Fuel Cell Including Means For Utilization Of Heat For Unrelated Application (e.g., Heating A Building, Etc.) Patents (Class 429/901)
  • Patent number: 6625027
    Abstract: A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with aluminum oxide on exterior surfaces. The aluminum and aluminum oxide of the isolated layers provide good thermal conduction for heat dissipation while the electric isolation from the common electric potential of the common layer is improved, at least in part, by increasing the distance between the integrated circuits and the common layer. The heat sink structure may be mounted within a weatherproof enclosure with one externally exposed surface for heat dissipation.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: September 23, 2003
    Assignee: Baker Hughes Incorporated
    Inventors: Jerald Ray Rider, Vester Ray Raynor
  • Patent number: 5718941
    Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: February 17, 1998
    Assignee: Quantum Materials, Inc.
    Inventors: Stephen M. Dershem, Deborah L. Derfelt