Abstract: Implementations described and claimed herein provide a synthetic antiferromagnetic (SAF) layer with canted pinning, wherein a down-track direction facing surface of the SAF layer has edges that are substantially parallel to pinning direction of the SAF layer.

Abstract: A ferromagnetic graphene includes at least one antidot such that the ferromagnetic graphene has ferromagnetic characteristics. A spin valve device includes a ferromagnetic graphene. The ferromagnetic graphene includes a first region, a second region, and a third region. At least one antidot is formed in each of the first region and the third region. The first region and the third region are ferromagnetic regions, whereas the second region is a non-ferromagnetic region.

Abstract: A domain wall motion element has a magnetic recording layer 10 that is formed of a ferromagnetic film and has a domain wall DW. The magnetic recording layer 10 has: a pair of end regions 11-1 and 11-2 whose magnetization directions are fixed; and a center region 12 sandwiched between the pair of end regions 11-1 and 11-2, in which the domain wall. DW moves. A first trapping site TS1 by which the domain wall DW is trapped is formed at a boundary between the end region 11-1, 11-2 and the center region 12. Furthermore, at least one second trapping site TS2 by which the domain wall DW is trapped is formed within the center region 12.

Abstract: A dual spin filter that minimizes spin-transfer magnetization switching current (Jc) while achieving a high dR/R in STT-RAM devices is disclosed. The bottom spin valve has a MgO tunnel barrier layer formed with a natural oxidation process to achieve low RA, a CoFe/Ru/CoFeB—CoFe pinned layer, and a CoFeB/FeSiO/CoFeB composite free layer with a middle nanocurrent channel (NCC) layer to minimize Jc0. The NCC layer may have be a composite wherein conductive M(Si) grains are magnetically coupled with adjacent ferromagnetic layers and are formed in an oxide, nitride, or oxynitride insulator matrix. The upper spin valve has a Cu spacer to lower the free layer damping constant. A high annealing temperature of 360° C. is used to increase the MR ratio above 100%. A Jc0 of less than 1×106 A/cm2 is expected based on quasistatic measurements of a MTJ with a similar MgO tunnel barrier and composite free layer.

Abstract: This etching method comprises the steps of forming first and second hard masks made of materials different from each other successively on a magnetoresistive film; forming a resist having a lower face opposing a front face of the second hard mask, a space being interposed between the front face and lower face; dry-etching the second hard mask by using the resist as a mask; etching the first hard mask by using the etched second hard mask; and etching the magnetoresistive film by using the first hard mask.