Abstract: A method of preparing an organic electronic device, an organic electronic device prepared using the same, and a use thereof are provided. For example, the method of effectively preparing an organic electronic device using a flexible substrate, the organic electronic device prepared using the same, and the use thereof may be provided.

Abstract: In a conventional Sn—Zn based lead-free solder, Zn crystallized to a large size of several tens of micrometers, and it was difficult to suppress the formation of coarse crystallizates and to increase the bonding strength without changing the soldering temperature. There were alloys which improved strength by the addition of a minute amount of a Group 1B metal, but the alloys had an increased melting temperature so that reflow could not be performed with the same temperature profile as for Sn—Pb, so the alloys had advantages and disadvantages. By using a solder paste formed by mixing an ethanol solution containing nanoparticles having a particle diameter of 5-300 nm and containing at least one of Ag, Au, and Cu with a flux and solder powder for an Sn—Zn based lead-free solder paste, the formation of an alloy of Au, Au, or Cu with Zn occurs during soldering, thereby forming fine clusters in the resulting liquid phase of molten solder, and a fine solder structure is obtained following melting.

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.

Abstract: There is provided a heat-dissipation sheet assembly comprising a heat-dissipation sheet layer having good heat conductivity and a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer. When the heat-dissipation sheet layer is immersed in an aqueous solution for electrodeposition added with a material for electrodeposition and electric current is permitted to flow in the aqueous solution, the protection layer(s) is electrodeposited on the one or both sides of the heat-dissipation sheet layer. The heat-dissipation sheet assembly can be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.

Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.

Abstract: An electroless silver plating ink useful in a one step process for coating an article substrate with a bright metallic silver plate, wherein the silvering ink comprises a silver diammine ion, [Ag(NH.sub.3).sub.2].sup.+, in dimethyl sulfoxide.

Abstract: It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.

Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.

Abstract: A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.

Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer.

Abstract: Metal coated organic polymer compositions are useful as vehicular transmission parts. Such parts may have lighter weight, and/or superior corrosion resistance, and/or be more easily fabricated than similar conventional transmission parts.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

Abstract: Metal-coated polymer articles containing structural substantially porosity-free, fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein on polymer substrates, are disclosed. The substantially porosity-free metallic coatings/layers/patches are applied to polymer or polymer composite substrates to provide, enhance or restore vacuum/pressure integrity and fluid sealing functions. Due to the excellent adhesion between the metallic coating and the polymer article satisfactory thermal cycling performance is achieved. The invention can also be employed as a repair/refurbishment technique. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, aerospace and automotive parts and other components exposed to thermal cycling and stress created by erosion and impact damage.

Abstract: The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper foil with the Very Low Profile, smooth on both sides (i.e. VLP copper foil) is used as the carrier foil, the said very low profile copper foil for supporting the ultra thin copper foil can bring advantages of no pinhole, excellent thickness uniformity and low surface roughness. The impact of a release layer on the bond strength between the carrier foil and the ultra thin copper foil is very significant, the release layer is composed of a quaternary metal alloy with peelability.

Abstract: Provided is a surface-treated copper foil, wherein a plated layer essentially consisting of cobalt and nickel, in which a total amount of cobalt and nickel is 75 ?g/dm2 or more and 200 ?g/dm2 or less and Co/Ni is 1 or more and 3 or less, is provided on the roughened surface of a copper foil. The present invention aims to form a surface-treated copper foil, which has superior alkali etching properties and maintains favorable characteristics of hydrochloric acid resistance, heat resistance and weather resistance, and of which the surface takes on a red color.

Abstract: Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: The inventors have conducted vigorous studies, and discovered as a result that it is possible to form a silver layer having a high reflectance of about 90 to 99% in a visible light area by setting a grain size of an outermost surface of a silver plated layer within a range of 0.5 ?m or more to 30 ?m or less.

Abstract: The invention relates to a cooling element to be used in the structure of a pyromettalurgical reactor used in the manufacturing of metals, which cooling element comprises a housing element mainly made of copper, provided with a channel system for the cooling medium circulation, made of pipe that is mainly made of copper; on the outer surface of the pipes forming the channel system, there is arranged a coating that has a lower melting point than the material of the housing element and the pipe. The invention also relates to a method for manufacturing the cooling element.

Abstract: Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (?? and ??) in the textured metal layer surface and orientation degrees (?? and ??) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved.

Abstract: A workpiece arrangement includes at least two join regions of at least one workpiece that are joined together by a material-to-material connection seam. The material-to-material connection seam covers only a portion of a first of the at least two join regions. A thermal insulation device is disposed in an area of the material-to-material connection seam and corresponds to the first of the at least two join regions.

Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming intermolecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.

Abstract: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes gold, nickel, silver, aluminum, and copper present in respective amounts to provide a post-braze hardness of between 450 and 600 KHN to thereby increase the impact resistance of the braze joint. The substrates may be brazed by induction heating at temperatures less than about 1800° F. (982° C.).

Abstract: It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel sheet and to provide a resin-coated steel sheet produced by coating the surface-treated steel sheet with resin. A surface-treated steel sheet including an adhesive layer which is disposed on at least one surface of the steel sheet and which contains Ti and at least one selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, the ratio of the total amount of Co, Fe, Ni, V, Cu, Mn, and Zn to the amount of Ti contained therein being 0.01 to ten on a mass basis, and a method for producing the surface-treated steel sheet.

Abstract: A silver-coated composite material for movable contact includes a base material composed of an alloy whose main component is iron or nickel, an under layer which is formed at least on part of the surface of the base material and which is composed of any one of nickel, cobalt, nickel alloy and cobalt alloy, an intermediate layer which is formed on the under layer and which is composed of copper or copper alloy and an outermost layer which is formed on the intermediate layer and which is composed of silver or silver alloy, and wherein a total thickness of the under layer and the intermediate layer falls within a range more than 0.025 ?m and less than 0.20 ?m.

Abstract: A method for producing titanium alloy brazing strips and the resulting brazing strips and/or foils. The method uses a cold-rolling process without heat treating to generate a titanium based multi-layer alloy strip or foil made up of discrete layers of titanium and an additional layer or layers of one or more metals, such as zirconium, nickel and/or copper, for example, or alloys thereof, with the layer of titanium roll bonded without heat treating to the layers of the additional metal(s). The resulting strip or foil can include, for example, Cu/Ti/Cu, Ni/Ti/Ni, Ni/Ti/Cu, Cu/Ni/Ti/Ni/Cu, Ni/Cu/Ti/Cu/Ni, Ni/Cu/Ni/Ti/Ni/Cu/Ni, Ni/Zr/Cu/Ti/Cu/Zr/Ni and Ni/Ti/Cu/Zr/Cu/Ti/Ni among other combinations. The resulting strip or foil can be used for brazing, creating an alloy of the weight percentage of the original materials.

Abstract: A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.

Abstract: A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body.

Abstract: A bonding pad structure for a semiconductor device includes a first lower metal layer beneath a second upper metal layer in a bonding region of the device. The lower metal layer is formed such that the metal of the lower metal layer is absent from the bonding region. As a result, if damage occurs to the structure during procedures such as probing or bonding at the bonding region, the lower metal is not exposed to the environment. Oxidation of the lower metal layer by exposure to the environment is prevented, thus improving reliability of the device.

Abstract: There is provided a method for manufacturing a cast iron member in which the production of gas defects such as blowholes or pinholes in a clad layer formed on the surface of a cast iron material can be reduced, and the generation of bead cracks in the clad layer can be restrained. In the method for manufacturing a cast iron member, including a step of forming the clad layer by melting a material for cladding by means of irradiation of a laser emitted from a laser irradiation device and by depositing the melted material on the surface of a part of the cast iron material, the step of forming the clad layer is performed by using a material the main ingredient of which is a copper element as the material for cladding so that when the clad layer is formed, a hardened layer having a thickness of 0.01 to 2.0 mm is formed on the surface of the cast iron material.

Abstract: It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.

Abstract: A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

Abstract: A method of electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of the pulse and continuously decreasing the amplitude of both the cathodic and anodic portions of the waveform across the surface of the low conductivity layer as the deposition zone moves from the center of the surface of the low conductivity layer to the outside edge. By virtue of the ability to vary the amplitude and duration of the pulse, the method facilitates the filling of structures in the center of the low conductivity layer without overdepositing on the outside edge, thus ensuring a controlled deposition of material across the surface of the low conductivity layer.

Abstract: A coated article, which has (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer. The article is characterized in that the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer (iii) containing the conductive polymer.

Abstract: The invention describes a multi-layered bearing with a supporting metal layer, optionally a bearing metal layer disposed on top of it, an anti-friction layer on top of the latter as well as a wearing layer on top of it. The wearing layer is made from bismuth or a bismuth alloy and the anti-friction layer is made from a copper-bismuth or silver-bismuth alloy or silver.

Abstract: A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Abstract: A method 10 and a laminated tool 31 which is created by the method 10 and which is formed by the selective coupling or attachment of sectional members, such as members 14, 16. The formed tool 31 includes a finished surface 36 which is formed by the selective deposition of material 30 onto surface 22.

Abstract: A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a magnetically soft underlayer: (1) a first crystalline layer of a material having a first lattice parameter and a strong preferred growth orientation; (2) a second crystalline layer of a material having a second lattice parameter and the same strong preferred growth orientation as the first crystalline layer; and (3) a third crystalline layer of an hcp material, having a [0002] lattice parameter similar to or different from that of the second lattice parameter of the second crystalline layer and a strong <0002> preferred growth orientation, wherein: the second crystalline layer has a lower interfacial energy with the first crystalline layer and a higher interfacial energy with the third crystalline layer, owing to a lower surface energy of th

Abstract: In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Abstract: A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the crystalline layers of the pair with a stronger out-of-plane preferred growth orientation than if each of the pair of crystalline layers are in overlying contact. Disclosed and preferred embodiments include perpendicular magnetic recording media comprising the multiple layer structure as an intermediate layer structure beneath a perpendicular magnetic recording layer for strengthening a preferred out-of-plane growth orientation of the latter.

Abstract: An improved catalyst system that includes a metal support structure and an anti-corrosive layer on the metal support structure, and has improved resistance to corrosion and other degradation under corrosive environments. Typically, a catalyst supporting layer is applied over the anti-corrosive layer.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: The present invention relates to a method of producing a magnetic particle including forming a layer containing an alloy particle that can form a CuAu-type or Cu3Au-type hard magnetic ordered alloy phase on a support, oxidizing the layer, and annealing the layer in a non-oxidizing atmosphere. The invention also relates to a method of producing a magnetic particle including producing an alloy particle that can form a hard magnetic ordered alloy phase, oxidizing the alloy particle, and annealing the particle in a non-oxidizing atmosphere, and a magnetic particle produced by the foregoing production method. Further, the invention relates to a magnetic recording medium comprising a magnetic layer containing a magnetic particle and a method of producing a magnetic recording medium including forming a layer containing an alloy that can form the foregoing hard magnetic ordered alloy phase, oxidizing the layer, and annealing the layer in a non-oxidizing atmosphere.

Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.

Abstract: A new article of manufacture, for example a faucet or other article of hardware, has a specified decorative color, and is resistant to corrosion, abrasion and attack by chemicals. The article includes a substrate, one or more corrosion resistant layers applied to the substrate, a thin transition layer having a composition that varies systematically from a first composition to a second composition and in which the first composition has, at least in part, the function of corrosion protection, and in which the second composition determines the visible color or that portion of the substrate to which the transition layer is applied.

Abstract: A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), and the second conductor is, for example, a terminal (20a, 21a) or a terminal board (22) of an electronic component (20 21). The first conductor is connected with the second conductor through an Au—Zn alloy layer formed through diffusion of Zn from the solder containing Zn into the Au layer of the first conductor.

Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).

Abstract: The aim of the invention is to provide a metal strip for epitaxial coating with a biaxially textured layer, this metal strip, however, being able to be produced in an uncomplicated manner and having a high tensile strength, low magnetic losses and/or a high electrical conductivity. According to the invention, the metal strip is comprised of Nj, Cu, Ag or alloys thereof all serving as basic material, whereby the one-layer metal strip and, in the instance of a multilayer metal strip, at least one of its layers contains 10 nm to 5 ?m large, strength-increasing dispersoids comprised of carbides, borides, oxides and/or nitrides with a volume proportion ranging from 0.1 to 5%. In the instance of a multilayer metal strip, the layers form a composite, and at least one of the layers does not contain any dispersoids and has a biaxial texture. For the production, a starting material is used, which is comprised of Ni, Cu, Ag or of alloys thereof all serving as basic material and which contains 0.

Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming inter-molecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.