Abstract: Disclosed is a sliding member having a bearing alloy layer, an intermediate layer of Ni or a Ni alloy formed on the bearing alloy layer, and an overlay layer of a Sn alloy containing Cu formed on the intermediate layer. There exist Sn—Cu compounds in the overlay layer, which protrudently extend from the intermediate layer. The hard Sn—Cu compounds contribute to the overlay layer in improving fatigue resistance property. A soft Sn matrix being rich in an outer surface region of the overlay layer is responsible for keeping good conformability to have excellent anti-seizure property.

Abstract: The present invention provides a surface treated steel sheet for electronic components which does not include lead, which is a hazardous substance with environmental impact, and, in particular, satisfies the solder wettability after retort treatment, a rust-proof property and a whisker-proof property simultaneously. More specifically, the present invention is a surface treated steel sheet with less environmental impact for electronic components excellent in solder wettability, a rust-proof property and a whisker-proof property and having an Sn—Zn alloy layer which is formed by plating Sn and Zn on a steel sheet or a Ni plated steel sheet and then applying thermal diffusion treatment, or by plating Sn—Zn alloy on a steel sheet or a Ni plated steel sheet, characterized in that the amount of said Sn—Zn alloy layer is not less than 3 g/m2, the Zn/Sn ratio (in weight ratio) is 0.01 to 10, more preferably 0.01 to 0.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin and zinc metal alloy.

Abstract: There was found a metallocenyl-phthalocyanine or its metal complex of a divalent metal, oxometal, halogenometal or hydroxymetal, in which at least one of the four phenyl rings of the phthalocyanine contains, bound via a bridge unit E, at least one metallocene radical as substituent, E being composed of a chain of at least two atoms or atom groups selected from the group consisting of —CH2—, —C(═O)—, —CH(C1-C4alkyl)—, —C(C1-C4alkyl)2—, —NH—, —S—, —O— and —CH═CH—, as well as mixtures of the novel compounds which comprise, inter alia, isomers, a process for the production, the use and recording media comprising the novel compounds.

Abstract: An electronic component includes external electrodes formed on a base member, each external electrode including a plurality of layers of which the outermost layer is a tin plating layer. The tin plating layer has a polycrystalline structure, and atoms of a metal other than tin are diffused into the tin crystal grain boundaries. Alternatively, each external electrode includes a plurality of layers including a thick-film electrode formed on the base member, a nickel layer or a nickel alloy layer formed on the thick-film electrode and a tin plating layer formed on the nickel layer or the nickel alloy layer. The tin plating layer has a polycrystalline structure and nickel atoms are diffused into the tin crystal grain boundaries. Methods for fabricating electronic components and a circuit board provided with a plurality of electronic components are also disclosed.

Abstract: To provide a plated material having both high heat-resistance and good insertability/extractability. The plated material comprises an undercoating of any one of metals belonging to group 4, group 5, group 6, group 7, group 8, group 9 or group 10 of the periodic table or an alloy containing any one of those metals as a main component, an intermediate coating of Cu or a Cu alloy, and a top-coating of Sn or an Sn alloy, the undercoating, the intermediate coating and the top-coating being formed on a surface of an electrically conductive base in this order, and the thickness of the top-coating is 1.9 times or more the thickness of the intermediate coating.

Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Abstract: The tin-plated steel sheet includes a base steel sheet; a tin plating layer coating approximately more than 97.0% of the base steel sheet; and a chemical conversion coating having approximately 0.5 to 100 mg/m2 phosphorus and approximately 0.1 to 250 mg/m2 silicon formed on the tin plating layer and an unplated region corresponding to approximately less than 3.0%. The tin-plated steel sheet does not contain chromium which is harmful to the environment but has superior overcoat adhesion property, discoloration resistance, and rust resistance.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: The present invention provides a surface treated steel sheet for electronic components which does not include lead, which is a hazardous substance with environmental impact, and, in particular, satisfies the solder wettability after retort treatment, a rust-proof property and a whisker-proof property simultaneously. More specifically, the present invention is a surface treated steel sheet with less environmental impact for electronic components excellent in solder wettability, a rust-proof property and a whisker-proof property and having an Sn—Zn alloy layer which is formed by plating Sn and Zn on a steel sheet or a Ni plated steel sheet and then applying thermal diffusion treatment, or by plating Sn—Zn alloy on a steel sheet or a Ni plated steel sheet, characterized in that the amount of said Sn—Zn alloy layer is not less than 3 g/m2, the Zn/Sn ratio (in weight ratio) is 0.01 to 10, more preferably 0.01 to 0.

Abstract: A Sn-based metal-coated steel strip excellent in appearance comprises a Ni-based metal (such as Ni, a Ni-Sn alloy, a Ni-Zn alloy, a Ni-Fe alloy and a Ni-Co alloy) preplating layer and a Sn-based metal (such as a Sn-Zn alloy) coating formed thereon, and is characterized in that a Ni emission intensity line and an Fe emission intensity line obtained by glow discharge spectroscopy of the surface of the coated steel strip satisfy a relationship of the formula: T1≧T2

Abstract: A lead-free solder, which contains from 1.0 to 3.5% of Ag, from 0.1 to 0.7% of Cu, and from 0.1 to 2.0% of In, the balance consisting of unavoidable impurities and Sn, is appropriate for ball-grid array (BGA). The solute Cu suppresses growth of intermetallic compound formed at the interface between the bulk of solder and a Ni or Cu conductor.

Abstract: Coloring master pellets for an optical molded article which are formed from a coloring composition, comprising a transparent thermoplastic resin (component A) containing a colorant (component B), wherein the proportion of pellets having colorant concentrations which satisfy a range of 0.5X to 1.5X when the concentrations of the colorants in the pellets are indicated in terms of absorbance and the average concentration is expressed as X is at least 90%. The coloring master pellets of the present invention have extremely small variations in the concentrations of colorants contained in the pellets. These master pellets are suitably used for obtaining an optical molded article such as an optical disk which has extremely few occurrences of color non-uniformity and color streaks and excellent electric properties.

Abstract: A surface treated tin-plated steel sheet which has an alloy layer formed on the surface of a steel sheet, a tin plating layer being formed on said alloy layer with a remaining exposed portion of the alloy layer having an area of 30% or more of that of the alloy layer and, formed on said tin plating layer and said exposed portion of the alloy layer, a coating film containing P and Si in an amount of 0.5 to 100 mg/m2 and 0.1 to 250 mg/m2, respectively; and a chemical treatment solution for use in preparing the steel sheet which comprises a phosphate ion, a tin ion and a silane coupling agent and has a pH of 1.5 to 5.5. The surface treated tin-plated steel sheet is free from chromium which causes problems from an environmental view point, and also is excellent in adhesion with a paint, corrosion resistance after being coated, rust resistance, and formability.

Abstract: A hybrid steel cord and method of making such cord which includes, in contact with one or more carbon steel wire(s), at least one stainless steel wire whose microstructure contains less than 20% of martensite (% by volume). Articles made of plastic and/or rubber, in particular tire envelopes or the carcass reinforcement plies of such envelopes embodying such cords.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

Abstract: A tin-plating or aluminum-plating surface treated steel material with excellent corrosion resistance containing an intermetallic compound composed of one or more Group IIa (alkaline earth metal) elements and one or more Group IVb elements in a tin-based plating layer or aluminum-based plating layer on the surface of a steel material. For a tin-based plating layer, the long diameter of the intermetallic compound massive bodies is 1 82 m or greater and the short diameter/long diameter ratio is at least 0.4. For an aluminum-based plating layer, the long diameter of the intermetallic compound massive bodies is 10 &mgr;m or greater and the short diameter/long diameter ratio is at least 0.4.

Abstract: A Zn—Al—Mg—Si alloy-plated steel material with excellent corrosion resistance, characterized by comprising, in terms of wt %, Al: at least 45% and no greater than 70%, Mg: at least 3% and less than 10%, Si: at least 3% and less than 10%, with the remainder Zn and unavoidable impurities, wherein the Al/Zn ratio is 0.89-2.75 and the plating layer contains a bulky Mg2Si phase; also, a Zn—Al—Mg—Si alloy-plated steel material with excellent corrosion resistance, characterized by comprising, in terms of wt %, Al: at least 45% and no greater than 70%, Mg: at least 1% and less than 5%, Si: at least 0.5% and less than 3%, with the remainder Zn and unavoidable impurities, wherein the Al/Zn ratio is 0.89-2.75 and the plating layer contains a scaly Mg2Si phase.

Abstract: A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70% tin, up to about 4% silver palladium, platinum and/or gold, about 0.5% to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor or solder pad, into the molten solder alloy during reflow. In addition, solder joints formed of the solder alloy form a diffusion barrier layer of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film and tin from the solder joint.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

Abstract: Ni alloy or Cu alloy containing P and/or B is plated on a base metal consisting of Cu or Cu alloy as an intermediate layer, Sn or Sn alloy is further plated on the content of P or B in the plating layer is limited by carrying out reflow treatment, whereby, heat resistance and insertion and withdrawal properties are improved.

Abstract: A multilayer engine bearing (10) includes a steel backing (12) having a liner (14) of bearing metal of either copper-lead or aluminum alloys formed on the backing (12). A multilayer overplate (24, 124) is formed on the base lining member (16) and includes at least a first layer (28, 128) electrodeposited from a bath at a first current density to a desired thickness, and at least one additional layer (26, 126) electrodeposited from the same bath but at a different current density and to a desired thickness to yield a composite lamellar overplate structure having layers with differing deposit characteristics, such as hard and soft layers, generated from the same bath at different current densities.

Abstract: Disclosed is a method of manufacturing an aluminium or aluminium alloy joined product, such as a shaped and hollow member, comprising the sequential steps of: (a) providing two parts made of aluminium or aluminium alloy, each part having a peripheral flange; (b) positioning the two parts such that the peripheral flange of one part faces the peripheral flange of the other part to form an assembly, and joining the facing flanges of the two parts by heating.

Abstract: The present invention relates to a method for controlling the formation of the intermetallic compounds in solder joints, The types of the intermetallic compounds between the SnAgCu solders and the Ni-bearing substrate can be controlled by adjusting the copper concentration in the SnAgCu solders. If the SnAgCu solder has a copper concentration higher than or equivalent to 0.6 wt. %, the soldering intermetallic compound includes a continuous (Cu1−xNix)6Sn5 layer. If the copper concentration of the SnAgCu solders is lower than or equivalent to 0.4 wt. %, the soldering intermetallic compound includes a continuous (Ni1−yCuy)3Sn4 layer and a non-continuous (Cu1−xNix)6Sn5 layer. If the copper concentration of the SnAgCu solders is between 0.4 wt. % to 0.6 wt. %, the soldering intermetallic compound includes the continuous (Cu1−xNix)6Sn5.

Abstract: Disclosed is an aluminium brazing product, such as a brazing sheet product, having a substrate (1) of an aluminium alloy comprising silicon in an amount in the of 2 to 18% by weight, and on at least one outer surface a layer (2) comprising nickel, wherein a separately deposited layer (3) is applied on one side of the layer (2) comprising nickel and the layer (3) comprising a metal such that taken together the aluminium base substrate (1) and all layers exterior thereto form a metal filler having a liquidus temperature in the range of 490 to 570° C., and preferably in the range of 510 to 550° C. The invention also relates to a method of manufacturing such a brazing product and to a brazed assembly comprising at least one component made of the brazing sheet product.

Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Abstract: A surface treated tin-plated steel sheet which has (1) an alloy layer formed on the surface of a steel sheet, (2) a tin plating layer being formed on said alloy layer with a remaining exposed portion of the alloy layer having an area of 30% or more of that of said alloy layer and, formed on said tin plating layer and said exposed portion of the alloy layer, (3) a coating film containing P and Si in an amount of 0.5 to 100 mg/m2 and 0.1 to 250 mg/m2, respectively: and a chemical treatment solution for use in preparing the steel sheet which comprises a phosphate ion, a tin ion and a silane coupling agent and has a pH of 1.5 to 5.5. The surface treated tin-plated steel sheet is free from chromium which causes problems from an environmental view point, and also is excellent in adhesion with a paint, corrosion resistance after being coated, rust resistance, and formability.

Abstract: An article is coated with a multi-layer decorative and protective coating having the appearance of stainless steel. The coating comprises one or more electroplated layers on the surface of said article and vapor deposited on the electroplated layers a stack layer containing layers of refractory metal or metal alloy alternating with layers containing the reaction products of refractory metal or refractory metal alloy, nitrogen and oxygen wherein the total nitrogen and oxygen content of these reaction products is from about 4 to about 32 atomic percent with the nitrogen content being at least about 3 atomic percent.

Abstract: The process for preparing copper-film-plated steel cord (hereafter abbreviated as copper-plated cord) of 20-90 nm of copper film for vehicle tire, by plating zinc or tin with strong tendency of ionization on the surface of steel cord and after drawing the zinc or tin-plated cord, and then plating copper film onto it contacting with cupric sulfate solution of 10 to 50 gram per litter.

Abstract: An electronic component includes external electrodes formed on a base member, each external electrode including a plurality of layers of which the outermost layer is a tin plating layer. The tin plating layer has a polycrystalline structure, and atoms of a metal other than tin are diffused into the tin crystal grain boundaries. Alternatively, each external electrode includes a plurality of layers including a thick-film electrode formed on the base member, a nickel layer or a nickel alloy layer formed on the thick-film electrode and a tin plating layer formed on the nickel layer or the nickel alloy layer. The tin plating layer has a polycrystalline structure and nickel atoms are diffused into the tin crystal grain boundaries. Methods for fabricating electronic components and a circuit board provided with a plurality of electronic components are also disclosed.

Abstract: A plated steel sheet and a connection terminal material using the plated steel sheet have low contact resistance and excellent corrosion resistance. The coated film, which has excellent adhesion, is formed by coating a stainless steel base sheet which is coated with a nickel-tin alloy with a solution/suspension of carbon black or graphite, carboxymethyl cellulose, and a water-borne organic resin which is acrylic resin, polyester resin, urethane resin, or phenol resin.

Abstract: The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of more than 1.0 wt % to about 20 wt %, preferably from 2.0 wt % to 15 wt %, and most preferably from 3.0 wt % to 10 wt %, silver and the balance essentially tin. The coating is preferably applied by immersing the substrate material in a molten tin-silver bath.

Abstract: A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: The tin-plated steel sheet includes a base steel sheet; a tin plating layer coating approximately more than 97.0% of the base steel sheet; and a chemical conversion coating having approximately 0.5 to 100 mg/m2 phosphorus and approximately 0.1 to 250 mg/m2 silicon formed on the tin plating layer and an unplated region corresponding to approximately less than 3.0%. The tin-plated steel sheet does not contain chromium which is harmful to the environment but has superior overcoat adhesion property, discoloration resistance, and rust resistance.

Abstract: Disclosed is a method of reducing whisker formation in tin films by the use of a thin metal undercoat. Also disclosed are structures having tin films with substantially reduced whisker formation.

Abstract: A composite multilayer material is described, which exhibits a relatively high specific load carrying capacity and relatively low wear. The composite multilayer material for plain bearings comprises a backing layer, a bearing metallayer (1), a first intermediate layer (2) of nickel, a second intermediate layer (3) of tin and nickel together with an overlay (4) consisting of copper and tin. The overlay (4) comprises a tin matrix (5), into which tin-copper particles (6) are incorporated, which consist of 39 to 55 wt. % copper, the rest being tin. At high temperatures, as occur in the case of plain bearings used in internal combustion engines, the tin migrates into the second intermediate layer (3) therebelow, resulting in concentration of the tin-copper particles (6).

Abstract: A silicon article including a silicon base and columns extending from the silicon base. The columns define a gap between the columns which is devoid of material so that the article can act as a filter or heat sink. Also disclosed is a method of making the silicon article.

Abstract: A plated lead for electrical devices is plated with a Sn-based lead-free alloy containing 0.001-0.1 weight percent of Ga. The formation of oxides in a hot dipping bath can be suppressed by the presence of 0.001-0.1 weight percent of P in the alloy.

Abstract: A material for use as a bearing sliding surface and a bearing having the material are described, the material comprises tin and having therein from 1 to 5 wt % of a metal selected from the group comprising nickel, cobalt and iron.

Abstract: A terminal material is composed of a base material and a plurality of plating layers provided on the base material and containing an Sn-plating layer as its outermost layer. When the plating layers include an Ni-plating layer, the plating layers are formed so that the Sn-plating layer does not come in contact with the Ni-plating layer. A crimp portion of a crimp terminal is formed of the terminal material.

Abstract: A lead-free multilayer material for plain bearings and a process for the production of corresponding bearing shells for improved emergency running and mechanical load-carrying capacity characteristics. The multilayer bearing material comprises a lead-free copper alloy having a copper content ranging from 50 to 95 wt. %, and an overlay formed of a lead-free tin and copper having a tin content ranging from 70 to 97 wt. % and a copper content ranging from 3 to 20 wt. %.

Abstract: Arrangement (1) for decreasing galvanic corrosion between metal components that includes at least a first component (2) in which a first metal is a part, and at least a second component (3) in which a second metal is a part, whereby the first metal has a higher normal-electrode potential (e0) than the second metal. The first component (2) is intended, after mounting, to be in electrical contact with the second component (3). The first component (2) is coated with a substantially continuous surface layer (4) that is adjusted to give the second component (3) an insignificant galvanic corrosion velocity after mounting. The invention is preferably applied in association with attachment elements such as bolt or screw joint reinforcements, which include a more noble metal than the component or the components with which the attachment element should be in contact with after mounting, and is particularly, preferred for vehicle components.

Abstract: A plated material for connectors, having superior insertion and withdrawal properties, comprises an intermediate layer consisting of Ni alloy plating having a Vickers hardness of 450 to 750 Hv and a thickness of 0.3 to 2 &mgr;m provided on a base metal consisting of Cu or Cu alloy, a reflowed Sn or Sn alloy plated surface layer provided thereon, and an alloy layer consisting primarily of Sn—Ni and having a thickness of 0.05 to 2 &mgr;m formed by diffusion between the intermediate layer and the surface layer, in which average grain size of said Sn—Ni compound is 0.05 to 1 &mgr;m.