the cast iron component has a surface to which enveloped casting is applied and which has a surface roughness such that a maximum height Ry is from 65 to 260 &mgr;m and a mean spacing of profile irregularities Sm is from 0.6 to 1.5 mm; an enveloped casting product using it; and a method for its production.

Abstract: A method for fabricating an abrasive tool. A tool substrate is provided. A surface of the substrate is coated with an electroplatable bonding material. The electroplatable bonding material comprises a mixture of a conductive material and an adhesive material. Abrasive particles are adhered to the bonding material. The abrasive particles are adhered so as to have a predetermined distribution over the coated surface of the substrate. A metal layer is electroplated to the electroplatable bonding material to secure the abrasive particles to the substrate. Thus, in accordance with the present invention, the fabricated abrasive tool has abrasive particles having the predetermine distribution and fixed to the substrate by the adhesive material and the electroplated metal layer.

Abstract: A surface treated metallic material according to the present invention comprises a metallic substrate and a metallic compound layer formed thereon, wherein the entire surface of the metallic compound layer is covered with minute, upright, scaly protrusions. The width in the major axial direction of the scaly protrusions is between 0.05˜0.5 &mgr;m and the thickness between 0.01˜0.1 &mgr;m, and the thickness of the metallic compound layer is between 0.1˜1.0 &mgr;m. The metallic compound layer incorporates one, or two or more of, the materials selected from the group consisting of chromium oxide, chromium hydroxide, niobium oxide, niobium hydroxide, rhodium oxide, rhodium hydroxide, vanadium oxide, vanadium hydroxide, palladium oxide, palladium hydroxide, nickel oxide, and nickel hydroxide. By using surface treated metallic materials of this type, bonding strength to a resin layer can be improved.

Abstract: A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.

Abstract: The periodic stress and strain fields produced by a pure twist grain boundary between two single crystals bonded together in the form of a bicrystal are used to fabricate a two-dimensional surface topography with controllable, nanometer-scale feature spacings (e.g., from 50 nanometers down to 1.5 nanometers). The spacing of the features is controlled by the misorientation angle used during crystal bonding. One of the crystals is selected to be thin, on the order of 5-100 nanometers. A buried periodic array of screw dislocations is formed at the twist grain boundary. To bring the buried periodicity to the surface, the thin single crystal is etched to reveal an array of raised elements, such as pyramids, that have nanometer-scale dimensions. The process can be employed with numerous materials, such as gold, silicon and sapphire. In addition, the process can be used with different materials for each crystal such that a periodic array of misfit dislocations is formed at the interface between the two crystals.

Abstract: An article having a layer of metal thermally sprayed over a substrate with a roughened interface at the surface of the substrate applied by a thermal spray process, such as the HVOF process. The interface has a predetermined cleanliness level so that after a diffusion heat treatment, the applied layer has an extended life in severe gas turbine service due to improved adhesion of the layer to the substrate. When the article is used for high temperature applications such as turbine shrouds and encounters significant levels of stress, the strength of the interface can be a factor in the life of the coating.

Abstract: Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.

Abstract: A bond coat and method of forming a bond coat for a thermal barrier coating system are set forth. The bond coat is a roughened bond coat and comprises a layer possessing an uneven, undulated, and irregular surface. The layer is formed of a metal powder mixture disposed on a substrate, such as a turbine component, by high velocity oxygen fuel spraying. The metal powder mixture comprises at least one of a first powder having a first melting point and a second powder having a second melting point that is higher than the first melting point. The bond coat's uneven, undulated, and irregular surface enhances prevention of de-bonding of elements in a thermal barrier coating system.

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasably bonded with resistance welds and adhesive to at least one surface of the substrate layer.

Abstract: A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing layer, and a zinc or zinc alloy layer electrodeposited on the copper/arsenic layer. A process for making such foil, and a copper-clad laminate wherein such foil is bonded to a polymeric substrate.

Abstract: A micro interface between a polymeric layer and a metal layer includes isolated clusters of metal partially embedded in the polymeric layer. The exposed portion of the clusters is smaller than embedded portions, so that a cross section, taken parallel to the interface, of an exposed portion of an individual cluster is smaller than a cross section, taken parallel to the interface, of an embedded portion of the individual cluster. At least half, but not all of the height of a preferred spherical cluster is embedded. The metal layer is completed by a continuous layer of metal bonded to the exposed portions of the discontinuous clusters. The micro interface is formed by heating a polymeric layer to a temperature, near its glass transition temperature, sufficient to allow penetration of the layer by metal clusters, after isolated clusters have been deposited on the layer at lower temperatures.

Abstract: A method of providing a roughened bond coat, for example in a thermal barrier coating system, comprises providing an oxidation-resistant plasma-sprayed layer onto a substrate and disposing a slurry overlayer on the oxidation-resistant plasma-sprayed layer. These steps form a roughened bond coat possessing an uneven, undulated, and irregular surface. A roughened bond coat in a thermal barrier coating system reduces de-bonding of the bond coat and a thermal barrier coating layer, which is desirable to maintain the insulation features of the thermal barrier coating system.

Abstract: Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.

Abstract: The periodic stress and strain fields produced by a pure twist grain boundary between two single crystals bonded together in the form of a bicrystal are used to fabricate a two-dimensional surface topography with controllable, nanometer-scale feature spacings (e.g., from 50 nanometers down to 1.5 nanometers). The spacing of the features is controlled by the misorientation angle used during crystal bonding. One of the crystals is selected to be thin, on the order of 5-100 nanometers. A buried periodic array of screw dislocations is formed at the twist grain boundary. To bring the buried periodicity to the surface, the thin single crystal is etched to reveal an array of raised elements, such as pyramids, that have nanometer-scale dimensions. The process can be employed with numerous materials, such as gold, silicon and sapphire. In addition, the process can be used with different materials for each crystal such that a periodic array of misfit dislocations is formed at the interface between the two crystals.

Abstract: A copper foil for a TAB tape carrier, comprising (a) a copper foil having a shiny surface and a mat surface; and (b) an alloy layer comprising nickel, cobalt and molybdenum, which is formed at least on the shiny surface; a TAB carrier tape, comprising a flexible insulating film and the copper foil for a TAB tape carrier applied onto the flexible insulating film with a surface on the side of the mat surface facing the flexible insulating film; and a TAB tape carrier, which is produced from the TAB carrier tape by etching the copper foil for a TAB tape carrier to form a copper lead pattern.

Abstract: This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

Abstract: A metal fiber of titanium or titanium alloy has given equivalent area diameter and specific surface area and is produced by a bundle drawing method wherein mild steel is used as a material for covering layer and outer housing and a composite wire is subjected to a heat treatment at a given temperature.

Abstract: A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a way that the additional layer is formed in the pores of the porous overcoat adjacent to the base coat. The additional layer is deposited either by currentless or electrolytic deposition. For electrolytic deposition of the additional layer, the ceramic substrate sintered with the base coat and the overcoat is submerged in an electrolytic bath and the base coat is connected as a cathode. The currentless deposition takes place from a solution of the metal to be deposited with the addition of a reducing agent.

Abstract: A method is provided for achieving an enhanced finish on a sputter target surface that results in good film uniformity, low particle counts, and little to no bum-in time. The method involves chemically etching the surface of the sputter target by immersing the surface one or more times in an etching solution, with intermediate rinsing steps. The result is a surface substantially free of mechanical deformation that exhibits a surface similar to a sputtered target with a surface roughness of 10-30 &mgr;in.

Abstract: To provide an aluminum alloy member having a high machinability while keeping a sufficient mechanical strength and a sufficient wear resistance, and a method of producing the aluminum alloy member. In an aluminum alloy member formed from an aluminum-silicon alloy by casting, eutectic silicon grains are exposed from at least part of an exposed plane of the aluminum alloy member. A coating layer having a thickness nearly equal to or thinner than a diameter of each of the eutectic silicon grains is formed on the exposed plane from which the eutectic silicon grains are exposed.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss of peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. The Another object is to impart excellent moisture resistance to the surface-treated copper foil.

Abstract: An article comprising a substrate and an outer metallic layer, such as a coating, is provided with augmented heat transfer from the substrate through the combination of a layer thickness of about 0.003″ to about 0.017″, a layer surface roughness of at least about 500 micro inches Ra, a layer tensile bond strength of at least about 5 ksi, and a heat transfer augmentation of at least about 1.1. A method of making the article uses an electric arc wire thermal spray process in which the atomizing gas pressure is maintained within the range of about 20-80 psi.

Abstract: The present invention provides a cast iron component for enveloped casting which is characterized by that the cast iron component has a surface to which enveloped casting is applied and which has a surface roughness such that a maximum height Ry is from 65 to 260 &mgr;m and a mean spacing of profile irregularities Sm is from 0.6 to 1.5 mm; an enveloped casting product using it; and a method for its production.

Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.

Abstract: Treated copper foil for use in the manufacture of copper-clad laminates for printed circuit boards, wherein a continuous, very thin cobalt barrier layer, which is substantially non-ferromagnetic, is electrodeposited on a copper bonding treatment electrodeposited on a bonding side of a base copper foil; and a process and electrolyte for producing such treated foil, wherein the electrolyte contains a low concentration of cobalt and certain addition agents.

Abstract: This invention provides a covered member which possesses a high bond strength of a base material and a covering film, and has a smooth surface. The covered member comprises a base material and a covering film and the surface of the base material to be covered with the covering film is characterized by an uneven surface having projections with an average height in the range from 10 to 100 nm and an average width of not more than 300 nm. The uneven surface can be formed by ion impacting. A surface of a covering film formed on that is smooth since the unevenness of the surface is extremely fine.

Abstract: A tungsten carbide surface is finished to an RMS surface roughness of about 25 nm (1.0 microinch) or less by abrasion using diamond grit particles. The tungsten carbide surface is abraded by a sequence of grit particle-containing abrasive members, such as abrasive films, pastes, or slurries, at least one of the members having an average grit particle diameter of about 2 &mgr;m or less. The finish is enhanced by oscillating the abrasive member back and forth over the tungsten carbide surface. A different speed is used for at least two consecutive films in the series, thereby generating scratches at different angles which can be distinguished. A superfinish, corresponding to a lack of visible scratches at 100× magnification, can be obtained by abrading the tungsten carbide surface with a diamond slurry or paste having grit particles with an average diameter of about 1 &mgr;m or less.

Abstract: A thin film magnetic head includes an upper core layer and a lower core layer which are made of an Fe--M--O alloy, an Fe--M--T--O alloy or an NI--Fe--X alloy so that the upper core layer has a high saturation magnetic flux density, low coercive force and high resistivity, and the lower core layer has a lower saturation magnetic flux density than the upper core layer, low coercive force, high resistivity, and a low magnetostriction constant. Also the lower core layer is formed so that the thickness gradually decreases toward both side ends, and a gap layer can be formed on the lower core layer to have a uniform thickness. Since the lower core layer is formed by sputtering, a material having excellent soft magnetic material can be used, thereby enabling recording at high frequency.

Abstract: A bond coat and method of forming a bond coat for a thermal barrier coating system are set forth. The bond coat is a roughened bond coat and comprises a layer possessing an uneven, undulated, and irregular surface. The layer is formed of a metal powder mixture disposed on a substrate, such as a turbine component, by high velocity oxygen fuel spraying. The metal powder mixture comprises at least one of a first powder having a first melting point and a second powder having a second melting point that is higher than the first melting point. The bond coat's uneven, undulated, and irregular surface enhances prevention of de-bonding of elements in a thermal barrier coating system.

Abstract: Grain oriented electrical steel sheet with a very low iron loss and a method for producing the same, wherein the surface of the iron substrate of the grain oriented electrical steel sheet is subjected to an enhancement treatment of crystal grain orientation or surface smoothing to a mean roughness of about 0.20 .mu.m or less, electroplating a chromium plating layer on the substrate with heterogeneous growth, and applying a tension coating film to the plating layer.

Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.

Abstract: A corrosion resistant sheet alloy separator sheet for use in a press lay-up between printed circuit board panels.

Abstract: An intermetallic bond between a ferrous metal and a non-ferrous metal wherein an intermetallic bond layer that is substantially free of graphic inclusions joins the two. The graphite is effectively eliminated from the bond layer by either removing it from the ferrous metal or by sealing it off from the bond layer. Graphite removal may be accomplished in a variety of ways, including electrochemical cleaning and laser surface treatment. Alternatively, the graphite may be prevented from incursing into the bond region by sealing it off with a layer of metal, such as a chromium plating, that prevents it from penetrating through the bond layer and into the non-ferrous metal.

Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a metal substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of metal-to-metal bonds disposed along the boundary of the foil layer such that gaps are defined between the bonds.

Abstract: The invention relates to a method for manufacturing a micromachined structure to be at least partly released from a substrate surface. A surface contact area, over which structure and the said substrate surface are in surface contact with each other during the manufacturing step, is divided into at least a first and a second contact zone, the adhesiveness between the structure and the substrate being greater in the first contact zone than in the second contact zone. As a manufacturing step, or as a step subsequent to the manufacturing, the structure can be released from the substrate surface at least over said second contact zone. The completed structure may also be completely loose from the substrate. The invention is also directed to a micromachined structure manufactured according to the method.

Abstract: The invention provides an improved near net-shape VPS formed multilayered combustion system component having an inner surface consisting of a smooth protective thermal barrier coating, and an outer layer of superalloy capable of withstanding temperatures in excess of 700.degree. C. The invention also includes the method of forming such components by first vacuum plasma spraying a suitable mold with a ceramic top coat, followed by a bond coat and followed by a thick structural layer of superalloy. The mold is then separated from the multilayered structure which results in the desired near net-shape component. Combustor liners and transition ducts of gas turbine engines can be advantageously formed in this manner.

Abstract: A cylinder-liner blank which preferably consists of a hypereutectic aluminum/silicon alloy and is cast into a crankcase. A special surface treatment achieves better material bonding of the liner in the crankcase. The blank has a roughness of 30 to 60 .mu.m on its outside, in the form of pyramid-like or lancet-like protruding material scabs or material accumulations. To obtain this roughness, the surface is blasted with particles which are broken so as to have sharp edges and consist of a brittle hard material, preferably high-grade corundum, with an average grain size of about 70 .mu.m. A fine fraction is formed and is continuously separated off. The average grain size is maintained by adding new particles.

Abstract: A metal-ceramic composite circuit substrate having a ceramic substrate and a metal plate joined to at least one main surface of the ceramic substrate, the rate of voids formed on at least a joint surface at a semiconductor mounting portion of the metal plate per unit surface area being not more than 1.49%. The diameter of void formed on at least the joint surface at a semiconductor mounting portion of the metal plate is not larger than 0.7 mm. The surface undulation of the ceramic substrate is not more than 15 .mu.m/20 mm measured by a surface roughness tester in case that the ceramic substrate is joined directly to the metal plate. The metal plate is joined to the ceramic substrate through a brazing material containing at least one active metal selected from a group consisting of Ti, Zr, Hf and Nb. The ceramic substrate is at least one kind of ceramic substrate selected from a group consisting of Al.sub.2 O.sub.3, AlN, BeO, SiC, Si.sub.3 N.sub.4 and ZrO.sub.2.

Abstract: A ceramic coating layer which is not less than 70 .mu.m in the maximum height Rmax of its profile curves and not less than 45 .mu.m in the 10-point average roughness, or which is less than 650 HV in Vickers hardness is provided on a metallic substrate. A heat-resistant member of such composition is excellent in thermal fatigue resistance and keeps an excellent heat resistance for a long period of time. Quality of a heat-resistant member is evaluated by, measuring at least one of roughness and hardness of a ceramic coating layer on a metallic substrate. According to this method, it is possible to easily and accurately evaluate a thermal resistant life of a heat-resistant member.