Abstract: A coating composition for a metal is provided. The coating composition comprises a synthetic resin solid content (A); a filler (B); and a mixture of (C-1) at least one member selected from an acetylene glycol represented by the following general formula (1): an ethylene oxide-propylene oxide block adduct of an acetylene glycol represented by the following general formula (2): and an ethylene oxide-propylene oxide random adduct of an acetylene glycol represented by the following general formula (3): and (C-2) a polyoxyalkylene alkyl ether having an HLB of 8 to 18 represented by the following general formula (4): R7O(C3H6O)v(C2H4O)w(C3H6O)x(C2H4O)y(C3H6O)zH??(4).

Abstract: [Task] In a method, in which a plain bearing alloy layer 3 is bonded to a surface of a backing steel sheet 1, and, a Bi-based overlay layer 10 is then deposited on the plain bearing alloy layer 3 by electroplating, replacement of Bi with the backing steel sheet 1 and deposition of Bi on the backing steel sheet 1 are prevented. [Solution Means] Prior to the step of electroplating of said Bi-based overlay layer 10, the following metals and the like are formed on at least the back surface of said backing steel sheet 1. An electrochemically more noble metal 2 than Bi, an electrochemically more base metal 2 than Bi and capable of forming a passivation state, or resin 4.

Abstract: A resin product (e.g., a millimeter-wave radar device cover) comprises a plate-like resin substrate, a base film formed on the resin substrate, and a metallic gloss film having a discontinuous structure formed on the base film, a top coat, a block coat, or the like being formed as a protective film on the metal film. The metal film contains a first film having a discontinuous structure obtainable by vacuum deposition of a first metal, a modified surface obtainable by modification of the surface of the first film by bringing the surface into contact with air, and a second film having a discontinuous structure obtainable by vacuum deposition of a second metal on the modified surface.

Abstract: A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains at least spherical metal powder and flake metal powder. The low melting point solder is infiltrated from the surface of the electrode into the electrode.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: The present invention relates to light weight composite materials which comprise a metallic layer and a polymeric layer, the polymeric layer containing a filled thermoplastic polymer which includes a thermoplastic polymer and a metallic fiber. The composite materials of the present invention may be formed using conventional stamping equipment at ambient temperatures. Composite materials of the present invention may also be capable of being welded to other metal materials using a resistance welding process such as resistance spot welding.

Abstract: The invention relates to a use of a duplex steel for the production of an armouring layer of a flexible pipe comprising at least one unbonded armouring layer and at least one unbonded sealing layer wherein the duplex steel comprises in weight percent 0.01-0.05% by weight of carbon (C) at least 0.15% by weight of nitrogen (N) 20.0-23.0% by weight of chromium (Cr) up to 3.0% by weight of nickel (Ni) up to 1.0% by weight of molybdenum (Mo) 3-6% by weight of manganese (Mn) up to 1.0% by weight of copper (Cu) incidental impurities and balance being iron (Fe).

Abstract: The present invention provides adhesiveless copper clad laminates wherein there is formed a copper film layer having high adhesiveness and insulation reliability, and a method for manufacturing such adhesiveless copper clad laminates.

Abstract: The disclosed subject matter relates to a metal multi-layered film structure that includes two types of metal films including first metal films and second metal films alternately formed on a resin substrate. The first metal films can be composed of an aluminum-based material having a film thickness between 0.7 nm and 20 nm. The second metal films can be composed of a metal selected from the group consisting of stainless steel-based materials, nickel-based materials, cobalt-based materials, titanium-based materials and chromium-based materials, having a film thickness ranging from 1 nm to 20 nm. This metal multi-layered film structure can be manufactured through a method of sputtering. The metal multi-layered film structure is suitable for an extension reflector for vehicular lamps.

Abstract: The present invention provides adhesiveless copper clad laminates, which does not have defects on a copper film part due to a pin hole generated at the time of forming a base metal layer on an insulating film by dry plating process, has excellent adhesion between the insulating film and the base metal layer and corrosion resistance, and has a copper film layer having high insulation reliability, and provides a method for manufacturing such adhesiveless copper clad laminates. In adhesiveless copper clad laminates according to the present invention provided by forming a base metal layer directly at least on one plane of an insulating film without having an adhesive in between, and then by forming a copper film layer on the base metal layer, the base metal layer having a film thickness of 3 to 50 nm is formed by dry plating method and mainly contains a chrome-molybdenum-nickel alloy wherein the chrome ratio is 4 to 22 weight %, the molybdenum ratio is 5 to 40 weight %, and the balance is nickel.

Abstract: A reactive foil assembly for the packaging and presenting of a reactive foil. The reactive foil assembly comprising a reactive foil, a film, a flex circuit and an adhesive. The reactive foil is placed above the film such that a portion of the reactive foil does not overlap with the film. The flex circuit is also placed above the film such that the flex circuit is operably coupled to the reactive foil. The reactive foil assembly is placed over a surface such that the film adheres to the surface with the help of the adhesive. The reactive foil is ignited by an energy pulse provided by the power source and delivered by the flex circuit coupled to the power source. An exothermic reaction of the reactive foil is initiated, which provides a molten foil available for joining of two objects.

Abstract: A composition for deposition as a coating includes a matrix material having a molten fraction of between about 33% and about 90% by volume and a filler material interspersed within the matrix.

Abstract: A metal material (10), having an electrical conductive substrate 1; a surface layer 2 having tin or tin alloy formed on the electrical conductive substrate 1; and an organic coating 3 formed on the surface layer 2, organic coating 3 being formed with an organic compound including an ether linking group.

Abstract: The integration of two separate manufacturing processes involving joining two pieces of metal using a clinching or Tog-L-Loc™ type of connection, while also injecting a molten material around the two pieces of metal to create the desired part. A process for creating the desired part made of both plastic and metal includes the steps of providing a first metal component, a second metal component, inserting the first metal component into a mold, and inserting the second metal component into the mold. At least one connection point is used for connecting the first metal component to the second metal component while the metal components are located in the mold. Molten material, such as a thermoplastic, is injected into the mold around the first metal component and the second metal component, forming the desired part using the first metal component, the second metal component, and the hardened molten material.

Abstract: An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.

Abstract: A digital media resource messaging system provides a convenient digital media resource viewing, managing, organizing, and editing platform that facilitates enhanced resource exchange by storing and forwarding digital media resources via a server between multiple resource-sharing partners designated by the user. In one embodiment, the digital media resource messaging system includes services to view, manage, organize, edit, and exchange digital images and video sequences.

Abstract: A surface-treated galvanized steel sheet includes a steel sheet, a zinc coating disposed on the steel sheet, and a film disposed on the zinc coating. The film has a thickness in the range of 0.01 to 3 ?m and contains certain amounts of resin compound having a particular chemical structure, cationic urethane resin, vanadium compound, zirconium compound, compound having a phosphate group, and acid compound. The surface-treated galvanized steel sheet contains no hexavalent chromium in the film and is excellent in terms of corrosion resistance, alkali resistance, and solvent resistance.

Abstract: The process for the application of a metal layer on a substrate by deposition of a metal from a metal salt solution comprises the presence of exfoliated graphite in the substrate surface.

Abstract: Provided is a non-adhesive flexible laminate comprising a polyimide film at least one surface of which has been plasma-treated, a tie-coat layer formed on the plasma-treated surface, a metal seed layer formed on the tie-coat layer, and a metal conductor layer formed on the metal seed layer, wherein a ratio ?p/?t of actual density ?p to theoretical density ?t of the tie-coat layer satisfies ?p/?t>0.6. The invention aims to improve the adhesion between the metal layer and the polyimide film of the non-adhesive flexible laminate (in particular a two-layered metalizing laminate).

Abstract: The invention concerns multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. A thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.

Abstract: A wire (10) for use in a brazing or soldering operation has an elongated body (12) of a metallic material. The elongated body (12) has an outer surface (18). A channel (14) is formed along a length of the body. The channel (14) has an opening (A1). A flux solution (22) is deposited within the channel (14) and along the length of the body. The flux solution (22) covers a portion of the outer surface (18). A portion of the flux solution (22) is exposed through the opening (A1) in the channel (14).

Abstract: A material for an electrical/electronic part, which has a resin coating directly formed on at least a part of a metal substrate or at least a part of a metal layer provided on the metal substrate, with the resin coating being formed with a resin composition containing at least one selected from the group consisting of a polyamideimide resin and a polyimide resin, each having a structure represented by formula (I) or (II) in the molecular structure: in which R1, R2, R3, and R4 each represent one selected from a hydrogen atom, an alkyl group, a hydroxyl group, a halogen atom, and an alkoxy group.

Abstract: Metallic substrates have a surface for receiving application of an adhesive that includes a precipitated coating of metallic nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion is in contact with the first portion. Also provided are adhered constructs. These constructs include a first substrate with a first surface that has a metallic precipitated coating of nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion contacts the first portion. The constructs include a second substrate that has a second surface; and an adhesive is applied between the first surface and the second surface.

Abstract: This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Abstract: The present invention provides a surface treated steel sheet including a steel sheet; a plating layer containing at least one metal selected from the group consisting of zinc and aluminum on a surface of the steel sheet; and a film on the plating layer, the film containing at least one metal selected from the group consisting of Al, Mg, and Zn, a tetravalent vanadium compound, and a phosphoric acid group. This surface treated steel sheet exhibits excellent corrosion resistance and excellent surface appearance without containing hazardous substances, such as hexavalent chromium, in the film.

Abstract: A process for producing a composite of aluminum material and synthetic resin molding with high efficiency; and a stable fast composite exhibiting high peeling resistance and large mechanical strength. The process is characterized in that aluminum material (1) is anodized in electrolytic bath of phosphoric acid or sodium hydroxide to thereby form anodic oxidation coating (2) provided with innumerable pores (3) having a diameter of 25 nm or more made open in the surface thereof is formed thereon, and a synthetic resin mold (6) is coupled with the anodic oxidation coating (2) in such a condition that the portion (6a) of the synthetic resin molding (6) is intruded or anchored in the innumerable pores (3) of the anodic oxidation coating (2). By this process, composite (P) with the above properties can be easily obtained.

Abstract: A sliding bearing element is characterized in that a bearing material that is bonded to the backing is disposed at least at the edges of the backing in form of wires in the circumferential direction and that a soft material is located at least in a space between said wires. At least one intermediate wire can be disposed between the two edge wires generally running in the circumferential direction. The method comprises the following processing steps: providing a strip of steel or any other material having the required degree of strength which forms the backing of the bearing to be produced, bonding at least one wire at each of the two edges of the backing strip, whereat disposing the wires in such a manner that said wires run in circumferential direction generally, and filling out the spaces between the wires with soft material.

Abstract: A halogen-free varnish includes epoxy resin, composite curing agent, condensed phosphate, and filler. The composite curing agent includes Benzoxazine (BZ) resin and amino triazine novolac (ATN) resin. The filler has aluminium hydroxide and silica. Glass fabric is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low moisture absorption.

Abstract: A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

Abstract: Coatings on a substrate and application methods result in coatings that can withstand different types or groups of bulk cargo and operations. This novel approach includes use of a combination of layers of coating materials at certain thicknesses and applied with certain techniques. In certain embodiments, the coating system includes coatings applied to a pretreated substrate, e.g., blasted steel cargo hold plates of an oceangoing vessel. The coatings include a bond layer and a resistance layer, e.g., an anti-corrosive layer tailored to resist at least one of corrosion, erosion, impact and wear of the substrate.

Abstract: A coating structure for a metal member includes a surface-smoothing layer formed on the metal member for smoothing a surface of the metal member, and a fluorine-based film formed on the surface-smoothing layer. The fluorine-based film can be formed by applying a fluorine-containing solution on the surface-smoothing layer, and by drying the fluorine-containing solution. The coating structure can be suitably used for a fuel injection nozzle.

Abstract: A nickel thin film is formed, for example, to a thickness of 2 nm or more on a polyethylene naphthalate substrate by a vacuum evaporation method. A magnetoresistance effect element using ferromagnetic nano-junction is comprised by using two laminates each comprising a nickel thin film formed on a polyethylene naphthalate substrate, and joining these two laminates so that the nickel thin films cross to each other in such a manner that edges of the nickel thin films face each other.

Abstract: The invention relates to a laminate of metal sheets and fiber-reinforced polymer layers connected thereto. The laminate comprises at least one thick metal sheet with a thickness of at least 1 mm that is connected to the rest of the laminate by means of at least one fiber-reinforced polymer layer, the fiber volume content of which is at most 45 volume-%. The invention also relates to a method for producing the laminate as well as skin sheets reinforced with the laminate for an aircraft or spacecraft.

Abstract: Article that includes optically-transmissive metal layer on light-reflective metal layer. Optically-transmissive metal layer has composition including at least about ten molar % of chromium. Article further includes optically-transmissive metal-adhering layer on optically-transmissive metal layer. Optically-transmissive metal-adhering layer has composition including metal oxide. Article also includes optically-transmissive protective layer on optically-transmissive metal-adhering layer. Optically-transmissive protective layer has composition including organic moiety-containing polymer. Method that includes providing light-reflective metal layer. Method also includes forming optically-transmissive metal layer on light-reflective metal layer wherein optically-transmissive metal layer has composition including at least about ten molar % chromium.

Abstract: A flexible film, a display device and a method of fabricating a display device are disclosed. The flexible film includes a polyimide film and first and second metal films formed on the polyimide film. The display device includes a panel, a driver for driving the panel, a flexible film having a circuit pattern and disposed between the panel and the driver, and a conductive film electrically connecting the panel and the driver with the flexible film. Because the metal films are formed on the polyimide film with cleaved imide rings, plating properties, adhesion strength (bond strength) and heat resistance can be improved, and a fine circuit pattern can be easily implemented.

Abstract: An article including a metallic substrate is presented. The article further includes a sacrificial layer disposed on a surface of the substrate and an anti-fouling layer disposed on the sacrificial layer. The anti-fouling layer includes a metal-polymer composite. An article including an anti-fouling layer having a nitride is also presented.

Abstract: Described are methods of coating a polymer substrate including thermal coating substrate with a metallic boundary material to form a first layer and thermal coating the first layer with a metallic thermal spray material to form a second layer. Related coated articles, coated members, actuators and other items are also included.

Abstract: To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 mum or less, and the microscopic line and a wiring board have large peel strength even after line of 15 mum is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 mum as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 mum or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment.

Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.

Abstract: An article surface ornamental structure that is easy to work and able to form a decorative pattern of an optional design and a high-grade feeling produced thanks to the metallic luster and, if necessary, to form a third dimensional decorative pattern. A metal-coated layer is formed by depositing a metal material with metallic luster on a surface of a base material. The metal-coated layer is at least partly provided with a separation part part, in which the based material has its surface exposed to create an ornamental pattern thanks to a difference between the outer appearance of the base material and the metallic luster of the remaining metal-coated layer. With the base material and the metal-coated layer exposed, respectively, each of their surfaces is coated with a clear-coating layer made of synthetic resin material having transmittancy in order to protect the surface of the ornamental pattern.

Abstract: A composite sheet structure is presented, and includes a core layer and two surface layers. Each surface layer has a plurality of metallic sheets. The metallic sheets bond with one another. The core layer and the surface layers bond with each other, and the core layer is sandwiched between the two surface layers. In comparison to conventional single type/solid piece of building material, the present invention results in a dramatic cost reduction in various building industry. With the up-to-date technology, the strength of metallic composite sheet remains within structural grade parameter and meets related specifications. Manufacturers are benefited from the cheaper metallic sheet in the composition while enjoying the same quality look of the outer layer.

Abstract: The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 ?m to 3.0 ?m, 0.5×Rz(S)+0.5?C(S)??(1) where Rz(S) is a numerical value represented by ?m.

Abstract: A stainless steel substrate with one or more conductive metal layers, a method for manufacturing the same, and a hard disk drive suspension material using the same that are excellent in etching accuracy and does not involve the use of any substances casing environmental burdens, while ensuring stable adhesion between the conductive metal layers on the stainless steel substrate and the polyimide-based resin layer. The conductive metal layers are formed to have a total thickness ranging from 0.1 to 10 ?m, a centerline average surface roughness Ra from 0.05 to 1 ?m, and a ten-point average surface roughness Rz from 1 to 5 ?m, respectively.

Abstract: The present invention provides a metallic coating having a sheen and having a discontinuous structure at high productivity and low cost by using sputtering. A resin product includes a resin base material, and a metallic coating having a sheen and a discontinuous structure that is deposited on the resin base material so as to include a portion in which a high-formation metal that relatively readily forms a discontinuous structure when using vacuum vapor deposition is sputtered, and thereafter, a low-formation metal that does not relatively readily form a discontinuous structure when using vacuum vapor deposition is sputtered. The high-formation metal and the low-formation metal are selected from at least two species of metals whose crystal structures are identical and whose lattice constant difference is within 10%.

Abstract: A barrier film for a flexible copper substrate comprising a Co—Cr alloy film containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is provided. The barrier film has a thickness of 3 to 150 nm and a film thickness uniformity of 10% or less at 1?. A sputtering target for forming a barrier film comprising a Co—Cr alloy containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is also provided. The relative magnetic permeability in the in-plane direction of the sputtered face of the target is 100 or less. The barrier film for a flexible copper substrate and the sputtering target for forming such barrier film have a film thickness that is thin enough to prevent film peeling and inhibiting the diffusion of copper to a resin film such as polyimide, is capable of obtaining a sufficient barrier effect even in a minute wiring pitch and has barrier characteristics that will not change even when the temperature rises due to heat treatment or the like.

Abstract: The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to the invention, there is provided electrodeposited copper foil with a carrier foil in which an adhesive interface layer is formed on a surface of the carrier foil and an electrodeposited copper foil layer is formed on the adhesive interface layer, which is characterized in that the electrodeposited copper foil layer is provided with a passivated layer formed without performing roughening treatment as nodular treatment and that a nickel-zinc alloy consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by weight is adopted as the passivated layer.

Abstract: The present invention provides a precoated metal sheet excellent in the coating material adhesion and having little affect on environment. The precoated metal sheet of the invention is a precoated metal sheet comprising a metal or plated metal sheet having stacked on the surface thereof at least a coat layer and an organic resin layer, the metal or plated metal sheet mainly comprising zinc and aluminum and the coat layer mainly comprising one or both of a metal oxide and a metal hydroxide each using a metal species exclusive of chromium.

Abstract: The invention relates to a corrosion-protective layer for protecting steel substrates from corrosion, comprising a zinc-chromium layer applied on the steel substrate by electrolytic joint deposition of zinc and chromium ions, and a chromate-free organic thin layer applied thereon, substantially comprising synthetic resins, and to a method for improving the paint adhesion of a zinc-chromium corrosion-protective layer.

Abstract: In a system having at least one metal part which is in contact with at least one plastic component, the metal part has a galvanically applied aluminum surface coating.